IF Diversity Receiver AD6655 Data Sheet FEATURES APPLICATIONS SNR = 74.5 dBc (75.5 dBFS) in a 32.7 MHz BW at 70 MHz at 150 MSPS SFDR = 80 dBc to 70 MHz at 150 MSPS 1.8 V analog supply operation 1.8 V to 3.3 V CMOS output supply or 1.8 V LVDS output supply Integer 1-to-8 input clock divider Integrated dual-channel ADC Sample rates up to 150 MSPS IF sampling frequencies to 450 MHz Internal ADC voltage reference Integrated ADC sample-and-hold inputs Flexible analog input range: 1 V p-p to 2 V p-p ADC clock duty cycle stabilizer 95 dB channel isolation/crosstalk Integrated wideband digital downconverter (DDC) 32-bit complex, numerically controlled oscillator (NCO) Decimating half-band filter and FIR filter Supports real and complex output modes Fast attack/threshold detect bits Composite signal monitor Energy-saving power-down modes Communications Diversity radio systems Multimode digital receivers (3G) TD-SCDMA, WiMax, WCDMA, CDMA2000, GSM, EDGE, LTE I/Q demodulation systems Smart antenna systems General-purpose software radios Broadband data applications PRODUCT HIGHLIGHTS 1. Integrated dual, 14-bit, 150 MSPS ADC. 2. Integrated wideband decimation filter and 32-bit complex NCO. 3. Fast overrange detect and signal monitor with serial output. 4. Proprietary differential input maintains excellent SNR performance for input frequencies up to 450 MHz. 5. Flexible output modes, including independent CMOS, interleaved CMOS, IQ mode CMOS, and interleaved LVDS. 6. SYNC input allows synchronization of multiple devices. 7. 3-bit SPI port for register programming and register readback. FUNCTIONAL BLOCK DIAGRAM FD[0:3]A DVDD DRVDD FD BITS/THRESHOLD DETECT CMOS/LVDS OUTPUT BUFFER AD6655 I SHA ADC VIN–A Q LP/HP DECIMATING HB FILTER + FIR VREF SENSE CML RBIAS SIGNAL MONITOR CLK– fADC /8 NCO REF SELECT DUTY CYCLE STABILIZER DCO GENERATION Q VIN–B SHA ADC VIN+B I AGND MULTI-CHIP SYNC FD BITS/THRESHOLD DETECT SYNC FD[0:3]B LP/HP DECIMATING HB FILTER + FIR SIGNAL MONITOR DATA PROGRAMMING DATA SIGNAL MONITOR INTERFACE SPI SMI SMI SMI SDFS SCLK/ SDO/ PDWN OEB SDIO/ SCLK/ CSB DCS DFS NOTES 1. PIN NAMES ARE FOR THE CMOS PIN CONFIGURATION ONLY; SEE FIGURE 10 FOR LVDS PIN NAMES. D0A CLK+ DIVIDE 1 TO 8 32-BIT TUNING NCO D13A DCOA DCOB D13B D0B DRGND 06709-001 VIN+A CMOS OUTPUT BUFFER AVDD Figure 1. Rev. B Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2007–2014 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com AD6655* PRODUCT PAGE QUICK LINKS Last Content Update: 07/15/2017 COMPARABLE PARTS TOOLS AND SIMULATIONS View a parametric search of comparable parts. • Visual Analog • AD6655 IBIS Models EVALUATION KITS • AD6653/AD6655 S-Parameters • AD6655 Evaluation Board REFERENCE MATERIALS DOCUMENTATION Technical Articles Application Notes • Matching An ADC To A Transformer • AN-1142: Techniques for High Speed ADC PCB Layout • AN-715: A First Approach to IBIS Models: What They Are and How They Are Generated DESIGN RESOURCES • AN-742: Frequency Domain Response of SwitchedCapacitor ADCs • PCN-PDN Information • AN-807: Multicarrier WCDMA Feasibility • AN-808: Multicarrier CDMA2000 Feasibility • AN-812: MicroController-Based Serial Port Interface (SPI) Boot Circuit • AN-827: A Resonant Approach to Interfacing Amplifiers to Switched-Capacitor ADCs • AN-835: Understanding High Speed ADC Testing and Evaluation • AN-851: A WiMax Double Downconversion IF Sampling Receiver Design • AN-878: High Speed ADC SPI Control Software • AN-905: Visual Analog Converter Evaluation Tool Version 1.0 User Manual • AN-935: Designing an ADC Transformer-Coupled Front End • AD6655 Material Declaration • Quality And Reliability • Symbols and Footprints DISCUSSIONS View all AD6655 EngineerZone Discussions. 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AD6655 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Decimating Half-Band Filter and FIR filter ................................ 39 Applications ....................................................................................... 1 Half-Band Filter Coefficients.................................................... 39 Product Highlights ........................................................................... 1 Half-Band Filter Features .......................................................... 39 Functional Block Diagram .............................................................. 1 Fixed-Coefficient FIR Filter ...................................................... 39 Revision History ............................................................................... 3 Synchronization .......................................................................... 40 General Description ......................................................................... 4 Combined Filter Performance .................................................. 40 Specifications..................................................................................... 5 Final NCO ................................................................................... 40 ADC DC Specifications—AD6655-80/AD6655-105 .............. 5 ADC Overrange and Gain Control .............................................. 41 ADC DC Specifications—AD6655-125/AD6655-150 ............ 6 Fast Detect Overview ................................................................. 41 ADC AC Specifications—AD6655-80/AD6655-105 ............... 7 ADC Fast Magnitude ................................................................. 41 ADC AC Specifications—AD6655-125/AD6655-150............. 8 ADC Overrange (OR)................................................................ 42 Digital Specifications—AD6655-80/AD6655-105 ................... 9 Gain Switching ............................................................................ 42 Digital Specifications—AD6655-125/AD6655-150 ............... 11 Signal Monitor ................................................................................ 44 Switching Specifications—AD6655-80/AD6655-105............ 13 Peak Detector Mode................................................................... 44 Switching Specifications—AD6655-125/AD6655-150 ......... 14 RMS/MS Magnitude Mode ....................................................... 44 Timing Specifications ................................................................ 15 Threshold Crossing Mode ......................................................... 45 Absolute Maximum Ratings.......................................................... 18 Additional Control Bits ............................................................. 45 Thermal Characteristics ............................................................ 18 DC Correction ............................................................................ 45 ESD Caution ................................................................................ 18 Signal Monitor SPORT Output ................................................ 46 Pin Configurations and Function Descriptions ......................... 19 Channel/Chip Synchronization .................................................... 47 Equivalent Circuits ......................................................................... 23 Serial Port Interface (SPI) .............................................................. 48 Typical Performance Characteristics ........................................... 24 Configuration Using the SPI ..................................................... 48 Theory of Operation ...................................................................... 29 Hardware Interface..................................................................... 48 ADC Architecture ...................................................................... 29 Configuration Without the SPI ................................................ 49 Analog Input Considerations.................................................... 29 SPI Accessible Features .............................................................. 49 Voltage Reference ....................................................................... 31 Memory Map .................................................................................. 50 Clock Input Considerations ...................................................... 32 Reading the Memory Map Register Table............................... 50 Power Dissipation and Standby Mode ..................................... 34 Memory Map Register Table ..................................................... 51 Digital Outputs ........................................................................... 35 Memory Map Register Description ......................................... 55 Digital Downconverter .................................................................. 37 Applications Information .............................................................. 59 Downconverter Modes .............................................................. 37 Design Guidelines ...................................................................... 59 Numerically Controlled Oscillator (NCO) ............................. 37 Evaluation Board ............................................................................ 61 Half-Band Decimating Filter and FIR Filter ........................... 37 Power Supplies ............................................................................ 61 fADC/8 Fixed-Frequency NCO ................................................... 37 Input Signals................................................................................ 61 Numerically Controlled Oscillator (NCO) ................................. 38 Output Signals ............................................................................ 61 Frequency Translation ............................................................... 38 Default Operation and Jumper Selection Settings ................. 62 NCO Synchronization ............................................................... 38 Alternative Clock Configurations ............................................ 62 Phase Offset ................................................................................. 38 Alternative Analog Input Drive Configuration...................... 63 NCO Amplitude and Phase Dither .......................................... 38 Schematics ................................................................................... 64 Rev. B | Page 2 of 84 Data Sheet AD6655 Evaluation Board Layouts ..........................................................74 Ordering Guide ........................................................................... 84 Bill of Materials ...........................................................................82 Outline Dimensions ........................................................................84 REVISION HISTORY 1/14—Rev. A to Rev. B Removed CP-63-3 Package ............................................... Universal Changes to Address 0x0D, Table 29 ..............................................52 Changes to Memory Map Description Section ...........................55 Updated Outline Dimensions ........................................................84 9/09—Rev. A to Rev. 0 Added Exposed Pad Notation to Figure 9 and Table 12 ............19 Added Exposed Pad Notation to Figure 10 and Table 13 ..........21 Updated Outline Dimensions ........................................................84 Changes to Ordering Guide ...........................................................85 11/07—Revision 0: Initial Version Rev. B | Page 3 of 84 AD6655 Data Sheet GENERAL DESCRIPTION The AD6655 is a mixed-signal intermediate frequency (IF) receiver consisting of dual 14-bit, 80 MSPS/105 MSPS/125 MSPS/150 MSPS ADCs and a wideband digital downconverter (DDC). The AD6655 is designed to support communications applications where low cost, small size, and versatility are desired. The dual ADC core features a multistage, differential pipelined architecture with integrated output error correction logic. Each ADC features wide bandwidth differential sample-and-hold analog input amplifiers supporting a variety of user-selectable input ranges. An integrated voltage reference eases design considerations. A duty cycle stabilizer is provided to compensate for variations in the ADC clock duty cycle, allowing the converters to maintain excellent performance. ADC data outputs are internally connected directly to the digital downconverter (DDC) of the receiver, simplifying layout and reducing interconnection parasitics. The digital receiver has two channels and provides processing flexibility. Each receive channel has four cascaded signal processing stages: a 32-bit frequency translator (numerically controlled oscillator (NCO)), a halfband decimating filter, a fixed FIR filter, and an fADC/8 fixedfrequency NCO. In addition to the receiver DDC, the AD6655 has several functions that simplify the automatic gain control (AGC) function in the system receiver. The fast detect feature allows fast overrange detection by outputting four bits of input level information with short latency. In addition, the programmable threshold detector allows monitoring of the incoming signal power using the four fast detect bits of the ADC with low latency. If the input signal level exceeds the programmable threshold, the coarse upper threshold indicator goes high. Because this threshold indicator has low latency, the user can quickly turn down the system gain to avoid an overrange condition. The second AGC-related function is the signal monitor. This block allows the user to monitor the composite magnitude of the incoming signal, which aids in setting the gain to optimize the dynamic range of the overall system. After digital processing, data can be routed directly to the two external 14-bit output ports. These outputs can be set from 1.8 V to 3.3 V CMOS or as 1.8 V LVDS. The CMOS data can also be output in an interleaved configuration at a double data rate using only Port A. The AD6655 receiver digitizes a wide spectrum of IF frequencies. Each receiver is designed for simultaneous reception of the main channel and the diversity channel. This IF sampling architecture greatly reduces component cost and complexity compared with traditional analog techniques or less integrated digital methods. Flexible power-down options allow significant power savings, when desired. Programming for setup and control is accomplished using a 3-bit SPI-compatible serial interface. The AD6655 is available in a 64-lead LFCSP and is specified over the industrial temperature range of −40°C to +85°C. Rev. B | Page 4 of 84 Data Sheet AD6655 SPECIFICATIONS ADC DC SPECIFICATIONS—AD6655-80/AD6655-105 AVDD = 1.8 V, DVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, DCS enabled, unless otherwise noted. Table 1. Parameter RESOLUTION ACCURACY No Missing Codes Offset Error Gain Error MATCHING CHARACTERISTIC Offset Error Gain Error TEMPERATURE DRIFT Offset Error Gain Error INTERNAL VOLTAGE REFERENCE Output Voltage Error (1 V Mode) Load Regulation at 1.0 mA INPUT-REFERRED NOISE VREF = 1.0 V ANALOG INPUT Input Span, VREF = 1.0 V Input Capacitance 1 VREF INPUT RESISTANCE POWER SUPPLIES Supply Voltage AVDD, DVDD DRVDD (CMOS Mode) DRVDD (LVDS Mode) Supply Current IAVDD 2, 3 IDVDD2, 3 IDRVDD2 (3.3 V CMOS) IDRVDD2 (1.8 V CMOS) IDRVDD2 (1.8 V LVDS) POWER CONSUMPTION DC Input Sine Wave Input2 (DRVDD = 1.8 V) Sine Wave Input2 (DRVDD = 3.3 V) Standby Power 4 Power-Down Power Temperature Full Full Full Full Min 14 −3.6 AD6655-80 Typ Max Guaranteed ±0.2 ±0.6 −1.8 −0.1 Min 14 −4.3 Unit Bits Guaranteed ±0.2 ±0.6 −2.2 −0.5 % FSR % FSR ±0.2 ±0.2 % FSR % FSR 25°C 25°C ±0.2 ±0.2 Full Full ±15 ±95 Full Full ±5 7 25°C 0.85 0.85 LSB rms Full Full Full 2 8 6 2 8 6 V p-p pF kΩ Full Full Full 1.7 1.7 1.7 1.8 3.3 1.8 Full Full Full Full Full 235 175 18 8 55 Full Full Full Full Full 470 755 800 52 2.5 ±0.6 ±0.75 AD6655-105 Typ Max ±0.6 ±0.75 ±15 ±95 ±18 1.9 3.6 1.9 420 490 8 ±5 7 1.7 1.7 1.7 1.8 3.3 1.8 315 225 21 11 56 620 995 1040 68 2.5 ppm/°C ppm/°C ±18 1.9 3.6 1.9 575 650 8 mV mV V V V mA mA mA mA mA mW mW mW mW mW Input capacitance refers to the effective capacitance between one differential input pin and AGND. See Figure 11 for the equivalent analog input structure. Measured with a 9.7 MHz, full-scale sine wave input, NCO enabled with a frequency of 13 MHz, FIR filter enabled and the fS/8 output mix enabled with approximately 5 pF loading on each output bit. 3 The maximum limit applies to the combination of IAVDD and IDVDD currents. 4 Standby power is measured with a dc input and with the CLK pin inactive (set to AVDD or AGND). 1 2 Rev. B | Page 5 of 84 AD6655 Data Sheet ADC DC SPECIFICATIONS—AD6655-125/AD6655-150 AVDD = 1.8 V, DVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, DCS enabled, unless otherwise noted. Table 2. Parameter RESOLUTION ACCURACY No Missing Codes Offset Error Gain Error MATCHING CHARACTERISTIC Offset Error Gain Error TEMPERATURE DRIFT Offset Error Gain Error INTERNAL VOLTAGE REFERENCE Output Voltage Error (1 V Mode) Load Regulation at 1.0 mA INPUT-REFERRED NOISE VREF = 1.0 V ANALOG INPUT Input Span, VREF = 1.0 V Input Capacitance 1 VREF INPUT RESISTANCE POWER SUPPLIES Supply Voltage AVDD, DVDD DRVDD (CMOS Mode) DRVDD (LVDS Mode) Supply Current IAVDD 2, 3 IDVDD2, 3 IDRVDD2 (3.3 V CMOS) IDRVDD2 (1.8 V CMOS) IDRVDD2 (1.8 V LVDS) POWER CONSUMPTION DC Input Sine Wave Input2 (DRVDD = 1.8 V) Sine Wave Input2 (DRVDD = 3.3 V) Standby Power 4 Power-down Power Temperature Full Full Full Full Min 14 −4.7 AD6655-125 Typ Max Guaranteed ±0.3 ±0.6 −2.7 −0.8 Min 14 −5.1 Unit Bits Guaranteed ±0.2 ±0.6 −3.2 −1.0 % FSR % FSR ±0.2 ±0.2 % FSR % FSR 25°C 25°C ±0.3 ±0.1 Full Full ±15 ±95 Full Full ±5 7 25°C 0.85 0.85 LSB rms Full Full Full 2 8 6 2 8 6 V p-p pF kΩ Full Full Full 1.7 1.7 1.7 1.8 1.8 1.8 Full Full Full Full Full 390 270 26 13 57 Full Full Full Full Full 770 1215 1275 77 2.5 ±0.7 ±0.7 AD6655-150 Typ Max ±0.7 ±0.8 ±15 ±95 ±18 1.9 3.6 1.9 705 810 8 ±5 7 1.7 1.7 1.7 1.8 1.8 1.8 440 320 28 17 57 870 1395 1450 77 2.5 ppm/°C ppm/°C ±18 1.9 3.6 1.9 805 920 8 mV mV V V V mA mA mA mA mA mW mW mW mW mW Input capacitance refers to the effective capacitance between one differential input pin and AGND. See Figure 11 for the equivalent analog input structure. Measured with a 9.7 MHz, full-scale sine wave input, NCO enabled with a frequency of 13 MHz, FIR filter enabled and the fS/8 output mix enabled with approximately 5 pF loading on each output bit. 3 The maximum limit applies to the combination of IAVDD and IDVDD currents. 4 Standby power is measured with a dc input, the CLK pin inactive (set to AVDD or AGND). 1 2 Rev. B | Page 6 of 84 Data Sheet AD6655 ADC AC SPECIFICATIONS—AD6655-80/AD6655-105 AVDD = 1.8 V, DVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, DCS enabled, NCO enabled, half-band filter enabled, FIR filter enabled, unless otherwise noted. Table 3. Parameter 1 SIGNAL-TO-NOISE-RATIO (SNR) fIN = 2.4 MHz fIN = 70 MHz fIN = 140 MHz fIN = 220 MHz WORST SECOND OR THIRD HARMONIC fIN = 2.4 MHz fIN = 70 MHz fIN = 140 MHz fIN = 220 MHz SPURIOUS-FREE DYNAMIC RANGE (SFDR) fIN = 2.4 MHz fIN = 70 MHz fIN = 140 MHz fIN = 220 MHz WORST OTHER HARMONIC OR SPUR 2 fIN = 2.4 MHz fIN = 70 MHz fIN = 140 MHz fIN = 220 MHz TWO-TONE SFDR fIN = 29.12 MHz, 32.12 MHz (−7 dBFS) fIN = 169.12 MHz, 172.12 MHz (−7 dBFS) CROSSTALK 3 ANALOG INPUT BANDWIDTH Temperature 25°C 25°C Full 25°C 25°C Min AD6655-80 Typ Max Min 74.9 74.8 AD6655-105 Typ Max 74.8 74.7 73.0 dB dB dB dB dB 73.0 74.5 73.4 74.3 73.4 25°C 25°C Full 25°C 25°C −86 −85 −86 −85 −84 −83 −84 −83 25°C 25°C Full 25°C 25°C 86 85 86 85 −74 74 Unit −74 dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc 74 84 83 84 83 25°C 25°C Full 25°C 25°C −93 −90 −93 −90 −89 −86 −89 −86 dBc dBc dBc dBc dBc 25°C 25°C Full 25°C 85 81 95 650 85 81 95 650 dBc dBc dB MHz −82 See Application Note AN-835, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions. See the Applications Information section for more information about the worst other specifications for the AD6655. 3 Crosstalk is measured at 100 MHz with −1 dBFS on one channel and with no input on the alternate channel. 