MLX80020 Enhanced LIN Transceiver Features RxD 1 EN 2 WAKE 3 TxD 4 8 INH 7 VS 6 LIN 5 GND Compatible to LIN Physical Layer Specification Rev.2.x and SAE J2602 MLX 80020 Baud rate up to 20 kBaud Wide operating voltage range VS = 5 to 27 V Very low standby current consumption of 10µA in sleep mode Bus and local wake up capable with source recognition Control output for voltage regulator with low on – resistance for switchable master termination Low EME(emission) and high EMI(immunity) level Fully compatible to 3.3V and 5V devices Integrated termination resistor for LIN slave nodes TxD dominant time out function Sleep timer to guarantee the most power saving mode after power on or wake up in case of faulty passive microcontroller High impedance Bus pin in case of loss of ground and undervoltage condition Bus short to ground protection Enhanced ESD robustness according to IEC 61000-4-2 RoHs compliant and AECQ-100 qualified Ordering Code Product Code MLX80020 MLX80020 MLX80020 MLX80020 Temperature Code K K K K Package Code DC DC DC DC Option Code BBA-000 BBA-000 BAA-000 BAA-000 Legend: Temperature Code: Package Code: Option Code: Packing Form: K for Temperature Range -40°C to 125°C DC for SOIC150Mil BBA-000 for SAE J2602, BAA-000 for LIN 2.x RE for Reel, TU for Tube Ordering example: MLX80020KDC-BBA-000-TU Packing Form Code TU RE TU RE General Description The MLX80020 is a physical layer device for a single wire data link capable of operating in applications using baud rates from 1kBd to 20kBd. The MLX80020 is compatible to LIN2.x as well as to the SAE J2602 specifications. Because of the very low power consumption of the MLX80020 in the sleep mode it’s suitable for ECU applications with hard standby current requirements. The implemented high resistive termination in sleep mode as well as the driving capability of the INH pin allows a comfortable handling of LIN short circuits to GND. In order to reduce the power consumption in case of failure modes, the integrated sleep timer takes care for switching the ECU into the most power saving sleep mode after power on or wake up events that are not followed by a mode change response of the microcontroller. The MLX80020 has an improved EMI performance and ESD robustness. The MLX80020 version with the ordering code extension ‘A’ is suitable for applications with baud rates up to 20kbd. The version of the MLX80020 with the ordering code extension ‘B’ is optimized for baud rates up to 10.4kbd as specified in the SAE J2602 standard. MLX80020 – Datasheet 3901080020 Page 1 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver Contents 1. Functional Diagram .................................................................................................... 4 2. Pin Description ........................................................................................................... 5 3. Electrical Specification .............................................................................................. 6 3.1 3.2 3.3 3.4 4. Functional Description ............................................................................................. 11 4.1 4.2 4.3 4.4 4.5 4.6 5. Operating Modes ................................................................................................. 11 Initialization and Standby mode ........................................................................... 12 Normal Mode ....................................................................................................... 12 Sleep Mode ......................................................................................................... 16 Wake Up .............................................................................................................. 16 Wake Up Source Recognition.............................................................................. 16 Fail-safe features ...................................................................................................... 18 5.1 5.2 5.3 5.4 5.5 5.6 5.7 6. Operating Conditions ............................................................................................. 6 Absolute Maximum Ratings ................................................................................... 