Diodes DMP2042UCB4-7 P-channel enhancement mode mosfet Datasheet

DMP2042UCB4
P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary (Typ @VGS = -4.5V, TA = +25°C)
BVDSS
RDS(ON)
ID
37mΩ @ VGS = -4.5V
-4.6A
49mΩ @ VGS = -2.5V
-3.7A
Features and Benefits
-20V

Low QG & QGD






Small Footprint
Low Profile 0.62mm Height
ESD Protected Up To 3KV
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Description and Applications
Mechanical Data
This new generation MOSFET is designed to minimize the on-state
resistance (RDS(ON)), yet maintain superior switching performance,


Case: U-WLB1010-4 (Type C)
Terminal Connections: See Diagram Below
making it ideal for high efficiency power management applications.



Battery Management
Load Switch
Battery Protection
U-WLB1010-4 (Type C)
ESD PROTECTED TO 3kV
Top View
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMP2042UCB4-7
Notes:
Case
U-WLB1010-4 (Type C)
Packaging
3000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen and Antimony free, "Green"
and Lead-Free.
3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
2A = Product Type Marking Code
YM = Date Code Marking
Y or Y = Year (ex: D = 2016)
M or M = Month (ex: 9 = September)
Date Code Key
Year
Code
Month
Code
2016
D
Jan
1
2017
E
Feb
2
DMP2042UCB4
Document number: DS38665 Rev. 2 - 2
Mar
3
2018
F
Apr
4
May
5
2019
G
Jun
6
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2020
H
Jul
7
Aug
8
2021
I
Sep
9
Oct
O
2022
J
Nov
N
Dec
D
July 2016
© Diodes Incorporated
DMP2042UCB4
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = -4.5V
Continuous Drain Current (Note 5) VGS = -2.5V
Pulsed Drain Current (Note 6)
Symbol
VDSS
VGSS
ID
ID
IDM
Value
-20
-6
-4.6
-3.7
-16
Unit
V
V
A
A
A
Symbol
PD
RθJA
PD
RθJA
TJ, TSTG
Value
0.75
165
1.4
87
-55 to +150
Unit
W
°C/W
W
°C/W
°C
Thermal Characteristics
Characteristic
Power Dissipation (Note 7)
Thermal Resistance, Junction to Ambient @TA = +25°C (Note 7)
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient @TA = +25°C (Note 5)
Operating and Storage Temperature Range
Electrical Characteristics
(@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Gate-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
BVGSS
IDSS
IGSS
-20
-6.0
—
—
—
—
—
—
—
—
-1
-100
V
V
µA
nA
VGS = 0V, ID = -250μA
VDS = 0V, IG = -250μA
VDS = -16V, VGS = 0V
VGS = -6V, VDS = 0V
VGS(TH)
RDS(ON)
|YFS|
VSD
-0.8
37
49
6.6
-0.7
-1.2
45
65
-1.0
V
Static Drain-Source On-Resistance
-0.4
—
—
—
—
VDS = VGS, ID = -250μA
VGS = -4.5V, ID =-1A
VGS = -2.5V, ID = -1A
VDS = -10V, ID = -1A
VGS = 0V, IS = -1A
CISS
COSS
CRSS
RG
RC
QG
QGS
QGD
QG(TH)
tD(ON)
tR
tD(OFF)
tF
QRR
tRR
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
218
148
11
20
5,000
2.5
0.4
0.4
0.2
0.6
0.8
1.4
0.8
2.2
10
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Series Gate Resistance
Series Clamp Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Charge at Vth
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Charge
Reverse Recovery Time
Notes:
mΩ
S
V
Test Condition
pF
VDS = -10V, VGS = 0V,
f = 1.0MHz
Ω
f = 1MHz, VGS = 0V, VDS = 0V
nC
VGS = -4.5V, VDS = -10V,
ID =-1A
µs
VDS = -10V, VGS = -2.5V,
RG = 10Ω, ID = -1A
nC
ns
VDD = -10V, IF = -1.0A,
di/dt =100A/μs
5. Device mounted on FR-4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.
6. Repetitive rating, pulse width limited by junction temperature.
7. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to production testing.
DMP2042UCB4
Document number: DS38665 Rev. 2 - 2
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DMP2042UCB4
10
VGS = -2.0V
VGS=-3.0V
VGS = -4.5V
8.0
VDS = -5V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
10.0
VGS = -8.0V
VGS = -1.8V
6.0
4.0
VGS = -1.5V
2.0
8
6
4
2
125℃
85℃
25℃
-55℃
150℃
VGS = -1.2V
0.0
0
0
0.4
0.8
1.2
1.6
2
0.4
VDS, DRAIN-SOURCE VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(W)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(W)
0.07
0.06
VGS = -2.5V
0.05
VGS = -4.5V
0.03
0.02
1
2
3
4
5
6
7
8
9
0.06
VGS = -2.5V, ID = -1.0A
1.2
1.1
VGS = -4.5V, ID = -1.0A
0.9
0.8
0.7
0
25
50
75
100
Document number: DS38665 Rev. 2 - 2
1.8
2
2.2
0.05
125
150
85℃
0.04
25℃
0.03
-55℃
0.02
0.01
2
4
6
8
10
ID, DRAIN CURRENT (A)
Figure 4. Typical On-Resistance vs. Drain Current and
Junction Temperature
TJ, JUNCTION TEMPERATURE (℃)
Figure 5. On-Resistance Variation with Junction
Temperature
DMP2042UCB4
1.6
125℃
0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (W)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
1.4
-25
1.4
150℃
10
1.5
-50
1.2
VGS = -4.5V
Figure 3. Typical On-Resistance vs. Drain Current and
Gate Voltage
1
1
0.07
ID, DRAIN-SOURCE CURRENT (A)
1.3
0.8
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
Figure 1. Typical Output Characteristic
0.04
0.6
0.08
0.07
0.06
VGS = -2.5V, ID = -1.0A
0.05
0.04
VGS = -4.5V, ID = -1.0A
0.03
0.02
-50
-25
0
25
50
75
100
125
150
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Junction
Temperature
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DMP2042UCB4
5
VGS = 0V
1
4
ID = -1mA
Is, SOURCE CURRENT (A)
VGS(TH), GATE THRESHOLD VOLTAGE (V)
1.1
0.9
ID = -250μA
0.8
0.7
0.6
0.5
3
2
TJ = 85oC
TJ = 125oC
1
TJ = 25oC
TJ = 150oC
TJ = -55oC
0.4
-50
-25
0
25
50
75
100
125
150
0
0
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. Gate Threshold Variation vs. Junction
Temperature
0.3
0.6
0.9
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 8.. Diode Forward Voltage vs. Current
1000
4.5
4
Ciss
3.5
100
3
Coss
VGS (V)
CT, JUNCTION CAPACITANCE (pF)
f=1MHz
10
2.5
2
VDS = -10V, ID = -1A
1.5
Crss
1
0.5
1
0
5
10
15
0
20
0
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 9: Typical Junction Capacitance
0.5
1
1.5
2
2.5
3
Qg (nC)
Figure 10. Gate Charge
400
100
RDS(ON) Limited
P(pk), PEAK TRANSIENT POWER (W)
ID, DRAIN CURRENT (A)
PW =100µs
10
1
PW =1ms
PW =10ms
PW =100ms
0.1
0.01
TJ(Max) = 150℃
TC = 25℃
PW =1s
Single Pulse
PW =10s
DUT on 1*MRP Board
DC
VGS= -4.5V
0.1
1
10
100
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 11. SOA, Safe Operation Area
DMP2042UCB4
Document number: DS38665 Rev. 2 - 2
300
Single Pulse
RθJA = 167℃/W
RθJA(t) = r(t) * RθJA
TJ-TA=P * RθJA (t)
200
100
0
0.000010.0001 0.001 0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Figure 12: Single Pulse Maximum Power Dissipation
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1
r(t), TRANSIENT THERMAL RESISTANCE
D=0.7
D=0.5
D=0.3
D=0.9
0.1
D=0.1
D=0.05
D=0.02
0.01
D=0.01
D=0.005
RθJA(t) = r(t) * RθJA
RθJA = 167℃/W
Duty Cycle, D = t1 / t2
D=Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Figure 13. Transient Thermal Resistance
DMP2042UCB4
Document number: DS38665 Rev. 2 - 2
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DMP2042UCB4
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
U-WLB1010-4 (Type C)
b(4x)
k
Pin1
E
k1
e
e
D
A2
U-WLB1010-4
(Type C)
Dim
Min
Max Typ
A
-0.62
-A2
--0.38
b
0.25 0.35 0.30
D
0.92 1.00 0.96
E
0.92 1.00 0.96
e
--0.50
k
--0.25
k1
--0.25
All Dimensions in mm
A
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
U-WLB1010-4 (Type C)
D(4x)
C
Dimensions
C
D
Value
(in mm)
0.500
0.300
C
DMP2042UCB4
Document number: DS38665 Rev. 2 - 2
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DMP2042UCB4
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Copyright © 2016, Diodes Incorporated
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DMP2042UCB4
Document number: DS38665 Rev. 2 - 2
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