BM63 Bluetooth® 4.2 Stereo Audio Module FIGURE 1: Features BM63 MODULE • Qualified for Bluetooth v4.2 specifications • Supports HFP 1.6, HSP 1.2, A2DP 1.3, SPP 1.2, AVRCP 1.6 • Supports Bluetooth 4.2 dual-mode (BR/EDR/BLE) specifications (FW dependent) • Stand-alone module with on-board PCB antenna and Bluetooth stack • Supports high resolution up to 24-bit, 96 kHz audio data format • Supports to connect two hosts with HFP/A2DP profiles simultaneously • Supports to connect one host with SPP/BTLE • Transparent UART mode for seamless serial data over UART interface • Easy to configure with Windows® GUI or directly by external MCU • Supports firmware field upgrade • Supports one microphone • Castellated surface mount pads for easy and reliable host PCB mounting • RoHS compliant • Ideal for portable battery operated devices • Internal battery regulator circuitry DSP Audio Processing Audio Codec • Supports 64 kbps A-Law, -Law PCM format/ Continuous Variable Slope Delta (CVSD) Modulation for SCO channel operation • Supports 8/16 kHz noise suppression • Supports 8/16 kHz echo cancellation • Supports Modified Sub-Band Coding (MSBC) decoder for wide band speech • Built-in High Definition Clean Audio (HCA) algorithms for both narrow band and wide band speech processing • Packet loss concealment (PLC) • Built-in audio effect algorithms to enhance audio streaming • Supports Serial Copy Management System (SCMS-T) content protection • • • • 2016 Microchip Technology Inc. SBC and optional AAC decoding 20-bit DAC with 98 dB SNR 16-bit ADC with 92 dB SNR Up to 24-bit, 96 kHz, I2S digital audio Peripherals • Built-in lithium-ion and lithium-polymer battery charger (up to 350 mA) • Integrated 1.8V and 3V configurable switching regulator and low-dropout (LDO) • Built-in ADC for battery voltage sense • An AUX-In port for external audio input • Three LED drivers • Multiple I/O pins for control and status Advance Information DS60001431A-Page 1 BM63 RF/Analog Description • Frequency spectrum: 2.402 GHz to 2.480 GHz • Receive sensitivity: -90 dBm (2 Mbps EDR) • Class 2 output power (+2 dBm typical) The BM63 module is a fully qualified Bluetooth v4.2 dual-mode (BDR/EDR/BLE) module for designers to add wireless audio and voice applications to their products. The BM63 module is a Bluetooth Special Interest Group (SIG) certified module that provides a complete wireless solution with a Bluetooth stack and an integrated PCB antenna in a compact surfacemount package. HCI Interface • High-speed HCI-UART interface (supports up to 921,600 bps) MAC/Baseband Processor • Supports Bluetooth 4.2 dual-mode (FW dependent) - BR/EDR transport for audio, voice and SPP data exchange - BLE transport for proprietary transparent service and ANCS data exchange The BM63 module has an integrated lithium-ion and lithium-polymer battery charger, and a digital audio interface. The module supports HSP, HFP, SPP, A2DP and AVRCP profiles, and AAC and SBC codecs. Operating Condition • Operating voltage: 3.2V to 4.2V • Operating temperature: -20°C to +70°C Compliance • Bluetooth SIG QDID: 83345 Applications • Soundbar and Subwoofer (FW dependent) • Bluetooth portable speaker phone • Multi-speaker (FW dependent) DS60001431A-Page 2 Advance Information 2016 Microchip Technology Inc. BM63 Table of Contents 1.0 Device Overview ....................................................................................................................................................... 5 2.0 Audio ....................................................................................................................................................................... 13 3.0 Transceiver ............................................................................................................................................................. 17 4.0 Power Management Unit ........................................................................................................................................ 19 5.0 Application Information ........................................................................................................................................... 21 6.0 Printed Antenna Information ................................................................................................................................... 33 7.0 Physical Dimensions ............................................................................................................................................... 37 8.0 Electrical Characteristics......................................................................................................................................... 