1 2 Rev. B | Page 7 of 84 −82 AD6655 Data Sheet ADC AC SPECIFICATIONS—AD6655-125/AD6655-150 AVDD = 1.8 V, DVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, DCS enabled, NCO enabled, half-band filter enabled, FIR filter enabled, unless otherwise noted. Table 4. Parameter 1 SIGNAL-TO-NOISE-RATIO (SNR) fIN = 2.4 MHz fIN = 70 MHz fIN = 140 MHz fIN = 220 MHz WORST SECOND OR THIRD HARMONIC fIN = 2.4 MHz fIN = 70 MHz fIN = 140 MHz fIN = 220 MHz SPURIOUS-FREE DYNAMIC RANGE (SFDR) fIN = 2.4 MHz fIN = 70 MHz fIN = 140 MHz fIN = 220 MHz WORST OTHER HARMONIC OR SPUR 2 fIN = 2.4 MHz fIN = 70 MHz fIN = 140 MHz fIN = 220 MHz TWO-TONE SFDR fIN = 29.12 MHz, 32.12 MHz (−7 dBFS) fIN = 169.12 MHz, 172.12 MHz (−7 dBFS) CROSSTALK 3 ANALOG INPUT BANDWIDTH 1 2 3 Temperature 25°C 25°C Full 25°C 25°C Min AD6655-125 Typ Max Min 74.7 74.6 AD6655-150 Typ Max 74.6 74.5 73.0 dB dB dB dB dB 72.5 74.2 73.3 73.9 73.0 25°C 25°C Full 25°C 25°C −86 −85 −85 −84 −84 −83 −83 −77 25°C 25°C Full 25°C 25°C 86 85 85 80 −73 73 73 Unit −73 dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc 84 83 76 74 25°C 25°C Full 25°C 25°C −92 −90 −87 −80 −88 −84 −76 −74 dBc dBc dBc dBc dBc 25°C 25°C Full 25°C 85 81 95 650 85 81 95 650 dBc dBc dB MHz −82 See Application Note AN-835, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions. See the Applications Information section for more information about the worst other specifications for the AD6655. Crosstalk is measured at 100 MHz with −1 dBFS on one channel and with no input on the alternate channel. Rev. B | Page 8 of 84 −80 Data Sheet AD6655 DIGITAL SPECIFICATIONS—AD6655-80/AD6655-105 AVDD = 1.8 V, DVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, DCS enabled, unless otherwise noted. Table 5. Parameter DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−) Logic Compliance Internal Common-Mode Bias Differential Input Voltage Input Voltage Range Input Common-Mode Range High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Capacitance Input Resistance SYNC INPUT Logic Compliance Internal Bias Input Voltage Range High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Capacitance Input Resistance LOGIC INPUT (CSB) 1 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance LOGIC INPUT (SCLK/DFS) 2 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance LOGIC INPUTS (SDIO/DCS, SMI SDFS)1 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance AD6655-80 Typ Max Min Full Full Full Full Full Full Full Full Full Full CMOS/LVDS/LVPECL 1.2 0.2 6 AVDD − 0.3 AVDD + 1.6 1.1 AVDD 1.2 3.6 0 0.8 −10 +10 −10 +10 4 8 10 12 CMOS/LVDS/LVPECL 1.2 0.2 6 AVDD − 0.3 AVDD + 1.6 1.1 AVDD 1.2 3.6 0 0.8 −10 +10 −10 +10 4 8 10 12 CMOS 1.2 CMOS 1.2 Full Full Full Full Full Full Full Full AVDD − 0.3 1.2 0 −10 −10 8 Full Full Full Full Full Full 1.22 0 −10 40 Full Full Full Full Full Full 1.22 0 −92 −10 Full Full Full Full Full Full 1.22 0 −10 38 4 10 Min AD6655-105 Typ Max Temp AVDD + 1.6 3.6 0.8 +10 +10 AVDD − 0.3 1.2 0 −10 −10 12 8 3.6 0.6 +10 132 1.22 0 −10 40 26 2 1.22 0 −92 −10 26 2 12 1.22 0 −10 38 26 5 V V p-p V V V V µA µA pF kΩ V V V V µA µA pF kΩ 3.6 0.6 +10 132 V V µA µA kΩ pF 3.6 0.6 −135 +10 V V µA µA kΩ pF 3.6 0.6 +10 128 V V µA µA kΩ pF 26 2 3.6 0.6 +10 128 Rev. B | Page 9 of 84 4 10 26 2 3.6 0.6 −135 +10 26 5 AVDD + 1.6 3.6 0.8 +10 +10 Unit AD6655 Parameter LOGIC INPUTS (SMI SDO/OEB, SMI SCLK/PDWN)2 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance DIGITAL OUTPUTS CMOS Mode—DRVDD = 3.3 V High Level Output Voltage IOH = 50 µA IOH = 0.5 mA Low Level Output Voltage IOL = 1.6 mA IOL = 50 µA CMOS Mode—DRVDD = 1.8 V High Level Output Voltage IOH = 50 µA IOH = 0.5 mA Low Level Output Voltage IOL = 1.6 mA IOL = 50 µA LVDS Mode, DRVDD = 1.8 V Differential Output Voltage (VOD), ANSI Mode Output Offset Voltage (VOS), ANSI Mode Differential Output Voltage (VOD), Reduced Swing Mode Output Offset Voltage (VOS), Reduced Swing Mode 1 2 Data Sheet Temp Min AD6655-80 Typ Max Min AD6655-105 Typ Max Full Full Full Full Full Full 1.22 0 −90 −10 3.6 0.6 −134 +10 1.22 0 −90 −10 3.6 0.6 −134 +10 Full Full 3.29 3.25 26 5 3.29 3.25 1.79 1.75 0.2 0.05 1.79 1.75 V V V V 0.2 0.05 Full Full V V µA µA kΩ pF V V 0.2 0.05 Full Full Full Full 26 5 Unit 0.2 0.05 V V Full 250 350 450 250 350 450 mV Full 1.15 1.25 1.35 1.15 1.25 1.35 V Full 150 200 280 150 200 280 mV Full 1.15 1.25 1.35 1.15 1.25 1.35 V Pull up. Pull down. Rev. B | Page 10 of 84 Data Sheet AD6655 DIGITAL SPECIFICATIONS—AD6655-125/AD6655-150 AVDD = 1.8 V, DVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, DCS enabled, unless otherwise noted. Table 6. Parameter DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−) Logic Compliance Internal Common-Mode Bias Differential Input Voltage Input Voltage Range Input Common-Mode Range High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Capacitance Input Resistance SYNC INPUT Logic Compliance Internal Bias Input Voltage Range High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Capacitance Input Resistance LOGIC INPUT (CSB) 1 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance LOGIC INPUT (SCLK/DFS) 2 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance LOGIC INPUTS (SDIO/DCS, SMI SDFS)1 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance AD6655-125 Typ Max Min Full Full Full Full Full Full Full Full Full Full CMOS/LVDS/LVPECL 1.2 0.2 6 AVDD − 0.3 AVDD + 1.6 1.1 V AVDD 1.2 3.6 0 0.8 −10 +10 −10 +10 4 8 10 12 CMOS/LVDS/LVPECL 1.2 0.2 6 AVDD − 0.3 AVDD + 1.6 1.1 V AVDD 1.2 3.6 0 0.8 −10 +10 −10 +10 4 8 10 12 CMOS 1.2 CMOS 1.2 Full Full Full Full Full Full Full Full AVDD − 0.3 1.2 0 −10 −10 8 Full Full Full Full Full Full 1.22 0 −10 40 Full Full Full Full Full Full 1.22 0 −92 −10 Full Full Full Full Full Full 1.22 0 −10 38 4 10 Min AD6655-150 Typ Max Temp AVDD + 1.6 3.6 0.8 +10 +10 AVDD − 0.3 1.2 0 −10 −10 12 8 3.6 0.6 +10 132 1.22 0 −10 40 26 2 1.22 0 −92 −10 26 2 12 1.22 0 −10 38 26 5 V V p-p V V V V µA µA pF kΩ V V V V µA µA pF kΩ 3.6 0.6 +10 132 V V µA µA kΩ pF 3.6 0.6 −135 +10 V V µA µA kΩ pF 3.6 0.6 +10 128 V V µA µA kΩ pF 26 2 3.6 0.6 +10 128 Rev. B | Page 11 of 84 4 10 26 2 3.6 0.6 −135 +10 26 5 AVDD + 1.6 3.6 0.8 +10 +10 Unit AD6655 Parameter LOGIC INPUTS (SMI SDO/OEB, SMI SCLK/PDWN)2 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance DIGITAL OUTPUTS CMOS Mode—DRVDD = 3.3 V High Level Output Voltage IOH = 50 µA IOH = 0.5 mA Low Level Output Voltage IOL = 1.6 mA IOL = 50 µA CMOS Mode—DRVDD = 1.8 V High Level Output Voltage IOH = 50 µA IOH = 0.5 mA Low Level Output Voltage IOL = 1.6 mA IOL = 50 µA LVDS Mode—DRVDD = 1.8 V Differential Output Voltage (VOD), ANSI Mode Output Offset Voltage (VOS), ANSI Mode Differential Output Voltage (VOD), Reduced Swing Mode Output Offset Voltage (VOS), Reduced Swing Mode 1 2 Data Sheet Temp Min AD6655-125 Typ Max Min AD6655-150 Typ Max Full Full Full Full Full Full 1.22 0 −90 −10 3.6 0.6 −134 +10 1.22 0 −90 −10 3.6 0.6 −134 +10 Full Full 3.29 3.25 26 5 3.29 3.25 Full Full Full Full 26 5 0.2 0.05 1.79 1.75 Full Full V V µA µA kΩ pF V V 0.2 0.05 1.79 1.75 Unit V V V V 0.2 0.05 0.2 0.05 V V Full 250 350 450 250 350 450 mV Full 1.15 1.25 1.35 1.15 1.25 1.35 V Full 150 200 280 150 200 280 mV Full 1.15 1.25 1.35 1.15 1.25 1.35 V Pull up. Pull down. Rev. B | Page 12 of 84 Data Sheet AD6655 SWITCHING SPECIFICATIONS—AD6655-80/AD6655-105 Table 7. Parameter CLOCK INPUT PARAMETERS Input Clock Rate Conversion Rate 1 DCS Enabled DCS Disabled CLK Period—Divide-by-1 Mode (tCLK) CLK Pulse Width High (tCLKH) Divide-by-1 Mode, DCS Enabled Divide-by-1 Mode DCS Disabled Divide-by-2 Mode, DCS Enabled Divide-by-3 Through Divide-by-8 Modes, DCS Enabled DATA OUTPUT PARAMETERS (DATA, FD) CMOS Noninterleaved Mode—DRVDD = 1.8 V Data Propagation Delay (tPD) 2 DCO Propagation Delay (tDCO) Setup Time (tS) Hold Time (tH) CMOS Noninterleaved Mode—DRVDD = 3.3 V Data Propagation Delay (tPD)2 DCO Propagation Delay (tDCO) Setup Time (tS) Hold Time (tH) CMOS Interleaved and IQ Mode—DRVDD = 1.8 V Data Propagation Delay (tPD)2 DCO Propagation Delay (tDCO) Setup Time (tS) Hold Time (tH) CMOS Interleaved and IQ Mode—DRVDD = 3.3 V Data Propagation Delay (tPD)2 DCO Propagation Delay (tDCO) Setup Time (tS) Hold Time (tH) LVDS Mode—DRVDD = 1.8 V Data Propagation Delay (tPD)2 DCO Propagation Delay (tDCO) Pipeline Delay (Latency) NCO, FIR, fS/8 Mix Disabled Pipeline Delay (Latency) NCO Enabled, FIR and fS/8 Mix Disabled (Complex Output Mode) Pipeline Delay (Latency) NCO, FIR, and fS/8 Mix Enabled Aperture Delay (tA) Aperture Uncertainty (Jitter, tJ) Wake-Up Time 3 OUT-OF-RANGE RECOVERY TIME Temp Min AD6655-80 Typ Max Full Min AD6655-105 Typ Max 625 Full Full Full 20 10 12.5 Full Full Full Full 3.75 5.63 1.6 0.8 Full Full Full Full Unit 625 MHz 105 105 MSPS MSPS ns 80 80 20 10 9.5 6.25 6.25 8.75 6.88 2.85 4.28 1.6 0.8 4.75 4.75 6.65 5.23 ns ns ns ns 1.6 4.0 3.9 5.4 14.0 11.0 6.2 7.3 1.6 4.0 3.9 5.4 11.0 8.0 6.2 7.3 ns ns ns ns Full Full Full Full 1.9 4.4 4.1 5.8 14.2 10.8 6.4 7.7 1.9 4.4 4.1 5.8 11.2 7.8 6.4 7.7 ns ns ns ns Full Full Full Full 1.6 3.4 3.9 4.8 7.15 5.35 6.2 6.7 1.6 3.4 3.9 4.8 5.65 3.85 6.2 6.7 ns ns ns ns Full Full Full Full 1.9 3.8 4.1 5.2 7.35 5.15 6.4 7.1 1.9 3.8 4.1 5.2 5.85 3.65 6.4 7.1 ns ns ns ns Full Full Full Full 2.5 3.7 4.8 5.3 38 38 7.0 7.3 2.5 3.7 4.8 5.3 38 38 7.0 7.3 ns ns Cycles Cycles Full Full Full Full Full Conversion rate is the clock rate after the divider. Output propagation delay is measured from CLK 50% transition to DATA 50% transition, with a 5 pF load. 3 Wake-up time is dependent on the value of the decoupling capacitors. 1 2 Rev. B | Page 13 of 84 109 1.0 0.1 350 2 109 1.0 0.1 350 2 Cycles ns ps rms us Cycles AD6655 Data Sheet SWITCHING SPECIFICATIONS—AD6655-125/AD6655-150 Table 8. Parameter CLOCK INPUT PARAMETERS Input Clock Rate Conversion Rate 1 DCS Enabled DCS Disabled CLK Period—Divide-by-1 Mode (tCLK) CLK Pulse Width High (tCLKH) Divide-by-1 Mode, DCS Enabled Divide-by-1 Mode, DCS Disabled Divide-by-2 Mode, DCS Enabled Divide-by-3 Through Divide-by-8 Modes, DCS Enabled DATA OUTPUT PARAMETERS (DATA, FD) CMOS Noninterleaved Mode—DRVDD = 1.8 V Data Propagation Delay (tPD) 2 DCO Propagation Delay (tDCO) Setup Time (tS) Hold Time (tH) CMOS Noninterleaved Mode—DRVDD = 3.3 V Data Propagation Delay (tPD)2 DCO Propagation Delay (tDCO) Setup Time (tS) Hold Time (tH) CMOS Interleaved and IQ Mode—DRVDD = 1.8 V Data Propagation Delay (tPD)2 DCO Propagation Delay (tDCO) Setup Time (tS) Hold Time (tH) CMOS Interleaved and IQ Mode—DRVDD = 3.3 V Data Propagation Delay (tPD)2 DCO Propagation Delay (tDCO) Setup Time (tS) Hold Time (tH) LVDS Mode—DRVDD = 1.8 V Data Propagation Delay (tPD)2 DCO Propagation Delay (tDCO) Pipeline Delay (Latency) NCO, FIR, fS/8 Mix Disabled Pipeline Delay (Latency) NCO Enabled; FIR and fS/8 Mix Disabled (Complex Output Mode) Pipeline Delay (Latency) NCO, FIR, and fS/8 Mix Enabled Aperture Delay (tA) Aperture Uncertainty (Jitter, tJ) Wake-Up Time 3 OUT-OF-RANGE RECOVERY TIME Temp AD6655-125 Min Typ Max Full AD6655-150 Min Typ Max 625 Full Full Full 20 10 8 Full Full Full Full 2.4 3.6 1.6 0.8 Full Full Full Full Unit 625 MHz 150 150 MSPS MSPS ns 125 125 20 10 6.66 4 4 5.6 4.4 2.0 3.0 1.6 0.8 3.33 3.33 4.66 3.66 ns ns ns ns 1.6 4.0 3.9 5.4 9.5 6.5 6.2 7.3 1.6 4.0 3.9 5.4 8.16 5.16 6.2 7.3 ns ns ns ns Full Full Full Full 1.9 4.4 4.1 5.8 9.7 6.3 6.4 7.7 1.9 4.4 4.1 5.8 8.36 4.96 6.4 7.7 ns ns ns ns Full Full Full Full 1.6 3.4 3.9 4.8 4.9 3.1 6.2 6.7 1.6 3.4 3.9 4.8 4.23 2.43 6.2 6.7 ns ns ns ns Full Full Full Full 1.9 3.8 4.1 5.2 5.1 2.9 6.4 7.1 1.9 3.8 4.1 5.2 4.43 2.23 6.4 7.1 ns ns ns ns Full Full Full Full 2.5 3.7 4.8 5.3 38 38 7.0 7.3 2.5 3.7 4.8 5.3 38 38 7.0 7.3 ns ns Cycles Cycles Full Full Full Full Full Conversion rate is the clock rate after the divider. Output propagation delay is measured from CLK 50% transition to DATA 50% transition, with a 5 pF load. 3 Wake-up time is dependent on the value of the decoupling capacitors. 1 2 Rev. B | Page 14 of 84 109 1.0 0.1 350 3 109 1.0 0.1 350 3 Cycles ns ps rms us Cycles Data Sheet AD6655 TIMING SPECIFICATIONS Table 9. Parameter SYNC TIMING REQUIREMENTS tSSYNC tHSYNC SPI TIMING REQUIREMENTS tDS tDH tCLK tS tH tHIGH tLOW tEN_SDIO Conditions Min SYNC to the rising edge of CLK setup time SYNC to the rising edge of CLK hold time tDIS_SDIO SPORT TIMING REQUIREMENTS tCSSCLK tSSLKSDO tSSCLKSDFS Typ Max Unit 0.24 0.4 ns ns Setup time between the data and the rising edge of SCLK Hold time between the data and the rising edge of SCLK Period of the SCLK Setup time between CSB and SCLK Hold time between CSB and SCLK Minimum period that SCLK should be in a logic high state Minimum period that SCLK should be in a logic low state Time required for the SDIO pin to switch from an input to an output relative to the SCLK falling edge Time required for the SDIO pin to switch from an output to an input relative to the SCLK rising edge 2 2 40 2 2 10 10 10 ns ns ns ns ns ns ns ns 10 ns Delay from rising edge of CLK+ to rising edge of SMI SCLK Delay from rising edge of SMI SCLK to SMI SDO Delay from rising edge of SMI SCLK to SMI SDFS 3.2 −0.4 −0.4 4.5 0 0 6.2 +0.4 +0.4 ns ns ns Timing Diagrams CLK+ tDCO tPD CHANNEL A/B DATA BITS DECIMATED CMOS DATA DECIMATED FD DATA CHANNEL A/B FD BITS CHANNEL A/B FD BITS CHANNEL A/B DATA BITS CHANNEL A/B FD BITS CHANNEL A/B FD BITS CHANNEL A/B FD BITS CHANNEL A/B DATA BITS CHANNEL A/B FD BITS 06709-109 tS DECIMATED DCOA/DCOB tH Figure 2. Decimated Noninterleaved CMOS Mode Data and Fast Detect Output Timing (Fast Detect Mode Select Bits = 000) CLK+ tPD tDCO DECIMATED CMOS DATA CHANNEL A/B DATA BITS CHANNEL A/B DATA BITS CHANNEL A/B DATA BITS DECIMATED FD DATA CHANNEL A/B FD BITS CHANNEL A/B FD BITS CHANNEL A/B FD BITS DECIMATED DCOA/DCOB 06709-012 tS tH Figure 3. Decimated Noninterleaved CMOS Mode Data and Fast Detect Output Timing (Fast Detect Mode Select Bits = 001 Through Fast Detect Mode Select Bits = 100) Rev. B | Page 15 of 84 AD6655 Data Sheet CLK+ tDCO tPD DECIMATED INTERLEAVED CMOS DATA CHANNEL A: DATA CHANNEL B: DATA CHANNEL A: DATA CHANNEL B: DATA CHANNEL A: DATA CHANNEL B: DATA DECIMATED INTERLEAVED FD DATA CHANNEL A: FD BITS CHANNEL B: FD BITS CHANNEL A: FD BITS CHANNEL B: FD BITS CHANNEL A: FD BITS CHANNEL B: FD BITS 06709-013 tS DECIMATED DCO tH Figure 4. Decimated Interleaved CMOS Mode Data and Fast Detect Output Timing CLK+ tPD tDCO DECIMATED CMOS IQ OUTPUT DATA CHANNEL A/B: Q DATA CHANNEL A/B: I DATA CHANNEL A/B: Q DATA CHANNEL A/B: I DATA CHANNEL A/B: Q DATA CHANNEL A/B: I DATA CMOS FD DATA CHANNEL A/B: FD BITS CHANNEL A/B: FD BITS CHANNEL A/B: FD BITS CHANNEL A/B: FD BITS CHANNEL A/B: FD BITS CHANNEL A/B: FD BITS 06709-014 tS DECIMATED DCOA/DCOB tH Figure 5. Decimated IQ Mode CMOS Data and Fast Detect Output Timing CLK– CLK+ tPD LVDS DATA CHANNEL A: DATA CHANNEL B: DATA CHANNEL A: DATA CHANNEL B: DATA CHANNEL A: DATA LVDS FAST DET CHANNEL A: FD CHANNEL B: FD CHANNEL A: FD CHANNEL B: FD CHANNEL A: FD tDCO 06709-015 DCO– DCO+ Figure 6. Decimated Interleaved LVDS Mode Data and Fast Detect Output Timing CLK+ tHSYNC 06709-016 tSSYNC SYNC Figure 7. SYNC Timing Inputs Rev. B | Page 16 of 84 Data Sheet AD6655 CLK+ CLK– tCSSCLK SMI SCLK tSSCLKSDFS tSSCLKSDFS SMI SDO DATA Figure 8. Signal Monitor SPORT Output Timing Rev. B | Page 17 of 84 DATA 06709-017 SMI SDFS AD6655 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 10. Parameter ELECTRICAL AVDD, DVDD to AGND DRVDD to DRGND AGND to DRGND VIN+A/VIN+B, VIN-A/VIN−B to AGND CLK+, CLK− to AGND SYNC to AGND VREF to AGND SENSE to AGND CML to AGND RBIAS to AGND CSB to AGND SCLK/DFS to DRGND SDIO/DCS to DRGND SMI SDO/OEB to DRGND SMI SCLK/PDWN to DRGND SMI SDFS to DRGND D0A/D0B through D13A/D13B to DRGND FD0A/FD0B through FD3A/FD3B to DRGND DCOA/DCOB to DRGND ENVIRONMENTAL Operating Temperature Range (Ambient) Maximum Junction Temperature Under Bias Storage Temperature Range (Ambient) THERMAL CHARACTERISTICS Rating −0.3 V to +2.0 V −0.3 V to +3.9 V −0.3 V to +0.3 V −0.3 V to AVDD + 0.2 V −0.3 V to +3.9 V −0.3 V to +3.9 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to +3.9 V −0.3 V to +3.9 V −0.3 V to DRVDD + 0.3 V −0.3 V to DRVDD + 0.3 V −0.3 V to DRVDD + 0.3 V −0.3 V to DRVDD + 0.3 V −0.3 V to DRVDD + 0.3 V −0.3 V to DRVDD + 0.3 V −0.3 V to DRVDD + 0.3 V The exposed paddle must be soldered to the ground plane for the LFCSP package. Soldering the exposed paddle to the customer board increases the reliability of the solder joints, maximizing the thermal capability of the package. Table 11. Thermal Resistance Package Type 64-Lead LFCSP 9 mm × 9 mm (CP-64-6) Airflow Velocity (m/s) 0 1.0 2.0 θJA1, 2 18.8 16.5 15.8 θJC1, 3 0.6 θJB1, 4 6.0 Unit °C/W °C/W °C/W Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board. Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). 3 Per MIL-Std 883, Method 1012.1. 4 Per JEDEC JESD51-8 (still air). 1 2 Typical θJA is specified for a 4-layer PCB with solid ground plane. As shown, airflow increases heat dissipation, which reduces θJA. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes, reduces the θJA. ESD CAUTION −40°C to +85°C 150°C −65°C to +125°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. B | Page 18 of 84 Data Sheet AD6655 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 DRGND D5B D4B D3B D2B D1B D0B (LSB) DVDD FD3B FD2B FD1B FD0B SYNC CSB CLK– CLK+ PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PIN 1 INDICATOR EXPOSED PADDLE, PIN 0 (BOTTOM OF PACKAGE) AD6655 PARALLEL CMOS TOP VIEW (Not to Scale) 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 SCLK/DFS SDIO/DCS AVDD AVDD VIN+B VIN–B RBIAS CML SENSE VREF VIN–A VIN+A AVDD SMI SDFS SMI SCLK/PDWN SMI SDO/OEB NOTES 1. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE PACKAGE PROVIDES THE ANALOG GROUND FOR THE PART. THIS EXPOSED PAD MUST BE CONNECTED TO GROUND FOR PROPER OPERATION. 06709-002 D5A D6A D7A DRGND DRVDD D8A D9A DVDD D10A D11A D12A D13A (MSB) FD0A FD1A FD2A FD3A 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 DRVDD D6B D7B D8B D9B D10B D11B D12B D13B (MSB) DCOB DCOA D0A (LSB) D1A D2A D3A D4A Figure 9. LFCSP Parallel CMOS Pin Configuration (Top View) Table 12. Pin Function Descriptions (Parallel CMOS Mode) Pin No. Mnemonic ADC Power Supplies 20, 64 DRGND 1, 21 DRVDD 24, 57 DVDD 36, 45, 46 AVDD 0 AGND, Exposed Pad ADC Analog 37 VIN+A 38 VIN−A 44 VIN+B 43 VIN−B 39 VREF 40 SENSE 42 RBIAS 41 CML 49 CLK+ 50 CLK− ADC Fast Detect Outputs 29 FD0A 30 FD1A 31 FD2A 32 FD3A 53 FD0B 54 FD1B 55 FD2B 56 FD3B Type Description Ground Supply Supply Supply Ground Digital Output Ground. Digital Output Driver Supply (1.8 V to 3.3 V). Digital Power Supply (1.8 V Nominal). Analog Power Supply (1.8 V Nominal). Analog Ground. The exposed thermal pad on the bottom of the package provides the analog ground for the part. This pad must be connected to ground for proper operation. Input Input Input Input Input/Output Input Input/Output Output Input Input Differential Analog Input Pin (+) for Channel A. Differential Analog Input Pin (−) for Channel A. Differential Analog Input Pin (+) for Channel B. Differential Analog Input Pin (−) for Channel B. Voltage Reference Input/Output. Voltage Reference Mode Select. (See Table 15 for details.) External Reference Bias Resistor. Common-Mode Level Bias Output for Analog Inputs. ADC Clock Input—True. ADC Clock Input—Complement. Output Output Output Output Output Output Output Output Channel A Fast Detect Indicator. (See Table 21 for details.) Channel A Fast Detect Indicator. (See Table 21 for details.) Channel A Fast Detect Indicator. (See Table 21 for details.) Channel A Fast Detect Indicator. (See Table 21 for details.) Channel B Fast Detect Indicator. (See Table 21 for details.) Channel B Fast Detect Indicator. (See Table 21 for details.) Channel B Fast Detect Indicator. (See Table 21 for details.) Channel B Fast Detect Indicator. (See Table 21 for details.) Rev. B | Page 19 of 84 AD6655 Pin No. Mnemonic Digital Input 52 SYNC Digital Outputs 12 D0A (LSB) 13 D1A 14 D2A 15 D3A 16 D4A 17 D5A 18 D6A 19 D7A 22 D8A 23 D9A 25 D10A 26 D11A 27 D12A 28 D13A (MSB) 58 D0B (LSB) 59 D1B 60 D2B 61 D3B 62 D4B 63 D5B 2 D6B 3 D7B 4 D8B 5 D9B 6 D10B 7 D11B 8 D12B 9 D13B (MSB) 11 DCOA 10 DCOB SPI Control 48 SCLK/DFS 47 SDIO/DCS 51 CSB Signal Monitor Port 33 SMI SDO/OEB 35 SMI SDFS 34 SMI SCLK/PDWN Data Sheet Type Description Input Digital Synchronization Pin. Slave mode only. Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel A Data Clock Output. Channel B Data Clock Output. Input Input/Output Input SPI Serial Clock/Data Format Select Pin in External Pin Mode. SPI Serial Data I/O/Duty Cycle Stabilizer Pin in External Pin Mode. SPI Chip Select. Active low. Input/Output Output Input/Output Signal Monitor Serial Data Output/Output Enable Input (Active Low) in External Pin Mode. Signal Monitor Serial Data Frame Sync. Signal Monitor Serial Clock Output/Power-Down Input (Active High) in External Pin Mode. Rev. B | Page 20 of 84 AD6655 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 DRGND D0+ (LSB) D0– (LSB) FD3+ FD3– FD2+ FD2– DVDD FD1+ FD1– FD0+ FD0– SYNC CSB CLK– CLK+ Data Sheet 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PIN 1 INDICATOR EXPOSED PADDLE, PIN 0 (BOTTOM OF PACKAGE) AD6655 PARALLEL LVDS TOP VIEW (Not to Scale) 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 SCLK/DFS SDIO/DCS AVDD AVDD VIN+B VIN–B RBIAS CML SENSE VREF VIN–A VIN+A AVDD SMI SDFS SMI SCLK/PDWN SMI SDO/OEB NOTES 1. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE PACKAGE PROVIDES THE ANALOG GROUND FOR THE PART. THIS EXPOSED PAD MUST BE CONNECTED TO GROUND FOR PROPER OPERATION. 06709-003 D7+ D8– D8+ DRGND DRVDD D9– D9+ DVDD D10– D10+ D11– D11+ D12– D12+ D13– (MSB) D13+ (MSB) 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 DRVDD D1– D1+ D2– D2+ D3– D3+ D4– D4+ DCO– DCO+ D5– D5+ D6– D6+ D7– Figure 10. LFCSP Interleaved Parallel LVDS Pin Configuration (Top View) Table 13. Pin Function Descriptions (Interleaved Parallel LVDS Mode) Pin No. Mnemonic ADC Power Supplies 20, 64 DRGND 1, 21 DRVDD 24, 57 DVDD 36, 45, 46 AVDD 0 AGND, Exposed Pad ADC Analog 37 VIN+A 38 VIN−A 44 VIN+B 43 VIN−B 39 VREF 40 SENSE 42 RBIAS 41 CML 49 CLK+ 50 CLK− ADC Fast Detect Outputs 54 FD0+ 53 FD056 FD1+ 55 FD1− 59 FD2+ 58 FD2− 61 FD3+ 60 FD3− Type Description Ground Supply Supply Supply Ground Digital Output Ground. Digital Output Driver Supply (1.8 V to 3.3 V). Digital Power Supply (1.8 V Nominal.) Analog Power Supply (1.8 V Nominal.) Analog Ground. The exposed thermal pad on the bottom of the package provides the analog ground for the part. This exposed pad must be connected to ground for proper operation. Input Input Input Input Input/Output Input Input/Output Output Input Input Differential Analog Input Pin (+) for Channel A. Differential Analog Input Pin (−) for Channel A. Differential Analog Input Pin (+) for Channel B. Differential Analog Input Pin (−) for Channel B. Voltage Reference Input/Output. Voltage Reference Mode Select. See Table 15 for details. External Reference Bias Resistor. Common-Mode Level Bias Output for Analog Inputs. ADC Clock Input—True. ADC Clock Input—Complement. Output Output Output Output Output Output Output Output Channel A/Channel B LVDS Fast Detect Indicator 0—True. See Table 21 for details. Channel A/Channel B LVDS Fast Detect Indicator 0—Complement. See Table 21 for details. Channel A/Channel B LVDS Fast Detect Indicator 1—True. See Table 21 for details. Channel A/Channel B LVDS Fast Detect Indicator 1—Complement. See Table 21 for details. Channel A/Channel B LVDS Fast Detect Indicator 2—True See Table 21 for details. Channel A/Channel B LVDS Fast Detect Indicator 2—Complement. See Table 21 for details. Channel A/Channel B LVDS Fast Detect Indicator 3—True. See Table 21 for details. Channel A/Channel B LVDS Fast Detect Indicator 3—Complement. See Table 21 for details. Rev. B | Page 21 of 84 AD6655 Pin No. Mnemonic Digital Input 52 SYNC Digital Outputs 63 D0+ (LSB) 62 D0− (LSB) 3 D1+ 2 D1− 5 D2+ 4 D2− 7 D3+ 6 D3− 9 D4+ 8 D4− 13 D5+ 12 D5− 15 D6+ 14 D6− 17 D7+ 16 D7− 19 D8+ 18 D8− 23 D9+ 22 D9− 26 D10+ 25 D10− 28 D11+ 27 D11− 30 D12+ 29 D12− 32 D13+ (MSB) 31 D13− (MSB) 11 DCO+ 10 DCO− SPI Control 48 SCLK/DFS 47 SDIO/DCS 51 CSB Signal Monitor Port 33 SMI SDO/OEB 35 SMI SDFS 34 SMI SCLK/PDWN Data Sheet Type Description Input Digital Synchronization Pin. Slave mode only. Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Channel A/Channel B LVDS Output Data 0—True. Channel A/Channel B LVDS Output Data 0—Complement. Channel A/Channel B LVDS Output Data 1—True. Channel A/Channel B LVDS Output Data 1—Complement. Channel A/Channel B LVDS Output Data 2—True. Channel A/Channel B LVDS Output Data 2—Complement. Channel A/Channel B LVDS Output Data 3—True. Channel A/Channel B LVDS Output Data 3—Complement. Channel A/Channel B LVDS Output Data 4—True. Channel A/Channel B LVDS Output Data 4—Complement. Channel A/Channel B LVDS Output Data 5—True. Channel A/Channel B LVDS Output Data 5—Complement. Channel A/Channel B LVDS Output Data 6—True. Channel A/Channel B LVDS Output Data 6—Complement. Channel A/Channel B LVDS Output Data 7—True. Channel A/Channel B LVDS Output Data 7—Complement. Channel A/Channel B LVDS Output Data 8—True. Channel A/Channel B LVDS Output Data 8—Complement. Channel A/Channel B LVDS Output Data 9—True. Channel A/Channel B LVDS Output Data 9—Complement. Channel A/Channel B LVDS Output Data 10—True. Channel A/Channel B LVDS Output Data 10—Complement. Channel A/Channel B LVDS Output Data 11—True. Channel A/Channel B LVDS Output Data 11—Complement. Channel A/Channel B LVDS Output Data 12—True. Channel A/Channel B LVDS Output Data 12—Complement. Channel A/Channel B LVDS Output Data 13—True. Channel A/Channel B LVDS Output Data 13—Complement. Channel A/Channel B LVDS Data Clock Output—True. Channel A/Channel B LVDS Data Clock Output—Complement. Input Input/Output Input SPI Serial Clock/Data Format Select Pin in External Pin Mode. SPI Serial Data I/O/Duty Cycle Stabilizer in External Pin Mode. SPI Chip Select (Active Low). Input/Output Output Input/Output Signal Monitor Serial Data Output/Output Enable Input (Active Low) in External Pin Mode. Signal Monitor Serial Data Frame Sync. Signal Monitor Serial Clock Output/Power-Down Input (Active High) in External Pin Mode. Rev. B | Page 22 of 84 Data Sheet AD6655 EQUIVALENT CIRCUITS 1kΩ SCLK/DFS VIN 06709-008 06709-004 26kΩ Figure 11. Equivalent Analog Input Circuit Figure 15. Equivalent SCLK/DFS Input Circuit AVDD 1.2V 10kΩ CLK– 06709-009 06709-005 CLK+ 1kΩ SENSE 10kΩ Figure 12. Equivalent Clock lnput Circuit Figure 16. Equivalent SENSE Circuit DRVDD AVDD 26kΩ 1kΩ DRGND 06709-010 06709-006 CSB Figure 17. Equivalent CSB Input Circuit Figure 13. Equivalent Digital Output Circuit AVDD DRVDD DRVDD VREF 26kΩ 6kΩ 1kΩ 06709-011 06709-007 SDIO/DCS Figure 18. Equivalent VREF Circuit Figure 14. Equivalent SDIO/DCS Circuit or SMI SDFS Circuit . Rev. B | Page 23 of 84 AD6655 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS AVDD = 1.8 V, DVDD = 1.8 V, DRVDD = 1.8 V, sample rate = 150 MSPS, DCS enabled, 1.0 V internal reference, 2 V p-p differential input, VIN = −1.0 dBFS, 64k sample, TA = 25°C, NCO enabled, FIR filter enabled, unless otherwise noted. In the FFT plots that follow, the location of the second and third harmonics is noted when they fall in the pass band of the filter. –60 SECOND HARMONIC THIRD HARMONIC THIRD HARMONIC –120 –120 10 15 20 25 30 35 FREQUENCY (MHz) –140 06709-018 5 0 0 AMPLITUDE (dBFS) –60 –80 20 25 30 35 FREQUENCY (MHz) –140 06709-019 15 0 0 AMPLITUDE (dBFS) –60 THIRD HARMONIC –80 15 20 25 FREQUENCY (MHz) 30 35 06709-020 –120 10 30 35 –80 –120 5 25 –60 –100 0 20 –40 –100 –140 15 150MSPS 332.1MHz @ –1dBFS SNR = 71.7dBc (72.7dBFS) SFDR = 95.0dBc fNCO = 321.5MHz –20 –40 10 Figure 23. AD6655-150 Single-Tone FFT with fIN = 220.1 MHz, fNCO = 205 MHz 150MSPS 140.1MHz @ –1dBFS SNR = 74.3dBc (75.3dBFS) SFDR = 83.3dBc fNCO = 56MHz –20 5 FREQUENCY (MHz) Figure 20. AD6655-150 Single-Tone FFT with fIN = 30.3 MHz, fNCO = 24 MHz 0 35 THIRD HARMONIC –120 10 30 –80 –120 5 25 –60 –100 0 20 –40 –100 –140 15 150MSPS 220.1MHz @ –1dBFS SNR = 71.8dBc (72.8dBFS) SFDR = 81.4dBc fNCO = 205MHz –20 –40 10 Figure 22. AD6655-150 Single-Tone FFT with fIN = 140.1 MHz, fNCO = 126 MHz 150MSPS 30.3MHz @ –1dBFS SNR = 74.8dBc (75.8dBFS) SFDR = 100dBc fNCO = 24MHz –20 5 FREQUENCY (MHz) Figure 19. AD6655-150 Single-Tone FFT with fIN = 2.4 MHz, fNCO = 18.75 MHz 0 SECOND HARMONIC –80 –100 0 AMPLITUDE (dBFS) –60 –100 –140 AMPLITUDE (dBFS) –40 06709-021 AMPLITUDE (dBFS) –40 –80 150MSPS 140.1MHz @ –1dBFS SNR = 73.7dBc (74.7dBFS) SFDR = 82.8dBc fNCO = 126MHz –20 06709-022 –20 AMPLITUDE (dBFS) 0 150MSPS 2.4MHz @ –1dBFS SNR = 74.7dBc (75.7dBFS) SFDR = 86.5dBc fNCO = 18.75MHz Figure 21. AD6655-150 Single-Tone FFT with fIN = 70.1 MHz, fNCO = 56 MHz Rev. B | Page 24 of 84 –140 0 5 10 15 20 25 30 35 FREQUENCY (MHz) Figure 24. AD6655-150 Single-Tone FFT with fIN = 332.1 MHz, fNCO = 321.5 MHz 06709-023 0 Data Sheet –20 AMPLITUDE (dBFS) –40 SECOND HARMONIC –60 THIRD HARMONIC –80 THIRD HARMONIC –80 –120 –120 5 20 15 10 25 30 35 FREQUENCY (MHz) Figure 25. AD6655-150 Single-Tone FFT with fIN = 445.1 MHz, fNCO = 429 MHz 0 –140 0 10 15 AMPLITUDE (dBFS) SECOND HARMONIC THIRD HARMONIC –100 25 30 125MSPS 140.1MHz @ –1dBFS SNR = 74.1dBc (75.1dBFS) SFDR = 90.3dBc fNCO = 142MHz –20 –60 20 Figure 28. AD6655-125 Single-Tone FFT with fIN = 70.3 MHz, fNCO = 78 MHz 0 –40 –80 5 FREQUENCY (MHz) 125MSPS 2.4MHz @ –1dBFS SNR = 74.5dBc (75.5dBFS) SFDR = 87.8dBc fNCO = 15.75MHz –20 –40 –60 THIRD HARMONIC –80 –100 –120 0 5 15 10 20 25 30 FREQUENCY (MHz) Figure 26. AD6655-125 Single-Tone FFT with fIN =2.4 MHz, fNCO = 15.75 MHz 0 –140 06709-025 –140 0 10 15 AMPLITUDE (dBFS) THIRD HARMONIC –80 –100 30 125MSPS 220.1MHz @ –1dBFS SNR = 73.4dBc (74.4dBFS) SFDR = 90.2dBc fNCO = 231MHz –20 –60 25 Figure 29. AD6655-125 Single-Tone FFT with fIN = 140.1 MHz, fNCO = 142 MHz 0 –40 20 FREQUENCY (MHz) 125MSPS 30.3MHz @ –1dBFS SNR = 74.7dBc (75.7dBFS) SFDR = 89.6dBc fNCO = 21MHz –20 5 06709-028 –120 –40 –60 –80 –100 –120 –120 0 5 10 15 20 FREQUENCY (MHz) 25 30 –140 06709-026 –140 Figure 27. AD6655-125 Single-Tone FFT with fIN = 30.3 MHz, fNCO = 21 MHz 0 5 10 15 20 FREQUENCY (MHz) 25 30 06709-029 AMPLITUDE (dBFS) –60 –100 –140 AMPLITUDE (dBFS) –40 –100 0 125MSPS 70.3MHz @ –1dBFS SNR = 74.6dBc (75.6dBFS) SFDR = 86.1dBc fNCO = 78MHz –20 06709-024 AMPLITUDE (dBFS) 0 150MSPS 445.1MHz @ –1dBFS SNR = 67.4dBc (65.4dBFS) SFDR = 74.1dBc fNCO = 429MHz 06709-027 0 AD6655 Figure 30. AD6655-125 Single-Tone FFT with fIN = 220.1 MHz, fNCO = 231 MHz Rev. B | Page 25 of 84 AD6655 Data Sheet 95 120 80 90 SFDR (dBFS) SFDR = +85°C 85 SNR (dBFS) SNR/SFDR (dBc) SNR/SFDR (dBc AND dBFS) 100 60 40 SFDR (dBc) SFDR = +25°C 80 SFDR = –40°C 75 SNR = +25°C SNR = +85°C SNR = –40°C 70 85dB REFERENCE LINE 20 65 –80 –70 –60 –50 –40 –30 –20 –10 0 INPUT AMPLITUDE (dBFS) 60 06709-030 0 –90 Figure 31. AD6655-150 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 2.4 MHz, fNCO = 18.75 MHz 0 50 100 150 200 250 300 350 400 450 INPUT FREQUENCY (MHz) 06709-033 SNR (dBc) Figure 34. AD6655-125 Single-Tone SNR/SFDR vs. Input Frequency (fIN) and Temperature with DRVDD = 3.3 V 120 –1.5 0.5 –2.0 0.4 GAIN ERROR (%FSR) SNR/SFDR (dBc AND dBFS) SNR (dBFS) 80 60 SFDR (dBc) 40 85dB REFERENCE LINE –2.5 0.3 OFFSET –3.0 0.2 GAIN 0.1 –3.5 20 OFFSET ERROR (%FSR) SFDR (dBFS) 100 SNR (dBc) –70 –60 –50 –40 –30 –20 –10 0 INPUT AMPLITUDE (dBFS) –4.0 –40 0 20 40 60 80 TEMPERATURE (°C) Figure 32. AD6655-150 Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fIN = 98.12 MHz, fNCO = 100.49 MHz Figure 35. AD6655-150 Gain and Offset vs. Temperature 95 0 90 –20 SFDR/IMD3 (dBc AND dBFS) SFDR = +85°C 85 SFDR = +25°C 80 SFDR = –40°C 75 SNR = +25°C SNR = +85°C SNR = –40°C 70 SFDR (dBc) –40 IMD3 (dBc) –60 –80 IMD3 (dBFS) SFDR (dBFS) –100 65 0 50 100 150 200 250 300 INPUT FREQUENCY (MHz) 350 400 450 –120 –90 06709-032 60 Figure 33. AD6655-125 Single-Tone SNR/SFDR vs. Input Frequency (fIN) and Temperature with DRVDD = 1.8 V –78 –66 –54 –42 –30 INPUT AMPLITUDE (dBFS) –18 –6 06709-035 SNR/SFDR (dBc) 0 –20 06709-034 –80 06709-031 0 –90 Figure 36. AD6655-150 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fIN1 = 29.12 MHz, fIN2 = 32.12 MHz, fS = 150 MSPS, fNCO = 22 MHz Rev. B | Page 26 of 84 Data Sheet AD6655 0 0 –20 SFDR (dBc) AMPLITUDE (dBFS) –40 IMD3 (dBc) –60 –80 –40 –60 –80 –100 IMD3 (dBFS) SFDR (dBFS) –100 –120 –66 –54 –42 –30 –18 –6 INPUT AMPLITUDE (dBFS) –140 0 –20 –20 –40 –40 AMPLITUDE (dBFS) 0 –120 06709-037 –120 5 10 15 20 25 0 7.5 15.0 22.5 30.0 37.5 FREQUENCY (MHz) Figure 41. AD6655-150 Noise Power Ratio (NPR) 95 150MSPS 29.12MHz @ –7dBFS 32.12MHz @ –7dBFS SFDR = 89.1dBc (96.1dBFS) fNCO = 22MHz SFDR (dBc) –40 SNR/SFDR (dBc) AMPLITUDE (dBFS) 35 –140 30 Figure 38. AD6655-125, Two 64k WCDMA Carriers with fIN = 170 MHz, fS = 122.88 MHz, fNCO = 168.96 MHz –20 30 NPR = 64.5dBc NOTCH @ 18.5MHz NOTCH WIDTH = 3MHz FREQUENCY (MHz) 0 25 –80 –100 0 20 –60 –100 –140 15 Figure 40. AD6655-150 Two Tone FFT with fIN1 = 169.12 MHz, fIN2 = 172.12 MHz, fS = 150 MSPS, fNCO = 177 MHz 0 –80 10 FREQUENCY (MHz) Figure 37. AD6655-150 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fIN1 = 169.12 MHz, fIN2 = 172.12 MHz, fS = 150 MSPS, fNCO = 177 MHz –60 5 06709-039 –78 06709-036 –120 –90 06709-040 SFDR/IMD3 (dBc AND dBFS) –20 AMPLITUDE (dBFS) 150MSPS 169.12MHz @ –7dBFS 172.12MHz @ –7dBFS SFDR = 85.5dBc (92.5dBFS) fNCO = 177MHz –60 –80 85 SNR (dBc) 75 –100 0 5 10 15 20 25 FREQUENCY (MHz) 30 35 65 06709-038 –140 Figure 39. AD6655-150 Two-Tone FFT with fIN1 = 29.12 MHz, fIN2 = 32.12 MHz, fS = 150 MSPS, fNCO = 22 MHz 06709-041 –120 0 25 50 75 100 125 150 SAMPLE RATE (MSPS) Figure 42. AD6655-150 Single-Tone SNR/SFDR vs. Sample Rate (fs) with fIN = 2.3 MHz Rev. B | Page 27 of 84 AD6655 Data Sheet 12 90 0.85 LSB rms 85 SFDR 8 SNR/SFDR (dBc) 6 4 N–3 N–2 N–1 N N+1 N+2 SNR 65 0.2 06709-042 0 N+3 OUTPUT CODE Figure 43. AD6655 Grounded Input Histogram 85 SFDR DCS ON SFDR DCS OFF 80 SNR DCS ON 75 40 50 60 DUTY CYCLE (%) 70 80 06709-043 SNR DCS OFF 30 0.4 0.6 0.8 1.0 1.2 INPUT COMMON-MODE VOLTAGE (V) 1.4 Figure 45. AD6655-150 SNR/SFDR vs. Input Common Mode (VCM) with fIN = 30.3 MHz, fNCO = 45 MHz 90 SNR/SFDR (dBc) 75 70 2 70 20 80 06709-044 NUMBER OF HITS (1M) 10 Figure 44. AD6655-150 SNR/SFDR vs. Duty Cycle with fIN = 30.3 MHz, fNCO = 45 MHz Rev. B | Page 28 of 84 Data Sheet AD6655 THEORY OF OPERATION The AD6655 has two analog input channels, two decimating channels, and two digital output channels. The intermediate frequency (IF) input signal passes through several stages before appearing at the output port(s) as a filtered, decimated digital signal. The dual ADC design can be used for diversity reception of signals, where the ADCs operate identically on the same carrier but from two separate antennae. The ADCs can also be operated with independent analog inputs. The user can sample any fS/2 frequency segment from dc to 150 MHz using appropriate lowpass or band-pass filtering at the ADC inputs with little loss in ADC performance. Operation to 450 MHz analog input is permitted but occurs at the expense of increased ADC noise and distortion. In nondiversity applications, the AD6655 can be used as a baseband receiver, where one ADC is used for I input data, and the other is used for Q input data. Synchronization capability is provided to allow synchronized timing between multiple channels or multiple devices. The NCO phase can be set to produce a known offset relative to another channel or device. Programming and control of the AD6655 are accomplished using a 3-bit SPI-compatible serial interface. ADC ARCHITECTURE ANALOG INPUT CONSIDERATIONS The analog input to the AD6655 is a differential switchedcapacitor SHA that has been designed for optimum performance while processing a differential input signal. The clock signal alternatively switches the SHA between sample mode and hold mode (see Figure 46). When the SHA is switched into sample mode, the signal source must be capable of charging the sample capacitors and settling within 1/2 of a clock cycle. A small resistor in series with each input can help reduce the peak transient current required from the output stage of the driving source. A shunt capacitor can be placed across the inputs to provide dynamic charging currents. This passive network creates a low-pass filter at the ADC input; therefore, the precise values are dependent on the application. In IF undersampling applications, any shunt capacitors should be reduced. In combination with the driving source impedance, the shunt capacitors limit the input bandwidth. Refer to Application Note AN-742, Frequency Domain Response of SwitchedCapacitor ADCs; Application Note AN-827, A Resonant Approach to Interfacing Amplifiers to Switched-Capacitor ADCs; and the Analog Dialogue article, “Transformer-Coupled Front-End for Wideband A/D Converters,” for more information on this subject (see www.analog.com). In general, the precise values are dependent on the application. S AD6655 architecture consists of a front-end sample-and-hold amplifier (SHA) followed by a pipelined, switched-capacitor ADC. The quantized outputs from each stage are combined into a final 14-bit result in the digital correction logic. The pipelined architecture permits the first stage to operate on a new input sample and the remaining stages to operate on the preceding samples. Sampling occurs on the rising edge of the clock. The input stage of each channel contains a differential SHA that can be ac- or dc-coupled in differential or single-ended modes. The output staging block aligns the data, corrects errors, and passes the data to the output buffers. The output buffers are powered from a separate supply, allowing adjustment of the output voltage swing. During power-down, the output buffers go into a high impedance state. CS VIN+ CPIN, PAR S H CS VIN– CH CPIN, PAR S 06709-048 Each stage of the pipeline, excluding the last, consists of a low resolution flash ADC connected to a switched-capacitor digitalto-analog converter (DAC) and an interstage residue amplifier (MDAC). The residue amplifier magnifies the difference between the reconstructed DAC output and the flash input for the next stage in the pipeline. One bit of redundancy is used in each stage to facilitate digital correction of flash errors. The last stage simply consists of a flash ADC. CH S Figure 46. Switched-Capacitor SHA Input For best dynamic performance, the source impedances driving VIN+ and VIN− should be matched such that common-mode settling errors are symmetrical. These errors are reduced by the common-mode rejection of the ADC. An internal differential reference buffer creates positive and negative reference voltages that define the input span of the ADC core. The output common mode of the reference buffer is set to VCMREF (approximately 1.6 V). Input Common Mode The analog inputs of the AD6655 are not internally dc biased. In ac-coupled applications, the user must provide this bias externally. Setting the device so that VCM = 0.55 × AVDD is recommended for optimum performance, but the device functions over a wider range with reasonable performance (see Figure 45). Rev. B | Page 29 of 84 AD6655 Data Sheet An on-board common-mode voltage reference is included in the design and is available from the CML pin. Optimum performance is achieved when the common-mode voltage of the analog input is set by the CML pin voltage (typically 0.55 × AVDD). The signal characteristics must be considered when selecting a transformer. Most RF transformers saturate at frequencies below a few megahertz (MHz). Excessive signal power can also cause core saturation, which leads to distortion. Differential Input Configurations At input frequencies in the second Nyquist zone and above, the noise performance of most amplifiers is not adequate to achieve the true SNR performance of the AD6655. For applications where SNR is a key parameter, differential double balun coupling is the recommended input configuration (see Figure 49). Optimum performance is achieved while driving the AD6655 in a differential input configuration. For baseband applications, the AD8138, ADA4937-2, and ADA4938-2 differential drivers provide excellent performance and a flexible interface to the ADC. The output common-mode voltage of the AD8138 is easily set with the CML pin of the AD6655 (see Figure 47), and the driver can be configured in a Sallen-Key filter topology to provide band limiting of the input signal. An alternative to using a transformer-coupled input at frequencies in the second Nyquist zone is to use the AD8352 differential driver is shown in Figure 50. See the AD8352 data sheet for more information. In addition, if the application requires an amplifier with variable gain, the AD8375 or AD8376 digital variable gain amplifiers (DVGAs) provide good performance driving the AD6655. 499Ω R AVDD 523Ω AD6655 C AD8138 0.1µF VIN+ 499Ω R CML VIN– In any configuration, the value of the shunt capacitor, C, is dependent on the input frequency and source impedance and may need to be reduced or removed. Table 14 displays recommended values to set the RC network. However, these values are dependent on the input signal and should be used only as a starting guide. 06709-049 49.9Ω 1V p-p 499Ω Figure 47. Differential Input Configuration Using the AD8138 For baseband applications where SNR is a key parameter, differential transformer coupling is the recommended input configuration. An example is shown in Figure 48. To bias the analog input, the CML voltage can be connected to the center tap of the secondary winding of the transformer. Table 14. Example RC Network Frequency Range (MHz) 0 to 70 70 to 200 200 to 300 >300 R VIN+ 2V p-p 49.9Ω C AD6655 R CML 06709-050 VIN– R Series (Ω, Each) 33 33 15 15 0.1µF Figure 48. Differential Transformer-Coupled Configuration 0.1µF 0.1µF R 2V p-p VIN+ 25Ω S P S 25Ω 0.1µF AD6655 C 0.1µF R CML VIN– 06709-051 PA Figure 49. Differential Double Balun Input Configuration VCC 0Ω 16 0.1µF 8, 13 1 11 0.1µF 2 CD RD RG 3 ANALOG INPUT 0.1µF 0Ω VIN+ 200Ω AD8352 10 4 5 R 0.1µF 200Ω C R AD6655 VIN– CML 14 0.1µF 0.1µF Figure 50. Differential Input Configuration Using the AD8352 Rev. B | Page 30 of 84 06709-052 0.1µF ANALOG INPUT C Differential (pF) 15 5 5 Open Data Sheet AD6655 Single-Ended Input Configuration A single-ended input can provide adequate performance in cost-sensitive applications. In this configuration, SFDR and distortion performance degrade due to the large input commonmode swing. If the source impedances on each input are matched, there should be little effect on SNR performance. Figure 51 shows a typical single-ended input configuration. This puts the reference amplifier in a noninverting mode with the VREF output defined as follows: R2 VREF = 0.5 × 1 + R1 The input range of the ADC always equals twice the voltage at the reference pin for either an internal or an external reference. AVDD 10µF VIN+A/VIN+B 1kΩ VIN–A/VIN–B R 49.9Ω 0.1µF 1kΩ AVDD 1kΩ 10µF 0.1µF ADC CORE AD6655 C R VIN– 1kΩ VREF 06709-053 2V p-p VIN+ 1.0µF 0.1µF SELECT LOGIC Figure 51. Single-Ended Input Configuration SENSE VOLTAGE REFERENCE 06709-054 0.5V A stable and accurate voltage reference is built into the AD6655. The input range can be adjusted by varying the reference voltage applied to the AD6655, using either the internal reference or an externally applied reference voltage. The input span of the ADC tracks reference voltage changes linearly. The various reference modes are summarized in the sections that follow. The Reference Decoupling section describes the best practices PCB layout of the reference. AD6655 Figure 52. Internal Reference Configuration VIN+A/VIN+B VIN–A/VIN–B Internal Reference Connection ADC CORE A comparator within the AD6655 detects the potential at the SENSE pin and configures the reference into four possible modes, which are summarized in Table 15. If SENSE is grounded, the reference amplifier switch is connected to the internal resistor divider (see Figure 52), setting VREF to 1.0 V. Connecting the SENSE pin to VREF switches the reference amplifier output to the SENSE pin, completing the loop and providing a 0.5 V reference output. If a resistor divider is connected externally to the chip, as shown in Figure 53, the switch again sets to the SENSE pin. VREF 1.0µF 0.1µF R2 SELECT LOGIC SENSE AD6655 Figure 53. Programmable Reference Configuration Table 15. Reference Configuration Summary Selected Mode External Reference SENSE Voltage AVDD Resulting VREF (V) N/A Resulting Differential Span (V p-p) 2 × external reference Internal Fixed Reference VREF 0.5 1.0 Programmable Reference 0.2 V to VREF R2 (see Figure 53) 0.5 × 1 + R1 2 × VREF Internal Fixed Reference AGND to 0.2 V 1.0 2.0 Rev. B | Page 31 of 84 06709-055 0.5V R1 AD6655 Data Sheet If the internal reference of the AD6655 is used to drive multiple converters to improve gain matching, the loading of the reference by the other converters must be considered. Figure 54 depicts how the internal reference voltage is affected by loading. AVDD 1.2V CLK+ CLK– 0 2pF 06709-058 2pF –0.25 VREF = 1.0V Figure 56. Equivalent Clock Input Circuit –0.50 Clock Input Options The AD6655 has a very flexible clock input structure. Clock input can be a CMOS, LVDS, LVPECL, or sine wave signal. Regardless of the type of signal being used, clock source jitter is of the most concern, as described in the Jitter Considerations section. –0.75 –1.00 –1.25 0 0.5 1.0 2.0 1.5 LOAD CURRENT (mA) 06709-056 Figure 54. VREF Accuracy vs. Load External Reference Operation The use of an external reference may be necessary to enhance the gain accuracy of the ADC or improve thermal drift characteristics. Figure 55 shows the typical drift characteristics of the internal reference in both 1.0 V and 0.5 V modes. 