TI BQ24770RUYT Bq2477x nvdc battery charge controller with system power monitor and processor hot indicator Datasheet

Product
Folder
Sample &
Buy
Support &
Community
Tools &
Software
Technical
Documents
bq24770, bq24773
SLUSCB0 – MAY 2015
bq2477x NVDC Battery Charge Controller With System Power Monitor
and Processor Hot Indicator
1 Features
2 Applications
•
•
•
•
1
•
•
•
•
•
•
•
Host-controlled NVDC-1 1S-4S Battery Charge
Controller with 4.5-24 V Input Range
– Support SMBus (bq24770) and I2C (bq24773)
– System Instant-on Operation with no Battery or
Deeply Discharged Battery
– Supplement Mode with Synchronous BATFET
Control when Adaptor is fully loaded
Ultra Fast Input Current DPM at 100 μs
Ultra Low Quiescent Current of 600 µA and High
PFM Light Load Efficiency >80% at 20 mA Load
to Meet Energy Star and ErP Lot6.
High Accuracy Power / Current Monitor for CPU
Throttling
– Comprehensive PROCHOT Profile
– Input and Battery Current Monitor (IADP/IBAT)
– System Power Monitor (PMON)
Programmable Input Current Limit, Charge
Voltage, Charge Current and Minimum System
Voltage Regulation
– ±0.5% Charge Voltage (16 mV/step)
– ±2% Input/charge Current (64 mA/step)
– ±2% 40x Input / 16x Discharge / 20x Charge
Current Monitor
Support Battery LEARN Function
High Integration
– NMOS ACFET and RBFET Driver
– PMOS battery FET Gate Driver
– Internal Loop Compensation
– Independent Comparator
– Automatic Trickle Charge to Wake up Gas
Gauge
600kHz to 1.2MHz Programmable Switching
Frequency
Ultrabook, Notebook, Detachable, and Tablet PC
Handheld Terminal
Industrial, Medical, Portable Equipment
3 Description
The bq2477x is high-efficiency, synchronous, NVDC1 battery charge controllers, offering low component
count for space-constraint, multi-chemistry battery
charging applications.
The power path management allows the system to be
regulated at battery voltage but does not drop below
system minimum voltage (programmable). With this
feature, the system keeps operating even when the
battery is completely discharged or removed. The
power path management allows the battery to provide
supplement current to the system to keep the input
supply from being overloaded.
The bq2477x provides drivers and power path
management for N-channel ACFET and reverse
blocking FET. The devices provides driver to control
NVDC operation of external P-channel battery FET. It
also drives high-side and low-side MOSFETs of the
switching regulator.
The bq2477x monitors adapter current (IADP),
battery charge/discharge current (IBAT) and system
power (PMON). The flexibly programmed PROCHOT
output goes directly to CPU for throttle back when
needed.
Device Information(1)
PART NUMBER
bq24770
bq24773
PACKAGE
BODY SIZE (NOM)
WQFN (28-Pin)
4.00mm x 4.00mm2
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Simplified Schematic
Light Load Efficiency (VIN = 19.5 V)
R AC
Adapter
4.5-24V
Enhanced Safety:
OCP, OVP, FET Short
100
N-FET Driver
95
90
SMBus Controls V and I
with high accuracy
SMBus
Bq24770
P-FET Driver
NVDC Charge
Controller
RSR
85
Efficiency (%)
Adapter Detection
SYS
80
75
70
65
HOST
60
IADP, IDCHG,
PMON, PROCHOT
VSYS = 9.0V
VSYS = 13.5V
55
50
0
0.02
0.04
0.06
0.08
0.1
System Load Current (A)
0.12
0.14
D003
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
bq24770, bq24773
SLUSCB0 – MAY 2015
www.ti.com
5 Revision History
2
DATE
REVISION
NOTES
May 2015
*
Initial Release
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: bq24770 bq24773
bq24770, bq24773
www.ti.com
SLUSCB0 – MAY 2015
6 Device and Documentation Support
6.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
bq24770
Click here
Click here
Click here
Click here
Click here
bq24773
Click here
Click here
Click here
Click here
Click here
6.2 Trademarks
All trademarks are the property of their respective owners.
6.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
6.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: bq24770 bq24773
3
PACKAGE OPTION ADDENDUM
www.ti.com
27-May-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
BQ24770RUYR
ACTIVE
WQFN
RUY
28
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
BQ
24770
BQ24770RUYT
ACTIVE
WQFN
RUY
28
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
BQ
24770
BQ24773RUYR
ACTIVE
WQFN
RUY
28
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
BQ
24773
BQ24773RUYT
ACTIVE
WQFN
RUY
28
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
BQ
24773
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
27-May-2015
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
22-May-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
BQ24770RUYR
WQFN
RUY
28
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3000
330.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
BQ24770RUYT
WQFN
RUY
28
250
180.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
BQ24773RUYR
WQFN
RUY
28
3000
330.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
BQ24773RUYT
WQFN
RUY
28
250
180.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-May-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ24770RUYR
WQFN
RUY
28
3000
367.0
367.0
35.0
BQ24770RUYT
WQFN
RUY
28
250
210.0
185.0
35.0
BQ24773RUYR
WQFN
RUY
28
3000
367.0
367.0
35.0
BQ24773RUYT
WQFN
RUY
28
250
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
Similar pages