6 Static Characteristics ............................................................................................. 7 Dynamic Characteristics ...................................................................................... 10 Loss of battery ..................................................................................................... 18 Loss of Ground .................................................................................................... 18 Short circuit to battery .......................................................................................... 18 Short circuit to ground ......................................................................................... 18 Thermal overload................................................................................................. 18 Undervoltage lock out .......................................................................................... 18 Open Circuit protection ........................................................................................ 18 Application Hints ...................................................................................................... 19 6.1 Application Circuitry ............................................................................................. 19 7. Mechanical Specification SOIC8 ............................................................................. 20 8. Tape and Reel Specification .................................................................................... 21 8.1 8.2 9. Tape Specification ............................................................................................... 21 Reel Specification ................................................................................................ 22 ESD/EMC Remarks ................................................................................................... 23 9.1 9.2 9.3 General Remarks ................................................................................................ 23 ESD-Test ............................................................................................................. 23 EMC .................................................................................................................... 23 MLX80020 – Datasheet 3901080020 Page 2 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver 10. Standard information regarding manufacturability of Melexis products with different soldering processes ......................................................................................... 24 11. Revision History .................................................................................................... 25 12. Disclaimer .............................................................................................................. 26 List of Figures Figure 1: Block Diagram ......................................................................................................................... 4 Figure 2: Pin description SOIC8 package ............................................................................................... 5 Figure 3: State Diagram of the MLX80020 ........................................................................................... 12 Figure 4 - Duty cycle measurement and calculation in accordance to LIN physical layer specification 2.x for baud rates up to 20Kbps ................................................... 14 Figure 5 - Duty cycle measurement and calculation in accordance to LIN physical layer specification 2.x for baud rates of 10.4Kbps or below ...................................... 15 Figure 6: Remote wake-up behavior .................................................................................................... 17 Figure 7: Application Circuitry ............................................................................................................... 