TI1 LM2590HVSX-3.3/NOPB Simple switcher power converter Datasheet

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LM2590HV
SNVS084C – DECEMBER 2001 – REVISED JULY 2016
LM2590HV SIMPLE SWITCHER® Power Converter 150-kHz, 1-A Step-Down Voltage
Regulator
1 Features
3 Description
•
•
The LM2590HV series of regulators are monolithic
integrated circuits that provide all the active functions
for a step-down (buck) switching regulator, capable of
driving a 1-A load with excellent line and load
regulation. These devices are available in fixed output
voltages of 3.3-V, 5-V, and an adjustable output
version.
1
•
•
•
•
•
•
•
•
•
•
3.3-V, 5-V, and Adjustable Output Versions
Adjustable Version Output Voltage Range, 1.2 V
to 57 V ±4% Max Over Line and Load Conditions
Ensured 1-A Output Load Current
Available in 7-Pin TO-220 and TO-263 (SurfaceMount) Package
Input Voltage Range Up To 60 V
150-kHz Fixed Frequency Internal Oscillator
Shutdown and Soft-start
Out Of Regulation Error Flag
Error Flag Delay
Low Power Standby Mode, IQ: 90 µA (Typical)
High Efficiency
Thermal Shutdown And Current Limit Protection
This series of switching regulators is similar to the
LM2591HV with additional supervisory and control
features.
Requiring a minimum number of external
components, these regulators are simple to use and
include internal frequency compensation, improved
line and load specifications, fixed-frequency oscillator,
Shutdown/Soft-start, output error flag and flag delay.
The LM2590HV operates at a switching frequency of
150 kHz thus allowing smaller sized filter components
than what would be needed with lower frequency
switching regulators. Available in a standard 7-pin
TO-220 package with several different lead bend
options, and a 7-pin TO-263 surface-mount package.
2 Applications
•
•
•
•
Simple High-Efficiency Step-Down (Buck)
Regulators
Efficient Preregulator For Linear Regulators
On-Card Switching Regulators
Positive-To-Negative Converters
Other features include an ensured ±4% tolerance on
output voltage under all conditions of input voltage
and output load conditions, and ±15% on the
oscillator frequency. External shutdown is included,
featuring 90-µA standby current (typical). Self
protection features include a two stage current limit
for the output switch and an over temperature
shutdown for complete protection under fault
conditions.
Device Information(1)
PART NUMBER
LM2590HV
PACKAGE
BODY SIZE (NOM)
TO-220 (7)
14.99 mm × 10.16 mm
TO-263 (7)
10.10 mm × 8.89 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application (Fixed Output Voltage Versions)
+VIN
+12V
Unregulated
DC Input
Feedback
1
10 NŸ
Error Flag
Flag
6
LM2590HV ± 5.0
3
Shutdown/Soft - start
7 SD /SS
+
330 µF
CIN
CSS
0.1 µF
5 Delay
Output
2
4 Gnd
33 µH
+
D1
1N5824
+5.0V
Regulated
Output
COUT
220 µF 1A Load
CDELAY
0.1 µF
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2590HV
SNVS084C – DECEMBER 2001 – REVISED JULY 2016
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Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
5
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
5
5
5
5
6
7
7
7
9
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Electrical Characteristics – 3.3-V Version.................
Electrical Characteristics – 5-V Version....................
Electrical Characteristics – Adjustable Version.........
Typical Characteristics ..............................................
7
Parameter Measurement Information ................ 13
8
Detailed Description ............................................ 15
7.1 Test Circuits ............................................................ 13
8.1 Overview ................................................................. 15
8.2 Functional Block Diagram ....................................... 15
8.3 Feature Description................................................. 15
8.4 Device Functional Modes........................................ 18
9
Application and Implementation ........................ 19
9.1 Application Information............................................ 19
9.2 Typical Application .................................................. 21
10 Power Supply Recommendations ..................... 25
11 Layout................................................................... 25
11.1 Layout Guidelines ................................................. 25
11.2 Layout Examples................................................... 25
11.3 Thermal Considerations ........................................ 26
12 Device and Documentation Support ................. 28
12.1
12.2
12.3
12.4
12.5
12.6
Documentation Support ........................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
28
28
28
28
28
28
13 Mechanical, Packaging, and Orderable
Information ........................................................... 28
4 Revision History
Changes from Revision B (December 2001) to Revision C
•
2
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
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SNVS084C – DECEMBER 2001 – REVISED JULY 2016
5 Pin Configuration and Functions
NDZ Package
7-Pin TO-220
Top View
KTW Package
7-Pin TO-263
Top View
Not to scale
7
SD/SS
6
Feedback
5
Delay
4
Ground
3
Flag
2
Output
1
VIN
1
2
3
4
5
6
7
VIN
Output
Flag
Ground
Delay
Feedback
SD/SS
Not to scale
Pin Functions
PIN
NO.
NAME
TYPE (1)
DESCRIPTION
1
VIN
I
This is the positive input supply for the IC switching regulator. A suitable input bypass capacitor must
be present at this pin to minimize voltage transients and to supply the switching currents needed by
the regulator.
2
Output
O
Internal switch. The voltage at this pin switches between approximately (+VIN – VSAT) and
approximately –0.5 V, with a duty cycle of VOUT/VIN.
3
Flag
O
Open collector output that goes active low (≤1 V) when the output of the switching regulator is out of
regulation (less than 95% of its nominal value). In this state it can sink maximum 3 mA. When not
low, it can be pulled high to signal that the output of the regulator is in regulation (power good).