39 9.0 Soldering Recommendations .................................................................................................................................. 47 10.0 Ordering Information ............................................................................................................................................. 49 Appendix A: Revision History........................................................................................................................................ 51 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrorsmicrochip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 3 BM63 NOTES: DS60001431A-Page 4 Advance Information 2016 Microchip Technology Inc. BM63 1.0 DEVICE OVERVIEW The BM63 module is built around Microchip Technology IS2063 SoC. The IS2063 SoC integrates the Bluetooth 4.2 dual-mode radio transceiver, Power Management Unit (PMU), crystal and DSP. Users can configure the BM63 module by using the UI tool and DSP tool, a Windows-based utility. FIGURE 1-1: Figure 1-1 illustrates a typical example of the BM63 module which is connected to an external MCU and a DSP/codec. APPLICATION USING BM63 MODULE 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 5 FIGURE 1-2: SOUNDBAR AND SUBWOOFER APPLICATIONS USING BM63 MODULE Advance Information Figure 1-3 shows Soundbar and Subwoofer applications using the BM63 module and smartphone. FIGURE 1-3: SOUNDBAR AND SUBWOOFER APPLICATIONS USING BM63 MODULE AND SMARTPHONE BM63 DS60001431A-Page 6 Figure 1-2 shows Soundbar and Subwoofer applications using the BM63 module. 2016 Microchip Technology Inc. 2016 Microchip Technology Inc. Figure 1-4 illustrates the Multi-speaker application using the BM63 module. FIGURE 1-4: MULTI-SPEAKER APPLICATION USING BM63 MODULE Advance Information BM63 DS60001431A-Page 7 BM63 Table 1-1 provides the key features of the BM63 module. TABLE 1-1: BM63 KEY FEATURES Feature BM63 Application Multi-speaker/Soundbar/Subwoofer Stereo/mono Stereo Pin count 48 Dimensions (mm2) 15 x 32 PCB antenna Yes Tx power (typical) 2 dBm Audio DAC output 2 Channel DAC (single-ended) SNR at 2.8V (dB) -98 DAC (capless) SNR at 2.8V (dB) -98 ADC SNR at 2.8V (dB) -92 I 2S digital interface Yes Analog AUX-In Yes Mono MIC 1 External audio amplifier interface Yes UART Yes LED driver 3 Internal DC-DC step-down regulator Yes DC 5V adapter input Yes Battery charger (350 mA max) Yes ADC for thermal charger protection No Undervoltage protection (UVP) No GPIO 15 Button support 6 NFC (triggered by external NFC) Yes EEPROM Yes Customized voice prompt No Multitone Yes DSP sound effect Yes BLE Yes Bluetooth profiles HFP 1.6 AVRCP 1.6 A2DP 1.3 HSP 1.2 SPP 1.2 DS60001431A-Page 8 Advance Information 2016 Microchip Technology Inc. BM63 Figure 1-5 illustrates the pin diagram of the BM63 module. FIGURE 1-5: BM63 MODULE PIN DIAGRAM 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 9 BM63 Table 1-2 provides the pin description of the module. TABLE 1-2: BM63 PIN DESCRIPTION Pin No Pin Type Name Description 2 1 I DR0 I S interface: digital left/right data 2 I/O RFS0 I2S interface: left/right clock 3 I/O SCLK0 4 O DT0 I2S interface: digital left/right data 5 O AOHPR Headphone output, right channel 6 O AOHPM Headphone common mode output/sense input 7 O AOHPL Headphone output, left channel 8 I MIC_N1 MIC1 mono differential analog negative input MIC1 mono differential analog positive input I2S interface: bit clock 9 I MIC_P1 10 P MIC_BIAS 11 I AIR Right-channel single-ended analog input 12 I AIL Left-channel single-ended analog input 13 I/O P1_2 EEPROM clock SCL 14 I/O P1_3 EEPROM data SDA 15 I RST_N 16 I/O P0_1 Configurable control or indication pin (Internally pulled-up if configured as an input) 17 I/O P2_4 System configuration pin along with P2_0 and EAN pins used to set the module in any one of these modes: • Application mode (for normal operation) • Test mode (to change EEPROM values) • Write Flash mode (to enter the new firmware into the module), refer to Table 5-1 18 I/O P0_4 Configurable control or indication pin (Internally pulled-up if configured as an input) • NFC detection pin, active-low • Out_Ind_1 19 I/O P1_5 Configurable control or indication pin (Internally pulled-up if configured as an input) • NFC detection pin • Slide switch detector, active-high • Out_Ind_1 • Multi-SPK Master/Slave mode control (FW dependent) 20 I HCI_RXD 21 O HCI_TXD 22 P CODEC_VO 23 P VDD_IO I/O positive supply. Do not connect, for internal use only 24 P ADAP_IN 5V power adapter input DS60001431A-Page 10 Electric microphone biasing voltage System reset (active-low) HCI-UART data input HCI-UART data output Power supply/reference voltage for codec. Do not connect, for internal use only Advance Information 2016 Microchip Technology Inc. BM63 TABLE 1-2: BM63 PIN DESCRIPTION (CONTINUED) Pin No Pin Type Name 25 P BAT_IN Battery input. Voltage range: 3.2V to 4.2V. When an external power supply is connected to the ADAP_IN pin, the BAT_IN pin can be left open if battery is not connected. 