LIGITEK LSBKS9UG42292-R2-W88 Dual color led lamp Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
DUAL COLOR LED LAMPS
Pb
Lead-Free Parts
LSBKS9UG42292/R2-W88
DATA SHEET
DOC. NO :
QW0905- LSBKS9UG42292/R2-W88
REV.
:
A
DATE
: 22 - Mar. - 2010
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/6
PART NO. LSBKS9UG42292/R2-W88
Package Dimensions
4.2
5.2
4.0
3.0
1.5 MAX
4.2
Thermo-shrinking tube
20±2
5.2
6.7±0.5
1.5 MAX
70±5
0.5
TYP
5.0±0.5
1
2
3
2.54TYP
2.54TYP
SBKS 9UG
1
White Wire
2
3
1.ANODE BLUE
2.COMMON CATHODE
3.ANODE GREEN
Black Wire
Red Wire
2.0±0.5
+-+
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60°
100% 75% 50%
60°
25%
0
25% 50% 75% 100%
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PART NO. LSBKS9UG42292/R2-W88
Page 2/6
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
SBKS
9UG
Forward Current
IF
30
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
100
60
mA
Power Dissipation
PD
120
75
mW
Ir
50
10
μA
Electrostatic Discharge( * )
ESD
500
2000
V
Operating Temperature
Topr
-20 ~ +80
℃
Storage Temperature
Tstg
-30 ~ +100
℃
Reverse Current @5V
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
* glove
is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
Dominant Spectral
wave
halfwidth
length
△λnm
λDnm
Luminous
Viewing
intensity
angle
@20mA(mcd) 2θ 1/2
(deg)
Min. Typ. Max. Min.
Lens
InGaN/SiC Blue
Forward
voltage
@20mA(V)
Typ.
475
26
----
3.5
4.2
90
160
60
574
20
1.7
----
2.6
65
160
60
White Diffused
LSBKS9UG42292/R2-W88
AlGaInP
Green
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
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Page 3/6
PART NO. LSBKS9UG42292/R2-W88
Typical Electro-Optical Characteristics Curve
SBK-S CHIP
Fig.2 Relative Intensity vs. Forward Current
30
1.5
Relative Intensity
Normalize @20mA
Forward Current(mA)
Fig.1 Forward current vs. Forward Voltage
25
20
15
10
5
0
1
2
3
4
1.25
1.0
0.75
0.5
0.25
0
5
0
5
Relative Intensity@20mA
Forward Current@20mA
40
30
20
10
0
50
75
Ambient Temperature( ℃)
20
25
30
Fig.4 Relative Intensity vs. Wavelength
Fig.3 Forward Current vs. Temperature
25
15
Forward Current(mA)
Forward Voltage(V)
0
10
100
1.0
0.5
0
380
430
480
530
580
Wavelength (nm)
630
680
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Page 4/6
PART NO. LSBKS9UG42292/R2-W88
Typical Electro-Optical Characteristics Curve
9UG CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0
2.0
1.0
3.0
4.0
1.0
5.0
10
Fig.4 Relative Intensity vs. Temperature
1.2
Relative Intensity @20mA
Normalize @25℃
Forward Voltage@20mA
Normaliz @25 ℃
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
100
Relative Intensity @20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
550
600
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
500
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
650
100
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PART NO.LSBKS9UG42292/R2-W88
Page 5/6
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5° C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(°C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
50
100
60 Seconds Max
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. LSBKS9UG42292/R2-W88
Page 6/6
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95 %
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
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