2.5 Figure 57 and Figure 58 show two preferred methods for clocking the AD6655 (at clock rates to up to 625 MHz). A low jitter clock source is converted from a single-ended signal to a differential signal using an RF transformer. The back-to-back Schottky diodes across the transformer secondary limit clock excursions into the AD6655 to approximately 0.8 V p-p differential. This helps prevent the large voltage swings of the clock from feeding through to other portions of the AD6655, while preserving the fast rise and fall times of the signal, which are critical to a low jitter performance. REFERENCE VOLTAGE ERROR (mV) 2.0 1.5 Mini-Circuits® ADT1–1WT, 1:1Z 0.1µF XFMR 0.1µF CLOCK INPUT 1.0 CLK+ 100Ω 50Ω ADC AD6655 0.1µF 0.5 CLK– 0 SCHOTTKY DIODES: HSMS2822 0.1µF –0.5 06709-059 REFERENCE VOLTAGE ERROR (%) VREF = 0.5V Figure 57. Transformer Coupled Differential Clock (Up to 200 MHz) –1.0 –1.5 –2.0 1nF 0 20 40 TEMPERATURE (°C) 60 80 CLOCK INPUT 0.1µF CLK+ 50Ω ADC AD6655 0.1µF 1nF Figure 55. Typical VREF Drift When the SENSE pin is tied to AVDD, the internal reference is disabled, allowing the use of an external reference. An internal reference buffer loads the external reference with an equivalent 6 kΩ load (see Figure 18). The internal buffer generates the positive and negative full-scale references for the ADC core. Therefore, the external reference must be limited to a maximum of 1.0 V. CLOCK INPUT CONSIDERATIONS CLK– SCHOTTKY DIODES: HSMS2822 06709-157 –20 06709-057 –2.5 –40 Figure 58. Balun-Coupled Differential Clock (Up to 625 MHz) If a low jitter clock source is not available, another option is to ac couple a differential PECL signal to the sample clock input pins as shown in Figure 59. The AD9510/AD9511/AD9512/ AD9513/AD9514/AD9515/AD9516 clock drivers offer excellent jitter performance. For optimum performance, the AD6655 sample clock inputs, CLK+ and CLK−, should be clocked with a differential signal. The signal is typically ac-coupled into the CLK+ and CLK− pins via a transformer or capacitors. These pins are biased internally (see Figure 56) and require no external bias. Rev. B | Page 32 of 84 Data Sheet AD6655 Input Clock Divider 0.1µF 0.1µF CLOCK INPUT CLK+ 0.1µF 0.1µF ADC AD6655 CLK– 50kΩ 240Ω 50kΩ 240Ω 06709-060 CLOCK INPUT 100Ω AD951x PECL DRIVER Figure 59. Differential PECL Sample Clock (Up to 625 MHz) A third option is to ac-couple a differential LVDS signal to the sample clock input pins, as shown in Figure 60. The AD9510/ AD9511/AD9512/AD9513/AD9514/AD9515/AD9516 clock drivers offer excellent jitter performance. The AD6655 contains an input clock divider with the ability to divide the input clock by integer values between 1 and 8. If a divide ratio other than 1 is selected, the duty cycle stabilizer is automatically enabled. The AD6655 clock divider can be synchronized using the external SYNC input. Bit 1 and Bit 2 of Register 0x100 allow the clock divider to be resynchronized on every SYNC signal or only on the first SYNC signal after the register is written. A valid SYNC causes the clock divider to reset to its initial state. This synchronization feature allows multiple parts to have their clock dividers aligned to guarantee simultaneous input sampling. Clock Duty Cycle 0.1µF 0.1µF CLOCK INPUT CLK+ 0.1µF 0.1µF ADC AD6655 CLK– 50kΩ 06709-061 CLOCK INPUT 100Ω AD951x LVDS DRIVER 50kΩ Figure 60. Differential LVDS Sample Clock (Up to 625 MHz) In some applications, it may be acceptable to drive the sample clock inputs with a single-ended CMOS signal. In such applications, the CLK+ pin should be driven directly from a CMOS gate, and the CLK− pin should be bypassed to ground with a 0.1 µF capacitor in parallel with a 39 kΩ resistor (see Figure 61). CLK+ can be driven directly from a CMOS gate. Although the CLK+ input circuit supply is AVDD (1.8 V), this input is designed to withstand input voltages of up to 3.6 V, making the selection of the drive logic voltage very flexible. VCC 0.1µF CLOCK INPUT 50Ω 1kΩ OPTIONAL 0.1µF 100Ω AD951x CMOS DRIVER 1kΩ CLK+ ADC AD6655 CLK– 39kΩ 06709-062 0.1µF Figure 61. Single-Ended 1.8 V CMOS Sample Clock (Up to 150 MSPS) Typical high speed ADCs use both clock edges to generate a variety of internal timing signals and, as a result, may be sensitive to clock duty cycle. Commonly, a ±5% tolerance is required on the clock duty cycle to maintain dynamic performance characteristics. The AD6655 contains a duty cycle stabilizer (DCS) that retimes the nonsampling (falling) edge, providing an internal clock signal with a nominal 50% duty cycle. This allows the user to provide a wide range of clock input duty cycles without affecting the performance of the AD6655. Noise and distortion performance are nearly flat for a wide range of duty cycles with the DCS on, as shown in Figure 44. Jitter on the rising edge of the input clock is still of paramount concern and is not easily reduced by the internal stabilization circuit. The duty cycle control loop does not function for clock rates less than 20 MHz nominally. The loop has a time constant associated with it that must be considered when the clock rate can change dynamically. A wait time of 1.5 µs to 5 µs is required after a dynamic clock frequency increase or decrease before the DCS loop is relocked to the input signal. During the time period that the loop is not locked, the DCS loop is bypassed, and internal device timing is dependent on the duty cycle of the input clock signal. In such applications, it may be appropriate to disable the duty cycle stabilizer. In all other applications, enabling the DCS circuit is recommended to maximize ac performance. Jitter Considerations High speed, high resolution ADCs are sensitive to the quality of the clock input. The degradation in SNR at a given input frequency (fIN) due to jitter (tJ) can be calculated by VCC 50Ω 1kΩ AD951x CMOS DRIVER OPTIONAL 0.1µF 100Ω 1kΩ 0.1µF CLK+ ADC AD6655 CLK– Figure 62. Single-Ended 3.3 V CMOS Sample Clock (Up to 150 MSPS) SNRHF = −10 log[(2π × fIN × tJRMS)2 + 10 ( / SNRLF /10) ] 06709-063 0.1µF CLOCK INPUT In the equation, the rms aperture jitter represents the rootmean-square of all jitter sources, which include the clock input, the analog input signal, and the ADC aperture jitter specification. IF undersampling applications are particularly sensitive to jitter, as shown in Figure 63. Rev. B | Page 33 of 84 AD6655 Data Sheet 75 0.6 1.50 0.05ps TOTAL POWER MEASURED 70 1.25 0.5 0.50ps 1.00ps 1.50ps 100 0.1 IDRVDD 1000 INPUT FREQUENCY (MHz) 0 0 50 25 100 75 125 0 150 06709-065 10 0.2 0.25 2.00ps 2.50ps 3.00ps 1 IDVDD 0.50 SAMPLE RATE (MSPS) Figure 64. AD6655-150 Power and Current vs. Sample Rate Figure 63. SNR vs. Input Frequency and Jitter Refer to Application Note AN-501 and Application Note AN-756 for more information about jitter performance as it relates to ADCs (see www.analog.com). 0.6 1.50 0.5 1.25 TOTAL POWER TOTAL POWER (W) The clock input should be treated as an analog signal in cases where aperture jitter may affect the dynamic range of the AD6655. Power supplies for clock drivers should be separated from the ADC output driver supplies to avoid modulating the clock signal with digital noise. Low jitter, crystal-controlled oscillators make the best clock sources. If the clock is generated from another type of source (by gating, dividing, or another method), it should be retimed by the original clock at the last step. 1.00 0.4 IAVDD 0.75 0.3 0.50 0.2 IDVDD 0.25 SUPPLY CURRENT (A) 45 0.3 0.1 POWER DISSIPATION AND STANDBY MODE IDRVDD 0 As shown in Figure 64 through Figure 67, the power dissipated by the AD6655 is proportional to its sample rate. In CMOS output mode, the digital power dissipation is determined primarily by the strength of the digital drivers and the load on each output bit. The maximum DRVDD current (IDRVDD) can be calculated by 0 25 75 50 100 0 125 06709-166 50 0.75 SAMPLE RATE (MSPS) Figure 65. AD6655-125 Power and Current vs. Sample Rate 0.5 1.25 IDRVDD = VDRVDD × CLOAD × fCLK × N 0.4 1.00 This maximum current occurs when every output bit switches on every clock cycle, that is, a full-scale square wave at the Nyquist frequency of fCLK/2. In practice, the DRVDD current is established by the average number of output bits switching, which is determined by the sample rate and the characteristics of the analog input signal. Reducing the capacitive load presented to the output drivers can minimize digital power consumption. The data in Figure 64 through Figure 67 was taken using the same operating conditions as those used for the Typical Performance Characteristics, with a 5 pF load on each output driver. TOTAL POWER (W) TOTAL POWER where N is the number of output bits (30, in the case of the AD6655, assuming the FD bits are inactive). 0.75 0.3 IAVDD 0.50 0.2 IDVDD 0.25 Rev. B | Page 34 of 84 SUPPLY CURRENT (A) 55 0.4 0.1 IDRVDD 0 0 25 50 75 100 0 SAMPLE RATE (MSPS) Figure 66. AD6655-105 Power and Current vs. Sample Rate 06709-167 60 IAVDD 1.00 06709-064 SNR (dBc) 65 SUPPLY CURRENT (A) TOTAL POWER (W) 0.20ps Data Sheet AD6655 1.00 0.4 0.3 TOTAL POWER IAVDD 0.50 0.2 IDVDD 0.25 The output data format can be selected for either offset binary or twos complement by setting the SCLK/DFS pin when operating in the external pin mode (see Table 16). As detailed in Application Note AN-877, Interfacing to High Speed ADCs via SPI, the data format can be selected for offset binary, twos complement, or gray code when using the SPI control. SUPPLY CURRENT (A) TOTAL POWER (W) 0.75 tions requiring the ADC to drive large capacitive loads or large fanouts may require external buffers or latches. 0.1 Table 16. SCLK/DFS Mode Selection (External Pin Mode) 0 0 20 40 60 0 80 SAMPLE RATE (MSPS) 06709-168 IDRVDD Figure 67. AD6655-80 Power and Current vs. Sample Rate By asserting PDWN (either through the SPI port or by asserting the PDWN pin high), the AD6655 is placed in power-down mode. In this state, the ADC typically dissipates 2.5 mW. During power-down, the output drivers are placed in a high impedance state. Asserting the PDWN pin low returns the AD6655 to its normal operating mode. Note that PDWN is referenced to the digital output driver supply (DRVDD) and should not exceed that supply voltage. PDWN can be driven with 1.8 V logic, even when DRVDD is at 3.3 V. Low power dissipation in power-down mode is achieved by shutting down the reference, reference buffer, biasing networks, and clock. Internal capacitors are discharged when entering power-down mode and then must be recharged when returning to normal operation. As a result, wake-up time is related to the time spent in power-down mode, and shorter power-down cycles result in proportionally shorter wake-up times. When using the SPI port interface, the user can place the ADC in power-down mode or standby mode. Standby mode allows the user to keep the internal reference circuitry powered when faster wake-up times are required. See the Memory Map Register Description section and Application Note AN-877, Interfacing to High Speed ADCs via SPI at www.analog.com for additional details. DIGITAL OUTPUTS The AD6655 output drivers can be configured to interface with 1.8 V to 3.3 V CMOS logic families by matching DRVDD to the digital supply of the interfaced logic. Alternatively, the AD6655 outputs can be configured for either ANSI LVDS or reduced drive LVDS using a 1.8 V DRVDD supply. In CMOS output mode, the output drivers are sized to provide sufficient output current to drive a wide variety of logic families. However, large drive currents tend to cause current glitches on the supplies that may affect converter performance. Applica- Voltage at Pin AGND (default) AVDD SCLK/DFS Offset binary Twos complement SDIO/DCS DCS disabled DCS enabled Digital Output Enable Function (OEB) The AD6655 has a flexible three-state ability for the digital output pins. The three-state mode is enabled using the SMI SDO/OEB pin or through the SPI interface. If the SMI SDO/OEB pin is low, the output data drivers are enabled. If the SMI SDO/OEB pin is high, the output data drivers are placed in a high impedance state. This OEB function is not intended for rapid access to the data bus. Note that OEB is referenced to the digital output driver supply (DRVDD) and should not exceed that supply voltage. OEB can be driven with 1.8 V logic even when DRVDD is at 3.3 V. When using the SPI interface, the data and fast detect outputs of each channel can be independently three-stated by using the output enable bar bit (Bit 4) in Register 0x14. Interleaved CMOS Mode Setting Bit 5 in Register 0x14 enables interleaved CMOS output mode. In this mode, output data is routed through Port A with the ADC Channel A output data present on the rising edge of DCO and the ADC Channel B output data present on the falling edge of DCO. Timing The AD6655 provides latched data with a pipeline delay that is dependent on which of the digital back end features are enabled. Data outputs are available one propagation delay (tPD) after the rising edge of the clock signal. The length of the output data lines and loads placed on them should be minimized to reduce transients within the AD6655. These transients can degrade converter dynamic performance. The lowest typical conversion rate of the AD6655 is 10 MSPS. At clock rates below 10 MSPS, dynamic performance may degrade. Data Clock Output (DCO) The AD6655 also provides data clock output (DCO) intended for capturing the data in an external register. Figure 2 through Figure 6 show a graphical timing description of the AD6655 output modes. Rev. B | Page 35 of 84 AD6655 Data Sheet Table 17. Output Data Format Input (V) VIN+ – VIN– VIN+ – VIN– VIN+ – VIN– VIN+ – VIN– VIN+ – VIN– Condition (V) < –VREF – 0.5 LSB = –VREF =0 = +VREF – 1.0 LSB > +VREF – 0.5 LSB Offset Binary Output Mode 00 0000 0000 0000 00 0000 0000 0000 10 0000 0000 0000 11 1111 1111 1111 11 1111 1111 1111 Rev. B | Page 36 of 84 Twos Complement Mode 10 0000 0000 0000 10 0000 0000 0000 00 0000 0000 0000 01 1111 1111 1111 01 1111 1111 1111 OR 1 0 0 0 1 Data Sheet AD6655 DIGITAL DOWNCONVERTER The AD6655 includes a digital processing section that provides filtering and reduces the output data rate. This digital processing section includes a numerically controlled oscillator (NCO), a half-band decimating filter, an FIR filter, and a second coarse NCO (fADC/8 fixed value) for output frequency translation. Each of these processing blocks (except the decimating half-band filter) has control lines that allow it to be independently enabled and disabled to provide the desired processing function. The digital downconverter can be configured to output either real data or complex output data. These blocks can be configured in five recommended combinations to implement different signal processing functions. DOWNCONVERTER MODES a maximum usable bandwidth of 16.5 MHz when using the filter in real mode (NCO bypassed) or a maximum usable bandwidth of 33.0 MHz when using the filter in the complex mode (NCO enabled). The optional fixed-coefficient FIR filter provides additional filtering capability to sharpen the half-band roll-off to enhance the alias protection. It removes the negative frequency images to avoid aliasing negative frequencies for real outputs. fADC/8 FIXED-FREQUENCY NCO A fixed fADC/8 NCO is provided to translate the filtered, decimated signal from dc to fADC/8 to allow a real output. Figure 68 to Figure 71 show an example of a 20 MHz input as it is processed by the blocks of the AD6655. Table 18. Downconverter Modes Output Type Real Real Complex Complex Real –50 –24 –14 –4 0 4 14 24 50 Figure 68. Example AD6655 Real 20 MHz Bandwidth Input Signal Centered at 14 MHz (fADC = 100 MHz) NUMERICALLY CONTROLLED OSCILLATOR (NCO) Frequency translation is accomplished with an NCO. Each of the two processing channels shares a common NCO. Amplitude and phase dither can be enabled on chip to improve the noise and spurious performance of the NCO. A phase offset word is available to create a known phase relationship between multiple AD6655s. Because the decimation filter prevents usage of half the Nyquist spectrum, a means is needed to translate the sampled input spectrum into the usable range of the decimation filter. To achieve this, a 32-bit, fine tuning, complex NCO is provided. This NCO/mixer allows the input spectrum to be tuned to dc, where it can be effectively filtered by the subsequent filter blocks to prevent aliasing. –50 –38 –28 –18 –10 0 10 50 06709-067 NCO/Filter Half-band filter only Half-band filter and FIR filter NCO and half-band filter NCO, half-band filter, and FIR filter NCO, half-band filter, FIR filter, and fADC/8 NCO Figure 69. Example AD6655 20 MHz Bandwidth Input Signal Tuned to DC Using the NCO (NCO Frequency = 14 MHz) –50 –38 –28 –18 –10 0 10 50 06709-068 Mode 1 2 3 4 5 06709-066 Table 18 details the recommended downconverter modes of operation in the AD6655. Figure 70. Example AD6655 20 MHz Bandwidth Input Signal with the Negative Image Filtered by the Half-Band and FIR Filters The goal of the AD6655 digital filter block is to allow the sample rate to be reduced by a factor of 2 while rejecting aliases that fall into the band of interest. The half-band filter is designed to operate as either a low-pass or high-pass filter and to provide greater than 100 dB of alias protection for 22% of the input rate of the structure. For an ADC sample rate of 150 MSPS, this provides –50 0.25 12.5 22.5 50 06709-069 HALF-BAND DECIMATING FILTER AND FIR FILTER Figure 71. Example AD6655 20 MHz Bandwidth Input Signal Tuned to fADC/8 for Real Output Rev. B | Page 37 of 84 AD6655 Data Sheet NUMERICALLY CONTROLLED OSCILLATOR (NCO) FREQUENCY TRANSLATION PHASE OFFSET This processing stage comprises a digital tuner consisting of a 32-bit complex numerically controlled oscillator (NCO). The two channels of the AD6655 share a single NCO. The NCO is optional and can be bypassed by clearing Bit 0 of Register 0x11D. This NCO block accepts a real input from the ADC stage and outputs a frequency translated complex (I and Q) output. The NCO phase offset register at Address 0x122 and Address 0x123 adds a programmable offset to the phase accumulator of the NCO. This 16-bit register is interpreted as a 16-bit unsigned integer. A 0x00 in this register corresponds to no offset, and a 0xFFFF corresponds to an offset of 359.995°. Each bit represents a phase change of 0.005°. This register allows multiple NCOs to be synchronized to produce outputs with predictable phase differences. Use the following equation to calculate the NCO phase offset value: The NCO frequency is programmed in Register 0x11E, Register 0x11F, Register 0x120, and Register 0x121. These four 8-bit registers make up a 32-bit unsigned frequency programming word. Frequencies between −CLK/2 and +CLK/2 are represented using the following frequency words: 0x8000 0000 represents a frequency given by −CLK/2. 0x0000 0000 represents dc (frequency = 0 Hz). 0x7FFF FFFF represents CLK/2 − CLK/232. NCO_FREQ 2 where: NCO_PHASE is a decimal number equal to the 16-bit binary number to be programmed at Register 0x122 and Register 0x123. PHASE is the desired NCO phase in degrees. NCO AMPLITUDE AND PHASE DITHER Use the following equation to calculate the NCO frequency: 32 NCO_PHASE = 216 × PHASE/360 Mod( f , f CLK ) f CLK where: NCO_FREQ is a 32-bit twos complement number representing the NCO frequency register. f is the desired carrier frequency in hertz (Hz). fCLK is the AD6655 ADC clock rate in hertz (Hz). NCO SYNCHRONIZATION The NCO block contains amplitude and phase dither to improve the spurious performance. Amplitude dither improves performance by randomizing the amplitude quantization errors within the angular-to-Cartesian conversion of the NCO. This option reduces spurs at the expense of a slightly raised noise floor. With amplitude dither enabled, the NCO has an SNR of >93 dB and an SFDR of >115 dB. With amplitude dither disabled, the SNR is increased to >96 dB at the cost of SFDR performance, which is reduced to 100 dB. The NCO amplitude dither is recommended and is enabled by setting Bit 1 of Register 0x11D. The AD6655 NCOs within a single part or across multiple parts can be synchronized using the external SYNC input. Bit 3 and Bit 4 of Register 0x100 allow the NCO to be resynchronized on every SYNC signal or only on the first SYNC signal after the register is written. A valid SYNC causes the NCO to restart at the programmed phase offset value. Rev. B | Page 38 of 84 Data Sheet AD6655 DECIMATING HALF-BAND FILTER AND FIR FILTER 0 –10 –20 –30 AMPLITUDE (dBc) The goal of the AD6655 half-band digital filter is to allow the sample rate to be reduced by a factor of 2 while rejecting aliases that fall into the band of interest. This filter is designed to operate as either a low-pass or a high-pass filter and to provide >100 dB of alias protection for 11% of the input rate of the structure. Used in conjunction with the NCO and the FIR filter, the halfband filter can provide an effective band-pass. For an ADC sample rate of 150 MSPS, this provides a maximum usable bandwidth of 33 MHz. Table 19. Fixed Coefficients for Half-Band Filter Decimal Coefficient (20-Bit) 844 −6189 25080 −79170 321584 524287 HALF-BAND FILTER FEATURES In the AD6655, the half-band filter cannot be disabled. The filter can be set for a low-pass or high-pass response. For a highpass filter, Bit 1 of Register 0x103 should be set; for a low-pass response, this bit should be cleared. The low-pass response of the filter with respect to the normalized output rate is shown in Figure 72, and the high-pass response is shown in Figure 73. 0 –10 –20 –110 0 0.1 0.2 0.3 0.4 FRACTION OF INPUT SAMPLE RATE 06709-071 –100 Figure 73. Half-Band Filter High-Pass Response The half-band filter has a ripple of 0.000182 dB and a rejection of 100 dB. For an alias rejection of 100 dB, the alias protected bandwidth is 11% of the input sample rate. If both the I and the Q paths are used, a complex bandwidth of 22% of the input rate is available. In the event of even Nyquist zone sampling, the half-band filter can be configured to provide a spectral reversal. Setting Bit 2 high in Address 0x103 enables the spectral reversal feature. The half-band decimation phase can be selected such that the half-band filter starts on the first or second sample following synchronization. This shifts the output from the half-band between the two input sample clocks. The decimation phase can be set to 0 or 1, using Bit 3 of Register 0x103. FIXED-COEFFICIENT FIR FILTER Following the half-band filters is a 66-tap, fixed-coefficient FIR filter. This filter is useful in providing extra alias protection for the decimating half-band filter. It is a simple sum-of-products FIR filter with 66 filter taps and 21-bit fixed coefficients. Note that this filter does not decimate. The normalized coefficients used in the implementation and the decimal equivalent value of the coefficients are listed in Table 20. The user can either select or bypass this filter, but the FIR filter can be enabled only when the half-band filter is enabled. Writing Logic 0 to the enable FIR filter bit (Bit 0) in Register 0x102 bypasses this fixed-coefficient filter. The filter is necessary when using the final NCO with a real output; bypassing it when using other configurations results in power savings. –30 –40 –50 –60 –70 –80 –90 –100 –110 0 0.1 0.2 0.3 0.4 FRACTION OF INPUT SAMPLE RATE 06709-070 AMPLITUDE (dBc) –70 –90 The 19-tap, symmetrical, fixed-coefficient half-band filter has low power consumption due to its polyphase implementation. Table 19 lists the coefficients of the half-band filter. The normalized coefficients used in the implementation and the decimal equivalent value of the coefficients are also listed. Coefficients not listed in Table 19 are 0s. Normalized Coefficient 0.0008049 −0.0059023 0.0239182 −0.0755024 0.3066864 0.5 –50 –60 –80 HALF-BAND FILTER COEFFICIENTS Coefficient Number C0, C18 C2, C16 C4, C14 C6, C12 C8, C10 C9 –40 Figure 72. Half-Band Filter Low-Pass Response Rev. B | Page 39 of 84 AD6655 Data Sheet COMBINED FILTER PERFORMANCE Normalized Coefficient 0.0001826 0.0006824 0.0009298 0.0000458 −0.0012689 −0.0008345 0.0011806 0.0011387 −0.0018439 −0.0024557 0.0018063 0.0035825 −0.0021510 −0.0056810 0.0017405 0.0078602 −0.0013437 −0.0110626 −0.0000229 0.0146618 0.0018959 −0.0195594 −0.0053153 0.0255623 0.0104036 −0.0341468 −0.0192165 0.0471258 0.0354118 −0.0728111 −0.0768890 0.1607208 0.4396725 Decimal Coefficient (21-Bit) 383 1431 1950 96 −2661 −1750 2476 2388 −3867 −5150 3788 7513 −4511 −11914 3650 16484 −2818 −23200 −48 30748 3976 −41019 −11147 53608 21818 −71611 −40300 98830 74264 −152696 −161248 337056 922060 SYNCHRONIZATION The AD6655 half-band filters within a single part or across multiple parts can be synchronized using the external SYNC input. Bit 5 and Bit 6 of Register 0x100 allow the half-bands to be resynchronized on every SYNC signal or only on the first SYNC signal after the register is written. A valid SYNC causes the half-band filter to restart at the programmed decimation phase value. The combined response of the half-band filter and the FIR filter is shown in Figure 74. The act of bandlimiting the ADC data with the half-band filter ideally provides a 3 dB improvement in the SNR at the expense of the sample rate and available bandwidth of the output data. As a consequence of finite math, additional quantization noise is added to the system due to truncation in the NCO and half-band. As a consequence of the digital filter rejection of out-of-band noise (assuming no quantization in the filters and with a white noise floor from the ADC), there should be a 3.16 dB improvement in the ADC SNR. However, the added quantization lessens improvement to about 2.66 dB. 