26 P ADC_IN Analog input 27 P SYS_PWR 28 I MFB Multi-function button and power-on key UART RX_IND, active-high 29 I LED3 LED driver 3 30 I LED2 LED driver 2 31 I LED1 LED driver 1 32 P GND Ground reference 33 I/O P3_7 Configurable control or indication pin (Internally pulled-up, if configured as an input) UART TX_IND, active-low 34 I/O P3_5 Configurable control or indication pin (Internally pulled-down, if configured as an input) 35 I/O P0_0 Configurable control or indication pin (Internally pulled-up if configured as an input) Slide switch detector, active-high 36 I/O P0_3 Configurable control or indication pin (Internally pulled-up if configured as an input) 37 I EAN External address bus negative System configuration pin along with P2_0 and P2_4 pins used to set the module in any one of these modes: • Application mode (for normal operation) • Test mode (to change EEPROM values) • Write Flash mode (to enter new firmware into the module), refer to Table 5-1 38 I/O DM Differential data-minus USB 39 I/O DP Differential data-plus USB 40 I/O P3_6 Configurable control or indication pin (Internally pulled-up if configured as an input) Multi-SPK Master/Slave mode control (FW dependent) 41 I/O P3_3 Configurable control or indication pin (Internally pulled-up if configured as an input) FWD key, active-low 42 I/O P3_1 Configurable control or indication pin (Internally pulled-up if configured as an input) REV key, active-low 43 I/O P0_2 Configurable control or indication pin (Internally pulled-up if configured as an input) Play/Pause key (default) 44 I/O P2_0 System configuration pin along with P2_4 and EAN pins used to set the module in one of these modes: • Application mode (for normal operation) • Test mode (to change EEPROM values) • Write Flash mode (to enter the new firmware into the module), refer to Table 5-1 • Pulse/PWM signal output 2016 Microchip Technology Inc. Description System power output Advance Information DS60001431A-Page 11 BM63 TABLE 1-2: BM63 PIN DESCRIPTION (CONTINUED) Pin No Pin Type Name 45 I/O P2_7 Configurable control or indication pin (Internally pulled-up if configured as an input) Volume-up key (default), active-low 46 I/O P3_0 Configurable control or indication pin (Internally pulled-up if configured as an input) AUX-In detector, active-low 47 I/O P0_5 Configurable control or indication pin (Internally pulled-up if configured as an input) Volume-down key (default), active-low 48 Legend: Note: P I= Input pin Description GND Ground reference O= Output pin I/O= Input/Output pin P= Power pin All I/O pins can be configured using the UI tool. DS60001431A-Page 12 Advance Information 2016 Microchip Technology Inc. BM63 2.0 AUDIO The input and output audios have different stages and each stage can be programmed to vary the characteristics of the gain response. For microphones, both single-ended inputs and differential inputs are supported. To maintain a high-quality signal, a stable bias voltage source to the condenser microphone’s FET is provided. The DC blocking capacitors can be used at positive and negative sides of the input. Internally, this analog signal is converted to 16-bit, 8/16 kHz linear PCM data. 2.1 Digital Signal Processor Digital Signal Processor (DSP) is used to perform speech and audio processing. The advanced speech features, such as acoustic echo cancellation and noise reduction are in-built. To reduce nonlinear distortion and help echo cancellation, an outgoing signal level to FIGURE 2-1: SPEECH SIGNAL PROCESSING FIGURE 2-2: AUDIO SIGNAL PROCESSING 2016 Microchip Technology Inc. the speaker is monitored and adjusted to avoid saturation of speaker output or microphone input. Adaptive filtering is also applied to track the echo path impulse in response to provide echo free and full-duplex user experience. The embedded noise reduction algorithm helps to extract clean speech signals from a noisy input captured by the microphones, and improves mutual understanding in communication. Advanced audio features, such as multi-band dynamic range control, parametric multi-band equalizer, audio widening and virtual bass are in-built. The audio effect algorithms improve the user’s audio listening experience in terms of better quality after audio signal processing. Figure 2-1 and Figure 2-2 illustrate the processing flow of speaker-phone applications for