AMIC A62S6308A 64k x 8 bit low voltage cmos sram Datasheet

A62S6308A Series
Preliminary
64K X 8 BIT LOW VOLTAGE CMOS SRAM
Document Title
64K X 8 BIT LOW VOLTAGE CMOS SRAM
Revision History
Rev. No.
0.0
PRELIMINARY
History
Issue Date
Remark
Initial issue
May 31, 2011
Preliminary
(May, 2011, Version 0.0)
AMIC Technology, Corp.
A62S6308A Series
Preliminary
64K X 8 BIT LOW VOLTAGE CMOS SRAM
Features
„ Power supply range: 2.7V to 3.6V
„ Access times:55/70 ns (max.)
„ Current:
A62S6308A series: Operating: 30mA (max.)
Standby: 5μA (max.)
„ Extended operating temperature range: 0°C to 70°C
for -S series, -40°C to +85°C for -SU series
„ Full static operation, no clock or refreshing required
„ All inputs and outputs are directly TTL-compatible
„ Common I/O using three-state output
„ Output enable and two chip enable inputs for easy
application
„ Data retention voltage: 2V (min.)
„ Available in 32-pin SOP, TSOP, sTSOP (8 X
13.4mm) forward type packages
„ All Pb-free (Lead-free) products are RoHS compliant
General Description
Two chip enable inputs are provided for POWER-DOWN
and a device enable and an output enable input are
included for easy interfacing.
Data retention is guaranteed at a power supply voltage as
low as 2V.
The A62S6308A is a low operating current 524,288-bit
static random access memory organized as 65,536 words
by 8 bits and operates on a low power supply voltage
from 2.7V to 3.6V.
Inputs and three-state outputs are TTL compatible and
allow for direct interfacing with common system bus
structures.
Pin Configurations
PRELIMINARY
7
8
9
10
11
12
13
14
15
16
32
31
VCC
A15
30
CE2
29
28
27
WE
A13
A8
26
25
24
23
22
A9
A11
OE
A10
CE1
21
20
19
18
17
I/O7
I/O6
I/O5
I/O4
I/O3
(May, 2011, Version 0.0)
A11
A9
A8
A13
WE
CE2
A15
VCC
NC
NC
A14
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A62S6308AV
(A62S6308AX)
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE1
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
A3
~
~
1
2
3
4
5
6
A62S6308AM
NC
NC
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
„ TSOP/(sTSOP)
(forward type)
~
~
„ SOP
1
AMIC Technology, Corp.
A62S6308A Series
Block Diagram
A0
VCC
GND
A13
ROW
512 X 1024
DECODER
MEMORY ARRAY
INPUT DATA
CIRCUIT
SENSE AMPS
A14
A15
I/O0
I/O7
CE2
CE1
CONTROL
CIRCUIT
OE
WE
Pin Descriptions - SOP
Pin No.
Symbol
1,2
NC
3 - 12, 23,
25 - 28, 31
Pin Description - TSOP/sTSOP
Pin No.
Symbol
No Connection
1 - 4, 7,
11 - 20, 31
A0 - A15
A0 - A15
Address Inputs
5
WE
Write Enable
13 - 15,
17 - 21
I/O0 - I/O7
Data Inputs/Outputs
6
CE2
Chip Enable
16
GND
Ground
8
VCC
Power Supply
22
Chip Enable
9, 10
NC
No Connection
CE1
24
OE
Output Enable
21 - 23,
25 - 29
I/O0 - I/O7
29
WE
Write Enable
24
GND
Ground
30
CE2
Chip Enable
30
CE1
Chip Enable
32
VCC
Power Supply
32
OE
Output Enable
PRELIMINARY
Description
(May, 2011, Version 0.0)
2
Description
Address Inputs
Data Inputs/Outputs
AMIC Technology, Corp.
A62S6308A Series
Recommended DC Operating Conditions
(TA = 0°C to +70°C, or -40°C to +85°C)
Symbol
Parameter
VCC
Supply Voltage
GND
Ground
Min.
Typ.
Max.
Unit
2.7
3.0
3.6
V
0
0
0
V
VIH
Input High Voltage
2.2
-
VCC + 0.3
V
VIL
Input Low Voltage
-0.3
-
+0.6
V
CL
Output Load
-
-
30
pF
TTL
Output Load
-
-
1
-
Absolute Maximum Ratings*
*Comments
VCC to GND . . . . . . . . . . . . . . . . . . . . . -0.5V to + 4.6V
IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to VCC + 0.5V
Operating Temperature, Topr . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . 0°C to +70°C, or -40°C to +85°C
Storage Temperature, Tstg . .. . . . . . . . -55°C to + 125°C
Power Dissipation, PT . . . . . . . . . . . . . . . . . . . . . . 0.7W
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of this
device at these or any other conditions above those
indicated in the operational sections of this specification is
not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may
affect device reliability.
DC Electrical Characteristics
Symbol
(TA = 0°C to +70°C or -40°C to +85°C, VCC = 2.7V to 3.6V, GND = 0V)
Parameter
Min.
Max.
Unit
Conditions
⎜ILI⎥
Input Leakage Current
-
1
μA
VIN = GND to VCC
⎜ILO⎥
Output Leakage Current
-
1
μA
CE1 = VIH or CE2 = VIL or
OE = VIH or WE = VIL
VI/O = GND to VCC
Active Power Supply Current
-
3
mA
CE1 = VIL, CE2 = VIH
II/O = 0mA
-
30
mA
Min. Cycle, Duty = 100%
CE1 = VIL, CE2 = VIH
II/O = 0mA
-
3
mA
CE1 = VIL, CE2 = VIH
VIH = VCC, VIL = 0V
f = 1MHZ, II/O = 0mA
ICC
ICC1
Dynamic Operating Current
ICC2
PRELIMINARY
(May, 2011, Version 0.0)
3
AMIC Technology, Corp.
A62S6308A Series
DC Electrical Characteristics (continued)
Symbol
Parameter
Min.
Max.
Unit
-
0.5
mA
VCC ≤ 3.3V
CE1 = VIH or CE2 = VIL
ISB
Conditions
Standby Power
-
5
μA
VCC ≤ 3.3V
CE1 ≥ VCC - 0.2V or CE2 ≤ 0.2V
VIN ≥ 0V
Supply Current
ISB1
VOL
Output Low Voltage
-
0.4
V
IOL = 2.1mA
VOH
Output High Voltage
2.2
-
V
IOH = -1.0mA
Truth Table
CE1
CE2
OE
WE
I/O Operation
H
X
X
X
High Z
ISB, ISB1
X
L
X
X
High Z
ISB, ISB1
Output Disable
L
H
H
H
High Z
ICC, ICC1, ICC2
Read
L
H
L
H
DOUT
ICC, ICC1, ICC2
Write
L
H
X
L
DIN
ICC, ICC1, ICC2
Mode
Standby
Supply Current
Note: X = H or L
Capacitance (TA = 25°C, f = 1.0MHz)
Symbol
Parameter
Min.
Max.
Unit
Conditions
CIN*
Input Capacitance
6
pF
VIN = 0V
CI/O*
Input/Output Capacitance
8
pF
VI/O = 0V
* These parameters are sampled and not 100% tested.
PRELIMINARY
(May, 2011, Version 0.0)
4
AMIC Technology, Corp.
A62S6308A Series
AC Characteristics (TA = 0°C to +70°C or -40°C to +85°C, VCC = 2.7V to 3.6V)
Symbol
A62S6308A-55S/SU
Parameter
A62S6308A-70S/SU
Unit
Min.
Max.
Min.
Max.
55
-
70
-
ns
-
55
-
70
ns
CE1
-
55
-
70
ns
CE2
-
55
-
70
ns
-
30
-
35
ns
CE1
10
-
10
-
ns
CE2
10
-
10
-
ns
5
-
5
-
ns
CE1
0
20
0
25
ns
CE2
0
20
0
25
ns
Read Cycle
tRC
Read Cycle Time
tAA
Address Access Time
tACE1
Chip Enable Access Time
tACE2
tOE
Output Enable to Output Valid
tCLZ1
Chip Enable to Output in Low Z
tCLZ2
tOLZ
Output Enable to Output in Low Z
tCHZ1
Chip Disable to Output in High Z
tCHZ2
tOHZ
Output Disable to Output in High Z
0
20
0
25
ns
tOH
Output Hold from Address Change
5
-
10
-
ns
tWC
Write Cycle Time
55
-
70
-
ns
tCW
Chip Enable to End of Write
50
-
60
-
ns
tAS
Address Setup Time
0
-
0
-
ns
tAW
Address Valid to End of Write
50
-
60
-
ns
tWP
Write Pulse Width
40
-
50
-
ns
tWR
Write Recovery Time
0
-
0
-
ns
tWHZ
Write to Output in High Z
0
25
0
25
ns
tDW
Data to Write Time Overlap
25
-
30
-
ns
tDH
Data Hold from Write Time
0
-
0
-
ns
tOW
Output Active from End of Write
5
-
5
-
ns
Read Cycle
Notes:
tCHZ1, tCHZ2, tOHZ and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are
not referred to output voltage levels.
PRELIMINARY
(May, 2011, Version 0.0)
5
AMIC Technology, Corp.
