CPL-WB-01C2 Wide band directional coupler with ISO port Features ■ 50 Ω nominal input / output impedance ■ Wide operating frequency range (824 MHz to 2025 MHz) ■ Low Insertion Loss (< 0.2 dB) ■ 34 dB typical coupling factor ■ High directivity (typical 25 dB) ■ High ESD robustness (IEC 61000-4-2 Level 4) ■ Flip-Chip package ■ Small footprint: 1700 x 1200 µm Figure 1. Benefits ■ Very low profile (< 690 µm thickness) ■ Lead-free package ■ High RF performance ■ RF module size reduction Pin configuration (top view) 3 2 RFOUT GND 1 RFIN A ATN. ATN. B ISO GND CPLD Applications ■ Quad band power amplifier module ■ Quad band front end module Description ■ GSM / WCDMA / TD-SCDMA mobile phone The CPL-WB-01C2 is a wide band directional coupler designed to measure RF antenna output power in GSM / TD-SCDMA applications. This CPL has been customized for wide band operating frequencies (EGSM and CELL, PCS, DCS, TD-SCDMA) with less than 0.2 dB insertion losses in the transmit bandwidth (824 MHz to 2025 MHz). The CPL-WB-01C2 has been designed using STMicroelectronics IPD (integrated passive device) technology on non conductive glass substrate to optimize RF performance. The device is delivered 100% tested in tape and reel. January 2010 Doc ID 15366 Rev 3 1/8 www.st.com 8 Characteristics CPL-WB-01C2 1 Characteristics Table 1. Absolute maximum rating (limiting values) Value Symbol Parameter Unit Min. PIN Typ. Input Power RFIN Max. 35 ESD ratings IEC 61000-4-2 (C = 150 pF, R = 330 Ω, 10 shots with both polarities and each condition, cumulative method) VESD (IEC) RFIN, RFOUT, air discharge RFIN, RFOUT, contact discharge dBm ±15 ±8 kV kV 2 kV VESD (MM) Machine model, JESD22-A115-A, All I/O 100 V VESD (CDM) Charge device model, JESD22-C101-C, All I/O 500 V VESD (HBM) Human body model, JESD22-A114-B, All I/O TOP Table 2. Operating temperature -30 +85 ºC Electrical characteristics - impedances (Tamb = 25 °C) Value Symbol Parameter Unit Min. Typ. Max. Nominal output impedance 50 Ω Nominal input impedance 50 Ω ZCPLD Nominal coupling impedance 50 Ω ZOUT Nominal ISO impedance 50 Ω ZOUT ZIN Table 3. Electrical characteristics - RF performance (Tamb = 25 °C) Value Symbol Parameter Test condition Unit Min. TOP Max. Operating temperature -30 +85 °C f Frequency range (bandwidth) 824 2025 MHz IL Insertion loss in bandwidth From 824 MHz to 2025 MHz 0.2 dB RL Return loss in bandwidth From 824 MHz to 2025 MHz CPLD 2/8 Typ. Coupling factor (including From 824 MHz to 915 MHz attenuator) From 1710 MHz to 2025 MHz Ripple Coupling ripple in individual band (824 to 849 MHz) (880 to 915 MHz) (1710 to 1785 MHz) (1850 to 1910 MHz)(1880 to 2025 MHz) DIR Coupler directivity From 824 MHz to 2025 MHz Doc ID 15366 Rev 3 0.1 15 dB 35 39 dB 28 33 dB 0.5 dB 20 25 dB CPL-WB-01C2 1.1 Characteristics RF measurement (on reference evaluation board) Measurements done on reference evaluation board under 50 Ω, de-embedding at CPL-WB-01C2 bumps. Figure 2. Insertion loss dB -0.0 -0.05 -0.1 -0.15 -0.2 -0.25 F (MHz) -0.3 Figure 3. 824 959 1093 1228 1362 1497 1632 1766 1901 2035 2170 Coupling and isolation -20 dB -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 Figure 4. F (MHz) 824 959 1093 1228 1362 1497 1632 1766 1901 2035 2170 Directivity 40 38 36 34 32 30 28 26 24 22 20 824 F (MHz) 959 1093 1228 1362 1497 1632 1766 1901 2035 2170 Doc ID 15366 Rev 3 3/8 Reference evaluation board 2 Reference evaluation board Figure 5. 4/8 CPL-WB-01C2 CPW lines (W = 850 µm with gap to gnd = 260 µm) on top layer + GND on bottom layer ● Material: 2 layers FR4 with solder mask on top and bottom layer ● Substrate thickness: 0.8 mm ● Line lengths: 10.2 mm ● Extension values on short line measurement: 102 ps ● Through insertion loss: 0.20 dB @ 1 GHz , 0.24 dB@ 2 GHz Doc ID 15366 Rev 3 CPL-WB-01C2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 6. Package dimensions 670 µm 1.700 mm ± 50µm 650 µm 500 µm 3 Package information 315 µm diameter 1.200 mm ± 50 µm Figure 7. Footprint Figure 8. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) Copper pad Diameter: 250 µm recommended, 300 µm max Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 300 µm copper pad diameter Doc ID 15366 Rev 3 E x x z y ww 5/8 Package information Figure 9. CPL-WB-01C2 Flip Chip tape and reel specifications Dot identifying Pin A1 location 3.5 ± 0.1 8 ± 0.3 ST E ST E ST E xxx yww xxx yww xxx yww 0.73 ± 0.05 All dimensions in mm Note: 4 ± 0.1 User direction of unreeling More information is available in the application note: AN1235: “Flip Chip: package description and recommendations for use” 6/8 1.75 ± 0.1 Ø 1.5 ± 0.1 4 ± 0.1 Doc ID 15366 Rev 3 CPL-WB-01C2 4 Ordering information Ordering information Table 4. 5 Ordering information Order code Marking Base qty Delivery mode CPL-WB-01C2 RE 5000 Tape and reel Revision history Table 5. Document revision history Date Revision Changes 15-Jan-2009 1 Initial release. 12-Oct-2009 2 Updated Table 3 value frequency range. 06-Jan-2010 3 Updated applications and description on page 1. Updated page layout. Doc ID 15366 Rev 3 7/8 CPL-WB-01C2 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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