TI1 DLP5531-Q1 0.55 2:1 1.3-mp automotive dmd Datasheet

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DLP5531-Q1
DLPS128 – MAY 2018
DLP5531-Q1 0.55 2:1 1.3-MP Automotive DMD
1 Features
2 Applications
•
•
•
•
•
•
Qualified for Automotive Applications
– –40°C to 105°C Operating DMD Array
Temperature Range
Optical Light Switching Component for the
DLP5531-Q1 Automotive Chipset:
– DLP5531-Q1 DMD
– DLPC230-Q1 DMD Controller
– TPS99000-Q1 System Management and
Illumination Controller
0.55-inch Diagonal Micromirror Array
– 7.6-μm Micromirror Pitch
– ±12° Micromirror Tilt Angle (Relative to Flat
State)
– Bottom Illumination for Optimal Efficiency and
Optical Engine Size
– 1.3-Megapixel Array Configured in 2:1 Aspect
Ratio Enabling High Resolution and Wide
Aspect Ratio Automotive Applications
– Compatible With LED or Laser
DMD Interface
– 600-MHz Sub-LVDS DMD Interface for Low
Power and Emission
– 10-kHz DMD Refresh Rate Over Temperature
Extremes
Thermally Efficient Hermetic Package Provides
Low Thermal Resistance of 1.3°C/W From Array
to Back of Package
High Resolution Headlight
3 Description
The DLP5531-Q1 Automotive DMD, combined with
the DLPC230-Q1 DMD controller and TPS99000-Q1
system management and illumination controller,
provides the capability to achieve high performance
high resolution headlight systems. The 2:1 aspect
ratio supports very wide aspect ratio designs, and the
1.3-megapixel resolution enables high resolution
symbol projection and adaptive driving beam
applications. The DLP5531-Q1 has more than 3 times
the optical throughput than the preceding DLP3030Q1 Automotive DMD. The DLP5531-Q1 Automotive
DMD micromirror array is configured for bottom
illumination which enables highly efficient and more
compact optical engine designs. The S450 package
has low thermal resistance to the DMD array to
enable more efficient thermal solutions. Note, this
datasheet pertains to the specifications and
application use of this DMD in the Headlight
application. Please see the DLP5530-Q1 datasheet
(DLPS073) for HUD specification and application
information.
Device Information(1)
PART NUMBER
PACKAGE
DLP5531-Q1
FYK (149)
BODY SIZE (NOM)
22.30 mm × 32.20 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
DLP® DLP5531-Q1 Chipset System Block Diagram
VBATT
Power
Regulation
Control &
Monitor
TPS99000-Q1
PROJ_ON
1.1V
1.8V
3.3V
6.5V
Power sequencing
and monitoring
Reset &
Power Good
I2C
DLPC230-Q1
System Diagnostics:
external watchdogs
and other monitors
Host
SPI
HOST
IRQ
MPU
SPI
Internal
Control
Illumination
Control
& feedback
LED
Control
OpenLDI
24-bit RGB
& Syncs
External
Monitor
SPI
Image Scaling
Photodiode
DMD Power
Regulation
GPIO
(configurable)
DMD Power
Flash
LED
drive
Flash
SPI
eSRAM
frame buffer
Sub-LVDS
TMP411
I2C
DLP5531-Q1
0.55 s450
1.3MP DMD
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to
change without notice.
ADVANCE INFORMATION
1
DLP5531-Q1
DLPS128 – MAY 2018
www.ti.com
4 Device and Documentation Support
4.1 Device Support
4.1.1 Device Nomenclature
XDLP553XX FYK Q1
Automotive
Package Type
Device Descriptor
Figure 1. Part Number Description
4.1.2 Device Markings
The device marking includes the legible character string GHJJJJK DLP5531XFYKQ1. GHJJJJK is the lot trace
code. DLP5531XFYKQ1 is the device marking.
ADVANCE INFORMATION
Figure 2. DMD Marking
4.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
2
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
DLP5531-Q1
TBD
TBD
TBD
TBD
TBD
DLPC230-Q1
TBD
TBD
TBD
TBD
TBD
TPS99000-Q1
TBD
TBD
TBD
TBD
TBD
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
Product Folder Links: DLP5531-Q1
DLP5531-Q1
www.ti.com
DLPS128 – MAY 2018
4.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
4.4 Trademarks
E2E is a trademark of Texas Instruments.