A62S6308A Series
Timing Waveforms
Read Cycle 1(1, 2, 4)
tRC
Address
tAA
tOH
tOH
DOUT
Read Cycle 2 (1, 3, 4, 6)
CE1
tACE1
tCLZ15
tCHZ15
DOUT
Read Cycle 3 (1, 4, 7 ,8)
CE2
tACE2
tCHZ25
tCLZ25
DOUT
PRELIMINARY
(May, 2011, Version 0.0)
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AMIC Technology, Corp.
A62S6308A Series
Timing Waveforms (continued)
Read Cycle 4 (1)
tRC
Address
tAA
OE
tOE
tOH
tOLZ5
CE1
tACE1
tCHZ15
tCLZ15
CE2
tACE2
tOHZ5
tCHZ25
tCLZ25
DOUT
Notes: 1.
2.
3.
4.
5.
6.
7.
8.
WE is high for Read Cycle.
Device is continuously enabled CE1 = VIL and CE2 = VIH.
Address valid prior to or coincident with CE1 transition low.
OE = VIL.
Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.
CE2 is high.
CE1 is low.
Address valid prior to or coincident with CE2 transition high.
PRELIMINARY
(May, 2011, Version 0.0)
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AMIC Technology, Corp.
A62S6308A Series
Timing Waveforms (continued)
Write Cycle 1(6)
(Write Enable Controlled)
tWC
Address
tAW
tWR3
tCW5
CE1
(4)
CE2
(4)
tAS1
tWP2
WE
tDW
tDH
DIN
tWHZ
tOW
DOUT
PRELIMINARY
(May, 2011, Version 0.0)
8
AMIC Technology, Corp.
A62S6308A Series
Timing Waveforms (continued)
Write Cycle 2
(Chip Enable Controlled)
tWC
Address
tWR3
tAW
tCW5
CE1
tAS1
CE2
(4)
(4)
tCW5
tWP2
WE
tDW
tDH
DIN
tWHZ7
DOUT
tAS is measured from the address valid to the beginning of Write.
A Write occurs during the overlap (tWP) of a low CE1, a high CE2 and a low WE .
tWR is measured from the earliest of CE1 or WE going high or CE2 going low to the end of the Write cycle.
If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transition or after
the WE transition, outputs remain in a high impedance state.
5. tCW is measured from the later of CE1 going low or CE2 going high to the end of Write.
6. OE is continuously low. ( OE = VIL)
7. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.
Notes: 1.
2.
3.
4.
PRELIMINARY
(May, 2011, Version 0.0)
9
AMIC Technology, Corp.
A62S6308A Series
AC Test Conditions
Input Pulse Levels
0.4V to 2.4V
Input Rise and Fall Time
5 ns
Input and Output Timing Reference Levels
1.5V
Output Load
See Figures 1 and 2
TTL
TTL
CL
CL
5pF
30pF
* Including scope and jig.
* Including scope and jig.
Figure 1. Output Load
Data Retention Characteristics
Symbol
Figure 2. Output Load for tCLZ1,
tCLZ2, tOHZ, tOLZ, tCHZ1,
tCHZ2, tWHZ, and tOW
(TA = 0°C to +70°C or -40°C to +85°C)
Parameter
Min.
Max.
Unit
2.0
3.6
V
CE1 ≥ VCC - 0.2V
VDR2
2.0
3.6
V
CE2 ≤ 0.2V
ICCDR1
-
1*
μA
VCC = 2.0V
CE1 ≥ VCC - 0.2V
VIN ≥ 0V
-
1*
μA
VCC = 2.0V
CE2 ≤ 0.2V
VIN ≥ 0V
0
-
ns
tRC
-
ns
5
-
ms
VDR1
Conditions
VCC for Data Retention
Data Retention Current
ICCDR2
tCDR
Chip Disable to Data Retention Time
tR
Operation Recovery Time
tVR
VCC Rise Time from Data Retention Voltage
to Operating Voltage
* A62S6308A-55S/70S
A62S6308A-55SU/70SU
PRELIMINARY
(May, 2011, Version 0.0)
See Retention Waveform
ICCDR: Max. 1μA at TA = 0°C to +40°C
ICCDR: Max. 1μA at TA = 0°C to +40°C
10
AMIC Technology, Corp.
A62S6308A Series
Low VCC Data Retention Waveform (1) ( CE1 Controlled)
DATA RETENTION MODE
VCC
2.7V
tCDR
2.7V
tR
VDR ≥ 2V
tVR
CE1
VIH
VIH
CE1 ≥ VDR - 0.2V
Low VCC Data Retention Waveform (2) (CE2 Controlled)
DATA RETENTION MODE
VCC
2.7V
tCDR
2.7V
tR
VDR ≥ 2V
tVR
CE2
VIL
VIL
CE2 < 0.2V
PRELIMINARY
(May, 2011, Version 0.0)
11
AMIC Technology, Corp.
A62S6308A Series
Ordering Information
Part No.