speech and audio signal processing. Advance Information DS60001431A-Page 13 BM63 Users can configure DSP parameters using the DSP tool. For additional information, refer to the “IS206X DSP Application Note”. Note: The DSP tool and “IS206X DSP Application Note” document, are available for download from the Microchip web site at: www.microchip.com/BM63. FIGURE 2-3: Note: Codec The built-in codec has a high signal-to-noise ratio (SNR) and it consist of an ADC, a DAC and an additional analog circuitry. Figure 2-3 through Figure 2-6 illustrate the dynamic range and frequency response of the codec. CODEC DAC DYNAMIC RANGE The data corresponds to the 16 ohm load with 2.8V operating voltage at 25°C room temperature. FIGURE 2-4: Note: 2.2 CODEC DAC THD+N VERSUS INPUT POWER The data corresponds to the 16 ohm load with 2.8V operating voltage at 25°C room temperature. DS60001431A-Page 14 Advance Information 2016 Microchip Technology Inc. BM63 FIGURE 2-5: CODEC DAC FREQUENCY RESPONSE (CAPLESS MODE) FIGURE 2-6: CODEC DAC FREQUENCY RESPONSE (SINGLE-ENDED MODE) Note: The DAC frequency response corresponds to Single-ended mode with a 47 μF DC block 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 15 BM63 2.3 Auxiliary Port 2.4 The BM63 module supports analog (line-in) signals from the external audio source. The analog (line-in) signal can be processed by the DSP to generate different sound effects (multi-band, dynamic range compression and audio widening), which can be set by using the DSP tool. FIGURE 2-7: CAPLESS MODE FIGURE 2-8: SINGLE-ENDED MODE DS60001431A-Page 16 Analog Speaker Output The BM63 module supports the following analog speaker output modes: • Capless mode – Recommended for headphone applications in which capless output connection helps to save the BOM cost by avoiding a large DC blocking capacitor. Figure 2-7 illustrates the capless mode. • Single-ended mode – Used for driving an external audio amplifier where a DC blocking capacitor is required. Figure 2-8 illustrates the single-ended mode. Advance Information 2016 Microchip Technology Inc. BM63 3.0 TRANSCEIVER 3.3 Synthesizer The BM63 module is designed and optimized for Bluetooth 2.4 GHz system. It contains a complete radio frequency transmitter/receiver section. An internal synthesizer generates a stable clock for synchronizing with another device. Synthesizer generates a clock for radio transceiver operation. There is a VCO inside, with a tunable internal LC tank that can reduce variation for components. A crystal oscillator with internal digital trimming circuit provides a stable clock for synthesizer. 3.1 3.4 Transmitter The internal power amplifier (PA) has a maximum output power of +4 dBm. This is applied for class 2 or class 3 radios without an external RF PA. The transmitter performs IQ conversion to minimize the frequency drift. 3.2 Receiver The low-noise amplifier (LNA) operates with TR-combined mode for single port application. It can save a pin on package without having an external Tx/Rx switch. The ADC can sample the input analog signal and convert it into a digital signal for demodulator analysis. A channel filter has been integrated into receiver channel before the ADC, which is used to reduce the external component count and increase the anti-interference capability. The image rejection filter is used to reject the image frequency for low-IF architecture. This filter for low-IF architecture is intended to reduce external Band Pass Filter (BPF) component for super heterodyne architecture. Modem For Bluetooth 1.2 specification and below, 1 Mbps was the standard data rate based on Gaussian Frequency Shift Keying (GFSK) modulation scheme. This basic rate modem meets Basic Data Rate (BDR) requirements of Bluetooth 2.0 with Enhanced Data Rate (EDR) specification. For Bluetooth 2.0 and above specifications, EDR has been introduced to provide data rates of 3/2/1 Mbps. For baseband, both BDR and EDR utilize the same 1 MHz symbol rate and 1.6 kHz slot rate. For BDR, symbol 1 represents 1-bit. However, each symbol in the payload part of EDR packets represents 2 or 3 bits. This is achieved by using two different modulations, π/4 DQPSK and 8 DPSK. 3.5 Adaptive Frequency Hopping (AFH) The BM63 module has AFH function to avoid RF interference. It has an algorithm to check the nearby interference and to choose clear channel for transceiver Bluetooth signal. The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF output power to make a good trade-off for effective distance and current consumption. 