Vicor BCM6123T60E15A3T00 Analog hv and lv 6123 chip bcmâ® bus converter evaluation board user guide Datasheet

USER GUIDE | UG:015
Analog HV and LV 6123 ChiP BCM®
Bus Converter Evaluation Board User Guide
Written by: Peter Makrum
Applications Engineer
April 2015
Contents
Introduction
Page
1
Enable Options
1
Fault Monitor Options
1
Contents
2
Features
3
Board Description
3
General Components
3
Test Points Description
6
Bill of Materials
11
Recommended Test
Equipment
12
Basic Connections
13
Board Operation Details
13
Thermal Considerations
13
Paralleling
14
Introduction
The 6123 Converter housed in a Package (ChiP) Bus Converter Module (BCM) evaluation board
described in this document is designed to be used with the BCM family of isolated, DC-DC Bus
converters. The Evaluation board is used for both the analog control, and digital control BCM products.
The focus of this document is to assist the user in evaluating the analog control version of the BCM
family.
The BCM evaluation board can be configured for various enabling and fault monitoring schemes, as well
as to exercise various loading conditions depending on the application requirements. The evaluation
board can be used to evaluate BCMs in either a stand-alone configuration, or as an array of modules.
It is important to remember the fast response of BCMs can readily show the limitations of the source,
load, and associated wiring connected to the evaluation board. Care should be exercised to minimize
the stray source and load impedance in order to fully exercise the BCM.
Refer to the appropriate data sheet for performance and operating limits. Data sheets are available at
www.vicorpower.com.
Enable Options:
1.
Apply input voltage greater than the BCM under voltage lockout. (Default)
2.
On-board mechanical switch
3.
External control using available test point
Fault Monitor Options:
1.
On-board LED: the VAUX pin drives a visible LED for visual feedback on the BCM status such as
enabled or fault condition.
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IMPORTANT NOTICE:
Hazardous voltages are present on the HV BCM Evaluation Board under power.
PERSONAL CONTACT WITH LINE VOLTAGE MAY RESULT IN SEVERE INJURY, DISABILITY, OR
DEATH. IMPROPER OR UNSAFE HANDLING OF THIS BOARD MAY RESULT IN SERIOUS INJURY
OR DEATH.
Read the precautions below entirely BEFORE using the BCM Evaluation Board. Do not operate the
evaluation board unless appropriate bench safety precautions are in place to guarantee safety.
The list below is not comprehensive and is not a substitute for common sense and good practice.
n During operation, the power devices and surrounding structures can be operated safely at
high temperatures.
n Remove power and use caution when connecting and disconnecting test probes and interface lines
to avoid inadvertent short circuits and contact with hot surfaces.
n Never use a jumper in place of the fuse.
n When testing electronic products always use approved safety glasses. Follow good laboratory
practice and procedures.
n Avoid creating ground loops when making measurements of the isolated input or output voltage.
n Care should be taken to protect the user from accidental contact when under power.
n Care should be taken to avoid reversing polarities if connecting to the opposite (solder) side of
the board.
n The product evaluation boards described in this document are designed for general laboratory
evaluation, and are not suitable for installation in end user equipment.
n Refer to the specific BCM module data sheet for electrical, thermal, and mechanical product details.
These boards provide a convenient way to evaluate/demonstrate the performance of
Vicor’s BCM products. Kelvin connections are provided for accurate voltage measurements on power
nodes. Sockets are provided to permit quick installation and changing of bulk filtering capacitors. The
evaluation board also provides lugs for Input / output connections, test points and sockets for easy
connection to standard test equipment, and a high performance air cooled heatsink assembly.
Contents
The evaluation board arrives with the following contents:
n 1 x BCM evaluation board
n 1 x Top heatsink pre-installed as well as a bottom of the ChiP heatsink when applicable
n 1 x hardware kit:
n
1 x through-hole aluminum-electrolytic output capacitor (C121)
n
3 x Connector Receptacle 8 position
n
2 x Connector socket 2 position
n
5 x size 10 screws, lugs and washers
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Features
The BCM evaluation board has the following features:
1.
Input and output lugs for source and load connections
2.
Appropriately rated input fuse
3.
Input Aluminum Electrolytic capacitor for additional source decoupling
4.
Basic output filtering footprint, including sockets to add through-hole output
Aluminum Electrolytic capacitors
5.
Toggle switch for enabling and disabling the BCM via the enable (EN) pin
6.
Oscilloscope probe jack for accurate, high frequency output voltage measurements
7.