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 0 0.1 0.2 0.3 0.4 FRACTION OF INPUT SAMPLE RATE 06709-072 Coefficient Number C0, C65 C1, C64 C2, C63 C3, C62 C4, C61 C5, C60 C6, C59 C7, C58 C8, C57 C9, C56 C10, C55 C11, C54 C12, C53 C13, C52 C14, C51 C15, C50 C16, C49 C17, C48 C18, C47 C19, C46 C20, C45 C21, C44 C22, C43 C23, C42 C24, C41 C25, C40 C26, C39 C27, C38 C28, C37 C29, C36 C30, C35 C31, C34 C32, C33 AMPLITUDE (dBc) Table 20. FIR Filter Coefficients Figure 74. Half-Band Filter and FIR Filter Composite Response FINAL NCO The output of the 32-bit fine tuning NCO is complex and typically centered in frequency around dc. This complex output is carried through the stages of the half-band and FIR filters to provide proper antialiasing filtering. The final NCO provides a means to move this complex output signal away from dc so that a real output can be provided from the AD6655. The final NCO, if enabled, translates the output from dc to a frequency equal to the ADC sampling frequency divided by 8 (fADC/8). This provides the user a decimated output signal centered at fADC/8 in frequency. Optionally, this final NCO can be bypassed, and the dc-centered I and Q values can be output in an interleaved fashion. Rev. B | Page 40 of 84 Data Sheet AD6655 ADC OVERRANGE AND GAIN CONTROL In receiver applications, it is desirable to have a mechanism to reliably determine when the converter is about to be clipped. The standard overflow indicator provides after-the-fact information on the state of the analog input that is of limited usefulness. Therefore, it is helpful to have a programmable threshold below full scale that allows time to reduce the gain before the clip actually occurs. In addition, because input signals can have significant slew rates, latency of this function is of major concern. Highly pipelined converters can have significant latency. A good compromise is to use the output bits from the first stage of the ADC for this function. Latency for these output bits is very low, and overall resolution is not highly significant. Peak input signals are typically between full scale and 6 dB to 10 dB below full scale. A 3-bit or 4-bit output provides adequate range and resolution for this function. Using the SPI port, the user can provide a threshold above which an overrange output is active. As long as the signal is below that threshold, the output should remain low. The fast detect outputs can also be programmed via the SPI port so that one of the pins functions as a traditional overrange pin for customers who currently use this feature. In this mode, all 14 bits of the converter are examined in the traditional manner, and the output is high for the condition normally defined as overflow. In either mode, the magnitude of the data is considered in the calculation of the condition (but the sign of the data is not considered). The threshold detection responds identically to positive and negative signals outside the desired range (magnitude). FAST DETECT OVERVIEW The AD6655 contains circuitry to facilitate fast overrange detection, allowing very flexible external gain control implementations. Each ADC has four fast detect (FD) output pins that are used to output information about the current state of the ADC input level. The function of these pins is programmable via the fast detect mode select bits and the fast detect enable bit in Register 0x104, allowing range information to be output from several points in the internal data path. These output pins can also be set up to indicate the presence of overrange or underrange conditions, according to programmable threshold levels. Table 21 shows the six configurations available for the fast detect pins. Table 21. Fast Detect Mode Select Bits Settings Fast Detect Mode Select bits (Register 0x104[3:1]) 000 001 010 011 100 101 Information Presented on Fast Detect (FD) Pins of Each ADC1, 2 FD[3] FD[2] FD[1] FD[0] ADC fast magnitude (see Table 22) OR ADC fast magnitude (see Table 23) OR F_LT ADC fast magnitude (see Table 24) C_UT F_LT ADC fast magnitude (see Table 24) OR C_UT F_UT F_LT OR F_UT IG DG 1 The fast detect pins are FD0A/FD0B to FD3A/FD3B for the CMOS mode configuration and FD0+/FD0− to FD3+/FD3− for the LVDS mode configuration. 2 See the ADC Overrange (OR) and Gain Switching sections for more information about OR, C_UT, F_UT, F_LT, IG, and DG. ADC FAST MAGNITUDE When the fast detect output pins are configured to output the ADC fast magnitude (that is, when the fast detect mode select bits are set to 0b000), the information presented is the ADC level from an early converter stage with a latency of only two clock cycles in CMOS output modes. In LVDS output mode, the fast detect bits have a latency of six cycles in all fast detect modes. Using the fast detect output pins in this configuration provides the earliest possible level indication information. Because this information is provided early in the datapath, there is significant uncertainty in the level indicated. The nominal levels, along with the uncertainty indicated by the ADC fast magnitude, are shown in Table 22. Because the DCO is at one-half the sample rate, the user can obtain all the fast detect information by sampling the fast detect outputs on both the rising and falling edge of DCO (see Figure 2 for timing information). Table 22. ADC Fast Magnitude Nominal Levels with Fast Detect Mode Select Bits = 000 ADC Fast Magnitude on FD[3:0] Pins 0000 0001 0010 0011 0100 0101 0110 0111 1000 Rev. B | Page 41 of 84 Nominal Input Magnitude Below FS (dB) <−24 −24 to −14.5 −14.5 to −10 −10 to −7 −7 to −5 −5 to −3.25 −3.25 to −1.8 −1.8 to −0.56 −0.56 to 0 Nominal Input Magnitude Uncertainty (dB) Minimum to −18.07 −30.14 to −12.04 −18.07 to −8.52 −12.04 to −6.02 −8.52 to −4.08 −6.02 to −2.5 −4.08 to −1.16 −2.5 to FS −1.16 to 0 AD6655 Data Sheet When the fast detect mode select bits are set to 0b001, 0b010, or 0b011, a subset of the fast detect output pins are available. In these modes, the fast detect output pins have a latency of six clock cycles, and the greater of the two input samples is output at the DCO rate. Table 23 shows the corresponding ADC input levels when the fast detect mode select bits are set to 0b001 (that is, when the ADC fast magnitude is presented on the FD[3:1] pins). Table 23. ADC Fast Magnitude Nominal Levels with Fast Detect Mode Select Bits = 001 ADC Fast Magitude on FD[2:0] Pins 000 001 010 011 100 101 110 111 Nominal Input Magnitude Below FS (dB) <−24 −24 to −14.5 −14.5 to −10 −10 to −7 −7 to −5 −5 to −3.25 −3.25 to −1.8 −1.8 to 0 Nominal Input Magnitude Uncertainty (dB) Minimum to −18.07 −30.14 to −12.04 −18.07 to −8.52 −12.04 to −6.02 −8.52 to −4.08 −6.02 to −2.5 −4.08 to −1.16 −2.5 to 0 Table 24. ADC Fast Magnitude Nominal Levels with Fast Detect Mode Select Bits = 010 or 011 Nominal Input Magnitude Below FS (dB) <−14.5 −14.5 to −7 −7 to −3.25 −3.25 to 0 The coarse upper threshold indicator is asserted if the ADC fast magnitude input level is greater than the level programmed in the coarse upper threshold register (Address 0x105[2:0]). This value is compared with the ADC Fast Magnitude Bits[2:0]. The coarse upper threshold output is output two clock cycles after the level is exceeded at the input and, therefore, provides a fast indication of the input signal level. The coarse upper threshold levels are shown in Table 25. This indicator remains asserted for a minimum of two ADC clock cycles or until the signal drops below the threshold level. Table 25. Coarse Upper Threshold Levels When the fast detect mode select bits are set to 0b010 or 0b011 (that is, when ADC fast magnitude is presented on the FD[2:1] pins), the LSB is not provided. The input ranges for this mode are shown in Table 24. ADC Fast Magitude on FD[2:1] Pins 00 01 10 11 Coarse Upper Threshold (C_UT) Nominal Input Magnitude Uncertainty (dB) Minimum to −12.04 −18.07 to −6.02 −8.52 to −2.5 −4.08 to 0 Coarse Upper Threshold Register[2:0] 000 001 010 011 100 101 110 111 C_UT Is Active When Signal Magnitude Below FS Is Greater Than (dB) <−24 −24 −14.5 −10 −7 −5 −3.25 −1.8 Fine Upper Threshold (F_UT) The fine upper threshold indicator is asserted if the input magnitude exceeds the value programmed in the fine upper threshold register located in Register 0x106 and Register 0x107. The 13-bit threshold register is compared with the signal magnitude at the output of the ADC. This comparison is subject to the ADC clock latency but is accurate in terms of converter resolution. The fine upper threshold magnitude is defined by the following equation: dBFS = 20 log(Threshold Magnitude/213) ADC OVERRANGE (OR) Fine Lower Threshold (F_LT) The ADC overrange indicator is asserted when an overrange is detected on the input of the ADC. The overrange condition is determined at the output of the ADC pipeline and, therefore, is subject to a latency of 12 ADC clock cycles. An overrange at the input is indicated by this bit 12 clock cycles after it occurs. The fine lower threshold indicator is asserted if the input magnitude is less than the value programmed in the fine lower threshold register located at Register 0x108 and Register 0x109. The fine lower threshold register is a 13-bit register that is compared with the signal magnitude at the output of the ADC. This comparison is subject to ADC clock latency but is accurate in terms of converter resolution. The fine lower threshold magnitude is defined by the following equation: GAIN SWITCHING The AD6655 includes circuitry that is useful in applications either where large dynamic ranges exist or where gain ranging converters are employed. This circuitry allows digital thresholds to be set such that an upper threshold and a lower threshold can be programmed. Fast detect mode select bits = 010 through fast detect mode select bits = 101 support various combinations of the gain switching options. dBFS = 20 log(Threshold Magnitude/213) The operation of the fine upper threshold and fine lower threshold indicators is shown in Figure 75. One such use is to detect when an ADC is about to reach full scale with a particular input condition. The result is to provide an indicator that can be used to quickly insert an attenuator that prevents ADC overdrive. Rev. B | Page 42 of 84 Data Sheet AD6655 Increment Gain (IG) and Decrement Gain (DG) with the magnitude at the output of the ADC. This comparison is subject to the ADC clock latency but allows a finer, more accurate comparison. The fine upper threshold magnitude is defined by the following equation: The increment gain and decrement gain indicators are intended to be used together to provide information to enable external gain control. The decrement gain indicator works in conjunction with the coarse upper threshold bits, asserting when the input magnitude is greater than the 3-bit value in the coarse upper threshold register (Address 0x105). The increment gain indicator, similarly, corresponds to the fine lower threshold bits except that it is asserted only if the input magnitude is less than the value programmed in the fine lower threshold register after the dwell time elapses. The dwell time is set by the 16-bit dwell time value located at Address 0x10A and Address 0x10B and is set in units of ADC input clock cycles ranging from 1 to 65,535. The fine lower threshold register is a 13-bit register that is compared dBFS = 20 log(Threshold Magnitude/213) The decrement gain output works from the ADC fast detect output pins, providing a fast indication of potential overrange conditions. The increment gain uses the comparison at the output of the ADC, requiring the input magnitude to remain below an accurate, programmable level for a predefined period before signaling external circuitry to increase the gain. The operation of the increment gain output and decrement gain output is shown graphically in Figure 75. UPPER THRESHOLD (COARSE OR FINE) DWELL TIME TIMER RESET BY RISE ABOVE F_LT FINE LOWER THRESHOLD DWELL TIME C_UT OR F_UT* TIMER COMPLETES BEFORE SIGNAL RISES ABOVE F_LT F_LT DG *C_UT AND F_UT DIFFER ONLY IN ACCURACY AND LATENCY. NOTE: OUTPUTS FOLLOW THE INSTANTEOUS SIGNAL LEVEL AND NOT THE ENVELOPE BUT ARE GUARANTEED ACTIVE FOR A MINIMUM OF 2 ADC CLOCK CYCLES. Figure 75. Threshold Settings for C_UT, F_UT, F_LT, DG, and IG Rev. B | Page 43 of 84 06709-073 IG AD6655 Data Sheet SIGNAL MONITOR The signal monitor block provides additional information about the signal being digitized by the ADC. The signal monitor computes the rms input magnitude, the peak magnitude, and/or the number of samples by which the magnitude exceeds a particular threshold. Together, these functions can be used to gain insight into the signal characteristics and to estimate the peak/average ratio or even the shape of the complementary cumulative distribution function (CCDF) curve of the input signal. This information can be used to drive an AGC loop to optimize the range of the ADC in the presence of real-world signals. current ADC input signal magnitude. This comparison continues until the monitor period timer reaches a count of 1. The signal monitor result values can be obtained from the part by reading back internal registers at Address 0x116 to Address 0x11B, using the SPI port or the signal monitor SPORT output. The output contents of the SPI-accessible signal monitor registers are set via the two signal monitor mode bits of the signal monitor control register (Address 0x112). Both ADC channels must be configured for the same signal monitor mode. Separate SPI-accessible, 20-bit signal monitor result (SMR) registers are provided for each ADC channel. Any combination of the signal monitor functions can also be output to the user via the serial SPORT interface. These outputs are enabled using the peak detector output enable, the rms magnitude output enable, and the threshold crossing output enable bits in the signal monitor SPORT control register (Address 0x1111). Figure 76 is a block diagram of the peak detector logic. The SMR register contains the absolute magnitude of the peak detected by the peak detector logic. For each signal monitor measurement, a programmable signal monitor period register (SMPR) controls the duration of the measurement. This time period is programmed as the number of input clock cycles in a 24-bit signal monitor period register located at Address 0x113, Address 0x114, and Address 0x115. This register can be programmed with a period from 128 samples to 16.78 (224) million samples. When the monitor period timer reaches a count of 1, the 13-bit peak level value is transferred to the signal monitor holding register (not accessible to the user), which can be read through the SPI port or output through the SPORT serial interface. The monitor period timer is reloaded with the value in the SMPR, and the countdown is restarted. In addition, the magnitude of the first input sample is updated in the peak level holding register, and the comparison and update procedure, as explained previously, continues. FROM MEMORY MAP POWER MONITOR PERIOD REGISTER TO INTERRUPT CONTROLLER DOWN COUNTER IS COUNT = 1? LOAD CLEAR MAGNITUDE STORAGE REGISTER POWER MONITOR HOLDING REGISTER LOAD TO MEMORY MAP LOAD COMPARE A>B 06709-074 FROM INPUT PORTS Figure 76. ADC Input Peak Detector Block Diagram RMS/MS MAGNITUDE MODE PEAK DETECTOR MODE In this mode, the root-mean-square (rms) or mean-square (ms) magnitude of the input port signal is integrated (by adding an accumulator) over a programmable time period (determined by SMPR) to give the rms or ms magnitude of the input signal. This mode is set by programming Logic 0 in the signal monitor mode bits of the signal monitor control register or by setting the rms magnitude output enable bit in the signal monitor SPORT control register. The 24-bit SMPR, representing the period over which integration is performed, must be programmed before activating this mode. The magnitude of the input port signal is monitored over a programmable time period (determined by SMPR) to give the peak value detected. This function is enabled by programming a Logic 1 in the signal monitor mode bits of the signal monitor control register or by setting the peak detector output enable bit in the signal monitor SPORT control register. The 24-bit SMPR must be programmed before activating this mode. After enabling the rms/ms magnitude mode, the value in the SMPR is loaded into a monitor period timer, and the countdown is started immediately. Each input sample is converted to floatingpoint format and squared. It is then converted to 11-bit, fixedpoint format and added to the contents of the 24-bit accumulator. The integration continues until the monitor period timer reaches a count of 1. After enabling this mode, the value in the SMPR is loaded into a monitor period timer, and the countdown is started. The magnitude of the input signal is compared with the value in the internal peak level holding register (not accessible to the user), and the greater of the two is updated as the current peak level. The initial value of the peak level holding register is set to the When the monitor period timer reaches a count of 1, the square root of the value in the accumulator is taken and transferred (after some formatting) to the signal monitor holding register, which can be read through the SPI port or output through the SPORT serial port. The monitor period timer is reloaded with the value in the SMPR, and the countdown is restarted. Because the dc offset of the ADC can be significantly larger than the signal of interest (affecting the results from the signal monitor), a dc correction circuit is included as part of the signal monitor block to null the dc offset before measuring the power. Rev. B | Page 44 of 84 Data Sheet AD6655 In addition, the first input sample signal power is updated in the accumulator, and the accumulation continues with the subsequent input samples. Figure 77 illustrates the rms magnitude monitoring logic. When the monitor period timer reaches a count of 1, the value in the internal count register is transferred to the signal monitor holding register, which can be read through the SPI port or output through the SPORT serial port. FROM MEMORY MAP The monitor period timer is reloaded with the value in the SMPR register, and the countdown is restarted. The internal count register is also cleared to a value of 0. Figure 78 illustrates the threshold crossing logic. The value in the SMR register is the number of samples that have a magnitude greater than the threshold register. DOWN COUNTER IS COUNT = 1? LOAD CLEAR ACCUMULATOR LOAD POWER MONITOR HOLDING REGISTER TO MEMORY MAP 06709-075 FROM INPUT PORTS FROM MEMORY MAP Figure 77. ADC Input RMS Magnitude Monitoring Block Diagram For rms magnitude mode, the value in the signal monitor result (SMR) register is a 20-bit fixed-point number. The following equation can be used to determine the rms magnitude in dBFS from the MAG value in the register. Note that if the signal monitor period (SMP) is a power of 2, the second term in the equation becomes 0. MAG SMP RMS Magnitude = 20 log 20 / 10 log ceil [log (SMP )] 2 2 2 For ms magnitude mode, the value in the SMR is a 20-bit fixedpoint number. The following equation can be used to determine the ms magnitude in dBFS from the MAG value in the register. Note that if the SMP is a power of 2, the second term in the equation becomes 0. MAG SMP MS Magnitude = 10 log 20 / 10 log ceil [log (SMP )] 2 2 2 THRESHOLD CROSSING MODE In the threshold crossing mode of operation, the magnitude of the input port signal is monitored over a programmable time period (given by SMPR) to count the number of times it crosses a certain programmable threshold value. This mode is set by programming Logic 1x (where x is a don’t care bit) in the signal monitor mode bits of the signal monitor control register or by setting the threshold crossing output enable bit in the signal monitor SPORT control register. Before activating this mode, the user needs to program the 24-bit SMPR and the 13-bit upper threshold register for each individual input port. The same upper threshold register is used for both signal monitoring and gain control (see the ADC Overrange and Gain Control section). After entering this mode, the value in the SMPR is loaded into a monitor period timer, and the countdown is started. The magnitude of the input signal is compared with the upper threshold register (programmed previously) on each input clock cycle. If the input signal has a magnitude greater than the upper threshold register, the internal count register is incremented by 1. The initial value of the internal count register is set to 0. This comparison and incrementing of the internal count register continues until the monitor period timer reaches a count of 1. POWER MONITOR PERIOD REGISTER DOWN COUNTER TO INTERRUPT CONTROLLER IS COUNT = 1? LOAD FROM INPUT PORTS FROM MEMORY MAP CLEAR A COMPARE A>B COMPARE A>B LOAD POWER MONITOR HOLDING REGISTER TO MEMORY MAP B UPPER THRESHOLD REGISTER 06709-076 POWER MONITOR PERIOD REGISTER TO INTERRUPT CONTROLLER Figure 78. ADC Input Threshold Crossing Block Diagram ADDITIONAL CONTROL BITS For additional flexibility in the signal monitoring process, two control bits are provided in the signal monitor control register. They are the signal monitor enable bit and the complex power calculation mode enable bit. Signal Monitor Enable Bit The signal monitor enable bit, located in Bit 0 of Register 0x112, enables operation of the signal monitor block. If the signal monitor function is not needed in a particular application, this bit should be cleared to conserve power. Complex Power Calculation Mode Enable Bit When this bit is set, the part assumes that Channel A is digitizing the I data and Channel B is digitizing the Q data for a complex input signal (or vice versa). In this mode, the power reported is equal to I 2 + Q2 This result is presented in the Signal Monitor DC Value Channel A register if the signal monitor mode bits are set to 00. The Signal Monitor DC Value Channel B register continues to compute the Channel B value. DC CORRECTION Because the dc offset of the ADC may be significantly larger than the signal being measured, a dc correction circuit is included to null the dc offset before measuring the power. The dc correction circuit can also be switched into the main signal path, but this may not be appropriate if the ADC is digitizing a time-varying signal with significant dc content, such as GSM. Rev. B | Page 45 of 84 AD6655 Data Sheet DC Correction Bandwidth SIGNAL MONITOR SPORT OUTPUT The dc correction circuit is a high-pass filter with a programmable bandwidth (ranging between 0.15 Hz and 1.2 kHz at 125 MSPS). The bandwidth is controlled by writing the 4-bit dc correction control register located at Register 0x10C, Bits[5:2]. The following equation can be used to compute the bandwidth value for the dc correction circuit: The SPORT is a serial interface with three output pins: the SMI SCLK (SPORT clock), SMI SDFS (SPORT frame sync), and SMI SDO (SPORT data output). The SPORT is the master and drives all three SPORT output pins on the chip. DC _ Corr _ BW = 2 /k /14 × SMI SCLK f CLK 2× π where: k is the 4-bit value programmed