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 17 BM63 NOTES: DS60001431A-Page 18 Advance Information 2016 Microchip Technology Inc. BM63 4.0 POWER MANAGEMENT UNIT The on-chip Power Management Unit (PMU) has two main features: lithium-ion and lithium-polymer battery charger, and voltage regulation. A power switch is used to switch over the power source between the battery and adapter. Also, the PMU provides current to drive three LEDs. FIGURE 4-1: 4.2 4.1 Charging a Battery The BM63 module has a built-in battery charger which is optimized for lithium-ion and lithium-polymer batteries.The charger includes a current sensor for charging control, user programmable current regulation and high-accuracy voltage regulation. The charging current parameters are configured by the UI tool. Reviving, pre-charging, constant current and constant voltage modes and re-charging functions are included. The maximum charging current is 350 mA. Figure 4-1 illustrates the charging curve of a battery. CHARGING CURVE Voltage Monitoring 4.3 A 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage level detection. The warning level can be programmed by using the UI tool. The ADC provides a granular resolution to enable the external MCU to take control over the charging process. 2016 Microchip Technology Inc. LED Driver Three dedicated LED drivers control the LEDs. They provide enough sink current (16 step control and 0.35 mA for each step), thus LEDs can be connected directly with the BM63 module. The LED settings can be configured using the UI tool. Figure 4-2 illustrates the LED drivers in the BM63 module. Advance Information DS60001431A-Page 19 BM63 FIGURE 4-2: 4.4 LED DRIVER Under Voltage Protection When the voltage of the SYS_PWR pin drops below the voltage level of 2.9V, the system will shutdown automatically. DS60001431A-Page 20 Advance Information 2016 Microchip Technology Inc. BM63 5.0 APPLICATION INFORMATION 5.1 Host MCU Interface The BM63 module supports UART commands. The UART commands enable an external MCU to control the BM63 module. Figure 5-1 illustrates the UART interface between the BM63 module and an external MCU. FIGURE 5-1: HOST MCU INTERFACE OVER UART The MCU can control the BM63 module over the UART interface and wake-up the module using the MFB pin, the P3_7 pin can be used for this function. Refer to the “UART_CommandSet” document for a list of functions the BM63 module supports and how to use the UI tool to configure the UART and UART Command Set tool. Note: The UART Command set Tool (SPKCommandSetTool v160.xx) and “UART_CommandSet” document are available for download from the Microchip web site at: www.microchip.com/BM63 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 21 FIGURE 5-2: POWER ON/OFF SEQUENCE BM63 DS60001431A-Page 22 Figure 5-2 through Figure 5-6 illustrate the timing sequences of various UART control signals. Advance Information 2016 Microchip Technology Inc. BM63 FIGURE 5-3: RX TIMING SEQUENCE (POWER-ON STATE) FIGURE 5-4: TIMING SEQUENCE (POWER-OFF STATE) Note 1: EEPROM clock = 100 kHz. 2: For byte write: 0.01 ms x 32 clock x 2 = 640 μs. 3: It is recommended to have a ramp-down time more than 640 μs during the power-off sequence to ensure safe operation of the device. 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 23 BM63 FIGURE 5-5: TIMING SEQUENCE OF POWER-ON (NACK) FIGURE 5-6: RESET TIMING SEQUENCE IN NO RESPONSE FROM MODULE TO HOST MCU Note: When the host MCU sends a UART command and the BM63 module does not respond, the MCU resends the UART command. If the module does not respond within 5 secs, the MCU will force the system to Reset. DS60001431A-Page 24 Advance Information 2016 Microchip Technology Inc. BM63 5.2 I2S Mode Application The BM63 module provides an I2S digital audio output interface to connect with the external codec or DSP. It provides 8, 16, 44.1, 48, 88.2 and 96 kHz sampling rates for 16-bit and 24-bit data formats. The I2S setting can be configured by using the UI and DSP tools. Note: The UI and DSP tools are available for download from the Microchip web site at: www.microchip.com/BM63. Figure 5-7 and Figure 5-8 illustrate the I2S signal connection between the BM63 module and an external DSP. Use the DSP tool to configure the BM63 module as a master/slave. For additional information on timing specifications, refer to 8.1 “Timing specifications”. FIGURE 5-7: BM63 MODULE IN I2S MASTER MODE FIGURE 5-8: BM63 MODULE IN I2S SLAVE MODE 5.3 Reset 5.4 The BM63 module provides a watchdog timer (WDT) to reset the chip. It has an integrated Power-on Reset (POR) circuit that resets all circuits to a known Power-on state. This action can be driven by an external reset signal which is used to control the device externally by forcing it into a POR state. The RST_N signal input is active-low and no connection is required in most of the applications. 