Connectors for BCM signal pins (TM, EN, and VAUX) and temperature monitor filtered signal
8.
Kelvin voltage test points for all power pins
9.
Top and bottom heatsink assembly for the BCM where applicable
Board Description
The following section provides a detailed description of the evaluation board components, test points
and sockets.
General Components
1.
BCM (PS01)
2.
Input lugs: Sized for #10 hardware. Use for making connection to the input source. This board does
not contain reverse polarity protection. Check for proper polarity before applying the power. It is
important to remember that noise from the source and voltage drops, will appear at the output of
he bus converter multiplied by transformation ratio (K). The K factor is the ratio of the output voltage to the input voltage (VOUT / VIN).
3.
Input fuse (F101 & F102): Appropriately rated for the BCM model installed on the board. The fuse is
not meant to protect the module.
4.
Input filtering: Aluminum Electrolytic input capacitor (C101).
5.
Enable / Disable switch (SW101): When actuator is in top position towards “ON” text on the board,
the (EN) pin will be open and the BCM will be enabled. When actuator is in bottom position
towards “OFF” text on the board, the (EN) pin will be connected to (-IN) pin and the BCM will be disabled. When switch (SW101) is “ON”, an external voltage source can control the EN pin state.
6.
Signal connector (J102): provides access to the bus converter signal pins (TM, EN, and VAUX) as well as (TM_DC) externally filtered signal. All signal pins are reference to the primary non-isolated
voltage return (-IN) pin.
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Figure 1
BCM Signal connector (J102)
2
–VIN
4
–VIN
6
–VIN
1
3
5
TM_PWM
EN
TM_DC
8
–VIN
7
VAUX
n Temperature Monitor (TM): The BCM (TM) pin outputs a 250kHz PWM signal. A 1kΩ and a
10nF is the recommended low pass filtering solution. (TM_PWM) and filtered (TM_DC) are both
accessible on (J102) connector header. (TM_DC) measures 1.27 V for a 27°C internal temperature
corresponding to a (TM_PWM) duty cycle of 38.48%.
n Enable Control (EN): Connecting the BCM (EN) pin to (–IN) will disable the module. (SW101) can be
used to turn off the power train and disable the module. The (EN) pin is internally pulled up. This
connector can be used to bus the (EN) pin in an array allowing array synchronous startup.
n Auxiliary Voltage Source (VAUX): The BCM (VAUX) can be used as a fault flag it is internally driven
low during a fault condition. The (VAUX) pin can also be used as a ready to process full power flag.
A 2ms delay from power train active is introduced on this pin signaling the end of soft-start. During
normal operation this pin can be used as an auxiliary supply up to 4mA max load.
7.
Output lugs: Sized for #10 hardware. Use these lugs to connect the output directly to the load.
8.
Output oscilloscope probe Jack (J101): Used for making accurate scope measurements of the output
voltage (e.g. ripple). The jack is directly compatible with many common passive voltage probes
models. Remove the grounding lead and insulating barrel of the probe and insert the probe tip
and barrel directly into the jack, ensuring that the probe tip sits in the center socket of the jack. To
avoid the risk of an inadvertent short circuit, do not attempt to install while power is applied. This
Johnson Jack is kelvin connected to the module output pins. The effect of the output capacitors will
not be noticeable.
9.
Output filter: 10x output ceramic capacitors 1206 footprint provision (C103, C104, C113, C114,
C115, C116, C117, C118, C119, and C120). In addition to socket (C121) that can be used for easy
installation of an Aluminum Electrolytic output capacitor included with in hardware kit of the
evaluation board.
10. Isolation barrier: R106, R107, R108 each are a 2010 package. The footprint can be used to provide a
convenient means to short the isolation barrier or provided an additional AC path using capacitors.
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Figure 2
PCB#42030 evaluation board
photo, top side
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Test Points Description
Test nodes are labeled and include an SMT test point for attaching miniature probes, clips or hooks.
Table 1
Primary referenced test point
descriptions
Name
Description
Provide measurement test points for the input voltage of
+VIN, –VIN
the BCM module. Test points are Kelvin connected to the
module input pins.
EN
TM_DC
TM_PWM
VAUX
Table 2
Secondary referenced test point
descriptions
Name
Used to measure the BCM EN pin relative to –VIN.
Used to measure the filtered BCM TM signal using a
recommended low pass filter relative to –VIN.
Used to measure the BCM TM pin which is a pulse width
modulated output signal relative to –VIN.
Used to measure the BCM VAUX pin output signal
relative to –VIN.
Description
Provide measurement test points for the output voltage of
+VOUT, –VOUT
the BCM module. Test points are Kelvin connected to the
module output pins.
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-IN
+IN
-VIN
FID101
-VIN
+IN
C102
29400-103
0603
0.01uF
TM_DC
FID102
37688
40A
FUSE
F102
19924
5A
F101
TM_DC
TP113
-VIN
TM_PWM
TP114
1SW101
2
3
FID103
-VIN
J102
CAP ALEL 10uF 20% 450V RAD
FID104
2
4
6
8
EN
TP112
TM_PWM
-VIN
0603
14695-7500
750
R102
TP101
+VIN
TP102
-VIN
-VIN
+VIN
0603
15462-0R00
0603
14695-00R0
R105
0603
15462-0R00
R104
R103
Kelvin
VAUX
TP115
EN_NON-COM
CONN HEADER R/A .100 8P
OS
A33079-ND / 5103166-2
41009
1
3
5
7
LED
40058
0805
D101
TM_PWM
TM_DC
EN_NON-COM
VAUX
C101
30799
SW_GT11MSABE
40538
BCM ON/OFF CONTROL
0603
15462-1001
R101
1K
TP106
PRIMARY
i
PRIMARY
i
SER-IN
EN
SER-OUT
Kelvin
TP105
TP111
TP110
TP109
-VIN
-IN
+IN
PS01
R108
DNP
2010
DNP
DNP
R106
2010
DNP
DNP
CHASSIS_GND
2010
DNP
DNP
DNP
ISOLATION BOUNDRY
-OUT
+OUT
-VOUT
+VOUT
SECONDARY
i
SECONDARY
i
-VOUT
HSGND
SECONDARY
R107
DNP
HS01
GND
PRIMARY
VAUX
CL
EN
DA
TM
AD
6123 LV / HV BCM
EMI
TP108
Kelvin
DNP
C104
1uF
1206
25185-105
TP107
C103
1uF
1206
25185-105
DNP
TP104
-VOUT
Kelvin
TP103
33292
J101
DNP
C114
1uF
1206
25185-105
+VOUT
C113
1uF
1206
25185-105
DNP
C115
1uF
1206
25185-105
DNP
-VOUT
+VOUT
C116
1uF
1206
25185-105
DNP
C117
1uF
1206
25185-105
DNP
C118
1uF
1206
25185-105
DNP
C119
1uF
1206
25185-105
DNP
-OUT
+OUT
C120
1uF
1206
25185-105
DNP
H02
30799
C121
H01
DNP
PCB#42030 evaluation board
schematic
1
Figure 3
Applications Engineering: 800 927.9474
Page 7
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-IN
+IN
-VIN
FID101
-VIN
+IN
C102
29400-103
0603
0.01uF
TM_DC
FID102
37688
40A
FUSE
F102
19924
5A
F101
TM_DC
TP113
-VIN
TM_PWM
TP114
1SW101
2
3
FID103
-VIN
1
3
5
7
J102
2
4
6
8
LED
40058
0805
D101
C101
30799
FID104
CAP ALEL 10uF 20% 450V RAD
TM_PWM
0603
14695-7500
750
TP101
+VIN
TP102
-VIN
-VIN
+VIN
0603
15462-0R00
0603
14695-00R0
R105
0603
15462-0R00
R104
R103
Kelvin
VAUX
TP115
EN_NON-COM
R102
-VIN
EN
TP112
CONN HEADER R/A .100 8P
OS
A33079-ND / 5103166-2
41009
TM_PWM
TM_DC
EN_NON-COM
VAUX
SW_GT11MSABE
40538
BCM ON/OFF CONTROL
0603
15462-1001
R101
1K
TP106
PRIMARY
i
PRIMARY
i
SER-IN
EN
SER-OUT
Kelvin
TP105
TP111
TP110
TP109
-VIN
*
-IN
+IN
CL
DA
AD
R108
DNP
2010
DNP
DNP
R106
2010
DNP
DNP
CHASSIS_GND
2010
DNP
DNP
DNP
-OUT
+OUT
-VOUT
+VOUT
SECONDARY
i
SECONDARY
i
-VOUT
HSGND
SECONDARY
ISOLATION BOUNDRY
6123
R107
DNP
HS01
GND
PRIMARY
VAUX PS01
EN
TM
6123 LV / HV Isolated BCM
EMI
TP108
Kelvin
DNP
C104
1uF
1206
25185-105
TP107
C103
1uF
1206
25185-105
DNP
TP104
-VOUT
Kelvin
TP103
33292
J101
DNP
C114
1uF
1206
25185-105
+VOUT
C113
1uF
1206
25185-105
DNP
C115
1uF
1206
25185-105
DNP
-VOUT
+VOUT
C116
1uF
1206
25185-105
DNP
C117
1uF
1206
25185-105
DNP
C118
1uF
1206
25185-105
DNP
C119
1uF
1206
25185-105
DNP
-OUT
+OUT
C120
1uF
1206
25185-105
DNP
H02
30799
C121
H01
DNP
PCB#42143 evaluation board
schematic
1
Figure 4
Applications Engineering: 800 927.9474
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Figure 5
PCB#42030 evaluation board
Figure 6
BPCB#42030 evaluation board
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Figure 7
PCB#42143 evaluation board
Figure 8
PCB#42143 evaluation board
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Bill of Materials
Following table describes the design specific components of all 6123 BCM
evaluation board.
