1 of 3 Creation Date : April 24, 2017 (GMT) Multilayer Ceramic Chip Capacitors C1608CH1V153K080AC TDK item description C1608CH1V153KT**** Applications Commercial Grade Feature General General (Up to 50V) Series C1608 [EIA 0603] Status Production (Not Recommended for New Design) Size Length(L) 1.60mm ±0.10mm Width(W) 0.80mm ±0.10mm Thickness(T) 0.80mm ±0.10mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.30mm Min. 0.70mm to 1.00mm(Flow Soldering) Recommended Land Pattern (PA) 0.60mm to 0.80mm(Reflow Soldering) 0.80mm to 1.00mm(Flow Soldering) Recommended Land Pattern (PB) 0.60mm to 0.80mm(Reflow Soldering) 0.60mm to 0.80mm(Flow Soldering) Recommended Land Pattern (PC) 0.60mm to 0.80mm(Reflow Soldering) Electrical Characteristics Capacitance 15nF ±10% Rated Voltage 35VDC Temperature Characteristic CH(0±60ppm/°C) Q (Min.) 1000 Insulation Resistance (Min.) 10000MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 No Packing Punched (Paper)Taping [180mm Reel] Package Quantity 4000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Multilayer Ceramic Chip Capacitors 2 of 3 Creation Date : April 24, 2017 (GMT) C1608CH1V153K080AC Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Multilayer Ceramic Chip Capacitors C1608CH1V153K080AC Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : April 24, 2017 (GMT)