2016 Microchip Technology Inc. External Configuration and Programming The BM63 module can be configured by using an external configuration tool (EEPROM tool) and firmware is programmed by using a programming tool (Flash tool). Note: Advance Information The EEPROM and Flash tools are available for download from the Microchip web site at: www.microchip.com/BM63. DS60001431A-Page 25 BM63 Figure 5-9 illustrates the configuration and firmware programming interface on the BM63 module. It is recommended to include a header pin on the main PCB for development. FIGURE 5-9: EXTERNAL PROGRAMMING HEADER CONNECTIONS Configuration and firmware programming modes are entered according to the system configuration I/O pins. Table 5-1 provides the system configuration settings. The P2_0, P2_4 and EAN pins have internal pull up. TABLE 5-1: SYSTEM CONFIGURATION SETTINGS P2_0 P2_4 EAN Operating Mode High High Low (Flash), High (ROM) APP mode (Normal operation) Low High Low (Flash), High (ROM) Test mode (Write EEPROM) Low Low High Write Flash DS60001431A-Page 26 Advance Information 2016 Microchip Technology Inc. 2016 Microchip Technology Inc. 5.5 Reference Circuit Figure 5-10 through Figure 5-13 illustrate the BM63 module reference circuit for a stereo headset application. FIGURE 5-10: BM63 REFERENCE CIRCUIT FOR STEREO HEADSET Advance Information BM63 DS60001431A-Page 27 BM63 BM63 REFERENCE CIRCUIT FOR STEREO HEADSET DS60001431A-Page 28 FIGURE 5-11: Advance Information 2016 Microchip Technology Inc. BM63 REFERENCE CIRCUIT FOR STEREO HEADSET 2016 Microchip Technology Inc. FIGURE 5-12: Advance Information BM63 DS60001431A-Page 29 BM63 BM63 REFERENCE CIRCUIT FOR STEREO HEADSET DS60001431A-Page 30 FIGURE 5-13: Advance Information 2016 Microchip Technology Inc. BM63 FIGURE 5-14: BM63 REFERENCE CIRCUIT FOR STEREO HEADSET 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 31 BM63 NOTES: DS60001431A-Page 32 Advance Information 2016 Microchip Technology Inc. BM63 6.0 PRINTED ANTENNA INFORMATION 6.1 Antenna Radiation Pattern Figure 6-2 illustrates the 3D radiation pattern of the PCB printed antenna at 2441 MHz. The BM63 module is integrated with one PCB printed antenna, see Figure 6-1. FIGURE 6-1: RECOMMENDED KEEP OUT AREA FOR PCB ANTENNA 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 33 BM63 FIGURE 6-2: TABLE 6-1: PCB ANTENNA RADIATION PATTERN PCB ANTENNA CHARACTERISTICS Parameter Values Frequency 2400 MHz ~ 2480 MHz Peak Gain 1.927 dBi Efficiency 73.41% 6.2 Module Placement Guidelines For Bluetooth-enabled products, the antenna placement affects the overall performance of the system. The antenna requires free space to radiate RF signals and it should not be surrounded by the ground plane. Microchip recommends that the areas underneath the antenna on the host PCB must not contain copper on the top, inner, or bottom layers, as illustrated in Figure 6-1. A low-impedance ground plane will ensure the best radio performance (best range, lowest noise). The ground plane can be extended beyond the minimum recommendation as required for the main PCB EMC noise reduction. For the best range performance, keep all external metal at least 15 mm away from the on-board PCB trace antenna. Figure 6-3 and Figure 6-4 illustrate the good and poor placement of the BM63 module on a host board with GND plane. DS60001431A-Page 34 Advance Information 2016 Microchip Technology Inc. BM63 FIGURE 6-3: BM63 PLACEMENT GUIDELINES FIGURE 6-4: GND PLANE ON MAIN APPLICATION BOARD 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 35 BM63 NOTES: DS60001431A-Page 36 Advance Information 2016 Microchip Technology Inc. BM63 7.0 PHYSICAL DIMENSIONS Figure 7-1 illustrates the PCB dimension of the BM63 module and Figure 7-2 illustrates the PCB footprint of the BM63 module. FIGURE 7-1: BM63 PCB DIMENSION Note: PCB Dimensions: X: 15.0 mm, Y: 32.0 mm, tolerances: 0.25 mm 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 37 BM63 FIGURE 7-2: DS60001431A-Page 38 RECOMMENDED BM63 PCB FOOTPRINT Advance Information 2016 Microchip Technology Inc. BM63 8.0 ELECTRICAL CHARACTERISTICS This section provides an overview of the BM63 module electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available. Absolute maximum ratings for the BM63 module are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied. Absolute Maximum Ratings Ambient temperature under bias.............................................................................................................. .-20°C to +70°C Storage temperature ...............................................................................................................................