19 MLX80020 – Datasheet 3901080020 Page 3 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver 1. Functional Diagram Figure 1: Block Diagram MLX80020 – Datasheet 3901080020 Page 4 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver 2. Pin Description RxD 1 EN 2 WAKE 3 TxD 4 MLX 80020 8 INH 7 VS 6 LIN 5 GND Figure 2: Pin description SOIC8 package Pin Name IO-Type 1 RXD O Received data from LIN bus, LOW in dominant state 2 EN I Mode control pin, enables the normal operation mode when HIGH 3 WAKE I High voltage input for local wake up, negative edge triggered 4 TXD I/O Transmit data input (LOW = dominant), active low after local wake up 5 GND G Ground 6 BUS I/O LIN bus transmitter/receiver pin, (LOW = dominant) 7 VS P Battery supply voltage 8 INH O Control output for voltage regulator, termination pin for master pull up MLX80020 – Datasheet 3901080020 Description Page 5 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver 3. Electrical Specification All voltages are referenced to ground (GND). Positive currents flow into the IC. 3.1 Operating Conditions Parameter Symbol Min Max Unit VS 7 18 V High battery supply voltage VS_S 18 27 V Low battery supply voltage Vs_L 5 7 V Operating ambient temperature Tamb -40 +125 °C Battery supply voltage [1] [1] Vs is the IC supply voltage including voltage drop of reverse battery protection diode, V DROP = 0.4 to 1V, VBAT_ECU voltage range is 8 to 18V 3.2 Absolute Maximum Ratings In accordance with the Maximum Rating System (IEC 60134). The absolute maximum ratings given in the table below are limiting values that do not lead to a permanent damage of the device but exceeding any of these limits may do so. Long term exposu re to limiting values may affect the reliability of the device. Parameter Battery Supply Voltage Symbol VS Condition Min Max Unit Respective to GND -0.3 40 V -100 Transients at battery supply voltage VVS.tr1 ISO 7637/2 pulse 1[1] Transients at battery supply voltage VVS.tr2 ISO 7637/2 pulse 2[1] Transients at high voltage signal pins VLIN..tr1 ISO 7637/3 pulses 1[2] Transients at high voltage signal pins VLIN..tr2 ISO 7637/3 pulses 2[2] Transients at high voltage signal and power supply pins VHV..tr3 ISO 7637/2 pulses 3A, 3B [3] DC voltage LIN, WAKE VLIN_DC Respective to GND and VS Loss of Ground( VGND=VS ) DC voltage INH DC voltage low voltage I/O’s (RxD,TxD,EN) MLX80020 – Datasheet 3901080020 75 -30 V V 30 V -150 100 V -27 40 V VINH_DC -0.3 VS + 0.3 V Vlv_DC -0.3 7 V -6 6 kV -8 -2 8 2 kV kV -1000 1000 V VESD_IEC ESD voltage V IEC 61000-4-2 Pin LIN, VS,to GND, WAKE VESD_HBM HBM (AEC-Q100-002) Pin LIN, VS to GND, WAKE, INH All other pins VESD_CDM CDM (AEC-Q100-011) Page 6 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver Parameter Symbol Maximum latch - up free current at any Pin Condition ILATCH Min Max Unit -500 500 mA 152 K/W Thermal impedance JA Storage temperature Tstg -55 150 °C Junction temperature Tvj -40 150 °C [1] [2] [3] in free air ISO 7637/2 test pulses are applied to VS via a reverse polarity diode and >2uF blocking capacitor. ISO 7637/3 test pulses are applied to LIN via a coupling capacitance of 100nF. ISO 7637/3 test pulses are applied to LIN via a coupling capacitance of 1nF. ISO 7637/2 test pulses are applied to VS via a reverse polarity diode and >10uF blocking capacitor 3.3 Static Characteristics Unless otherwise specified all values in the following tables are valid for VS = 5 to 27V and TJ= -40 to 150°C. Typical values are valid for VS = 12V and TAMB= 25°C. All voltages are referenced to ground (GND), positive currents are flow into the IC. Parameter Symbol Condition Min Typ Max Unit 4.8 V 0.7 V 4.9 V PIN VS Power on reset Power on reset hysteresis Undervoltage lockout Undervoltage lockout hysteresis VS_POR 2.4 VS_POR_hys 0.1 VS_UV 4.2 VS_UV_hys 0.1 0.3 0.7 V 3 9 20 µA 300 800 2000 µA 0.3 Supply current, sleep mode ISsl VEN = 0V, VWAKE = VS = VLIN <14V Supply current standby mode ISBY VEN = 0V, after POR or WU Supply current normal mode, dominant ISd VEN = 5V, VTxD = 0V 1 3 5 mA Supply current normal mode, recessive ISr VEN = 5V, VTxD = 5V 300 800 2000 µA 40 200 mA 20 60 kΏ -20 µA PIN LIN – Transmitter Short circuit bus current IBUS_LIM Pull up resistance bus, normal & standby mode RSLAVE VLIN = VS, VEN = 5V,VTxD = 0V IBUS_SLEEP VLIN = 0, VS = 12V, VEN = 5V, VTxD = 5V -100 Input Leakage current at the receiver incl. pull-up