Diodes D5V0F6U8LP33 6 channel low capacitance tvs diode array Datasheet

D5V0F6U8LP33
6 CHANNEL LOW CAPACITANCE TVS DIODE ARRAY
Product Summary
VBR (min)
6V
Features
IPP (max)
2A

CT (typ)
0.5pF

NEW PRODUCT
Description
This new generation TVS is designed to protect sensitive electronics
from the damage due to ESD. The combination of small size and high
ESD surge capability makes it ideal for use in portable applications
such as cellular phones, digital cameras and MP3 players.




Ultra Low Profile Package (0.42mm max) and Small PCB Footprint
Area (3.38mm x 1.38mm max) Suitable for Compact Portable
Electronics
Provides ESD Protection per IEC 61000-4-2 Standard:
Air ±15kV, Contact ±12kV
6 Channels of ESD Protection
Low Channel Input Capacitance
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Mechanical Data
Applications





Cellular Handsets
Portable Electronics
Computers and Peripheral



Case: X1-DFN3313-8
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: NiPdAu over Copper Leadframe. Solderable per MILSTD-202, Method 208 e4
Weight: TBD grams (Approximate)
Pin Description (Top View)
Ordering Information (Note 4)
Product
D5V0F6U8LP33-7
Notes:
Compliance
Standard
Marking
TG7
Reel size(inches)
7
Tape width(mm)
8
Quantity per reel
3000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
D5V0F6U8LP33
Document number: DS36886 Rev. 1 - 2
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D5V0F6U8LP33
Marking Information
NEW PRODUCT
TG7
TF2
Date Code Key
Year
Code
Month
Code
2014
B
Jan
1
2015
C
Feb
2
Mar
3
TG7 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: B = 2014)
M = Month (ex: 9 = September)
YM
2016
D
Apr
4
2017
E
May
5
Jun
6
2018
F
Jul
7
Aug
8
2019
G
Sep
9
Oct
O
2020
H
Nov
N
Dec
D
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Peak Pulse Current
ESD Protection – Contact Discharge
ESD Protection – Air Discharge
Symbol
IPP
VESD_Contact
VESD_Air
Value
2.0
±12
Unit
A
kV
Conditions
8/20µs (Note 7)
Standard IEC 61000-4-2
±15
kV
Standard IEC 61000-4-2
Thermal Characteristics
Characteristic
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient TA = +25°C
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ, TSTG
Value
300
417
-55 to +150
Unit
mW
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Reverse Standoff Voltage
Channel Leakage Current (Note 6)
Reverse breakdown voltage
Forward voltage
Symbol
VRWM
IR
VBR
VF
Clamping Voltage, Positive Transients (Note 7)
VC
Channel Input Capacitance (Note 8)
CT
Dynamic Resistance
Notes:
RDYN
Min
—
—
6.0
—
—
—
Typ
—
—
—
0.85
9.5
10.5
Max
5.5
100
—
—
11.5
12.5
—
0.5
—
—
0.4
0.65
—
0.9
—
Unit
V
nA
V
V
V
pF
Ω
Test Conditions

VR = 5V, Any I/O to GND
IR = 1mA
IF = 4mA
IPP = 1A, tp = 8/20μs
IPP = 2A, tp = 8/20μs
VR = 0V, f = 1MHz, Any I/O to
GND
VR = 2.5V, f = 1MHz, Any I/O to
GND
IPP = 1A, tp = 8/20μs
5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website
at http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
7. Clamping voltage value is based on an 8x20µs peak pulse current (Ipp) waveform.
8. Measured from any I/O to GND.
9. For information on the impact of Diodes' USB 2.0 compatible ESD protectors on signal integrity including eye diagram plots, please refer to AN77 at
the following URL: http://www.diodes.com/destools/appnote_dnote.html.
D5V0F6U8LP33
Document number: DS36886 Rev. 1 - 2
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D5V0F6U8LP33
400
100
Note 5
PEAK PULSE DERATING % OF
PEAK POWER OR CURRENT
PD, POWER DISSIPATION (mW)
300
250
200
150
100
75
50
25
50
0
0
25
50
75
100
125
150
TA, AMBIENT TEMPERATURE (°C)
Figure 1 Power Derating Curve
100
Peak Value Ipp
Half Value Ipp/2
50
8x20 Waveform
as defined by R.E.A.
0
20
0
60
40
0
175
IF, INSTANTANEOUS FORWARD CURRENT (mA)
IPP, PEAK PULSE CURRENT (%Ipp)
0
t, TIME (s)
Figure 3 Pulse Waveform
25
50
75 100 125 150 175 200
TA, AMBIENT TEMPERATURE (°C)
Figure 2 Pulse Derating Curve
1000
100
TA = 150°C
10
TA = 125°C
TA = 85°C
1
TA = 25°C
TA = -55°C
0.1
0.01
300 400 500 600 700 800 900 1000 1100
VF, INSTANTANEOUS FORWARD VOLTAGE (mV)
Figure 4 Typical Forward Characteristics
0.6
100
f = 1MHz
Note 8
CT, TOTAL CAPACITANCE (pF)
0.55
IR, LEAKAGE CURRENT (nA)
NEW PRODUCT
350
0.5
0.45
TA = 150°C
10
0.35
T A = 125°C
TA = 85°C
TA = 25°C
0.1
0
1
2
3
4
5 5.5
VR, REVERSE VOLTAGE (V)
Figure 5 Typical Reverse Characteristics
Document number: DS36886 Rev. 1 - 2
0.2
0.15
1
D5V0F6U8LP33
0.3
0.25
TA = -55°C
0
0.4
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0.5
1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
VR, REVERSE VOLTAGE (V)
Figure 6 Total Capacitance vs. Reverse Voltage
October 2014
© Diodes Incorporated
D5V0F6U8LP33
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
A
A1
A3
X1-DFN3313-8
Dim Min Max
Typ
A
0.37 0.43 0.40
A1
0
0.05 0.02
A2
0.13
b
0.20 0.30 0.25
D
3.25 3.38 3.30
E
1.25 1.38 1.30
e
0.50 BSC
e1
1.25 BSC
L
0.30 0.43 0.38
L1
0.57 0.70 0.65
All Dimensions in mm
NEW PRODUCT
Seating Plane
D
1
L(6x)
e
E
8
La(2x)
e1
b
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X2
X
C
Dimensions
Y
Y2
Y1
X1
C
C1
X
X1
X2
X3
Y
Y1
Y2
Value
(in mm)
0.500
1.250
0.350
0.350
2.850
1.600
0.550
0.850
1.600
C1
X3
D5V0F6U8LP33
Document number: DS36886 Rev. 1 - 2
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D5V0F6U8LP33
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
NEW PRODUCT
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
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Document number: DS36886 Rev. 1 - 2
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October 2014
© Diodes Incorporated
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