-40°C to +125°C Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +3.6V Maximum output current sink by any I/O pin..........................................................................................................12 mA Maximum output current sourced by any I/O pin....................................................................................................12 mA Note: Stresses listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only. The functional operation of the device at those or any other conditions and those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 39 BM63 TABLE 8-1: RECOMMENDED OPERATING CONDITION Symbol Parameter BAT_IN Input voltage for battery ADAP_IN Min. Typical Max. Unit 3.2 3.8 4.2 V Input voltage for adapter 4.5 5 5.5 V Operation temperature -20 +25 +70 ºC Min. Typical Max. Unit 3.0 3.3 3.6 V VIL input logic levels low 0 – 0.8 V VIH input logic levels high 2.0 – 3.6 V VOL output logic levels low – – 0.4 V VOH output logic levels high 2.4 – – V – 0.8 – V Min. Typical Max. Unit 4.5 5.0 5.5 V – 3 4.5 mA Headroom > 0.7V (ADAP_IN = 5V) – 350 – mA Headroom = 0.3V~0.7V (ADAP_IN = 4.5V) – 175(2) – mA TOPERATION TABLE 8-2: I/O AND RESET LEVEL Parameter I/O Supply Voltage (VDD_IO) I/O Voltage Levels RST_N Threshold voltage Note: These parameters are characterized but not tested in manufacturing. TABLE 8-3: BATTERY CHARGER(1,3) Parameter ADAP_IN Input Voltage Supply current to charger only Maximum Battery Fast Charge Current Trickle Charge Voltage Threshold – 3 – V Battery Charge Termination Current, (% of Fast Charge Current) – 10 – % Note 1: Headroom = VADAP_IN – VBAT 2: When VADAP_IN – VBAT > 2V, the maximum fast charge current is 175 mA for thermal protection. 3: These parameters are characterized but not tested in manufacturing. DS60001431A-Page 40 Advance Information 2016 Microchip Technology Inc. BM63 TABLE 8-4: LED DRIVER(1,2) Parameter Open-drain Voltage Min. Typical Max. Unit – – 3.6 V Programmable Current Range 0 – 5.25 mA Intensity Control – 16 – step Current Step – 0.35 – mA Power Down Open-drain Current – – 1 μA Shutdown Current – – 1 μA Min. Typical Max. Unit Resolution – – 16 Bit Output Sample Rate 8 – 48 kHz Signal to Noise Ratio (Note 1) (SNR at MIC or Line-in mode) – 92 – dB -54 – 4.85 dB Digital Gain Resolution – 2~6 – dB MIC Boost Gain – 20 – dB Note 1: Test condition: BK_O = 1.8V with temperature +25 ºC. 2: These parameters are characterized but not tested in manufacturing. TABLE 8-5: AUDIO CODEC ANALOG TO DIGITAL CONVERTER(2) T = 25 oC, VDD = 2.8V, 1 kHz sine wave input, Bandwidth = 20 Hz~20 kHz Parameter (Condition) Digital Gain Analog Gain – - 60 dB Analog Gain Resolution – 2.0 – dB Input full-scale at maximum gain (differential) – 4 – mV/rms Input full-scale at minimum gain (differential) – 800 – mV/rms 3 dB bandwidth – 20 – kHz Microphone mode (input impedance) – 24 – kOhm THD+N (microphone input) at 30 mV/rms input – 0.02 – % Note 1: fin = 1 kHz, B/W = 20~20 kHz, A-weighted, THD+N < 1%, 150 mVpp input. 2: These parameters are characterized but not tested in manufacturing. 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 41 BM63 TABLE 8-6: AUDIO CODEC DIGITAL TO ANALOG CONVERTER(4) T = 25 oC, VDD = 2.8V, 1 kHz sine wave input, Bandwidth = 20 Hz~20 kHz Parameter (Condition) Min. Typical Max. Unit Over-sampling rate – 128 – fs Resolution 16 – 20 Bit Output Sample Rate 8 – 48 kHz Signal to Noise Ratio (Note 1) (SNR at capless mode) for 48 kHz – 98 – dB Signal to Noise Ratio (Note 1) (SNR at single-ended mode) for 48 kHz – 98 – dB -54 – 4.85 dB – 2~6 – dB -28 – 3 dB Digital Gain Digital Gain Resolution Analog Gain Analog Gain Resolution – 1 – dB 495 742.5 – mV/rms Maximum Output Power (16 Ohm load) – 34.5 – mW Maximum Output Power (32 Ohm load) – 17.2 – mW Resistive – 16 O.C. Ohm Capacitive – – 500 pF THD+N (16 Ohm load) (Note 2) – 0.05 – % Signal to Noise Ratio (SNR at 16 Ohm load) (Note 3) – 98 – dB Output Voltage Full-scale Swing (AVDD = 2.8V) Allowed Load Note 1: fin = 1 kHz, B/W = 20~20 kHz, A-weighted, THD+N < 0.01%, 0dBFS signal, Load = 100 kOhm 2: fin = 1 kHz, B/W = 20~20 kHz, A-weighted, -1dBFS signal, Load =16 Ohm 3: fin = 1 kHz, B/W = 20~20 kHz, A-weighted, THD+N < 0.05%, 0dBFS signal, Load = 16 Ohm 4: These parameters are characterized but not tested in manufacturing. TABLE 8-7: TRANSMITTER SECTION FOR BDR AND EDR(1,2,3) Min. Typical Max. Bluetooth specification Unit Maximum RF transmit power – 2 – -6 to 4 dBm EDR/BDR Relative transmit power -4 -1.8 1 -4 to 1 dB Parameter Note 1: The RF Tx power is modulation value. 2: The RF Transmit power is calibrated during the production using the MP tool and MT8852 Bluetooth Test equipment. 