resistor IBUS_PAS_dom VLIN =0V ,VS =12V, VEN = 5V, VTxD = 5V -600 Bus reverse current, recessive IBUS_PAS_rec VLIN=18V, VS =5V, VEN = 5V, VTxD = 5V, Tamb<125°C 20 µA Bus reverse current loss of battery [2] IBUS_NO_BAT VS = 0V, 0V < VLIN < 18V Tamb<125°C 20 µA Bus current during loss of ground [2] IBUS_NO_GND VS = 12V, 0 < VLIN < 18V -100 20 µA VolBUS Rload = 500 0 0.2 VS V Pull up current bus, sleep mode Transmitter dominant voltage [2] MLX80020 – Datasheet 3901080020 Page 7 of 26 µA November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver Parameter Symbol Condition Transmitter recessive voltage [2] VohBUS No load, VEN = 0/5V,VTxD = 5V BUS input capacitance [1] CBUS Pulse response via 10k, VPULSE = 12V, Vs open Voltage drop serial Diode [3] VSerDiode Min Typ 0.8 VS 25 0.4 Max Unit VS V 35 pF 1.0 V PIN LIN – Receiver Receiver dominant voltage Receiver recessive voltage Center point of receiver threshold Receiver hysteresis VilLIN VihLIN ViLIN_cnt ViLIN_hys 0.4 *VS High level input voltage Low level input voltage Hysteresis Vih_EN Vil_EN Vihys_EN Rising edge Falling edge Pull down resistor Rpd_EN VEN = 5V Leakage Current Vleak_EN VEN = 0V PIN TxD -5 High level input voltage Low level input voltage Hysteresis Vih_TxD Vil_TxD Vihys_TxD Rising edge Falling edge 2 Pull down resistor Rpd_TxD VTxD = 5V Low level output voltage Leakage Current Vol_rxd Vleak_TxD ITxD = 2mA VTxD = 0V VLIN_cnt = ( VilLIN_ + VihLIN )/2 VLIN_cnt = ( VihLIN -VilLIN ) PIN EN 0.6 *VS 0.475 *VS 0.5 *VS 0.525 *VS 0.175 *VS 2 0.05 0.1 0.8 0.3 100 350 600 V V V V V V V 5 k µA V V V 0.05 0.1 0.8 0.3 100 350 600 -5 0.4 5 k V µA -5 -5 0.4 5 5 V µA µA 50 5 5 µA µA -20 VS-3.3V 5 -1 V V µA µA 170 10 190 30 °C °C PIN RXD Low level output voltage Leakage Current high Leakage Current low Vol_rxd Vleak_rxd Vleak_rxd IRxD = 2mA VRxD = 5V,VTxD = 5V, VEN = 5V VRxD = 0V,VTxD = 5V, VEN = 5V PIN INH On resistance INH Ron_INH Leakage current INH high Leakage current INH low IINH_lk IINH_lk Normal or standby mode, VINH = VS-1V , VS = 12V EN = L ,VINH = 27V, VS = 27V EN = L ,VINH = 0V, VS = 27V 20 -5 -5 PIN WAKE High level input voltage Low level input voltage Leakage current WAKE high Pull up current WAKE Vih_WK Vil_WK IWAKE_lk IWAKE_pu VS-1V VWAKE = 27V, VS = 27V -5 -30 Thermal Protection Thermal shutdown Thermal hysteresis [1] Tsd [1] 155 Thys [1] No production test, guaranteed by design and qualification MLX80020 – Datasheet 3901080020 Page 8 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver [2] [3] In accordance to SAE J2602 Guaranteed by design MLX80020 – Datasheet 3901080020 Page 9 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver 3.4 Dynamic Characteristics Unless otherwise specified all values in the following table are valid for V S = 5 to 27V and o TAMB= -40 to 125 C. Parameter Symbol Condition Min Typ Max Unit Propagation delay receiver [1] trec_pdf CRxD =25pF falling edge 6 µs Propagation delay receiver [1] trec_pdr CRxD =25pF rising edge 6 µs Propagation delay receiver symmetry trec_sym Calculate trec_pdf - trec_pdr -2 2 µs Receiver debounce time trec_deb LIN rising & falling edge 0.5 4 µs [2] LIN duty cycle 1 [2] [3] [4] D1 20kbps operation , 0.396 LIN duty cycle 2 [2] [3] [4] D2 20kbps operation , LIN duty cycle 3 [2] [3] D3 LIN duty cycle 4 [2] [3] D4 0.590 trec(max) – tdom(min) [5] Δt3 15.9 µs trec(min) – tdom(max) [5] Δt4 17.28 µs 0.581 0.417 Remote Wake-up filter time twu_remote sleep mode, LIN rising & falling edge 30 150 µs Local Wake-up filter time twu_local sleep mode, WAKE falling edge 10 50 µs Delay from Standby to Sleep Mode tdsleep VEN = 0 150 500 ms TxD dominant time out time tTxD_to normal mode, VTxD = 0 27 60 ms EN – debounce time tEN_deb normal <--> standby mode transitions 0.5 4 µs [1] [2] [3] [4] [5] This parameter is tested by applying a square wave signal to the LIN. The minimum slew rate for the LIN rising and falling edges is 50V/us See figure 5 – LIN timing diagram Standard loads for duty cycle measurements are 1K/1nF, 660/6.8nF, 500/10nF Not valid for the SAE J2602 version (optimized for 10.4kBd operation) of the MLX80020 xA In accordance to SAE J2602, only for device version MLX80020 xB MLX80020 – Datasheet 3901080020 Page 10 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver 4. Functional Description 4.1 Operating Modes Mode EN TxD RxD INH Standby 0 weak pull down/active low[1] floating/active low[2] Vs off entered after power on or wake up Normal mode 1 weak pull down/input for transmit data stream output for LIN data stream Vs on [3] [4] [5] Sleep mode 0 weak pull down floating floating off No local or remote wake up [1] [2] [3] [4] [5] Transmitter Remarks Indicates the wake up flag in case of local wake up After power on RxD is floating. If any wake up(local or remote) occurs it will be indicated by active low Active low interrupt at pin RxD will be removed when entering normal mode Wake up source flag at pin TxD will be removed when entering normal mode Normal mode will be entered by a low -> high transition on pin EN. When recessive level (high) on pin TxD is present the transmit path will be enabled MLX80020 – Datasheet 3901080020 Page 11 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver VS on Normal Mode EN EN =>Low high INH RxD Vs receive data LIN termination 30kO Transmitter on EN =>High Standby t > 150ms -> no mode change -> no valid wake up EN INH low RxD TxD VS floating low/ low[1] high[2] LIN termination 30kO Transmitter off EN =>High Sleep Mode EN INH RxD low floating floating Remote or local wake up request LIN termination 200kO Transmitter off [1] [2] floating after power on active low interrupt after wake up weak pull down after power on indicates wake up source via weak /strong pull down Figure 3: State Diagram of the MLX80020 4.2 Initialization and Standby mode When the battery supply voltage Vs exceeds the specified threshold VS_POR, the MLX80020 automatically enters an intermediate standby mode. The INH output becomes HIGH (Vs) and therefore the external voltage regulator will provide the Vcc supply voltage to the ECU. The pin RxD is floating and the integrated slave pull up resistor with decoupling diode secures high level on the pin LIN. The transmitter as well as the receiver is disabled. If there occurs no mode change to normal mode via an EN LOW to HIGH transition within the time defined (typically 350ms), the IC enters the most power saving sleep mode and the INH output will become floating (logic 0). Furthermore the standby mode will be entered after a valid local or remote wake up event, when the MLX80020 is in sleep mode. The entering of the standby mode after wake up will be indicated by an active LOW interrupt on pin RxD. 4.3 Normal Mode By entering this mode the MLX80020 can be used as interface between the single wire LIN bus and the microcontroller. The incoming bus traffic is detected by the receiver and transferred via the RxD output pin to the microcontroller. (see figure 3, LIN timing diagram) MLX80020 – Datasheet 3901080020 Page 12 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver RxD The pin RxD is a buffered open drain output with a typical load of: Resistance: 2.7 kOhm Capacitance: < 25 pF The output signal supports by the external pull up resistor 3.3V and 5V supply systems. TxD The transmit data stream of the LIN protocol controller applied to the pin TxD is converted into the LIN bus signal with slew rate control in order to minimize electromagnetic emissions. The pin TxD contains a weak pull down resistor. The input thresholds are compatible to 3.3V and 5V supply systems. To enable the transmit path, the TxD pin has to be driven recessive (HIGH) after or during the normal mode has been entered. TxD dominant time-out feature By the first dominant level on pin TxD after the transmit path has been enabled, the dominant time-out counter is started. In case of a faulty blocked permanent dominant level on pin TxD the transmit path will be disabled after the specified time tTxD_to. The time-out counter is reset by the first negative edge on pin TxD. EN The normal mode can be entered being in sleep or standby mode, when the pin EN is driven HIGH. To prevent unwanted mode transitions, the EN input contains a debounce filter as specified (tEN_deb). The pin EN contains a weak pull down resistor. The input thresholds are compatible to 3.3V and 5V supply systems. Additionally the positive edge on pin EN results in an immediate reset of the active low interrupt on pin RxD as well as the wake-up source recognition flag on pin TxD (see chapter 4.5 Wake Up). MLX80020 – Datasheet 3901080020 Page 13 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver Data transmission speed The MLX80020 is a constant slew rate transceiver that means the bus driver operates with a fixed slew rate range independent of the supply voltage. This principle secures a very good symmetry of the slope times between recessive to dominant and dominant to recessive slopes within the LIN bus load range (C BUS, Rterm). The MLX80020 KDC A version guarantees data rates up to 20kbd within the complete bus load range under worst case conditions. The version MLX80020 KDC B is optimized for applications with a maximum baud rate of 10.4kBd (SAE J2602) in order to minimize EME. These devices can not be used in applications with higher baud rates. The constant slew rate principle is very robust against voltage drops and can operate with RC- oscillator systems with a clock tolerance up to ±2% between 2 nodes. Duty cycle calculation LIN 2.x With the timing parameters shown in the picture below two duty cycles , based on trec(min) and trec(max) can be calculated as follows : tBit =50µs D1 = trec(min) / (2 x tBit) D2 = trec(max) / (2 x tBit) Figure 4 - Duty cycle measurement and calculation in accordance to LIN physical layer specification 2.x for baud rates up to 20Kbps MLX80020 – Datasheet 3901080020 Page 14 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver Duty cycle calculation J2602: With the timing parameters shown in the table below two duty cycles , based on trec(min) and trec(max) can be calculated as follows : tBit =96µs D3 = trec(min) / (2 x tBit) D4 = trec(max) / (2 x tBit) Figure 5 - Duty cycle measurement and calculation in accordance to LIN physical layer specification 2.x for baud rates of 10.4Kbps or below MLX80020 – Datasheet 3901080020 Page 15 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver 4.4 Sleep Mode The most power saving mode of the MLX80020 is the sleep mode. The MLX80020 offers two procedures to enter the sleep mode: The mode is selected when the pin EN is driven LOW in normal mode for longer than the specified filter time (tEN_deb). The mode change into sleep mode is possible even in case of dominant voltage levels on the LIN bus, pins WAKE or TxD. If the MLX80020 is in standby mode after power-on or wake-up, a sleep counter is started and switches the transceiver into sleep mode after the specified time (typ. 350ms) even when the microcontroller of the ECU will not confirm the normal operation by setting the EN pin to logic HIGH. This new feature allows faulty blocked LIN nodes to reach always the most power saving mode. Being in sleep mode the INH pin becomes floating and the ECU voltage regulator can be switched off in order to minimize the current consumption of the complete LIN node. The transmitter is disabled and the pin RxD is disconnected from the receive path and is floating. The slave termination resistor (LIN pull up resistor with decoupling diode between pins LIN and Vs) is disconnected and only a weak LIN pull up resistor is applied to the LIN bus (see chapter 5.4 fail-safe features) 4.5 Wake Up When in sleep mode the MLX80020 offers thee wake-up procedures: In applications with continuously powered ECU a wake up via mode transition to normal mode is possible (see chapter 4.3 Normal Mode) Remote wake-up via LIN bus traffic After a falling edge on the LIN bus followed by a dominant voltage level for longer than the specified value(twu_remote) and a rising edge on pin LIN will cause a remote wake up (see fig.4 page ) Local wake-up via a negative edge on pin WAKE A negative edge on the pin WAKE and a dominant voltage level for longer than the specified time(twu_local) will cause a local wake-up. The current for an external switch has to be provided by an external pull up resistor RWK. For a reverse current limitation in case of a closed external switch and a negative ground shift or an ECU loss of ground a protection resistor RWK_prot between pin WAKE and the switch is recommended. (see fig.5 page ) The pin WAKE provides a weak pull up current towards the battery voltage that provides a HIGH level on the pin in case of open circuit failures or if no local wake up is required. In such applications it is recommended to connect the pin WAKE directly to pin Vs in order to prevent influences due to EMI. 4.6 Wake Up Source Recognition The device can distinguish between a local wake-up event (pin WAKE) and a remote wake-up event. The wake-up source flag is set after a local wake-up event and is indicated by an active LOW on pin TxD. The wake-up flag can be read if an external pull up resistor towards the microcontroller supply voltage has been added (see fig.5 ) and the MLX80020 is still in stanby mode: LOW level indicates a local wake-up event HIGH level indicates a remote wake up event The wake-up request is indicated by an active LOW on pin RxD and can be used for an interrupt.. When the microcontroller confirms a normal mode operation by setting the pin EN to HIGH, both the wake-up request on pin RxD as well as the wake-up source flag on pin TxD are reset immediately. MLX80020 – Datasheet 3901080020 Page 16 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver VLIN t VINH t > twu_remote t VCC_ECU t VEN t VRxD wake-up interrupt t Figure 6: Remote wake-up behavior MLX80020 – Datasheet 3901080020 Page 17 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver 5. Fail-safe features 5.1 Loss of battery If the ECU is disconnected from the battery, the bus pin is in high impedance state. There is no impact to the bus traffic and to the ECU itself. Reverse current is limited to < 20µA 5.2 Loss of Ground In case of an interrupted ECU ground connection there is no influence to the bus line. The current from the ECU to the LIN bus is limited by the weak pull up resistance of the pin LIN, the slave termination resistor is disconnected in order to fulfill the SAE J2602 requirements for the loss of ground current (<100µA @12V). 5.3 Short circuit to battery The transmitter output current is limited to the specified value in case of short circuit to battery in order to prevent high current densities and thermal hot spots in the LIN driver. 5.4 Short circuit to ground If the LIN bus wiring is shorted to negative shifted ground levels, there is no current flow from the ECU ground to the bus and no distortion of the bus traffic occurs. The permanent failure current from battery to ground can be reduced dramatically by using the INH pin as termination control pin for the master pull up resistor (See Figure 7: Application Circuitry). If the controller detects a short circuit of the LIN bus to ground the transceiver can be set into sleep mode. The INH pin is floating and therefore the master pull up resistor is disconnected from the bus line. Additionally the internal slave termination resistor is switched off and only a weak pull up termination is applied to the LIN bus (typ. 75A). If the failure disappears, the bus level will become recessive again and will wake up the system even if no local wake up occurs or is possible. 5.5 Thermal overload The MLX80020 is protected against thermal overloads. If the chip temperature exceeds the specified value, the transmitter is disabled until thermal recovery and the following recessive to dominant transition on pin TxD. The receiver is still working while thermal shutdown. 5.6 Undervoltage lock out If the battery supply voltage is missing or decreased under the specified value(VS_UV), the transmitter is disabled to prevent undefined bus traffic. 5.7 Open Circuit protection The pin TxD provides a weak pull down. The transmitter can not be enabled. The pin EN provides a weak pull down to prevent undefined normal mode transitions. If the battery supply voltage is disconnected, the pin RxD is floating The pin WAKE provides a weak pull up current towards supply voltage Vs to prevent local wake-up requests MLX80020 – Datasheet 3901080020 Page 18 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver 6. Application Hints 6.1 Application Circuitry VS 100nF 1N4001 10uF VBAT MASTER ECU Voltage regulator VBAT Optinal connection in case switchable termination is required 3.3V/5V 100nF 1kO RRX INH RWK VS RxD RTX µP LIN MLX80020 TxD RWK_PROT WAKE 180pF VS 100nF 1N4001 10uF VBAT GND LIN BUS GND SLAVE ECU Voltage regulator VBAT 3.3V/5V 100nF RRX INH VS RxD µP LIN MLX80020 TxD WAKE 180pF GND GND Figure 7: Application Circuitry MLX80020 – Datasheet 3901080020 Page 19 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver 7. Mechanical Specification SOIC8 Small Outline Integrated Circiut (SOIC), SOIC 8, 150 mil A1 B D E e H h L A ZD A2 4.80 4.98 3.81 3.99 1.27 5.80 6.20 0.25 0.50 0.41 1.27 1.52 1.72 0° 8° 0.53 1.37 1.57 0.189 0.196 0.150 0.157 0.050 0.2284 0.244 0.0099 0.0198 0.016 0.050 0.060 0.068 0° 8° 0.021 0.054 0.062 C All Dimension in mm, coplanarity < 0.1 mm min max 0.10 0.25 0.36 0.46 0.19 0.25 All Dimension in inch, coplanarity < 0.004” min max 0.004 0.0098 0.014 0.018 MLX80020 – Datasheet 3901080020 0.0075 0.0098 Page 20 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver 8. Tape and Reel Specification 8.1 Tape Specification max. 10° max. 10° IC pocket R Top View n. mi Sectional View T2 P0 D0 36 m P2 T E G1 < A0 > F K0 W B0 B1 S1 G2 P1 D1 T1 Cover Tape Abwickelrichtung Standard Reel with diameter of 13“ Package Parts per Reel Width Pitch SOIC8 3000 12 mm 8 mm D0 E P0 P2 Tmax T1 max G1 min G2 min B1 max D1 min F P1 Rmin T2 max W 1.5 +0.1 1.75 0.1 4.0 0.1 2.0 0.05 0.6 0.1 0.75 0.75 8.2 1.5 5.5 0.05 4.0 0.1 30 6.5 12.0 0.3 A0, B0, K0 can be calculated with package specification. Cover Tape width 9.2 mm. MLX80020 – Datasheet 3901080020 Page 21 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver 8.2 Reel Specification W2 W1 B* D* C A N Amax B* C D*min 330 2.0 0.5 13.0 +0,5/-0,2 20.2 Width of half reel Nmin W1 W2 max 4 mm 100,0 4,4 7,1 8 mm 100,0 8,4 11,1 MLX80020 – Datasheet 3901080020 Page 22 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver 9. ESD/EMC Remarks 9.1 General Remarks Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. 9.2 ESD-Test The MLX80020 is tested according to HBM AEC-Q100-002. The ESD test CDM according to AEC-Q100-011 as well as system level ESD test according to IEC 61000-4-2 are performed by an external test house. 9.3 EMC The test on EMC impacts is done according to ISO 7637-2 for power supply pins and ISO 7637-3 for dataand signal pins as well as the “Hardware requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications”; Audi, BMW, Daimler, Porsche, VW; 2009-12-02” MLX80020 – Datasheet 3901080020 Page 23 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver 10. Standard information regarding manufacturability of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD’s (Surface Mount Devices) IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2) Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) EN60749-20 Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD’s (Through Hole Devices) EN60749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) EIA/JEDEC JESD22-B102 and EN60749-21 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx MLX80020 – Datasheet 3901080020 Page 24 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver 11. Revision History Version Changes Remark 001 Initial release Date October 2010 002 Changed maximum ratings (ESD value CDM increased) Changed Static Characteristic in acc to CPK-values Changed Chapter 9.3 EMC Changes Tape Specification Chapter 8.1 November 2010 003 Change of Order Code November 2010 004 Change “short term” to “high” operating range in chapter “Operating Conditions” June 2011 005 Logo, disclaimer, ordering code June 2012 006 Electrical Specification of LIN-Transmitter updated November 2015 MLX80020 – Datasheet 3901080020 Page 25 of 26 November 2015 Rev 006 MLX80020 Enhanced LIN Transceiver 12. Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services. © 2012 Melexis NV. All rights reserved. For the latest version of this document, go to our website at www.melexis.com Or for additional information contact Melexis Direct: Europe, Africa, Asia: Phone: +32 1367 0495 E-mail: [email protected] America: Phone: +1 248 306 5400 E-mail: [email protected] ISO/TS 16949 and ISO14001 Certified MLX80020 – Datasheet 3901080020 Page 26 of 26 November 2015 Rev 006