in Bits[5:2] of Register 0x10C (values between 0 and 13 are valid for k; programming 14 or 15 provides the same result as programming 13). fCLK is the AD6655 ADC sample rate in hertz (Hz). DC Correction Readback The current dc correction value can be read back in Register 0x10D and Register 0x10E for Channel A and Register 0x10F and Register 0x110 for Channel B. The dc correction value is a 14-bit value that can span the entire input range of the ADC. DC Correction Freeze Setting Bit 6 of Register 0x10C freezes the DC correction at its current state and continues to use the last updated value as the dc correction value. Clearing this bit restarts dc correction and adds the currently calculated value to the data. The data and frame sync are driven on the positive edge of the SMI SCLK. The SMI SCLK has three possible baud rates: 1/2, 1/4, or 1/8 the ADC clock rate, based on the SPORT controls. The SMI SCLK can also be gated off when not sending any data, based on the SPORT SMI SCLK sleep bit. Using this bit to disable the SMI SCLK when it is not needed can reduce any coupling errors back into the signal path, if these prove to be a problem in the system. Doing so, however, has the disadvantage of spreading the frequency content of the clock. If desired the SMI SCLK can be left running to ease frequency planning. SMI SDFS The SMI SDFS is the serial data frame sync, and it defines the start of a frame. One SPORT frame includes data from both datapaths. The data from Datapath A is sent just after the frame sync, followed by data from Datapath B. SMI SDO The SMI SDO is the serial data output of the block. The data is sent MSB first on the next positive edge after the SMI SDFS. Each data output block includes one or more of rms magnitude, peak level, and threshold crossing values from each datapath in the stated order. If enabled, the data is sent, rms first, followed by peak and threshold, as shown in Figure 79. DC Correction Enable Bits Setting Bit 0 of Register 0x10C enables dc correction for use in the signal monitor calculations. The calculated dc correction value can be added to the output data signal path by setting Bit 1 of Register 0x10C. GATED, BASED ON CONTROL SMI SCLK SMI SDFS MSB PK CH A RMS/MS CH A LSB 20 CYCLES 16 CYCLES THR CH A MSB 16 CYCLES RMS/MS CH B LSB 20 CYCLES PK CH B 16 CYCLES THR CH B RMS/MS CH A 06709-077 SMI SDO 16 CYCLES Figure 79. Signal Monitor SPORT Output Timing (RMS, Peak, and Threshold Enabled) GATED, BASED ON CONTROL SMI SCLK SMI SDFS MSB RMS/MS CH A LSB 20 CYCLES THR CH A 16 CYCLES MSB RMS/MS CH B LSB 20 CYCLES THR CH B 16 CYCLES Figure 80. Signal Monitor SPORT Output Timing (RMS and Threshold Enabled) Rev. B | Page 46 of 84 RMS/MS CH A 06709-078 SMI SDO Data Sheet AD6655 CHANNEL/CHIP SYNCHRONIZATION The AD6655 has a SYNC input that allows the user flexible synchronization options for synchronizing the internal blocks. The sync feature is useful for guaranteeing synchronized operation across multiple ADCs. The input clock divider, NCO, half-band filters, and signal monitor block can be synchronized using the SYNC input. Each of these blocks, except for the signal monitor, can be enabled to synchronize on a single occurrence of the SYNC signal or on every occurrence. The SYNC input is internally synchronized to the sample clock. However, to ensure that there is no timing uncertainty between multiple parts, the SYNC input signal should be synchronized to the input clock signal. The SYNC input should be driven using a single-ended CMOS type signal. Rev. B | Page 47 of 84 AD6655 Data Sheet SERIAL PORT INTERFACE (SPI) The AD6655 serial port interface (SPI) allows the user to configure the converter for specific functions or operations through a structured register space provided inside the ADC. The SPI gives the user added flexibility and customization, depending on the application. Addresses are accessed via the serial port and can be written to or read from via the port. Memory is organized into bytes that can be further divided into fields. These fields are documented in the Memory Map section. For detailed operational information, see Application Note AN-877, Interfacing to High Speed ADCs via SPI. CONFIGURATION USING THE SPI Three pins define the SPI of this ADC: the SCLK/DFS pin, the SDIO/DCS pin, and the CSB pin (see Table 26). The SCLK/DFS (serial clock) pin is used to synchronize the read and write data presented from/to the ADC. The SDIO/DCS (serial data input/ output) pin is a dual-purpose pin that allows data to be sent and read from the internal ADC memory map registers. The CSB (chip select bar) pin is an active-low control that enables or disables the read and write cycles. Table 26. Serial Port Interface Pins Pin SCLK SDIO CSB Function Serial Clock. The serial shift clock input, which is used to synchronize serial interface reads and writes. Serial Data Input/Output. A dual-purpose pin that typically serves as an input or an output, depending on the instruction being sent and the relative position in the timing frame. Chip Select Bar. An active-low control that gates the read and write cycles. The falling edge of the CSB, in conjunction with the rising edge of the SCLK, determines the start of the framing. An example of the serial timing and its definitions can be found in Figure 81 and Table 9. Other modes involving the CSB are available. The CSB can be held low indefinitely, which permanently enables the device; this is called streaming. The CSB can stall high between bytes to allow for additional external timing. When CSB is tied high, SPI functions are placed in a high impedance mode. This mode turns on any SPI pin secondary functions. During an instruction phase, a 16-bit instruction is transmitted. Data follows the instruction phase, and its length is determined by the W0 bit and the W1 bit. All data is composed of 8-bit words. The first bit of each individual byte of serial data indicates whether a read command or a write command is issued. This allows the serial data input/output (SDIO) pin to change direction from an input to an output. In addition to word length, the instruction phase determines whether the serial frame is a read or write operation, allowing the serial port to be used both to program the chip and to read the contents of the on-chip memory. If the instruction is a readback operation, performing a readback causes the serial data input/ output (SDIO) pin to change direction from an input to an output at the appropriate point in the serial frame. Data can be sent in MSB-first mode or in LSB-first mode. MSB first is the default on power-up and can be changed via the SPI port configuration register. For more information about this and other features, see Application Note AN-877, Interfacing to High Speed ADCs via SPI at www.analog.com. HARDWARE INTERFACE The pins described in Table 26 comprise the physical interface between the user programming device and the serial port of the AD6655. The SCLK pin and the CSB pin function as inputs when using the SPI interface. The SDIO pin is bidirectional, functioning as an input during write phases and as an output during readback. The SPI interface is flexible enough to be controlled by either FPGAs or microcontrollers. One method for SPI configuration is described in detail in Application Note AN-812, MicrocontrollerBased Serial Port Interface (SPI) Boot Circuit. The SPI port should not be active during periods when the full dynamic performance of the converter is required. Because the SCLK signal, the CSB signal, and the SDIO signal are typically asynchronous to the ADC clock, noise from these signals can degrade converter performance. If the on-board SPI bus is used for other devices, it may be necessary to provide buffers between this bus and the AD6655 to prevent these signals from transitioning at the converter inputs during critical sampling periods. Some pins serve a dual function when the SPI interface is not being used. When the pins are strapped to AVDD or ground during device power-on, they are associated with a specific function. The Digital Outputs section describes the strappable functions supported on the AD6655. Rev. B | Page 48 of 84 Data Sheet AD6655 CONFIGURATION WITHOUT THE SPI SPI ACCESSIBLE FEATURES In applications that do not interface to the SPI control registers, the SDIO/DCS pin, the SCLK/DFS pin, the SMI SDO/OEB pin, and the SMI SCLK/PDWN pin serve as standalone CMOScompatible control pins. When the device is powered up, it is assumed that the user intends to use the pins as static control lines for the duty cycle stabilizer, output data format, output enable, and power-down feature control. In this mode, the CSB chip select should be connected to AVDD, which disables the serial port interface. Table 28 provides a brief description of the general features that are accessible via the SPI. These features are described in detail in Application Note AN-877, Interfacing to High Speed ADCs via SPI (see www.analog.com). The AD6655 part-specific features are described in the Memory Map Register Description section. Table 27. Mode Selection Clock Offset External Voltage AVDD (default) Pin SDIO/DCS AGND SCLK/DFS AVDD SMI SDO/OEB AGND (default) AVDD SMI SCLK/PDWN AGND (default) AVDD AGND (default) Configuration Duty cycle stabilizer enabled Duty cycle stabilizer disabled Twos complement enabled Offset binary enabled Outputs in high impedance Outputs enabled Chip in power-down or standby Normal operation tHIGH tDS tS Table 28. Features Accessible Using the SPI Feature Name Mode tDH Test I/O Output Mode Output Phase Output Delay VREF Description Allows the user to set either power-down mode or standby mode Allows the user to access the DCS via the SPI Allows the user to digitally adjust the converter offset Allows the user to set test modes to have known data on output bits Allows the user to set up outputs Allows the user to set the output clock polarity Allows the user to vary the DCO delay Allows the user to set the reference voltage tCLK tH tLOW CSB SCLK DON’T CARE R/W W1 W0 A12 A11 A10 A9 A8 A7 D5 D4 D3 D2 D1 D0 DON’T CARE 06709-079 SDIO DON’T CARE DON’T CARE Figure 81. Serial Port Interface Timing Diagram Rev. B | Page 49 of 84 AD6655 Data Sheet MEMORY MAP READING THE MEMORY MAP REGISTER TABLE Logic Levels Each row in the memory map register table has eight bit locations. The memory map is roughly divided into four sections: the chip configuration registers (Address 0x00 to Address 0x02); the channel index and transfer registers (Address 0x05 and Address 0xFF); the ADC functions registers, including setup, control, and test (Address 0x08 to Address 0x18); and the digital feature control registers (Address 0x100 to Address 0x123). An explanation of logic level terminology follows: The memory map register table (see Table 29) documents the default hexadecimal value for each hexadecimal address shown. The column with the heading Bit 7 (MSB) is the start of the default hexadecimal value given. For example, Address 0x18, the VREF select register, has a hexadecimal default value of 0xC0. This means that Bit 7 = 1, Bit 6 = 1, and the remaining bits are 0s. This setting is the default reference selection setting. The default value uses a 2.0 V p-p reference. For more information on this function and others, see Application Note AN-877, Interfacing to High Speed ADCs via SPI. This document details the functions controlled by Register 0x00 to Register 0xFF. The remaining registers, from Register 0x100 to Register 0x123, are documented in the Memory Map Register Description section. Address 0x08 to Address 0x18 and Address 0x11E to Address 0x123 are shadowed. Writes to these addresses do not affect part operation until a transfer command is issued by writing 0x01 to Address 0xFF, setting the transfer bit. This allows these registers to be updated internally and simultaneously when the transfer bit is set. The internal update takes place when the transfer bit is set, and the bit autoclears. Open Locations All address and bit locations that are not included in Table 29 are not currently supported for this device. Unused bits of a valid address location should be written with 0s. Writing to these locations is required only when part of an address location is open (for example, Address 0x18). If the entire address location is open (for example, Address 0x13), this address location should not be written. Default Values • • “Bit is set” is synonymous with “bit is set to Logic 1” or “writing Logic 1 for the bit.” “Clear a bit” is synonymous with “bit is set to Logic 0” or “writing Logic 0 for the bit.” Transfer Register Map Channel-Specific Registers Some channel setup functions, such as the signal monitor thresholds, can be programmed differently for each channel. In these cases, channel address locations are internally duplicated for each channel. These registers and bits are designated in Table 29 as local. These local registers and bits can be accessed by setting the appropriate Channel A or Channel B bits in Register 0x05. If both bits are set, the subsequent write affects the registers of both channels. In a read cycle, only Channel A or Channel B should be set to read one of the two registers. If both bits are set during an SPI read cycle, the part returns the value for Channel A. Registers and bits designated as global in Table 29 affect the entire part or the channel features where independent settings are not allowed between channels. The settings in Register 0x05 do not affect the global registers and bits. After the AD6655 is reset, critical registers are loaded with default values. The default values for the registers are given in the memory map register table, Table 29. Rev. B | Page 50 of 84 Data Sheet AD6655 MEMORY MAP REGISTER TABLE All address and bit locations that are not included in Table 29 are not currently supported for this device. Table 29. Memory Map Registers Addr. Register Bit 7 (Hex) Name (MSB) Chip Configuration Registers 0x00 0 SPI Port Configuration (Global) 0x01 Chip ID (Global) 0x02 Chip Grade (Global) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (LSB) LSB first Soft reset 1 1 Soft reset LSB first 0 Open Speed Grade ID[4:3] 00 = 150 MSPS 01 = 125 MSPS 10 = 105 MSPS 11 = 80 MSPS Default Notes/ Comments 0x18 The nibbles are mirrored so that LSB-first or MSB-first mode registers correctly, regardless of shift mode Default is unique chip ID, different for each device; this is a read-only register Speed grade ID used to differentiate devices; this is a read-only register 0x0D 8-bit Chip ID[7:0] (AD6655 = 0x0D) (default) Open Default Value (Hex) Open Open Open Open Channel Index and Transfer Registers 0x05 Open Channel Index Open Open Open Open Open Data Channel B (default) Data Channel A (default) 0x03 0xFF Open Open Open Open Open Open Open Transfer 0x00 ADC Function Registers 0x08 Power Modes Open Open Open Open Open Internal power-down mode (local) 00 = normal operation 01 = full power-down 10 = standby 11 = normal operation 0x00 0x09 Global Clock (Global) Open Open External powerdown pin function (global) 0 = pdwn 1 = stndby Open Open Open 0x0B Clock Divide (Global) Open Open Open Open Open Transfer Rev. B | Page 51 of 84 Open Open Duty cycle stabilize (default) Clock divide ratio 000 = divide by 1 001 = divide by 2 010 = divide by 3 011 = divide by 4 100 = divide by 5 101 = divide by 6 110 = divide by 7 111 = divide by 8 Bits are set to determine which device on chip receives the next write command; applies to local registers Synchronously transfers data from the master shift register to the slave Determines various generic modes of chip operation 0x01 0x00 Clock divide values other than 000 automatically activate duty cycle stabilization AD6655 Data Sheet Addr. (Hex) 0x0D Register Name Test Mode (Local) Bit 7 (MSB) Open Bit 6 Open 0x10 Offset Adjust (Local) Output Mode Open Open Drive strength 0 V to 3.3 V CMOS or ANSI LVDS; 1 V to 1.8 V CMOS or reduced LVDS (global) Invert DCO clock Output type 0 = CMOS 1 = LVDS (global) Interleaved CMOS (global) Output enable bar (local) Open Open Open Open Open Open Open Open 0x14 0x16 Clock Phase Control (Global) 0x17 DCO Output Delay (Global) 0x18 VREF Select (Global) Bit 5 Open Bit 4 Open Bit 3 Open Bit 2 Bit 0 Bit 1 (LSB) Output test mode 000 = off (default) 001 = midscale short 010 = positive FS 011 = negative FS Others = not supported Offset adjust in LSBs from +31 to -32 (twos complement format) Output invert (local) Configures the outputs and the format of the data 0x00 Allows selection of clock delays into the input divider Open Open Half-band sync enable NCO32 next sync only NCO32 sync enable 0x101 0x102 0x103 0x104 0x105 0x00 0xC0 Clock divider sync enable Master sync enable 0x00 fS/8 next sync only fS/8 sync enable 0x00 FIR filter enable 0x00 Open 0x01 Fast detect enable 0x00 fS/8 Output Mix Control (Global) FIR Filter and Output Mode Control (Global) Open Open fS/8 start state Open Open Open Open Digital Filter Control (Global) Fast Detect Control (Local) Coarse Upper Threshold (Local) Open Open Open Open Open Open Open Open FIR gain fS/8 Complex output output 0 = gain of mix enable 2 disable 1 = gain of 1 Half-band Spectral High-pass/ decimation reversal low-pass phase select Fast Detect Mode Select[2:0] Open Open Open Open Open Rev. B | Page 52 of 84 0x00 0x00 Reference voltage selection 00 = 1.25 V p-p 01 = 1.5 V p-p 10 = 1.75 V p-p 11 = 2.0 V p-p (default) Digital Feature Control Registers 0x100 Sync Control Signal Half-band monitor next sync (Global) sync only enable Open Default Notes/ Comments When enabled, the test data is placed on the output pins in place of ADC output data 00 = offset binary 01 = twos complement 01 = gray code 11 = offset binary (local) Input clock divider phase adjust 000 = no delay 001 = 1 input clock cycle 010 = 2 input clock cycles 011 = 3 input clock cycles 100 = 4 input clock cycles 101 = 5 input clock cycles 110 = 6 input clock cycles 111 = 7 input clock cycles DCO clock delay (delay = 2500 ps × register value/31) 00000 = 0 ps 00001 = 81 ps 00010 = 161 ps … 11110 = 2419 ps 11111 = 2500 ps Open Open Open Open Clock divider next sync only Open Default Value (Hex) 0x00 Coarse Upper Threshold[2:0] 0x00 Data Sheet Addr. (Hex) 0x106 0x107 0x108 0x109 0x10A 0x10B 0x10C 0x10D 0x10E 0x10F 0x110 0x111 0x112 Register Name Fine Upper Threshold Register 0 (Local) Fine Upper Threshold Register 1 (Local) Fine Lower Threshold Register 0 (Local) Fine Lower Threshold Register 1 (Local) Increase Gain Dwell Time Register 0 (Local) Increase Gain Dwell Time Register 1 (Local) Signal Monitor DC Correction Control (Global) Signal Monitor DC Value Channel A Register 0 (Global) Signal Monitor DC Value Channel A Register 1 (Global) Signal Monitor DC Value Channel B Register 0 (Global) Signal Monitor DC Value Channel B Register 1 (Global) Signal Monitor SPORT Control (Global) Signal Monitor Control (Global) AD6655 Bit 7 (MSB) Bit 6 Bit 5 Open Open Open Bit 4 Bit 3 Fine Upper Threshold[7:0] Bit 2 Bit 1 Bit 0 (LSB) Fine Upper Threshold[12:8] Open Open Open 0x00 Fine Lower Threshold[12:8] 0x00 Increase Gain Dwell Time[7:0] 0x00 In ADC clock cycles Increase Gain Dwell Time[15:8] 0x00 In ADC clock cycles DC Correction Bandwidth(k:[3:0]) DC correction freeze DC correction for signal path enable DC correction for signal monitor enable 0x00 DC Value Channel A[7:0] Open Default Notes/ Comments 0x00 Fine Lower Threshold[7:0] Open Default Value (Hex) 0x00 Open Read only DC Value Channel A[13:8] Read only DC Value Channel B[7:0] Open Open Open RMS magnitude output enable Peak detector output enable Threshold crossing output enable Complex power calculation mode enable Open Open Open Read only DC Value Channel B[13:8] SPORT SMI SCLK SPORT divide SMI SCLK sleep 00 = Undefined 01 = divide by 2 10 = divide by 4 11 = divide by 8 Signal monitor mode Signal monitor 00 = rms/ms rms/ms magnitude select 01 = peak detector 0 = rms 10 = threshold crossing 1 = ms 11 = threshold crossing Rev. B | Page 53 of 84 Read only Signal monitor SPORT output enable 0x04 Signal monitor enable 0x00 AD6655 Addr. (Hex) 0x113 0x114 0x115 0x116 0x117 0x118 0x119 0x11A 0x11B 0x11D 0x11E 0x11F 0x120 0x121 0x122 0x123 Register Name Signal Monitor Period Register 0 (Global) Signal Monitor Period Register 1 (Global) Signal Monitor Period Register 2 (Global) Signal Monitor Result Channel A Register 0 (Global) Signal Monitor Result Channel A Register 1 (Global) Signal Monitor Result Channel A Register 2 (Global) Signal Monitor Result Channel B Register 0 (Global) Signal Monitor Result Channel B Register 1 (Global) Signal Monitor Result Channel B Register 2 (Global) NCO Control (Global) NCO Frequency 0 NCO Frequency 1 NCO Frequency 2 NCO Frequency 3 NCO Phase Offset 0 NCO Phase Offset 1 Data Sheet Bit 7 (MSB) Open Bit 6 Open Bit 5 Open Default Value (Hex) 0x80 Default Notes/ Comments In ADC clock cycles Signal Monitor Period[15:8] 0x00 I In ADC clock cycles Signal Monitor Period[23:16] 0x00 In ADC clock cycles Bit 4 Bit 3 Signal Monitor Period[7:0] Bit 2 Bit 1 Bit 0 (LSB) Signal Monitor Result Channel A[7:0] Read only Signal Monitor Result Channel A[15:8] Read only Open Signal Monitor Result Channel A[19:16] Read only Signal Monitor Result Channel B[7:0] Read only Signal Monitor Result Channel B[15:8] Read only Open Open Open Open Open Open Open Open Signal Monitor Result Channel B[19:16] Open NCO32 phase dither enable NCO32 amplitude dither enable NCO32 enable Read only 0x00 NCO Frequency Value[7:0] 0x00 NCO Frequency Value[15:8] 0x00 NCO Frequency Value[23:16] 0x00 NCO Frequency Value[31:24] 0x00 NCO Phase Value[7:0] 0x00 NCO Phase Value[15:8] 0x00 Rev. B | Page 54 of 84 Data Sheet AD6655 MEMORY MAP REGISTER DESCRIPTION For more information on functions controlled in Register 0x00 to Register 0xFF, see Application Note AN-877, Interfacing to High Speed ADCs via SPI, at www.analog.com. Note that not all test modes are supported on the AD6655. Bit 1—Clock Divider Sync Enable Bit 1 gates the sync pulse to the clock divider. The sync signal is passed when Bit 1 and Bit 0 are high. This is continuous sync mode. SYNC Control (Register 0x100) Bit 7—Signal Monitor Sync Enable Bit 0—Master Sync Enable Bit 7 enables the sync pulse from the external sync input to the signal monitor block. The sync signal is passed when Bit 7 and Bit 0 are high. This is continuous sync mode. fS/8 Output Mix Control (Register 0x101) Bits[7:6]—Reserved Bit 6—Half-Band Next Sync Only Bit 5 and Bit 4 set the starting phase of the fS/8 output mix. Bit 0 must be high to enable any of the sync functions. If the master sync enable bit (Register 0x100, Bit 0) and the halfband sync enable bit (Register 0x100, Bit 5) are high, Bit 6 allows the NCO32 to synchronize following the first sync pulse it receives and ignore the rest. If Bit 6 is set, Bit 5 of Register 0x100 resets after this sync occurs. Bit 5—Half-Band Sync Enable Bit 5 gates the sync pulse to the half-band filter. When