3: Test condition: VCC_RF = 1.28V, temperature +25 ºC. DS60001431A-Page 42 Advance Information 2016 Microchip Technology Inc. BM63 RECEIVER SECTION FOR BDR AND EDR(1,2) TABLE 8-8: Modulation Min. Typical Max. Bluetooth specification Unit Sensitivity at 0.1% BER GFSK – -89 – ≤-70 dBm Sensitivity at 0.01% BER π/4 DQPSK – -90 – ≤-70 dBm 8 DPSK – -83 – ≤-70 dBm Note 1: Test condition: VCC_RF = 1.28V with temperature +25 ºC. 2: These parameters are characterized but not tested in manufacturing. SYSTEM CURRENT CONSUMPTION OF BM63(2,3) TABLE 8-9: Typical(1) Max. Unit – 10 μA Stand-by mode 0.57 – mA Link mode 0.5 – mA ESCO link 15.1 – mA 14.3 – mA Stand-by mode 0.6 – mA Link mode 0.6 – mA SCO link 15.3 – mA A2DP link 15.4 – mA System Status System-off mode Stop advertising (Samsung S5 (SM-G900I)/Android™ 4.4.2) A2DP link Stop advertising (iPhone® 6/iOS 8.4) Note 1: The measurement data corresponds to Firmware v1.0. 2: Mode definition: Stand-by mode: Power-on without Bluetooth link Link mode: With Bluetooth link in Low-Power mode. 3: The current consumption values are measured with the BM63 EVB as a test platform, with BAT_IN = 3.8V. The distance between the smartphone and BM63 EVB is 30 cm, and the speaker is without loading. 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 43 BM63 8.1 Timing specifications Figure 8-1 and Figure 8-2 illustrate the timing diagram of the BM63 module in I2S and PCM modes. FIGURE 8-1: TIMING DIAGRAM FOR I2S MODES (MASTER/SLAVE) FIGURE 8-2: TIMING DIAGRAM FOR PCM MODES (MASTER/SLAVE) Note 1: fs: 8,16, 32, 44.1, 48, 88.2 and 96 kHz. 2: SCLK0: 64*fs/256*fs. 3: Word length: 16-bit and 24-bit. DS60001431A-Page 44 Advance Information 2016 Microchip Technology Inc. BM63 Figure 8-3 illustrates the timing diagram of the audio interface and Table 8-10 provides the timing specifications. FIGURE 8-3: AUDIO INTERFACE TIMING DIAGRAM TABLE 8-10: AUDIO INTERFACE TIMING SPECIFICATIONS PARAMETER SYMBOL MIN TYP MAX UNIT SCLK0 duty ratio dSCLK – 50 – % SCLK0 cycle time tSCLKCY 50 – – ns SCLK0 pulse width high tSCLKCH 20 – – ns SCLK0 pulse width low tSCLKCL 20 – – ns RFS0 set-up time to SCLK0 rising edge tRFSSU 10 – – ns RFS0 hold time from SCLK0 rising edge tRFSH 10 – – ns DR0 hold time from SCLK0 rising edge tDH 10 – – ns Note: Test Conditions: Slave mode, fs = 48 kHz, 24-bit data and SCLK0 period = 256 fs. 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 45 BM63 NOTES: DS60001431A-Page 46 Advance Information 2016 Microchip Technology Inc. BM63 9.0 SOLDERING RECOMMENDATIONS The BM63 module is assembled using a standard lead-free reflow profile, IPC/JEDEC J-STD-020. The BM63 module can be soldered to the main PCB using a standard leaded and lead-free solder reflow profiles. To avoid any damage to the module, follow these recommendations: • Refer to the “AN233 Solder Reflow Recommendation” (DS00233) document for the soldering reflow recommendations • The peak temperature should not exceed (TP) of +250 ºC • Refer to the “Solder Paste” data sheet for specific reflow profile recommendations FIGURE 9-1: • Use no-clean flux solder paste • Do not wash the module as moisture can be trapped under the shield • Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. Figure 9-1 illustrates the reflow profile of the BM63 module. REFLOW PROFILE 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 47 BM63 NOTES: DS60001431A-Page 48 Advance Information 2016 Microchip Technology Inc. BM63 10.0 ORDERING INFORMATION Table 10-1 provides the ordering information of the BM63 module. TABLE 10-1: Module BM63 Note: ORDERING INFORMATION Microchip IC IS2063GM Description Part No 2 Bluetooth 4.2 Stereo Audio with BLE, I S, Flash, Class 2, no shield, built-in antenna BM63SPKA1MC2 The BM63 module can be purchased through a Microchip representative. Go to Microchip website www.microchip.com/ for the current pricing and a list of distributors for the product. 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 49 BM63 NOTES: DS60001431A-Page 50 Advance Information 2016 Microchip Technology Inc. BM63 APPENDIX A: REVISION HISTORY Revision A (June 2016) This is the initial released version of this document. 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 51 BM63 NOTES: DS60001431A-Page 52 Advance Information 2016 Microchip Technology Inc. BM63 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2016 Microchip Technology Inc. Advance Information DS60001431A-Page 53 BM63 NOTES: DS60001431A-Page 54 Advance Information 2016 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2016 Microchip Technology Inc. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. 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