Table 3
BCM Evaluation board
components common
to all boards
Reference
Description
Designator
C101
Manufacturer
CAP ALEL 10 µF 20% 450 V RAD
C102
CAP X7R .010 µF 10% 50 V 0603
D101
DLED RED 0805
F101
F102
J101
J102
United Chemi-Con
Murata
Manufacturing
Manufacturer
Part Number
EKXG451ELL100MK20S
GRM188R71H103KA01D
Rohm
SML-211UTT86
Tektronix
131-5031-00
TE Connectivity Ltd
5-103166-2
Design specific - See Table 4
JACK VERTICAL MECH THRU
HOLE
CONN HEADER R/A .100 8POS
30AU
HS01
Design specific - See Table 4
PCB Part Number
Design specific - See Table 4
R103, R104, R105
RES 0 OHM JUMPER 1 A 0603
KOA Speer Electronics
RK73Z1JTTD
R102
RES 750 OHM 1/10W 5% 0603
KOA Speer Electronics
RK73B1JTTD751J
R101
RES 1K OHM 1/10W 1% 0603
KOA Speer Electronics
RK73H1JTTD1001F
SW Horizontal SPDT 1 POS SMD
C&K Components
GT11MSABETR
SW101
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Table 4
BOM additions, components
which are BCM model specific
Reference
Description
Designator
Manufacturer
Manufacturer
Part Number
Evaluation board numbers: BCM6123E60E15A3T00; BCM6123E60E10A5T00
PS01
PCB Part Number
F102
HS01
BCM6123T60E15A3T00;
LV BCM
Vicor Corporation
BCM Evaluation Board
Vicor Corporation
42030
Littelfuse
0456040.DR
Vicor Corporation
42676
FUSE 40A 60VAC FAST 4.5X12.5
SMD
BOM HEATSINK, TOP
BCM6123T60E10A5T00
Evaluation board numbers: BCD384P120T1K5AC0; BCD384P120T800AC0; BCD384P120T1K5ACR;
BCD384P120T800ACR
BCM384P120T1K5AC0;
PS01
HV BCM
Vicor Corporation
BCM384P120T800AC0;
BCM384P120T1K5ACR;
BCM384P120T800ACR
PCB Part Number
BCM Evaluation Board
Vicor Corporation
42030
F101
FUSE PC-TRON PCI 5A
Cooper Industries
PCI-5-R
HS01
BOM HEATSINK, TOP
Vicor Corporation
42676
Evaluation board numbers: BCD400P500T1K8A30; BCD380P475T1K2A30; BCD380P475T800A30;
BCD400P500T1K8A3R; BCD380P475T1K2A3R; BCD380P475T800A3R
BCM400P500T1K8A30;
BCM380P475T1K2A30;
PS01
HV BCM
Vicor Corporation
BCM380P475T800A30;
BCM400P500T1K8A3R;
BCM380P475T1K2A3R;
BCM380P475T800A3R
PCB Part Number
BCM Evaluation Board
Vicor Corporation
42143
F101
FUSE PC-TRON PCI 5A
Cooper Industries
PCI-5-R
Vicor Corporation
40528
HS01
BOM ASSY 6123 DUAL HTSNK
NO TIM FOR 11 MM
Recommended Test Equipment
The following is a list of recommended test equipment.
1.
Safety glasses
2.
DC power supply: Refer to the specific BCM model datasheet to ensure the supply has sufficient
power and current capability
3.
Electronic load: Refer to the specific BCM model datasheet to ensure the load has sufficient power handling and current capability for testing
4.