Bit 5 is set high, the sync signal causes the half-band to resynchronize, starting at the half-band decimation phase selected in Register 0x103, Bit 3. This sync is active only when the master sync enable bit (Register 0x100, Bit 0) is high. This is continuous sync mode. Bit 4—NCO32 Next Sync Only If the master sync enable bit (Register 0x100, Bit 0) and the NCO32 sync enable bit (Register 0x100, Bit 3) are high, Bit 4 allows the NCO32 to synchronize following the first sync pulse it receives and ignore the rest. Bit 3 of Register 0x100 resets after a sync occurs if Bit 4 is set. Bit 3—NCO32 Sync Enable Bit 3 gates the sync pulse to the 32-bit NCO. When this bit is set high, the sync signal causes the NCO to resynchronize, starting at the NCO phase offset value. This sync is active only when the master sync enable bit (Register 0x100, Bit 0) is high. This is continuous sync mode. Bit 2—Clock Divider Next Sync Only If the master sync enable bit (Register 0x100, Bit 0) and the clock divider sync enable bit (Register 0x100, Bit 1) are high, Bit 2 allows the clock divider to synchronize following the first sync pulse it receives and ignores the rest. Bit 1 of Register 0x100 resets after it synchronizes. Bits[5:4]—fS/8 Start State Bits[3:2]—Reserved Bit 1—fS/8 Next Sync Only If the master sync enable bit (Register 0x100, Bit 0) and the fS/8 sync enable bit (Register 0x101, Bit 0) are high, Bit 1 allows the fS/8 output mix to synchronize following the first sync pulse it receives and ignore the rest. Bit 0 of Register 0x100 resets after it synchronizes. Bit 0—fS/8 Sync Enable Bit 0 gates the sync pulse to the fS/8 output mix. This sync is active only when the master sync enable bit (Register 0x100, Bit 0) is high. This is continuous sync mode. FIR Filter and Output Mode Control (Register 0x102) Bits[7:4]—Reserved Bit 3—FIR Gain When Bit 3 is set high, the FIR filter path, if enabled, has a gain of 1. When Bit 3 set low, the FIR filter path has a gain of 2. Bit 2—fS/8 Output Mix Disable Bit 2 disables the fS/8 output mix when enabled. Bit 2 should be set along with Bit 1 to enable complex output mode. Bit 1—Complex Output Mode Enable Setting Bit 1 high enables complex output mode. Bit 0—FIR Filter Enable When set high, Bit 0 enables the FIR filter. When Bit 0 is cleared, the FIR filter is bypassed and shut down for power savings. Rev. B | Page 55 of 84 AD6655 Data Sheet Digital Filter Control (Register 0x103) Bits[7:4]—Reserved Bit 3—Half-Band Decimation Phase When set high, Bit 3 uses the alternate phase of the decimating half-band filter. Bit 2—Spectral Reversal Bit 2 enables the spectral reversal feature of the half-band filter. Bit 1—High-Pass/Low-Pass Select Bit 1 enables the high-pass mode of the half-band filter when set high. Setting this bit low enables the low-pass mode (default). Increase Gain Dwell Time (Register 0x10A and Register 0x10B) Register 0x10B, Bits[7:0]—Increase Gain Dwell Time Bits[15:8] Register 0x10A, Bits[7:0]—Increase Gain Dwell Time Bits[7:0] These register values set the minimum time in ADC sample clock cycles (after clock divider) that a signal needs to stay below the fine lower threshold limit before the F_LT and IG are asserted high. Bit 0—Reserved Signal Monitor DC Correction Control (Register 0x10C) Bit 7—Reserved Bit 0 reads back as a 1. Bit 6—DC Correction Freeze Fast Detect Control (Register 0x104) Bits[7:4]—Reserved When Bit 6 is set high, the dc correction is no longer updated to the signal monitor block, which holds the last dc value calculated. Bits[3:1]—Fast Detect Mode Select Bits[3:1] set the mode of the fast detect output bits according to Table 29. Bit 0—Fast Detect Enable Bit 0 is used to enable the fast detect output pins. When the FD outputs are disabled, the outputs go into a high impedance state. In LVDS mode when the outputs are interleaved, the outputs go high-Z only if both channels are turned off (power-down/ standby/output disabled). If only one channel is turned off (power-down/standby/output disabled), the fast detect outputs repeat the data of the active channel. Coarse Upper Threshold (Register 0x105) Bits[7:3]—Reserved Bits[5:2]—DC Correction Bandwidth Bits[5:2] set the averaging time of the signal monitor dc correction function. This 4-bit word sets the bandwidth of the correction block, according to the following equation: DC _ Corr _ BW = 2/ k / 14 × fCLK 2× π where: k is the 4-bit value programmed in Bits[5:2] of Register 0x10C (values between 0 and 13 are valid for k; programming 14 or 15 provides the same result as programming 13). fCLK is the AD6655 ADC sample rate in hertz (Hz). Bit 1—DC Correction for Signal Path Enable Setting this bit high causes the output of the dc measurement block to be summed with the data in the signal path to remove the dc offset from the signal path. Bits[2:0]—Coarse Upper Threshold These bits set the level required to assert the coarse upper threshold indication (see Table 25). Fine Upper Threshold (Register 0x106 and Register 0x107) Register 0x107, Bits[7:5]—Reserved Register 0x107, Bits[4:0]—Fine Upper Threshold Bits[12:8] Register 0x106, Bits[7:0]—Fine Upper Threshold Bits[7:0] These registers provide a fine upper limit threshold. The 13-bit value is compared to the 13-bit magnitude from the ADC block. If the ADC magnitude exceeds this threshold value, the F_UT indicator is set. Bit 0—DC Correction for Signal Monitor Enable This bit enables the dc correction function in the signal monitor block. The dc correction is an averaging function that can be used by the signal monitor to remove dc offset in the signal. Removing this dc from the measurement allows a more accurate power reading. Signal Monitor DC Value Channel A (Register 0x10D and Register 0x10E) Register 0x10E, Bits[7:6]—Reserved Fine Lower Threshold (Register 0x108 and Register 0x109) Register 0x109, Bits[7:5]—Reserved Register 0x10E, Bits[5:0]—DC Value Channel A[13:8] Register 0x109, Bits[4:0]—Fine Lower Threshold Bits[12:8] These read-only registers hold the latest dc offset value computed by the signal monitor for Channel A. Register 0x108, Bits[7:0]—Fine Lower Threshold Bits[7:0] Register 0x10D, Bits[7:0]—DC Value Channel A[7:0] These registers provide a fine lower limit threshold. This 13-bit value is compared with the 13-bit magnitude from the ADC block. If the ADC magnitude is less than this threshold value, the F_LT indicator is set. Rev. B | Page 56 of 84 Data Sheet AD6655 Signal Monitor DC Value Channel B (Register 0x10F and Register 0x110) Register 0x110, Bits[7:6]—Reserved Register 0x110, Bits[5:0]—Channel B DC Value Bits[13:8] Register 0x10F, Bits[7:0]—Channel B DC Value Bits [7:0] These read-only registers hold the latest dc offset value computed by the signal monitor for Channel B. Signal Monitor SPORT Control (Register 0x111) Bit 7—Reserved Bit 6—RMS/MS Magnitude Output Enable Bit 6 enables the 20-bit rms or ms magnitude measurement as output on the SPORT. Bit 5—Peak Detector Output Enable Bit 5 enables the 13-bit peak measurement as output on the SPORT. Bit 4—Threshold Crossing Output Enable Bit 4 enables the 13-bit threshold measurement as output on the SPORT. Bit 0—Signal Monitor Enable Setting Bit 0 high enables the signal monitor block. Signal Monitor Period (Register 0x113 to Register 0x115) Register 0x115 Bits[7:0]—Signal Monitor Period[23:16] Register 0x114 Bits[7:0]—Signal Monitor Period[15:8] Register 0x113 Bits[7:0]—Signal Monitor Period[7:0] This 24-bit value sets the number of clock cycles over which the signal monitor performs its operation. The minimum value for this register is 128 cycles (programmed values less than 128 revert to 128). Signal Monitor Result Channel A (Register 0x116 to Register 0x118) Register 0x118, Bits[7:4]—Reserved Register 0x118, Bits[3:0]—Signal Monitor Result Channel A[19:16] Register 0x117, Bits[7:0]—Signal Monitor Result Channel A[15:8] Bits[3:2]—SPORT SMI SCLK Divide Register 0x116, Bits[7:0]—Signal Monitor Result Channel A[7:0] The values of these bits set the SPORT SMI SCLK divide ratio from the input clock. A value of 0x01 sets divide by 2 (default), a value of 0x10 sets divide by 4, and a value of 0x11 sets divide by 8. This 20-bit value contains the power value calculated by the signal monitor block for Channel A. The content is dependent on the settings in Register 0x112, Bits[2:1]. Bit 1—SPORT SMI SCLK Sleep Setting Bit 1 high causes the SMI SCLK to remain low when the signal monitor block has no data to transfer. Bit 0—Signal Monitor SPORT Output Enable When set, Bit 0 enables the signal monitor SPORT output to begin shifting out the result data from the signal monitor block. Signal Monitor Control (Register 0x112) Bit 7—Complex Power Calculation Mode Enable This mode assumes I data is present on one channel and Q data is present on the alternate channel. The result reported is the complex power measured as I 2 + Q2 Signal Monitor Result Channel B (Register 0x119 to Register 0x11B) Register 0x11B, Bits[7:4]—Reserved Register 0x11B, Bits[3:0]—Signal Monitor Result Channel B[19:16] Register 0x11A, Bits[7:0]—Signal Monitor Result Channel B[15:8] Register 0x119, Bits[7:0]—Signal Monitor Result Channel B[7:0] This 20-bit value contains the power value calculated by the signal monitor block for Channel B. The content is dependent on the settings in Register 0x112, Bits[2:1]. Bits[6:4]—Reserved NCO Control (Register 0x11D) Bits[7:3]—Reserved Bit 3—Signal Monitor RMS/MS Select Bit 2—NCO32 Phase Dither Enable Setting Bit 3 low selects rms power measurement mode. Setting Bit 3 high selects ms power measurement mode. When Bit 2 is set, phase dither in the NCO is enabled. When Bit 2 is cleared, phase dither is disabled. Bits[2:1]—Signal Monitor Mode Bit 1—NCO32 Amplitude Dither Enable Bit 2 and Bit 1 set the mode of the signal monitor for data output to registers at Address 0x116 through Address 0x11B. Setting these bits to 0x00 selects rms/ms magnitude output, setting these bits to 0x01 selects peak detector output, and setting 0x10 or 0x11 selects threshold crossing output. When Bit 1 is set, amplitude dither in the NCO is enabled. When Bit 1 is cleared, amplitude dither is disabled. Rev. B | Page 57 of 84 AD6655 Data Sheet Bit 0—NCO32 Enable When Bit 0 is set, this bit enables the 32-bit NCO operating at the frequency programmed into the NCO frequency register. When Bit 0 is cleared, the NCO is bypassed and shuts down for power savings. NCO Frequency (Register 0x11E to Register 0x121) Register 0x11E, Bits[7:0]—NCO Frequency Value[7:0] Register 0x11F, Bits[7:0]—NCO Frequency Value[15:8] Register 0x120, Bits[7:0]—NCO Frequency Value[23:16] NCO Phase Offset (Register 0x122 and Register 0x123) Register 0x122, Bits[7:0]—NCO Phase Value[7:0] Register 0x123, Bits[7:0]—NCO Phase Value[15:8] The 16-bit value programmed into the NCO phase value register is loaded into the NCO block each time the NCO is started or when an NCO SYNC signal is received. This process allows the NCO to be started with a known nonzero phase. Use the following equation to calculate the NCO phase offset value: NCO_PHASE = 216 × PHASE/360 Register 0x121, Bits[7:0]—NCO Frequency Value[31:24] This 32-bit value is used to program the NCO tuning frequency. The frequency value to be programmed is given by the following equation: NCO_FREQ = 232 × Mod( f , fCLK ) fCLK where: NCO_PHASE is a decimal number equal to the 16-bit binary number to be programmed at Register 0x122 and Register 0x123. PHASE is the desired NCO phase in degrees. where: NCO_FREQ is a 32-bit twos complement number representing the NCO frequency register. f is the desired carrier frequency in hertz (Hz). fCLK is the AD6655 ADC clock rate in hertz (Hz). Rev. B | Page 58 of 84 Data Sheet AD6655 APPLICATIONS INFORMATION DESIGN GUIDELINES Before starting system-level design and layout of the AD6655, it is recommended that the designer become familiar with these guidelines, which discuss the special circuit connections and layout requirements needed for certain pins. For the specifications provided in Table 2, the fS/2 spur, if in band, is excluded from the SNR values. It is treated as a harmonic, in terms of SNR. The fS/2 level is included in the SFDR and worst other specifications. –60 Power and Ground Recommendations Depending on the relationship of the IF frequency to the center of the Nyquist zone, this spurious tone may or may not exist in the AD6655 output band. Some residual fS/2 energy is present in the AD6655, and the level of this spur is typically below the level of the harmonics at clock rates of 125 MSPS and below. Figure 82 shows a plot of the fS/2 spur level vs. analog input frequency for the AD6655-125. At sampling rates above 125 MSPS, the fS/2 spur level increases and is at a higher level than the worst harmonic, as shown in Figure 83, which shows the AD6655-150 fS/2 levels. –SFDR –90 –100 fS/2 SPUR 06709-083 –110 –120 0 50 100 150 200 250 300 350 400 450 500 INPUT FREQUENCY (MHz) Figure 82. AD6655-125 SFDR and fS/2 Spurious Level vs. Input Frequency (fIN) with DRVDD = 1.8 V Parallel CMOS Output Mode –60 –70 SFDR AND fS/2 SPUR (dBFS) fS/2 Spurious Because the AD6655 output data rate is at one-half the sampling frequency, there is significant fS/2 energy in the outputs of the part. If this fS/2 spur falls in band, care must be taken to ensure that this fS/2 energy does not couple into either the clock circuit or the analog inputs of the AD6655. When fS/2 energy is coupled in this fashion, it appears as a spurious tone reflected around fS/4, 3fS/4, 5fS/4, and so on. For example, in a 125 MSPS sampling application with a 90 MHz single-tone analog input, this energy generates a tone at 97.5 MHz. In this example, the center of the Nyquist zone is 93.75 MHz; therefore, the 90 MHz input signal is 3.75 MHz from the center of the Nyquist zone. As a result, the fS/2 spurious tone appears at 97.5 MHz, or 3.75 MHz above the center of the Nyquist zone. These frequencies are then tuned by the NCOs before being output by the AD6655. –80 fS/2 SPUR –80 –90 –SFDR –100 –110 06709-084 A single PCB ground plane should be sufficient when using the AD6655. With proper decoupling and smart partitioning of the PCB analog, digital, and clock sections, optimum performance is easily achieved. SFDR AND fS/2 SPUR (dBFS) –70 When connecting power to the AD6655, it is recommended that two separate 1.8 V supplies be used: one supply should be used for analog (AVDD) and digital (DVDD), and a separate supply should be used for the digital outputs (DRVDD). The AVDD and DVDD supplies, while derived from the same source, should be isolated with a ferrite bead or filter choke and separate decoupling capacitors. The designer can employ several different decoupling capacitors to cover both high and low frequencies. These capacitors should be located close to the point of entry at the PC board level and close to the pins of the part with minimal trace length. –120 0 50 100 150 200 250 300 350 400 450 500 ANALOG INPUT FREQUENCY (MHz) Figure 83. AD6655-150 SFDR and fS/2 Spurious Level vs. Input Frequency (fIN) with DRVDD = 1.8 V Parallel CMOS Output Mode Operating the part with a 1.8 V DRVDD voltage rather than a 3.3 V DRVDD lowers the fS/2 spur. In addition, using LVDS, CMOS interleaved, or CMOS IQ output modes also reduces the fS/2 spurious level. LVDS Operation The AD6655 defaults to CMOS output mode on power-up. If LVDS operation is desired, this mode must be programmed using the SPI configuration registers after power-up. When the AD6655 powers up in CMOS mode with LVDS termination resistors (100 Ω) on the outputs, the DRVDD current can be higher than the typical value until the part is placed in LVDS mode. This additional DRVDD current does not cause damage to the AD6655, but it should be taken into account when considering the maximum DRVDD current for the part. Rev. B | Page 59 of 84 AD6655 Data Sheet To avoid this additional DRVDD current, the AD6655 outputs can be disabled at power-up by taking the OEB pin high. After the part is placed into LVDS mode via the SPI port, the OEB pin can be taken low to enable the outputs. Exposed Paddle Thermal Heat Slug Recommendations It is mandatory that the exposed paddle on the underside of the ADC be connected to analog ground (AGND) to achieve the best electrical and thermal performance. A continuous, exposed (no solder mask) copper plane on the PCB should mate to the AD6655 exposed paddle, Pin 0. The copper plane should have several vias to achieve the lowest possible resistive thermal path for heat dissipation to flow through the bottom of the PCB. These vias should be filled or plugged with nonconductive epoxy. To maximize the coverage and adhesion between the ADC and the PCB, a silkscreen should be overlaid to partition the continuous plane on the PCB into several uniform sections. This provides several tie points between the ADC and the PCB during the reflow process. Using one continuous plane with no partitions guarantees only one tie point between the ADC and the PCB. See the evaluation board for a PCB layout example. For detailed information about packaging and PCB layout of chip scale packages, refer to Application Note AN-772, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) (see www.analog.com). CML The CML pin should be decoupled to ground with a 0.1 μF capacitor, as shown in Figure 48. RBIAS The AD6655 requires that a 10 kΩ resistor be placed between the RBIAS pin and ground. This resistor sets the master current reference of the ADC core and should have at least a 1% tolerance. Reference Decoupling The VREF pin should be externally decoupled to ground with a low ESR, 1.0 μF capacitor in parallel with a low ESR, 0.1 μF ceramic capacitor. SPI Port The SPI port should not be active during periods when the full dynamic performance of the converter is required. Because the SCLK, CSB, and SDIO signals are typically asynchronous to the ADC clock, noise from these signals can degrade converter performance. If the on-board SPI bus is used for other devices, it may be necessary to provide buffers between this bus and the AD6655 to keep these signals from transitioning at the converter inputs during critical sampling periods. Rev. B | Page 60 of 84 Data Sheet AD6655 EVALUATION BOARD The AD6655 evaluation board provides all of the support circuitry required to operate the ADC in its various modes and configurations. The converter can be driven differentially through a double balun configuration (default) or optionally through the AD8352 differential driver. The ADC can also be driven in a single-ended fashion. Separate power pins are provided to isolate the DUT from the AD8352 drive circuitry. Each input configuration can be selected by proper connection of various components (see Figure 85 to Figure 94). Figure 84 shows the typical bench characterization setup used to evaluate the ac performance of the AD6655. External supplies can be used to operate the evaluation board by removing L1, L3, L4, and L13 to disconnect the voltage regulators supplied from the switching power supply. This enables the user to individually bias each section of the board. Use P3 and P4 to connect a different supply for each section. At least one 1.8 V supply is needed with a 1 A current capability for AVDD and DVDD; a separate 1.8 V to 3.3 V supply is recommended for DRVDD. To operate the evaluation board using the AD8352 option, a separate 5.0 V supply (AMP VDD) with a 1 A current capability is needed. To operate the evaluation board using the alternate SPI options, a separate 3.3 V analog supply (VS) is needed, in addition to the other supplies. The 3.3 V supply (VS) should have a 1 A current capability, as well. Solder Jumper SJ35 allows the user to separate AVDD and DVDD, if desired. It is critical that the signal sources used for the analog input and clock have very low phase noise (<<1 ps rms jitter) to realize the optimum performance of the converter. Proper filtering of the analog input signal to remove harmonics and lower the integrated or broadband noise at the input is also necessary to achieve the specified noise performance. INPUT SIGNALS When connecting the clock and analog source, use clean signal generators with low phase noise, such as the Rohde & Schwarz SMA100A signal generators or the equivalent. Use 1 m long, shielded, RG-58, 50 Ω coaxial cable for making connections to the evaluation board. Enter the desired frequency and amplitude for the ADC. The AD6655 evaluation board from Analog Devices, Inc., can accept a ~2.8 V p-p or 13 dBm sine wave input for the clock. When connecting the analog input source, it is recommended that a multipole, narrow-band, band-pass filter with 50 Ω terminations be used. Band-pass filters of this type are available from TTE, Allen Avionics, and K&L Microwave, Inc. Connect the filter directly to the evaluation board, if possible. See Figure 85 to Figure 102 for the complete schematics and layout diagrams that demonstrate the routing and grounding techniques that should be applied at the system level. POWER SUPPLIES This evaluation board comes with a wall-mountable switching power supply that provides a 6 V, 2 A maximum output. Connect the supply to the rated 100 V ac to 240 V ac wall outlet at 47 Hz to 63 Hz. The output of the supply is a 2.1 mm inner diameter circular jack that connects to the PCB at J16. Once on the PC board, the 6 V supply is fused and conditioned before connection to six low dropout linear regulators that supply the proper bias to each of the various sections on the board. OUTPUT SIGNALS The parallel CMOS outputs interface directly with the Analog Devices standard ADC data capture board (HSC-ADC-EVALCZ). For more information on the ADC data capture boards and their optional settings, visit www.analog.com/FIFO. WALL OUTLET 100V TO 240V AC 47Hz TO 63Hz – + GND VCP AD6655 EVALUATION BOARD 14-BIT PARALLEL CMOS 14-BIT PARALLEL CMOS CLK SPI Figure 84. Evaluation Board Connection Rev. B | Page 61 of 84 HSC-ADC-EVALCZ FPGA BASED DATA CAPTURE BOARD PC RUNNING VISUAL ANALOG AND SPI CONTROLLER SOFTWARE USB CONNECTION SPI 06709-108 ROHDE & SCHWARZ, SMA100A, 2V p-p SIGNAL SYNTHESIZER + VS AINB 3.3V – GND BAND-PASS FILTER 3.3V + DRVDD IN ROHDE & SCHWARZ, SMA100A, 2V p-p SIGNAL SYNTHESIZER 3.3V – GND AINA – GND BAND-PASS FILTER + AMP VDD ROHDE & SCHWARZ, SMA100A, 2V p-p SIGNAL SYNTHESIZER 1.8V + – GND 5.0V SWITCHING POWER SUPPLY AVDD IN 6V DC 2A MAX AD6655 Data Sheet DEFAULT OPERATION AND JUMPER SELECTION SETTINGS The following is a list of the default and optional settings or modes allowed on the AD6655 evaluation board. POWER Connect the switching power supply that is provided in the evaluation kit between a rated 100 V ac to 240 V ac wall outlet at 47 Hz to 63 Hz and P500. VIN The evaluation board is set up for a double balun configuration analog input with optimum 50 Ω impedance matching from 70 MHz to 200 MHz. For more bandwidth response, the differential capacitor across the analog inputs can be changed or removed (see Table 14). The common mode of the analog inputs is developed from the center tap of the transformer via the CML pin of the ADC (see the Analog Input Considerations section). VREF VREF is set to 1.0 V by tying the SENSE pin to ground by adding a jumper on Header J5 (Pin 1 to Pin 2). This causes the ADC to operate in 2.0 V p-p full-scale range. To place the ADC in 1.0 V p-p mode (VREF = 0.5 V), a jumper should be placed on Header J4. A separate external reference option is also included on the evaluation board. To use an external reference, connect J6 (Pin 1 to Pin 2) and provide an external reference at TP5. Proper use of the VREF options is detailed in the Voltage Reference section. RBIAS RBIAS requires a 10 kΩ resistor (R503) to ground and is used to set the ADC core bias current. CLOCK The default clock input circuitry is derived from a simple baluncoupled circuit using a high bandwidth 1:1 impedance ratio balun (T5) that adds a very low amount of jitter to the clock path. The clock input is 50 Ω terminated and ac-coupled to handle singleended sine wave inputs. The transformer converts the single-ended input to a differential signal that is clipped before entering the ADC clock inputs. When the AD6655 input clock divider is utilized, clock frequencies up to 625 MHz can be input into the evaluation board through Connector S5. PDWN To enable the power-down feature, connect J7, shorting the PDWN pin to AVDD. CSB The CSB pin is internally pulled up, setting the chip into external pin mode, to ignore the SDIO and SCLK information. To connect the control of the CSB pin to the SPI circuitry on the evaluation board, connect J21, Pin 1 to J21, Pin 2. SCLK/DFS If the SPI port is in external pin mode, the SCLK/DFS pin sets the data format of the outputs. If the pin is left floating, the pin is internally pulled down, setting the default data format condition to offset binary. Connecting J2, Pin 1 to J2, Pin 2 sets the format to twos complement. If the SPI port is in serial pin mode, connecting J2, Pin 2 to J2, Pin 3 connects the SCLK pin to the on-board SPI circuitry (see the Serial Port Interface (SPI) section). SDIO/DCS If the SPI port is in external pin mode, the SDIO/DCS pin sets the duty cycle stabilizer. If the pin is left floating, the pin is internally pulled up, setting the default condition to DCS enabled. To disable the DCS, connect J1, Pin 1 to J1, Pin 2. If the SPI port is in serial pin mode, connecting J1, Pin 2 to J1, Pin 3 connects the SDIO pin to the on-board SPI circuitry (see the Serial Port Interface (SPI) section). ALTERNATIVE CLOCK CONFIGURATIONS Two alternate clocking options are provided on the AD6655 evaluation board. The first option is to use an on-board crystal oscillator (Y1) to provide the clock input to the part. To enable this crystal, Resistor R8 (0 Ω) and Resistor R85 (10 kΩ) should be installed, and Resistor R82 and Resistor R30 should be removed. A second clock option is to use a differential LVPECL clock to drive the ADC input using the AD9516 (U2). When using this drive option, the AD9516 charge pump filter components need to be populated (see Figure 89). Consult the AD9516 data sheet for more information. To configure the clock input from S5 to drive the AD9516 reference input instead of directly driving the ADC, the following components need to be added, removed, and/or changed. 