DLP is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
4.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
Product Folder Links: DLP5531-Q1
3
ADVANCE INFORMATION
4.5 Electrostatic Discharge Caution
8
5
6
7
3
4
C
NOTES UNLESS OTHERWISE SPECIFIED:
DWG NO.
COPYRIGHT 2015 TEXAS INSTRUMENTS
UN-PUBLISHED, ALL RIGHTS RESERVED. REV
A
B
C
1 SUBSTRATE EDGE PERPENDICULARITY TOLERANCE APPLIES TO ENTIRE SURFACE.
2 DIE PARALLELISM TOLERANCE APPLIES TO DMD ACTIVE ARRAY ONLY.
2514853
SH
1
1
REVISIONS
DESCRIPTION
ECO 2155049: INITIAL RELEASE
ECO 2165903: UPDATE SUBSTRATE BACK MARKING, SH. 4
ECO 2170159: RELAX DIE HEIGHT TOL., WAS +/-0.08
DATE
12/7/2015
4/25/2017
11/9/2017
BY
BMH
BMH
BMH
3 ROTATION ANGLE OF DMD ACTIVE ARRAY IS A REFINEMENT OF THE LOCATION
TOLERANCE AND HAS A MAXIMUM VALUE OF 0.8 DEGREES.
D
4 SUBSTRATE SYMBOLIZATION PAD AND PLATING AT BOTTOM OF DATUMS B AND C
HOLES TO BE ELECTRICALLY CONNECTED TO VSS PLANE WITHIN THE SUBSTRATE.
D
5 BOUNDARY MIRRORS SURROUNDING THE ACTIVE ARRAY.
6 MAXIMUM ENCAPSULANT PROFILE SHOWN.
7 ENCAPSULANT ALLOWED ON THE SURFACE OF THE CERAMIC IN THE AREA SHOWN
IN VIEW B (SHEET 2). ENCAPSULATION SHALL NOT EXCEED 0.2 THICKNESS MAXIMUM.
A
8 INDICATED CERAMIC SUBSTRATE FEATURES TO BE PLATED WITH 0.3 MICROMETERS
MINIMUM ELECTROLYTIC GOLD OVER 0.1 MICROMETER MINIMUM PALLADIUM OVER
1.27-8.89 MICROMETERS ELECTROLYTIC NICKEL PER ASTM B488-01, ASTM
B679-95(2009), AND AMS-QQ-N-290, RESPECTIVELY.
1
9 NOTE THAT THE ACTIVE ARRAY CENTER IS IN A DIFFERENT LOCATION FROM ALL
PRIOR SERIES 450 DMD'S.
A
(Ø2)
 0.2 E
SEE VIEW E (SHEET 3)
FOR WINDOW AND ACTIVE
ARRAY DIMENSIONS
3 0.5
B
E
1.064 0.15
3 0.5
C
C
A
A
22.3 0.22
12.687 0.15
C
(1.5)
2.335 0.15
23.33 0.15
B
B
32.2 0.32
SUBSTRATE
A
6 ENCAPSULANT
(0.56)
3 PLACES
INDICATED
(SHEET 2)
0.8 MAX
WINDOW
1.05 0.1
2.925 0.24
G
WINDOW APERTURE
1.1 0.05
(0.51)
(0.75)
INCIDENT
LIGHT
1.61 0.077

0.0254 A
0.02 G
2
ACTIVE ARRAY
149X 1.4 0.1
A
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
SECTION A-A
(Ø0.305)
SCALE 20 : 1
THIRD ANGLE
PROJECTION
NONE
0314DA
NEXT ASSY
USED ON
8
7
6
5
4
12/7/2015
ENGINEER
12/7/2015
B. HASKETT
2 PLACE DECIMALS 0.25
QA/CE
1 PLACE DECIMALS 0.50
DIMENSIONAL LIMITS APPLY BEFORE PROCESSES
INTERPRET DIMENSIONS IN ACCORDANCE WITH ASME
Y14.5M-1994
REMOVE ALL BURRS AND SHARP EDGES
PARENTHETICAL INFORMATION FOR REFERENCE ONLY
P. KONRAD
CM
Dallas Texas
TITLE
12/8/2015
12/8/2015
M. DORAK
12/8/2015
SIZE
APPROVED
12/8/2015
SCALE
2
A
TEXAS
INSTRUMENTS
S. SUSI
B. RAY
3
DATE
B. HASKETT
ANGLES 1
APPLICATION
INV2013-DLPa
DRAWN
ICD, MECHANICAL, DMD
.55 2:1 1.3MP SERIES 450 -A1
(FYK PACKAGE)
REV
DWG NO
D
C
2514853
4:1
SHEET
1
1
OF
4
8
5
6
7
3
4
DWG NO.
2514853
SH
1
2
D
D
0.5 MIN
A
1.84 0.13
28 0.28
(DATUM B TO CENTER OF DATUM C SLOT)
F
A
25.85 MAX
2.1 0.15
2±0.05
D
B
(Ø2)
2 MIN
ENCAPSULANT ALLOWED
ON CERAMIC AREA
B
A2
7
E
SECTION C-C
DATUM B
SCALE 16 : 1
5.15 0.15
C
C
2.9
C
C
6
23.2° 1°
12 0.12
14.9
0.5 MIN
A1
C
(1.5)
3X 4
D
1.84 0.13
B
B
C
D
1.5 0.05
0.75 0.025
1 0.1
WINDOW
SECTION D-D
DATUM C
0.5 0.05
A3
2X 28
(DATUM B TO A2 AND A3)
(VIEW ROTATED FOR CLARITY)
SCALE 16 : 1
VIEW B
DATUMS AND ENCAPSULANT ALLOWABLE AREA
A
A
SCALE 10 : 1
TEXAS
INSTRUMENTS
Dallas Texas
INV2013-DLPa
8
7
6
5
4
3
DRAWN
B. HASKETT
DATE
12/7/2015
SIZE
D
SCALE
2
DWG NO
REV
2514853
SHEET
1
2
OF
C
4
8
5
6
7
4
3
DWG NO.
2514853
SH
1
3
D
D
3 9
(2.1)
(Ø2)
(12.447)
ACTIVE ARRAY
7.776 0.076
5
B
4X (0.108)
(5.15)
1.073±0.0885
3 9
C
C
2.887 0.076

2.075 0.05
(8.033)
WINDOW
APERTURE
2
(6.2262)
ACTIVE ARRAY
6.96±0.0885
(10)
WINDOW
7.925±0.05
C
B
B
(1.5)
0.356±0.0885
12.802±0.0885
(13.158)
WINDOW APERTURE
2.6844 0.05
15.1314 0.05
(17.8158)
WINDOW
A
A
VIEW E
ACTIVE ARRAY AND WINDOW
SCALE 12 : 1
TEXAS
INSTRUMENTS
Dallas Texas
INV2013-DLPa
8
7
6
5
4
3
DRAWN
B. HASKETT
DATE
12/7/2015
SIZE
D
SCALE
2
DWG NO
REV
2514853
SHEET
1
3
OF
C
4
8
5
6
7
3
4
DWG NO.
2514853
SH
1
4
D
D
F
19.145
9 X 1.27 = 11.43
1.625
1.625
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
(A1, A2, & B1 OMITTED)
D
20
A
9 X 1.27 = 11.43
E
A
3.895 0.25
B
C
D
E
C
C
F
G
H
14.51 0.25
J
15 X 1.27 = 19.05
K
L
M
N
P
R
G
T
8
+0.05
149X 0.305 PINS
0.025
0.5 D E F

0.25 D
B
SYMBOLIZATION
PAD
4 8
8.5 0.25
11.85 0.25
B
8
VIEW F
PINS AND SYMBOLIZATION PAD
SCALE 8 : 1
0.28 MAX
(BRAZE AREA)
Ø0.85 MAX
(BRAZE AREA)
(R0.05)
(Ø0.305)
(1.4)
A
A
DETAIL G
PIN AND BRAZE DIMENSIONS
149 PLACES
SCALE 40 : 1
TEXAS
INSTRUMENTS
Dallas Texas
INV2013-DLPa
8
7
6
5
4
3
DRAWN
B. HASKETT
DATE
12/7/2015
SIZE
D
SCALE
2
DWG NO
REV
2514853
SHEET
1
4
OF
C
4
PACKAGE OPTION ADDENDUM
www.ti.com
2-Jun-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DLP5531AFYKQ1
PREVIEW
CPGA
FYK
149
33
RoHS & Green
-40 to 105
XDLP553XBFYKQ1
ACTIVE
CPGA
FYK
149
1
RoHS & Green
-40 to 105
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
8
5
6
7
3
4
C
NOTES UNLESS OTHERWISE SPECIFIED:
DWG NO.
COPYRIGHT 2015 TEXAS INSTRUMENTS
UN-PUBLISHED, ALL RIGHTS RESERVED. REV
A
B
C
1 SUBSTRATE EDGE PERPENDICULARITY TOLERANCE APPLIES TO ENTIRE SURFACE.
2 DIE PARALLELISM TOLERANCE APPLIES TO DMD ACTIVE ARRAY ONLY.
2514853
SH
1
1
REVISIONS
DESCRIPTION
ECO 2155049: INITIAL RELEASE
ECO 2165903: UPDATE SUBSTRATE BACK MARKING, SH. 4
ECO 2170159: RELAX DIE HEIGHT TOL., WAS +/-0.08
DATE
12/7/2015
4/25/2017
11/9/2017
BY
BMH
BMH
BMH
3 ROTATION ANGLE OF DMD ACTIVE ARRAY IS A REFINEMENT OF THE LOCATION
TOLERANCE AND HAS A MAXIMUM VALUE OF 0.8 DEGREES.
D
4 SUBSTRATE SYMBOLIZATION PAD AND PLATING AT BOTTOM OF DATUMS B AND C
HOLES TO BE ELECTRICALLY CONNECTED TO VSS PLANE WITHIN THE SUBSTRATE.
D
5 BOUNDARY MIRRORS SURROUNDING THE ACTIVE ARRAY.
6 MAXIMUM ENCAPSULANT PROFILE SHOWN.
7 ENCAPSULANT ALLOWED ON THE SURFACE OF THE CERAMIC IN THE AREA SHOWN
IN VIEW B (SHEET 2). ENCAPSULATION SHALL NOT EXCEED 0.2 THICKNESS MAXIMUM.
A
8 INDICATED CERAMIC SUBSTRATE FEATURES TO BE PLATED WITH 0.3 MICROMETERS
MINIMUM ELECTROLYTIC GOLD OVER 0.1 MICROMETER MINIMUM PALLADIUM OVER
1.27-8.89 MICROMETERS ELECTROLYTIC NICKEL PER ASTM B488-01, ASTM
B679-95(2009), AND AMS-QQ-N-290, RESPECTIVELY.
1
9 NOTE THAT THE ACTIVE ARRAY CENTER IS IN A DIFFERENT LOCATION FROM ALL
PRIOR SERIES 450 DMD'S.
A
(Ø2)
 0.2 E
SEE VIEW E (SHEET 3)
FOR WINDOW AND ACTIVE
ARRAY DIMENSIONS
3 0.5
B
E
1.064 0.15
3 0.5
C
C
A
A
22.3 0.22
12.687 0.15
C
(1.5)
2.335 0.15
23.33 0.15
B
B
32.2 0.32
SUBSTRATE
A
6 ENCAPSULANT
(0.56)
3 PLACES
INDICATED
(SHEET 2)
0.8 MAX
WINDOW
1.05 0.1
2.925 0.24
G
WINDOW APERTURE
1.1 0.05
(0.51)
(0.75)
INCIDENT
LIGHT
1.61 0.077

0.0254 A
0.02 G
2
ACTIVE ARRAY
149X 1.4 0.1
A
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
SECTION A-A
(Ø0.305)
SCALE 20 : 1
THIRD ANGLE
PROJECTION
NONE
0314DA
NEXT ASSY
USED ON
8
7
6
5
4
12/7/2015
ENGINEER
12/7/2015
B. HASKETT
2 PLACE DECIMALS 0.25
QA/CE
1 PLACE DECIMALS 0.50
DIMENSIONAL LIMITS APPLY BEFORE PROCESSES
INTERPRET DIMENSIONS IN ACCORDANCE WITH ASME
Y14.5M-1994
REMOVE ALL BURRS AND SHARP EDGES
PARENTHETICAL INFORMATION FOR REFERENCE ONLY
P. KONRAD
CM
Dallas Texas
TITLE
12/8/2015
12/8/2015
M. DORAK
12/8/2015
SIZE
APPROVED
12/8/2015
SCALE
2
A
TEXAS
INSTRUMENTS
S. SUSI
B. RAY
3
DATE
B. HASKETT
ANGLES 1
APPLICATION
INV2013-DLPa
DRAWN
ICD, MECHANICAL, DMD
.55 2:1 1.3MP SERIES 450 -A1
(FYK PACKAGE)
REV
DWG NO
D
C
2514853
4:1
SHEET
1
1
OF
4
8
5
6
7
3
4
DWG NO.