Cooling fan
5.
Digital multi-meters (DMMs)
6.
Oscilloscope and probes
7.
Interconnect wires, cables and fastening hardware
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Basic Connections
n Confirm bench equipment is powered off.
n Connect the input DC power supply positive lead to the +IN input lug of the
evaluation board, connect the input power supply negative lead to the –IN input lug
of the evaluation board.
n Connect the CHASSIS_GND lug of the evaluation board to a safety “green wire”
earth ground.
n Connect the +OUT lug of the evaluation board to the electronic load positive input, connect the –OUT lug of the evaluation board to the electronic load negative input.
n Verify proper polarity of the connections.
n Verify (SW101) desired actuator position.
n Direct airflow from the cooling fan through the BCM heatsink fins.
n Have the latest BCM datasheet on hand for reference.
Board Operation Details
n SW01 provides control over enable.
n In the “OFF” position, the switch will connect –IN pin to the EN net, which disables the BCM.
n In the “ON” position, the EN net is allowed to float.
n External connection to EN is permitted using the EN test point. (SW01) should be set to “ON” to
allow external control.
n The (J102) paralleling connectors can be used to connect EN nets across different boards.
Note: to enable the BCMs in a parallel array, all boards need (SW01) set to “ON” to avoid pulling the
EN node low.
n The heatsink assembly of the BCM is connected to the CHASSIS_GND lug. A connection from the
CHASSIS_GND lug to earth ground is required for safety as the heatsink will be floating otherwise.
n The visible LED at D101 and its bias resistor network (R102 & R105) are connected to the VAUX pin.
LED turns “ON” when VAUX is high signaling that the BCM is ready to process full power.
n Primary input voltage greater than the undervoltage lockout must be applied to enable the BCM
power train. This applies to all products listed in this document which includes reversible products.
Thermal Considerations
The evaluation board is supplied with a pre-installed 11mm double sided heatsink
assembly for PCB#42143 and a 27mm top only for PCB#42030. A fan blowing across the evaluation
board and heat sink assembly is required during operation at load. The fan should be placed about
4 inches away from the evaluation board facing the output voltage side. A typical bench top fan is
recommended providing about 1000 LFM. Using the supplied rubber feet is also required in order to
elevate the board about 0.4 inches off a flat surface and enable air flow underneath the PCB.
The PCB top layer used for the 42676 heatsink ChiP is required to be of the same potential of
the heatsink this is to allow heat transfer from the bottom of the ChiP and leads to the heatsink.
CHOMERICS GEL-8010 is used on both top and bottom surface of the ChiP. (Between the ChiP top and
heatsink as well as the ChiP bottom and the PCB). It is also required to apply to the heatsink extended
surface resting on the PCB.
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Paralleling
The paralleling and sharing performance of multiple BCMs can be easily demonstrated by stacking
multiple evaluation boards and interconnecting the inputs and outputs with standoffs to create a
parallel array. Each BCM in an array operates in the same way as it does as a stand-alone unit. With
equal impedance, the load is effectively shared across multiple BCMs. Mismatches in this case are
modest, and are further canceled by an effective negative voltage vs. temperature coefficient.
The following connections and settings should be used for an array of BCM evaluation boards:
n All BCMs in a parallel array must be the same model.
n The boards should be physically stacked using metal standoffs at the +IN & –IN lugs, the +OUT &
–OUT lugs, and the CHASSIS_GND lug. This also connects these nodes electrically so that a single
source, single load, and earth ground connection can be made to the system.
n The +IN lugs are required to be connected together for an array of BCMs.
n Standoffs must be sufficient in length to avoid contact between boards, and to permit airflow to all
BCMs in the system.
n If coordinated enable control then the paralleling connectors (J102) can be used to easily
interconnect the EN pin across boards.
n The paralleling connector receptacle (J102) is provided to daisy chain EN signal and –VIN. The will
accept a wire size range 26 - 22 AWG, 0.12 - 0.3mm2 wires.
The paralleling and current sharing capability of the devices can be demonstrated by stacking multiple
evaluation board and interconnecting the inputs and outputs with standoffs of sufficient current rating
to create a parallel array. If synchronous startup is desired, connect EN pin 5 and –VIN pin 6 in (J102)
using a twisted pair to all respective pins in different paralleled units.
Figure 9
BCM evaluation boards stacked
to form a high power parallel
array, using common -IN and
the paralleling connectors.
Paralleling of
BCM evaluation board.
Rev 1.5 11/2016
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