1. Remove R32, R33, R99, and R101 in the default clock path. 2. Populate C78 and C79 with 0.001 μF capacitors and R78 and R79 with 0 Ω resistors in the clock path. In addition, unused AD9516 outputs (one LVDS and one LVPECL) are routed to optional Connector S8 through Connector S11 on the evaluation board. Rev. B | Page 62 of 84 Data Sheet AD6655 ALTERNATIVE ANALOG INPUT DRIVE CONFIGURATION 1. Remove C1, C17, C18, and C117 in the default analog input path. This section provides a brief description of the alternative analog input drive configuration using the AD8352. When using this particular drive option, some additional components need to be populated. For more details on the AD8352 differential driver, including how it works and its optional pin settings, consult the AD8352 data sheet. 2. Populate C8 and C9 with 0.1 µF capacitors in the analog input path. To drive the AD8352 in the differential input mode, populate the T10 transformer; the R1, R37, R39, R126, and R127 resistors; and the C10, C11, and C125 capacitors. 3. Populate the optional amplifier output path with the desired components including an optional low-pass filter. Install 0 Ω resistors, R44 and R48. R43 and R47 should be increased (typically to 100 Ω) to increase to 200 Ω the output impedance seen by the AD8352. To configure the analog input to drive the AD8352 instead of the default transformer option, the following components need to be added, removed, and/or changed for Channel A. For Channel B, the corresponding components should be changed. Rev. B | Page 63 of 84 AIN+ 1 S2 2 R28 1 R1 57.6 OHM R121 0 OHM RES0402 R120 0 OHM INA+ 0.1U C117 0.1U C1 0 OHM R2 INA+ 0.1U C47 INA- 0.1U C9 T10 R54 0 OHM P S 3 2 1 DNP R36 5 4 P 5 4 S ETC1-1-13 T1 1ADT1_1WT6 2 3 T7 0 OHM R110 1 2 3 1 2 3 CML P ETC1-1-13 S T2 5 4 0.1U C18 0.1U C17 DEFAULT AMPLIFIER INPUT PATH 4 5 ETC1-1-1 3 F 0.1U R31 R29 R35 0 OHM 24.9 OHM 24.9 OHM C8 4.12K 0.1U C11 0.1U C10 R126 INA- 0 OHM R48 0 OHM R44 C125 .3PF R37 100 OHM CML RGP RDP VIN 4 RDN 0 OHM R40 5 16 VIP 3 RGN 2 1 R42 AMP+A AMP-A 0 OHM R39 DNP R38 0 OHM R127 W1 Z1 GND VOP 13 VCC AMPVDD VCC 8 C3 0.1U 12 9 10 11 C22 0.1U GND VON AD8352 VCM 14 GND 6 7 15 ENB A B R41 R5 OPTIONAL AMPLIFIER INPUT PATH F 10K OHM 57.6 OHM 10K OHM R43 R47 S1 2 AIN- 57.6 OHM Figure 85. Evaluation Board Schematic, Channel A Analog Inputs R4 33 OHM 33 OHM Rev. B | Page 64 of 84 0 OHM F 33 OHM R27 33 OHM R26 C23 0.1U C27 10U C12 0.001U C16 0.001U AMPVDD C2 0.1U C5 4.7PF L15 1 IND0603 L14 1 IND0603 DNP 120NH DNP 120NH 2 2 0 OHM R49 DNP 180NH DNP R50 0 OHM 2 2 AVDD AVDD AMP+A C139 12PF DNP AMP-A Transformer/amp channel A VIN+A TP15 1 L16 180NH VIN-A TP14 1 L17 1 IND0603 C4 18PF DNP 1 IND0603 06709-200 AMPVDD AD6655 Data Sheet SCHEMATICS Figure 86. Evaluation Board Schematic, Channel B Analog Inputs AIN+ AIN- S4 S3 1 1 57.6 OH M R52 57.6 OH M R51 RES0402 0 OH M R123 RES0402 0 OH M R122 INB0.1U C31 INB+ 0.1U C6 0.1U C28 0 OH M R67 INB - 4 5 P 3 2 1 DN P 0.1U 0.1U C39 .3PF C128 C51 0.1U 4 5 T8 P T3 4 5 6 S ETC1-1-1 3 3 2 1 ADT1_1W T 0 OH M R111 3 2 1 4 5 CML P T4 S ETC1-1-1 3 3 2 1 DN P R133 0 OH M R132 R6 0 OH M DEFAULT AMP LIFIER INPUT PATH 0 OH M R55 T11 S ETC1-1-1 3 0 OH M F 0.1U R134 R135 INB+ 24.9 OH M 24.9 OH M C38 R128 R66 R68 F R129 C30 4.12K R69 2 2 0.1U C82 0.1U C7 100 OH M RGP RDP VIN 4 RDN 5 16 VIP 3 RGN 2 1 15 0 OH M R95 CML 0 OH M R94 6 ENB Z2 7 AMP+B 0 OH M R96 AMP-B GND VON VCC 8 GND R53 VOP VCC 13 AMPVDD AD8352 VCM 14 GND 10K OH M A B W2 C60 0.1U 9 10 11 12 R70 R71 R131 C61 0.1U C24 0.1U C62 10U C83 0.1U AMPVDD 0.001U C140 0.001U C46 57.6 OH M OPTIONAL AMPLIFIER INPUT PATH F 0 OH M R72 10K OH M 33 OH M 33 OH M Rev. B | Page 65 of 84 R73 33 OH M R74 33 OH M L19 1 IND0603 L18 1 IND0603 C84 4.7PF DNP 180NH DNP 120NH DNP L21 1 IND0603 180NH C19 18PF DNP L20 1 IND0603 DNP 2 2 120NH 2 2 R80 R81 0 OH M 0 OH M TP17 1 TP16 1 AMP-B C29 12PF DNP VIN+B VIN- B AMP+B AVDD AVDD 06709-201 AMPVDD Data Sheet AD6655 S6 SMA200U P ENC\ ENC S5 SMA200U P 1 1 R30 R7 R8 57.6OHM 57.6OHM 0 OHM R85 R82 R90 10KOHM 10KOHM 0 OHM R3 0 OHM Figure 87. Evaluation Board Schematic, DUT Clock Input 0.001U C77 0.001U C94 0.001U C63 0.001U 4 5 0.1U OPT_CLK- 3 S 2 T5 ETC1-1-13 P 1 6 T9 5 4 ADT1_1W T 1 2 3 C56 OPT_CLK+ 0.1U R32 0.001U C79 0 OHM R33 0 OHM 0.001U C78 OPT_CLK- ALTCLK- OPT_CLK+ ALTCLK+ R78 0 OHM R79 0 OHM R101 0 OHM R99 0 OHM R83 0.1U C21 24.9OHM R84 0.1U C20 24.9OHM C145 1 C64 F 2 2 Rev. B | Page 66 of 84 2 VS CLK- CLK+ AD6655 Data Sheet 06709-202 TP2 DNP R34 S7 1 CLK IN AD9516 VS_OUT_D R VCXO_CLK- RES0402 0 OHM R125 RES0402 R89 0 OHM C100 0.1U 0 OHM R124 VCXO_CLK+ C104 0.1U 49.9 OHM C101 0.1U C98 0.1U 0.1U C143 0.1U C142 C80 18PF VCP C99 0.1U VS SCLK VCP BYPASS_LDO 9 BYPASS_LDO CLK C96 0.1U SCLK 16 NC1 15 CLKB 14 13 C97 0.1U VS_CLK_DIS T 12 VS_VCO 11 10 LF SYNCB LF REF_SEL 7 STATUS 6 CP 4 5 8 STATUS REFMON LD 2 3 SYNCB CP TP18 TEST 1 REF_SEL VCP REFMON U2 AD9516_64LFCS P RESETB TP19 TES1 T RSET_CLOC K58 23 R10 PDB 1 LD OUT5B VS_OUT45_DI V OUT153 28 OUT5 VS_OUT01_DR V54 27 VS_OUT45_DR V SDO CP_RSE T62 19 NC3 NC4 CSB R11 REFINB 18 63 NC2 5.1K VS_PLL_ 261 20 R12 SDIO 4.12K VS_REF57 24 TEST OUT4 VS_PLL_1 OUT4B 1 OUT056 25 TP20 2 OUT0B55 26 VS VS_OUT01_DI V51 30 OPT_CLK + OUT1B52 29 VS VS_OUT89_ 1 AGND VS_OUT89_ 2 VS_OUT_DR VS_OUT67_ 250 31 VS VS_OUT67_ 149 32 OPT_CLK - REFIN64 17 CSB_2 VS_PRESCALE R60 21 SDO GND_REF 59 22 SDI Rev. B | Page 67 of 84 RESETB Figure 88. Evaluation Board Schematic, Optional AD9516 Clock Circuit PDB VS 36 35 34 33 OUT9B OUT9 OUT8B OUT8 GND_OUT89_DI V 37 39 38 40 OUT3B OUT3 VS_OUT23_DI V VS R88 200 R86 200 AGND VS R92 200 R91 200 ALTCLK+ VS_OUT_DR 42 OUT2B VS_OUT23_DR V 41 ALTCLK- 43 LVPECL TO ADC 1TP8 0.001U C141 OUT2 AGND R9 44 45 46 47 48 100 OHM GND_ESD OUT7B OUT7 OUT6B OUT6 OUT6N SYNC 0.1U C86 0.1U C85 0.1U C87 0.1U C88 1 1 1 1 S8 S9 S10 S11 2 VS_OUT_D R 2 PAD 2 LVDS LVPECL OUTPUT OUTPUT 06709-203 OUT6P Data Sheet AD6655 2 100 OHM R75 CP Figure 89. Evaluation Board Schematic, Optional AD9516 Loop Filter/VCO and SYNC Input Rev. B | Page 68 of 84 BYPASS_LDO VAL R136 SYNC S12 SMA200UP 2 R98 VAL C90 SEL RES0603 57.6 OH M R45 C89 SEL R93 VAL VAL R137 SEL C91 C144 SEL 0.1U Charge Pump Filter 1 C25 VAL R97 3 2 A2 NL27WZ04 C92 SEL GND Y1 4 5 6 RES0402 0 OH M R117 RES0402 0 OH M R116 Y2 VCC LF RES0402 TP1 1 R87 OSCVECTRON_VS500 RES0402 0 OH M R104 U25 4 OUT2 3 GND 6 VCC 5 OUT1 24.9 OH M 2 OUT_DISABLE VS-500 1 FREQ_CTRL_V 33 OH M R46 SYNC R106 R108 U3 10K OH M 10K OH M A1 R107 R109 1 10K OH M 10K OH M VS R114 RES0402 0 OH M RES0402 R139 0 OH M VCP VCP RES0402 10K OH M R100 VCXO_CLK- VCXO_CLK+ VS REF_SE L VS PD B VS SYNC B VS RESET B 06709-204 C26 0.1U RES0402 RES0402 R76 200 RES0402 RES0402 LD VS AD6655 Data Sheet RES0402 10K OH M R105 RES0402 10K OH M R103 RES0402 10K OH M R102 Rev. B | Page 69 of 84 Figure 90. Evaluation Board Schematic, DUT D1B D9A DVDD1 D0B_LSB_ DVDD2 FD2B FD3B RPAK8 D13A_MSB_ FD0B FD1B FD0A FD1A SPI_CSB SYNC FD2A CLK- FD3A CLK+ 57 52 50 51 49 C137 0.001U D2B U1 SPI_SCLK/DFS DRVDD1 C121 0.1U C120 0.1U AVDD3 D8A C109 0.1U C40 0.1U 48 RES040 2 SPI_SDIO/DCS D4B C122 0.001U C126 0.001U SPI_SCLK 47 46 AVDD2 VIN+B 0.001U D3B C127 0.001U R64 AVDD SPI_SDIO 45 44 43 VIN-B AD6655 C36 0.1U C35 DRVDD D7A D1A D2A D3A D4A 63 61 62 59 60 58 55 56 53 54 R57 22ohm 9 10 11 12 13 14 15 16 RPAK8 DRVDD D6B D7B D8B D9B D10B D11B D12B D13B_MSB_ DCOB DCOA DOA_LSB_ 64 AVDD 1 AVDD VIN+B VIN-B 42 RBIAS CML SENSE TP3 DRGND1 DVDD TP6 R63RES0402 0 OHM 10KOHM 0.1U 41 40 D12A CML VREF VIN-A D11A AVDD RES0402 C32 39 38 AVDD1 VIN+A 1 D10A TP5 VIN-A 37 32 36 31 VIN+A AVDD 28 PWR_SDFS 27 PWR_SCLK_PDWN 26 C14 0.1U PWR_SDFS R62 RES0402 25 35 R112 PWR_SCL K PWR_SDO FD3A FD2A FD1A FD0A 8 7 6 5 4 3 2 1 30 PWR_SDO/OEB 0 OHM R115 0 OHM 24 34 33 RES0402 23 1 C15 1U J4 - INSTALLFOR 0.5V VREF/IV INPUTSPAN J5 - INSTALLFORIV VREF/2VINPUTSPAN J6 - INSTALLFOR EXTERNALREFERENCEMODE J7 - INSTALLFORPDWN J8 - INSTALLFOROUTPUTDISABLE R113 22ohm 29 9 10 11 12 13 14 15 16 0 OHM 21 D5B CLK- 22 DRGND CLK+ DVDD 20 D6A SPI_CSB 19 D5A SYNC 17 DVDD 18 8 7 6 5 4 3 2 1 1 2 3 4 5 6 7 8 9 DRVDD 10 11 12 13 14 15 16 D1B D0B FD3B FD2B FD1B FD0B R58 5 6 7 8 C34 R59 RPAK8 22ohm R60 RPAK8 22ohm RPAK4 22ohm 4 3 2 1 0.001U 9 10 11 12 13 14 15 16 9 10 11 12 13 14 15 16 8 7 6 5 4 3 2 1 0.1U R61 RPAK8 22ohm C33 9 10 11 12 13 14 15 16 8 7 6 5 4 3 2 1 8 7 6 5 4 3 2 1 D5B D4B D3B D2B D13A D12A D11A D10A D9A D8A D7A D6A D13B D12B D11B D10B D9B D8B D7B D6B D5A D4A D3A D2A D1A D0A DCOA DCOB 06709-205 DRVDD Data Sheet AD6655 Figure 91. Evaluation Board Schematic, Digital Output Interface FD1B FD0B V_DIG D1B D0B FD3B FD2B D5B D4B V_DIG D3B D2B D7B D6B D9B D8B D13B D12B V_DIG D11B D10B D1A D0A DCOA DCOB D5A D4A V_DIG D3A D2A D7A D6A D9A D8A D13A D12A V_DIG D11A D10A FD3A FD2A FD1A FD0A V_DIG PWR_SDO PWR_SDFS PWR_SCLK 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 U17 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 74VCX162244MTD 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 74VCX162244MTD 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 U16 74VCX162244MTD V_DIG V_DIG V_DIG V_DIG SDO_OUT SDFS_OUT SCLK_OUT OUT6P OUT6N J11 BG1 BG2 BG3 BG4 BG5 BG6 BG7 BG8 BG9 BG10 DG1 DG2 DG3 DG4 DG5 DG6 DG7 DG8 DG9 DG10 CSB TYCO_HM-ZD CHANNELB B1 C10 D10 C9 D9 A9 B9 C8 D8 A8 B8 C7 D7 A7 B7 C6 D6 A6 B6 A10 B10 C5 D5 A5 B5 C4 D4 A4 B4 C3 D3 A3 B3 C2 D2 A2 B2 C1 D1 A1 CSB_2 SCLK TYCO_HM-ZD J10 BG1 BG2 BG3 BG4 BG5 BG6 BG7 BG8 BG9 BG10 DG1 DG2 DG3 DG4 DG5 DG6 DG7 DG8 DG9 DG10 R140 RES0402 0 OHM R145 RES0402 0 OHM R144 VS 0 OHM SCLK_OUT OUT6N TP22 TEST 1 TP23 TEST 1 TP24 TEST 1 OUT6P SYNC SDI RES0402 R143 0 OHM SDO_OUT SDFS_OU T RES0402 0 OHM R142 RES0402 0 OHM R119 R141 RES0402 SDO RESETB TP21 TEST 1 VS R118 CHANNELA B1 C10 D10 C9 D9 A9 B9 C8 D8 A8 B8 C7 D7 A7 B7 C6 D6 A6 B6 A10 B10 C5 D5 A5 B5 C4 D4 A4 B4 C3 D3 A3 B3 C2 D2 A2 B2 C1 D1 A1 A1 D1 C1 B2 A2 D2 C2 B3 A3 D3 C3 B4 A4 D4 C4 B5 A5 D5 C5 B10 A10 B6 A6 D6 C6 B7 A7 D7 C7 B8 A8 D8 C8 B9 A9 D9 C9 D10 C10 B1 J12 DG10 DG9 DG8 DG7 DG6 DG5 DG4 DG3 DG2 DG1 BG10 BG9 BG8 BG7 BG6 BG5 BG4 BG3 BG2 BG1 TYCO_HM-ZD V_DIG V_DIG C65 0.1U C66 0.1U C72 0.1U C67 0.1U C73 0.1U C68 0.1U C74 0.1U C69 0.1U C75 0.1U C70 0.1U C76 0.1U C71 0.1U 06709-206 DIGITAL/HSC-ADC-EVALCZ INTERFACE 10KOHM 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 RES040 2 U15 R130 VAL R77 Rev. B | Page 70 of 84 100OHM 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 AD6655 Data Sheet RES040 2 10KOHM Rev. B | Page 71 of 84 CSB SDO SDI SCLK CSB_2 V_DIG RES0402 CSB SCLK 10KOHM R18 C13 0.1U R24 A2 GND A1 3 2 1 RES0402 A2 Y1 U8 Y2 Y2 VCC NC7WZ16P6X GND A1 Y1 VCC NC7WZ07P6X RES0603 10KOHM 3 2 1 RES040 2 R19 U7 1KOHM 4 5 6 4 5 6 SDO V_DIG C81 0.1U V_DIG V_DIG V_DIG RES0603 1KOHM R21 RES0603 1KOHM R20 R17 RES0603 100KOHM VS V_DIG R22 3 RES0603 SPI_CSB 100KOHM R23 RES0603 100KOHM J2 3 1 J1 SPI_SCLK SPI_SDIO 1 V_DIG J1 - JUMPERPINS 2 TO 3 FOR SPI OPERATION JUMPERPINS 1 TO 2 FOR DCS ENABLE J2 - JUMPERPINS 2 TO 3 FOR SPI OPERATION JUMPERPINS 1 TO 2 FOR TWOS COMPLIMENT OUTPUT J21 - INSTALLJUMPERFOR SPI OPERATION 06709-207 SDI Data Sheet AD6655 Figure 92. Evaluation Board Schematic, SPI Circuitry 10KOHM R65 Rev. B | Page 72 of 84 Figure 93. Evaluation Board Schematic, Power Supply P4 P3 P2 P1 P4 P66 P55 P44 P33 P22 P3 P11 VCP VS DRVDDI N 1 1 AVDDI N SMDC110F C41 10U F2 OPTIONAL POWER SUPPLY INPUT S POWER_JACK 2 L6 IND1210 10U H 10u h L10 IND1210 L9 IND1210 10U H 1 2 2 CR7 2 C53 10U C102 10U C52 10U BNX-01 6 3 PSG 1 BIAS C58 0.1U C103 0.1U C57 0.1U CG6 CG5 CG 4 CB 2 1 10u h IND1210 L11 1 2 DRVD D 2 PWR_I N DVDD AVD D R16 1 3 2 1 CR8 C54 10U RES0603 SHOT_RECT 261 OH M TP25 1 C59 0.1U 1 2 V_DI G CR10 S2A_REC T 1 CR11 S2A_REC T 1 C42 1U SJ35 TP13 1 TP12 1 TP10 1 1TP9 1TP4 SD 6 8 IN 7 IN2 ADP3334 2 C44 1U CR12 S2A_REC T GND TEST POINT S 2 3 VR3 PAD 5 GND OUT VR1 OUT 1 OUT2 2 FB 3 IN 4 GND 1 F1 C43 1U 1 10u h 1.8 2.5 3.3 DRVD D R1 3 76.8 K 107 K 140 K 2 147 K 94.0 K 78.7 K R1 4 C93 0.001U L3 IND1210 DRVDD SETTIN G ADP3339 R13 R14 J16 76.8 KOH M 147K OH M S2A_REC T C45 1U AVDDI N 1 10u h L4 IND1210 2 DRVDDI N 06709-208 POWER INPU T 6V, 2A MAX AD6655 Data Sheet PWR_IN PWR_IN Rev. B | Page 73 of 84 Figure 94. Evaluation Board Schematic, Power Supply (Continued) PAD ADP333 9 VCP 5 C119 10U GND OUT 1 OUT2 2 FB 3 VR2 OUT OUT C124 10U VS_OUT_D R Power Supply ByPass Capaci tors VCP SD 6 8 IN 7 IN2 ADP3334 C132 1U IN VR6 C135 1U 3 C133 1U PAD ADP333 9 4 GND 1 4 GND 1 IN VS C136 1U C134 1U C118 10U R25 VR5 140KOHM R15 0.001U C95 SJ36 78.7KOHM 1 1 1 2 2 C131 1U L13 IND1210 10uh L12 IND1210 10uh L8 IND1210 10UH 2 VS VCP VS VS_OUT_DR C110 0.1U PWR_IN C112 0.1U C108 0.1U C129 1U 3 IN PAD ADP333 9 C111 0.1U VR4 4 GND 1 3 C115 0.1U OUT C114 0.1U C113 0.1U C130 1U 1 2 C107 0.1U L1 IND1210 10UH C116 0.1U C105 0.1U AMPVDD 06709-209 PWR_IN Data Sheet AD6655 SJ37 AD6655 Data Sheet 06709-100 EVALUATION BOARD LAYOUTS Figure 95. Evaluation Board Layout, Primary Side Rev. B | Page 74 of 84 AD6655 06709-101 Data Sheet Figure 96. Evaluation Board Layout, Ground Plane Rev. B | Page 75 of 84 Data Sheet 06709-102 AD6655 Figure 97. Evaluation Board Layout, Power Plane Rev. B | Page 76 of 84 AD6655 06709-103 Data Sheet Figure 98. Evaluation Board Layout, Power Plane Rev. B | Page 77 of 84 Data Sheet 06709-104 AD6655 Figure 99. Evaluation Board Layout, Ground Plane Rev. B | Page 78 of 84 AD6655 06709-105 Data Sheet Figure 100. Evaluation Board Layout, Secondary Side (Mirrored Image) Rev. B | Page 79 of 84 Data Sheet 06709-106 AD6655 Figure 101. Evaluation Board Layout, Silkscreen, Primary Side Rev. B | Page 80 of 84 AD6655 06709-107 Data Sheet Figure 102. Evaluation Board Layout, Silkscreen, Secondary Side Rev. B | Page 81 of 84 AD6655 Data Sheet BILL OF MATERIALS Table 30. Evaluation Board Bill of Materials (BOM) 1, 2 Item 1 2 Qty 1 55 3 1 Reference Designator AD6655CE_REVB C1 to C3, C6, C7, C13, C14, C17, C18, C20 to C26, C32, C57 to C61, C65 to C76, C81 to C83, C96 to C101, C103, C105, C107, C108, C110 to C116, C145 C80 4 2 C5, C84 5 10 6 13 7 10 8 1 C33, C35, C63, C93 to C95, C122, C126, C127, C137 C15, C42 to C45, C129 to C136 C27, C41, C52 to C54, C62, C102, C118, C119, C124 CR5 9 2 CR6, CR9 10 4 11 1 12 13 Description PCB 0.1 µF, 16 V ceramic capacitor, SMT 0402 Package PCB C0402SM Manufacturer Analog Devices Murata GRM155R71C104KA88D 18 pF, COG, 50 V, 5% ceramic capacitor, SMT 0402 4.7 pF, COG, 50 V, 5% ceramic capacitor, SMT 0402 0.001 µF, X7R, 25 V, 10% ceramic capacitor, SMT 0402 C0402SM Murata GJM1555C1H180JB01J C0402SM Murata GJM1555C1H4R7CB01J C0402SM Murata GRM155R71H102KA01D 1 µF, X5R, 25 V, 10% ceramic capacitor, SMT 0805 10 µF, X5R, 10 V, 10% ceramic capacitor, SMT 1206 C0805 Murata GR4M219R61A105KC01D C1206 Murata GRM31CR61C106KC31L Schottky diode HSMS2822, SOT23 SOT23 Avago Technologies HSMS-2822-BLKG LED RED, SMT, 0603, SS-type LED0603 Panasonic LNJ208R8ARA CR7, CR10 to CR12 50 V, 2 A diode DO_214AA Micro Commercial Components S2A-TP CR8 30 V, 3 A diode DO_214AB Micro Commercial Components SK33-TP 1 F1 EMI filter FLTHMURATABNX01 Murata BNX016-01 1 F2 L1206 Tyco Raychem NANOSMDC150F-2 14 2 J1, J2 HDR3 Samtec TWS-1003-08-G-S 15 9 HDR2 Samtec TWS-102-08-G-S 16 3 J4 to J9, J18, J19, J21 J10 to J12 6.0 V, 3.0 A, trip current resettable fuse 3-pin, male, single row, straight header 2-pin, male, straight header Interface connector TYCO_HM_ZD Tyco 6469169-1 17 1 J14 CNBERG2X4H350LD Samtec TSW-104-08-T-D 18 1 J16 8-pin, male, double row, straight header DC power jack connector PWR_JACK1 Cui Stack PJ-002A 19 10 10 µH, 2 A bead core, 1210 1210 Panasonic EXC-CL3225U1 20 1 L1, L3, L4, L6, L8 to L13 P3 6-terminal connector PTMICRO6 Weiland Electric, Inc. Z5.531.3625.0 21 1 P4 4-terminal connector PTMICRO4 Weiland Electric, Inc. Z5.531.3425.0 22 3 R7, R30, R45 R0603 NIC Components NRC06F57R6TRF 23 27 R0402SM NIC Components NRC04ZOTRF 24 1 R2, R3, R4, R32, R33, R42, R64, R67, R69, R90, R96, R99, R101, R104, R110 to F113, R115, R119, R121, R123, R141 to R145 R13 57.6 Ω, 0603, 1/10 W, 1% resistor 0 Ω, 1/16 W, 5% resistor 76.8 kΩ, 0603, 1/10 W, 1% resistor R0603 NIC Components NRC06F7682TRF 25 1 R25 140 kΩ, 0603, 1/10 W, 1% resistor R0603 NIC Components NRC06F1403TRF 26 1 R14 147 kΩ, 0603, 1/10 W, 1% resistor R0603 NIC Components NRC06F1473TRF 27 1 R15 78.7 kΩ, 0603, 1/10 W, 1% resistor R0603 NIC Components NRC06F7872TRF Rev. B | Page 82 of 84 Mfg. Part Number Data Sheet AD6655 Item 28 Qty 1 Reference Designator R16 Description 261 Ω, 0603, 1/10 W, 1% resistor Package R0603 Manufacturer NIC Components Mfg. Part Number NRC06F2610TRF 29 3 R17, R22, R23 100 kΩ, 0603, 1/10 W, 1% resistor R0603 NIC Components NRC06F1003TRF 30 7 10 kΩ, 0402, 1/16 W, 1% resistor R0402SM NIC Components NRC04F1002TRF 31 3 R18, R24, R63, R65, R82, R118, R140 R19, R21 1 kΩ, 0603, 1/10 W, 1% resistor R0603 NIC Components NRC06F1001TRF 32 9 33 Ω, 0402, 1/16 W, 5% resistor R0402SM NIC Components NRC04J330TRF 33 5 R26, R27, R43, R46, R47, R70, R71, R73, R74 R57, R59 to R62 22 Ω, 16-pin, 8-resistor, resistor array R_742 CTS Corporation 742C163220JPTR 34 1 R58 RES_ARRY CTS Corporation 742C083220JPTR 35 1 R76 22 Ω, 8-pin, 4-resistor, resistor array 200 Ω, 0402, 1/16 W, 1% resistor R0402SM NIC Components NCR04F2000TRF 36 4 S2, S3, S5, S12 SMA_EDGE 1 SJ35 SLDR_PAD2MUYLAR Emerson Network Power NIC Components 142-0701-201 37 SMA, inline, male, coaxial connector 0 Ω, 1/8 W, 1% resistor NRC10ZOTRF 38 5 T1 to T5 Balun TRAN6B M/A-COM MABA-007159-000000 39 1 U1 IC, AD6655 LFCSP64-9X9-9E Analog Devices AD6655BCPZ 40 1 U2 Clock distribution, PLL IC LFCSP64-9X9 Analog Devices AD9516-4BCPZ 41 1 U3 Dual inverter IC SC70_6 Fairchild Semiconductor NC7WZ04P6X_NL 42 1 U7 SC70_6 Fairchild Semiconductor NC7WZ07P6X_NL 43 1 U8 Dual buffer IC, open-drain circuits UHS dual buffer IC SC70_6 Fairchild Semiconductor NC7WZ16P6X_NL 44 3 U15 to U17 16-bit CMOS buffer IC TSOP48_8_1MM Fairchild Semiconductor 74VCX16244MTDX_NL 45 2 VR1, VR2 Adjustable regulator LFCSP8-3X3 Analog Devices ADP3334ACPZ 46 1 VR3 1.8 V high accuracy regulator SOT223-HS Analog Devices ADP3339AKCZ-1.8 47 1 VR4 5.0 V high accuracy regulator SOT223-HS Analog Devices ADP3339AKCZ-5.0 48 2 VR5, VR6 3.3 V high accuracy regulator SOT223-HS Analog Devices ADP3339AKCZ-3.3 49 1 Y1 Oscillator clock, VFAC3 OSC-CTS-CB3 Valpey Fisher VFAC3-BHL 50 2 Z1, Z2 High speed IC, op amp LFCSP16-3X3-PAD Analog Devices AD8352ACPZ 1 2 This bill of materials is RoHS compliant. The bill of materials lists only those items that are normally installed in the default condition. Items that are not installed are not included in the BOM. Rev. B | Page 83 of 84 AD6655 Data Sheet OUTLINE DIMENSIONS 9.10 9.00 SQ 8.90 0.30 0.25 0.18 0.60 MAX 0.60 MAX 64 48 49 1 PIN 1 INDICATOR PIN 1 INDICATOR 8.85 8.75 SQ 8.65 0.50 BSC 0.50 0.40 0.30 33 32 0.22 MIN 7.50 REF 0.80 MAX 0.65 TYP 0.05 MAX 0.02 NOM SEATING PLANE 16 0.20 REF FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4 06-15-2012-B 12° MAX 17 BOTTOM VIEW TOP VIEW 1.00 0.85 0.80 7.55 7.50 SQ 7.45 EXPOSED PAD Figure 103. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 9 mm × 9 mm Body, Very Thin Quad (CP-64-6) Dimensions shown in millimeters ORDERING GUIDE Model 1 AD6655ABCPZ-150 AD6655ABCPZ-125 AD6655ABCPZ-105 AD6655ABCPZ-80 AD6655ABCPZRL7-150 AD6655ABCPZRL7-125 AD6655-125EBZ AD6655-150EBZ 1 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C Package Description 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] Evaluation Board with AD6655 and Software Evaluation Board with AD6655 and Software Z = RoHS Compliant Part. ©2007–2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06709-0-1/14(B) Rev. B | Page 84 of 84 Package Option CP-64-6 CP-64-6 CP-64-6 CP-64-6 CP-64-6 CP-64-6