Top View Features A Directly mounts to target PCB (needs tooling 30.23mm [1.190"] holes) with hardware Minimum real estate required Compression plate distributes forces evenly A Clamshell lid 8 25.48mm [1.003"] Materials: Side View (Section AA) 5.85mm 4 34.5mm 1 + IC thickness 3 1 Clam Shell Lid: Black anodized Aluminum. Height = 16.5 mm. 2 Socket Base: Black anodized Aluminum. Height = 6 mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 8.5 mm. 4 Compression Screw: Clear anodized Aluminum. Height = 25 mm, Fluted Knob 5 Ball Guide: Kapton polyimide. 6 Customer's BGA IC 7 2 Socket Base Screw: Socket Head Cap Screw, alloy steel with black oxide finish, 0-80 Thread, 1/4" long. 5 8 Latch: Black anodised Aluminum. 9 Elastomer Guide: Non-clad FR4. Thickness = 0.725mm. 10 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Customer's PCB 9 10 7 CG-BGA-4009 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev:A Drawing: Vinayak R Date: 9/1/09 File: CG-BGA-4009 Dwg.mcd Modified: All Tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. Orientation Mark 0.80mm typ. 2.3375mm* 1.9625mm 2.54mm Ø 0.850mm±0.025mm (x2) Nonplated Alignment Hole 15.225mm±0.125mm sqr. Socket size Ø 0.3600mm PAD 5.08mm Ø 1.61mm±0.05mm (x4) Nonplated Mounting Hole 1.25mm±0.13mm (x4) 1.25mm±0.13mm (x4) 8.80mm(x4) Ø 4.78mm washer keep out 12.725mm Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask CG-BGA-4009 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com All dimensions are in mm unless stated otherwise Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Status: Released Scale: 4:1 Rev:A Drawing: Vinayak R Date: 9/1/09 File: CG-BGA-4009 Dwg.mcd Modified: Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. PAGE 2 of 4 Compatible BGA Spec D X Y e E 3 Øb Ø0.15 X Y Ø0.08 Bottom View Top View 1. 5 2. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. A 0.08 Z A1 4 Side View DIM Interpret dimensions and tolerances per ASME Y14.5M-1994. 0.20 Z Z Dimensions are in millimeters. MIN MAX 2.5 A A1 0.35 0.25 b 0.6 D 10.0 BSC E 10.0 BSC e 0.8 BSC Array: 12x12 CG-BGA-4009 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev:A Drawing: Vinayak R Date: 9/1/09 File: CG-BGA-4009 Dwg.mcd Modified: PAGE 3 of 4 9.71mm 8.59mm 25.48mm 12.86mm 8.09mm 30.23mm 37.55mm 13.33mm 1.81mm 10.08mm 7.33mm 3.33mm 7.61mm 11.12mm 16.11mm 20.07mm 41.30mm 14.11mm CG-BGA-4009 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev:A Drawing: Vinayak R Date: 9/1/09 File: CG-BGA-4009 Dwg.mcd Modified: All Tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 4 of 4