2514853
SH
1
2
D
D
0.5 MIN
A
1.84 0.13
28 0.28
(DATUM B TO CENTER OF DATUM C SLOT)
F
A
25.85 MAX
2.1 0.15
2±0.05
D
B
(Ø2)
2 MIN
ENCAPSULANT ALLOWED
ON CERAMIC AREA
B
A2
7
E
SECTION C-C
DATUM B
SCALE 16 : 1
5.15 0.15
C
C
2.9
C
C
6
23.2° 1°
12 0.12
14.9
0.5 MIN
A1
C
(1.5)
3X 4
D
1.84 0.13
B
B
C
D
1.5 0.05
0.75 0.025
1 0.1
WINDOW
SECTION D-D
DATUM C
0.5 0.05
A3
2X 28
(DATUM B TO A2 AND A3)
(VIEW ROTATED FOR CLARITY)
SCALE 16 : 1
VIEW B
DATUMS AND ENCAPSULANT ALLOWABLE AREA
A
A
SCALE 10 : 1
TEXAS
INSTRUMENTS
Dallas Texas
INV2013-DLPa
8
7
6
5
4
3
DRAWN
B. HASKETT
DATE
12/7/2015
SIZE
D
SCALE
2
DWG NO
REV
2514853
SHEET
1
2
OF
C
4
8
5
6
7
4
3
DWG NO.
2514853
SH
1
3
D
D
3 9
(2.1)
(Ø2)
(12.447)
ACTIVE ARRAY
7.776 0.076
5
B
4X (0.108)
(5.15)
1.073±0.0885
3 9
C
C
2.887 0.076

2.075 0.05
(8.033)
WINDOW
APERTURE
2
(6.2262)
ACTIVE ARRAY
6.96±0.0885
(10)
WINDOW
7.925±0.05
C
B
B
(1.5)
0.356±0.0885
12.802±0.0885
(13.158)
WINDOW APERTURE
2.6844 0.05
15.1314 0.05
(17.8158)
WINDOW
A
A
VIEW E
ACTIVE ARRAY AND WINDOW
SCALE 12 : 1
TEXAS
INSTRUMENTS
Dallas Texas
INV2013-DLPa
8
7
6
5
4
3
DRAWN
B. HASKETT
DATE
12/7/2015
SIZE
D
SCALE
2
DWG NO
REV
2514853
SHEET
1
3
OF
C
4
8
5
6
7
3
4
DWG NO.
2514853
SH
1
4
D
D
F
19.145
9 X 1.27 = 11.43
1.625
1.625
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
(A1, A2, & B1 OMITTED)
D
20
A
9 X 1.27 = 11.43
E
A
3.895 0.25
B
C
D
E
C
C
F
G
H
14.51 0.25
J
15 X 1.27 = 19.05
K
L
M
N
P
R
G
T
8
+0.05
149X 0.305 PINS
0.025
0.5 D E F

0.25 D
B
SYMBOLIZATION
PAD
4 8
8.5 0.25
11.85 0.25
B
8
VIEW F
PINS AND SYMBOLIZATION PAD
SCALE 8 : 1
0.28 MAX
(BRAZE AREA)
Ø0.85 MAX
(BRAZE AREA)
(R0.05)
(Ø0.305)
(1.4)
A
A
DETAIL G
PIN AND BRAZE DIMENSIONS
149 PLACES
SCALE 40 : 1
TEXAS
INSTRUMENTS
Dallas Texas
INV2013-DLPa
8
7
6
5
4
3
DRAWN
B. HASKETT
DATE
12/7/2015
SIZE
D
SCALE
2
DWG NO
REV
2514853
SHEET
1
4
OF
C
4
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