Access Time (ns)
Operating Current
Max. (mA)
Standby Current
Max. (μA)
Package
A62S6308AM-55SF
32L Pb-Free SOP
A62S6308AM-55SUF
32L Pb-Free SOP
A62S6308AV-55SF
32L Pb-Free TSOP
55
30
5
A62S6308AV-55SUF
32L Pb-Free TSOP
A62S6308AX-55SF
32L Pb-Free sTSOP
A62S6308AX-55SUF
32L Pb-Free sTSOP
A62S6308AM-70SF
32L Pb-Free SOP
A62S6308AM-70SUF
32L Pb-Free SOP
A62S6308AV-70SF
32L Pb-Free TSOP
70
30
5
A62S6308AV-70SUF
32L Pb-Free TSOP
A62S6308AX-70SF
32L Pb-Free sTSOP
A62S6308AX-70SUF
32L Pb-Free sTSOP
PRELIMINARY
(May, 2011, Version 0.0)
12
AMIC Technology, Corp.
A62S6308A Series
Package Information
SOP (W.B.) 32L Outline Dimensions
HE
17
E
32
unit: inches/mm
θ
L
1
b
16
Detail F
D
Seating Plane
LE
A1
e
S
A
A2
c
D
y
See Detail F
Dimensions in inches
Symbol
A
Dimensions in mm
Min
Nom
Max
Min
Nom
Max
-
-
0.118
-
-
3.00
A1
0.004
-
-
0.10
-
-
A2
0.101
0.106
0.111
2.57
2.69
2.82
b
0.014
0.016
0.020
0.36
0.41
0.51
c
0.006
0.008
0.012
0.15
0.20
0.31
D
-
0.805
0.817
-
20.45
20.75
E
0.440
0.445
0.450
11.18
11.30
11.43
e
0.044
0.050
0.056
1.12
1.27
1.42
HE
0.546
0.556
0.566
13.87
14.12
14.38
L
0.023
0.031
0.039
0.58
0.79
0.99
LE
0.047
0.055
0.063
1.19
1.40
1.60
S
-
-
0.036
-
-
0.91
y
-
-
0.004
-
-
0.10
θ
0°
-
10°
0°
-
10°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
PRELIMINARY
(May, 2011, Version 0.0)
13
AMIC Technology, Corp.
A62S6308A Series
Package Information
TSOP 32L TYPE I (8 X 20mm) Outline Dimensions
unit: inches/mm
A
A1
c
E
A2
e
D
θ
L
LE
HD
Detail "A"
D
Detail "A"
y
S
Dimensions in inches
Symbol
b
Dimensions in mm
Min
Nom
Max
Min
Nom
Max
A
-
-
0.047
-
-
1.20
A1
0.002
-
0.006
0.05
-
0.15
A2
0.037
0.039
0.041
0.95
1.00
1.05
b
0.007
0.009
0.011
0.18
0.22
0.27
c
0.004
-
0.008
0.11
-
0.20
D
0.720
0.724
0.728
18.30
18.40
18.50
E
-
0.315
0.319
-
8.00
8.10
e
0.020 BSC
0.50 BSC
HD
0.779
0.787
0.795
19.80
20.00
20.20
L
0.016
0.020
0.024
0.40
0.50
0.60
LE
-
0.032
-
-
0.80
-
S
-
-
0.020
-
-
0.50
y
-
-
0.003
-
-
0.08
θ
0°
-
5°
0°
-
5°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
PRELIMINARY
(May, 2011, Version 0.0)
14
AMIC Technology, Corp.
A62S6308A Series
Package Information
sTSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions
A
A1
c
E
A2
e
unit: inches/mm
θ
L
LE
D1
D
Detail "A"
D
Detail "A"
0.076MM
S
b
SEATING PLANE
Dimensions in inches
Symbol
Dimensions in mm
Min
Nom
Max
Min
Nom
Max
A
-
-
0.049
-
-
1.25
A1
0.002
-
-
0.05
-
-
A2
0.037
0.039
0.041
0.95
1.00
1.05
b
0.007
0.008
0.009
0.17
0.20
0.23
c
0.0056
0.0059
0.0062
0.142
0.150
0.158
E
0.311
0.315
0.319
7.90
8.00
8.10
e
0.020 TYP
0.50 TYP
D
0.520
0.528
0.535
13.20
13.40
13.60
D1
0.461
0.465
0.469
11.70
11.80
11.90
L
0.012
0.020
0.028
0.30
0.50
0.70
LE
0.0275
0.0315
0.0355
0.700
0.800
0.900
5°
0°
S
θ
0.0109 TYP
0°
3°
0.278 TYP
3°
5°
Notes:
1. The maximum value of dimension D1 includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
PRELIMINARY
(May, 2011, Version 0.0)
15
AMIC Technology, Corp.
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