CDC204 HEX INVERTER/CLOCK DRIVER SCAS098E – OCTOBER 1989– REVISED OCTOBER 1998 D D D D D D D D DW PACKAGE (TOP VIEW) CDC204 Replaces 74AC11204 Low-Skew Propagation Delay Specifications for Clock-Driver Applications CMOS-Compatible Inputs and Outputs Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Pin Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-µm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline Package (DW)) 1Y 2Y 3Y GND GND GND GND 4Y 5Y 6Y 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 1A 2A 3A NC VCC VCC NC 4A 5A 6A NC – No internal connection description The CDC204 contains six independent inverters. The device performs the Boolean function Y = A. It is designed specifically for applications requiring low skew between switching outputs. The CDC204 is characterized for operation from TA = 25°C to 70°C. FUNCTION TABLE INPUT A OUTPUT Y H L L H logic symbol† 1A 2A 3A 4A 5A 6A 20 logic diagram (positive logic) 1 1 19 2 18 3 13 8 12 9 11 10 1Y 1A 20 1 19 2 18 3 13 8 12 9 11 10 1Y 2Y 3Y 2A 2Y 4Y 5Y 3A 3Y 6Y † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 4A 5A 6A 4Y 5Y 6Y Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC is a trademark of Texas Instruments Incorporated. Copyright 1998, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CDC204 HEX INVERTER/CLOCK DRIVER SCAS098E – OCTOBER 1989– REVISED OCTOBER 1998 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±150 mA Maximum power dissipation at TA = 55°C (in still air) (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils. For more information, refer to the Package Thermal Considerations application note in the 1994 ABT Advanced BiCMOS Technology Data Book, literature number SCBD002B. recommended operating conditions VCC Supply voltage VIH High level input voltage High-level VCC = 4.75 V VCC = 5.25 V VIL Low level input voltage Low-level VCC = 4.75 V VCC = 5.25 V VI Input voltage IOH High level output current High-level VCC = 4.75 V VCC = 5.25 V IOL Low level output current Low-level VCC = 4.75 V VCC = 5.25 V ∆t / ∆v Input transition rise or fall rate fclock TA Input clock frequency 2 MIN NOM MAX UNIT 4.75 5 5.25 V 3.3 1.4 1.6 0 24 24 25 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 VCC – 24 –24 0 Operating free-air temperature V 3.7 V V mA mA 10 ns / V 80 MHz 70 °C CDC204 HEX INVERTER/CLOCK DRIVER SCAS098E – OCTOBER 1989– REVISED OCTOBER 1998 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VCC = 4 4.75 75 V IOH = – 50 µA VCC = 5 5.25 25 V VOH High-level voltage output VCC = 4 4.75 75 V IOH = – 24 mA VCC = 5 5.25 25 V IOH = – 75 mA‡, VCC = 5.25 V VCC = 4 4.75 75 V IOL = 50 µA VCC = 5 5.25 25 V VOL TA† 25°C 4.65 Full range 4.65 25°C 5.15 Full range 5.15 TEST CONDITIONS Low-level voltage output 75 V VCC = 4 4.75 IOL = 24 mA VCC = 5 5.25 25 V IOL = 75 mA‡, VCC = 5.25 V II Input current VI = VCC or GND 25 V VCC = 5 5.25 ICC Supply current VI = VCC or GND,, IO = 0 VCC = 5.25 V, MIN 25°C 4.19 Full range 4.05 25°C 4.68 Full range 4.55 Full range 3.6 TYP MAX V 25°C 0.1 Full range 0.1 25°C 0.1 Full range 0.1 25°C 0.36 Full range 0.44 25°C 0.36 Full range 0.44 Full range 1.65 25°C ± 0.1 ±1 Full range 25°C 4 Full range 40 Ci Input capacitance VI = VCC or GND, VCC = 5 V 25°C † Full range is TA = 25°C to 70°C. ‡ Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms. UNIT 4 V µA µA pF switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.25 V (see Note 3 and Figures 1 and 2) PARAMETER tPLH tPHL Propagation delay time, low-to-high level (see Figure 1) tsk(o) Output skew time (see Figure 2) Proagation delay time, high-to-low level (see Figure 1) FROM (INPUT) TO (OUTPUT) A Y A Y MIN MAX 3.7 5.7 2.9 5.7 1 UNIT ns ns NOTE 3: All specifications are valid only for all outputs switching simultaneously and in phase. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 CDC204 HEX INVERTER/CLOCK DRIVER SCAS098E – OCTOBER 1989– REVISED OCTOBER 1998 PARAMETER MEASUREMENT INFORMATION From Output Under Test CL = 50 pF (see Note A) 500 Ω LOAD CIRCUIT VCC Input (see Note B) 50% 50% 0 tPLH tPHL VOH 50% Output 50% VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES NOTES: A. CL includes probe and jig capacitance. B. Input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns. C. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CDC204 HEX INVERTER/CLOCK DRIVER SCAS098E – OCTOBER 1989– REVISED OCTOBER 1998 PARAMETER MEASUREMENT INFORMATION 50% 1A – 6A Y1 50% 50% 50% tPLH1 Y2 tPHL1 50% 50% tPLH2 Y3 tPHL2 50% 50% tPHL3 tPLH3 Y4 50% 50% tPLH4 Y5 tPHL4 50% 50% tPLH5 tPHL5 50% Y6 50% tPHL6 tPLH6 NOTE A: Output skew, tsk(o), is calculated as the greater of: – The difference between the fastest and slowest of tPHLn (n = 1, 2, . . . , 6) – The difference between the fastest and slowest of tPLHn (n = 1, 2, . . . , 6) Figure 2. Waveforms for Calculation of tsk(o) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 CDC204 HEX INVERTER/CLOCK DRIVER SCAS098E – OCTOBER 1989– REVISED OCTOBER 1998 MECHANICAL INFORMATION DW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 16 PIN SHOWN 0.050 (1,27) 0.020 (0,51) 0.014 (0,35) 16 0.010 (0,25) M 9 0.419 (10,65) 0.400 (10,15) 0.010 (0,25) NOM 0.299 (7,59) 0.293 (7,45) Gage Plane 0.010 (0,25) 1 8 0°– 8° A 0.050 (1,27) 0.016 (0,40) Seating Plane 0.104 (2,65) MAX 0.012 (0,30) 0.004 (0,10) 0.004 (0,10) PINS ** 16 20 24 A MAX 0.410 (10,41) 0.510 (12,95) 0.610 (15,49) A MIN 0.400 (10,16) 0.500 (12,70) 0.600 (15,24) DIM 4040000 / D 02/98 NOTES: A. B. C. D. 6 All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MS-013 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 7-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CDC204DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CDC204DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CDC204DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CDC204DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CDC204N OBSOLETE PDIP N 20 TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device CDC204DWR Package Package Pins Type Drawing SOIC DW 20 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2000 330.0 24.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.8 13.0 2.7 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CDC204DWR SOIC DW 20 2000 346.0 346.0 41.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated