ON NLV14093BDG Quad 2-input "nand" Datasheet

MC14093B
Quad 2-Input “NAND"
Schmitt Trigger
The MC14093B Schmitt trigger is constructed with MOS
P−channel and N−channel enhancement mode devices in a single
monolithic structure. These devices find primary use where low power
dissipation and/or high noise immunity is desired. The MC14093B
may be used in place of the MC14011B quad 2−input NAND gate for
enhanced noise immunity or to “square up” slowly changing
waveforms.
Features
SOIC−14
D SUFFIX
CASE 751A
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Capable of Driving Two Low−Power TTL Loads or One
•
•
•
•
•
•
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Low−Power Schottky TTL Load Over the Rated Temperature
Range
Triple Diode Protection on All Inputs
Pin−for−Pin Compatible with CD4093
Can be Used to Replace MC14011B
Independent Schmitt−Trigger at each Input
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
VDD
Vin, Vout
Iin, Iout
PD
Parameter
Unit
−0.5 to +18.0
V
−0.5 to VDD + 0.5
V
Input or Output Current
(DC or Transient) per Pin
±10
mA
Power Dissipation,
per Package (Note 1)
500
mW
Input or Output Voltage Range
(DC or Transient)
TA
Ambient Temperature Range
−55 to +125
°C
Tstg
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature
(8−Second Soldering)
260
°C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
August, 2014 − Rev. 10
1
14
VDD
IN 2A
2
13
IN 2D
OUTA
3
12
IN 1D
OUTB
4
11
OUTD
IN 1B
5
10
OUTC
IN 2B
6
9
IN 2C
VSS
7
8
IN 1C
14
14
14093BG
AWLYWW
MC14093B
ALYWG
1
1
SOIC−14
SOEIAJ−14
14
14
093B
ALYW G
G
1
TSSOP−14
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Temperature Derating: “D/DW” Packages: –7.0 mW/_C From 65_C To 125_C
© Semiconductor Components Industries, LLC, 2014
IN 1A
MARKING DIAGRAMS
Value
DC Supply Voltage Range
TSSOP−14
DT SUFFIX
CASE 948G
PIN ASSIGNMENT
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol
SOEIAJ−14
F SUFFIX
CASE 965
1
A
WL, L
YY, Y
WW, W
G or G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Publication Order Number:
MC14093B/D
MC14093B
LOGIC DIAGRAM
1
2
3
5
6
4
8
9
10
12
13
11
VDD = PIN 14
VSS = PIN 7
EQUIVALENT CIRCUIT SCHEMATIC
(1/4 OF CIRCUIT SHOWN)
ORDERING INFORMATION
Package
Shipping†
MC14093BDG
SOIC−14
(Pb−Free)
55 Units / Rail
NLV14093BDG*
SOIC−14
(Pb−Free)
55 Units / Rail
MC14093BDR2G
SOIC−14
(Pb−Free)
2500 Units / Tape & Reel
NLV14093BDR2G*
SOIC−14
(Pb−Free)
2500 Units / Tape & Reel
MC14093BDTR2G
TSSOP−14
(Pb−Free)
2500 Units / Tape & Reel
NLV14093BDTR2G*
TSSOP−14
(Pb−Free)
2500 Units / Tape & Reel
MC14093BFELG
SOEIAJ−14
(Pb−Free)
2000 Units / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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2
MC14093B
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
−55_C
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
25_C
VDD
Vdc
Min
Max
Min
Typ
(Note 2)
125_C
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
5.0
5.0
10
15
–3.0
–0.64
–1.6
–4.2
−
−
−
−
–2.4
–0.51
–1.3
–3.4
–4.2
–0.88
–2.25
–8.8
−
−
−
−
–1.7
–0.36
–0.9
–2.4
−
−
−
−
IOL
5.0
10
15
0.64
1.6
4.2
−
−
−
0.51
1.3
3.4
0.88
2.25
8.8
−
−
−
0.36
0.9
2.4
−
−
−
mAdc
Input Current
Iin
15
−
±0.1
−
±0.00001
±0.1
−
±1.0
mAdc
Input Capacitance
(Vin = 0)
Cin
−
−
−
−
5.0
7.5
−
−
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
−
−
−
0.25
0.5
1.0
−
−
−
0.0005
0.0010
0.0015
0.25
0.5
1.0
−
−
−
7.5
15
30
mAdc
IT
5.0
10
15
Hysteresis Voltage
VH†
5.0
10
15
0.3
1.2
1.6
2.0
3.4
5.0
0.3
1.2
1.6
1.1
1.7
2.1
2.0
3.4
5.0
0.3
1.2
1.6
2.0
3.4
5.0
Threshold Voltage
Positive−Going
VT+
5.0
10
15
2.2
4.6
6.8
3.6
7.1
10.8
2.2
4.6
6.8
2.9
5.9
8.8
3.6
7.1
10.8
2.2
4.6
6.8
3.6
7.1
10.8
VT–
5.0
10
15
0.9
2.5
4.0
2.8
5.2
7.4
0.9
2.5
4.0
1.9
3.9
5.8
2.8
5.2
7.4
0.9
2.5
4.0
2.8
5.2
7.4
Vin = 0 or VDD
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
IOH
Source
Sink
Total Supply Current (Notes 3 & 4)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
Negative−Going
mAdc
IT = (1.2 mA/kHz) f + IDD
IT = (2.4 mA/kHz) f + IDD
IT = (3.6 mA/kHz) f + IDD
mAdc
Vdc
Vdc
Vdc
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25_C.
4. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in mA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.004.
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3
MC14093B
SWITCHING CHARACTERISTICS (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
VDD
Vdc
Min
Typ
(Note 5)
Max
Unit
Output Rise Time
tTLH
5.0
10
15
−
−
−
100
50
40
200
100
80
ns
Output Fall Time
tTHL
5.0
10
15
−
−
−
100
50
40
200
100
80
ns
tPLH, tPHL
5.0
10
15
−
−
−
125
50
40
250
100
80
ns
Propagation Delay Time
5. Data labeled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
VDD
20 ns
14
PULSE
GENERATOR
INPUT
OUTPUT
20 ns
VDD
90%
50%
10%
tPHL
INPUT
7
VSS
CL
tPLH
90%
50%
10%
OUTPUT
tTHL
VSS
VOH
VOL
tTLH
Figure 1. Switching Time Test Circuit and Waveforms
VH
VDD
VH
Vin
VDD
Vin
VSS
VSS
VDD
VDD
Vout
Vout
VSS
VSS
(a) Schmitt Triggers will square up
(a) inputs with slow rise and fall times.
(b) A Schmitt trigger offers maximum
(b) noise immunity in gate applications.
Figure 2. Typical Schmitt Trigger Applications
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4
MC14093B
14
14
IOH
VGS
Vout
All unused inputs
connected to ground.
-4.0
VGS
10
c
b
VGS = -5.0 Vdc
a
aTA = -55°C
bTA = +25°C
bTA = +125°C
c
-6.0
-10 Vdc
b
c
-8.0
-10
-10
7
All unused inputs
connected to ground.
IOL , DRAIN CURRENT (mAdc)
-2.0
-15 Vdc
b
a
-8.0
Vout
7
-6.0
-4.0
VDS, DRAIN VOLTAGE (Vdc)
a
b c
15 Vdc
a
8.0
VGS = 10 Vdc
b
c
6.0
aTA = -55°C
bTA = +25°C
cTA = +125°C
4.0
a
2.0
b
a
-2.0
0
0
0
Figure 3. Typical Output Source
Characteristics Test Circuit
2.0
4.0
6.0
VDS, DRAIN VOLTAGE (Vdc)
0
8.0
Figure 4. Typical Output Sink
Characteristics Test Circuit
VDD
0
5.0 Vdc
c
Vout , OUTPUT VOLTAGE (Vdc)
IOH, DRAIN CURRENT (mAdc)
0
IOL
VT-
VT+
VH
Vin, INPUT VOLTAGE (Vdc)
Figure 5. Typical Transfer Characteristics
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5
VDD
10
MC14093B
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE K
D
A
B
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
8
A3
E
H
L
1
0.25
M
DETAIL A
7
B
13X
M
b
0.25
M
C A
S
B
S
e
DETAIL A
h
A
X 45 _
M
A1
C
SEATING
PLANE
DIM
A
A1
A3
b
D
E
e
H
h
L
M
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
MC14093B
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G
ISSUE B
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
F
7
1
0.15 (0.006) T U
N
S
DETAIL E
K
A
−V−
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
J J1
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
MILLIMETERS
INCHES
MIN
MAX
MIN MAX
4.90
5.10 0.193 0.200
4.30
4.50 0.169 0.177
−−−
1.20
−−− 0.047
0.05
0.15 0.002 0.006
0.50
0.75 0.020 0.030
0.65 BSC
0.026 BSC
0.50
0.60 0.020 0.024
0.09
0.20 0.004 0.008
0.09
0.16 0.004 0.006
0.19
0.30 0.007 0.012
0.19
0.25 0.007 0.010
6.40 BSC
0.252 BSC
0_
8_
0_
8_
MC14093B
PACKAGE DIMENSIONS
SOEIAJ−14
CASE 965
ISSUE B
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
8
Q1
M_
E HE
L
7
1
DETAIL P
Z
D
VIEW P
A
e
c
A1
b
0.13 (0.005)
M
0.10 (0.004)
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
--2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
--1.42
INCHES
MIN
MAX
--0.081
0.002
0.008
0.014
0.020
0.004
0.008
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
--0.056
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MC14093B/D
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