During power-up, it can be programmed to go high after a certain delay as set by the Delay pin (Pin
5). The maximum rating of this pin must not be exceeded, so if the rail to which it will be pulled-up to
is higher than 45 V, a resistive divider must be used instead of a single pull-up resistor, as indicated
in Test Circuits.
4
Ground
G
Circuit ground
O
This sets a programmable power-up delay from the moment that the output reaches regulation, to the
high signal output (power good) on Pin 3. A capacitor on this pin starts charging up by means on an
internal (3 μA) current source when the regulated output rises to within 5% of its nominal value. Pin 3
goes high (with an external pull-up) when the voltage on the capacitor on Pin 5 exceeds 1.3 V. The
voltage on this pin is clamped internally to about 1.7 V. If the regulated output drops out of regulation
(less than 95% of its nominal value), the capacitor on Pin 5 is rapidly discharged internally and Pin 3
will be forced low in about 1/1000th of the set power-up delay time.
I
Senses the regulated output voltage to complete the feedback loop. This pin is directly connected to
the Output for the fixed voltage versions, but is set to 1.23 V by means of a resistive divider from the
output for the adjustable version. If a feedforward capacitor is used (adjustable version), then a
negative voltage spike is generated on this pin whenever the output is shorted. This happens
because the feedforward capacitor cannot discharge fast enough, and since one end of it is dragged
to Ground, the other end goes momentarily negative. To prevent the energy rating of this pin from
being exceeded, a small-signal Schottky diode to Ground is recommended for DC input voltages
above 40 V whenever a feedforward capacitor is present (see Test Circuits). Feedforward capacitor
values larger than 0.1 µF are not recommended for the same reason, whatever be the DC input
voltage.
5
6
(1)
Delay
Feedback
G = Ground, I = Input, O = Output
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Pin Functions (continued)
PIN
NO.
7
4
NAME
SD/SS
TYPE (1)
DESCRIPTION
I
Shutdown/Soft-start: The regulator is in shutdown mode, drawing about 90 μA, when this pin is driven
to a low level (≤0.6 V), and is in normal operation when this Pin is left floating (internal-pullup) or
driven to a high level (≥2 V). The typical value of the threshold is 1.3 V and the pin is internally
clamped to a maximum of about 7 V. If it is driven higher than the clamp voltage, it must be ensured
by means of an external resistor that the current into the pin does not exceed 1 mA. The duty cycle is
minimum (0%) if this Pin is below 1.8 V, and increases as the voltage on the pin is increased. The
maximum duty cycle (100%) occurs when this pin is at 2.8 V or higher. So adding a capacitor to this
pin produces a soft-start feature. An internal current source will charge the capacitor from zero to its
internally clamped value. The charging current is about 5 µA when the pin is below 1.3 V but is
reduced to only 1.6 µA above 1.3 V, so as to allow the use of smaller soft-start capacitors.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
63
V
Supply voltage, VIN
SD/SS pin input voltage
(2)
Delay pin voltage (2)
6
V
1.5
V
Flag pin voltage
–0.3
45
V
Feedback pin voltage
–0.3
25
V
–1
V
Output voltage to ground, steady-state
Power dissipation
Internally limited
S package
Lead temperature
Vapor phase (60 s)
215
Infrared (10 s)
245
T package, soldering (10 s)
Maximum junction temperature
Storage temperature, Tstg
(1)
(2)
°C
260
–65
150
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Voltage internally clamped. If clamp voltage is exceeded, limit current to a maximum of 1 mA.
6.2 ESD Ratings
V(ESD)
(1)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
VALUE
UNIT
±2000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
TJ
MIN
MAX
Supply voltage
4.5
60
UNIT
V
Temperature
–40
125
°C
6.4 Thermal Information
LM2590HV
THERMAL METRIC
RθJA
RθJC
(1)
(2)
(3)
(4)
(5)
(1)
Junction-to-ambient thermal resistance
NDZ (TO-220)
KTW (TO-263)
7 PINS
7 PINS
See (2)
50
—
(3)
—
50
See (4)
—
30
See (5)
—
20
2
2
See
Junction-to-case thermal resistance
UNIT
°C/W
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Junction to ambient thermal resistance (no external heat sink) for the package mounted TO-220 package mounted vertically, with the
leads soldered to a printed-circuit board with (1 oz.) copper area of approximately 1 in2.
Junction to ambient thermal resistance with the TO-263 package tab soldered to a single sided printed-circuit board with 0.5 in2 of
(1 oz.) copper area.
Junction to ambient thermal resistance with the TO-263 package tab soldered to a single sided printed-circuit board with 2.5 in2 of
(1 oz.) copper area.
Junction to ambient thermal resistance with the TO-263 package tab soldered to a double sided printed circuit board with 3 in 2 of
(1 oz.) copper area on the LM2590HVS side of the board, and approximately 16 in2 of copper on the other side of the PCB. See
Application Information in this data sheet.
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6.5 Electrical Characteristics
TJ = 25°C, VIN = 12 V for the 3.3-V, 5-V, and adjustable version, and ILOAD = 500 mA (unless otherwise noted)
PARAMETER
Ib
Feedback bias current
fO
Oscillator frequency (3)
VSAT
Saturation voltage
Max duty cycle (ON)
DC
MIN (1) TYP (2)
TEST CONDITIONS
Adjustable version only,
VFB = 1.3 V
TJ = 25°C
10
TJ = –40°C to 125°C
TJ = 25°C
127
TJ = –40°C to 125°C
110
IOUT = 1 A (4) (5)
1.2
(5)
150
173
173
0.95
1.3
UNIT
nA
kHz
V
100%
0%
ICLIM
Switch current limit
Peak current (4) (5)
IL
Output leakage current
VIN = 60 V (4) (6)
IQ
Operating quiescent current
SD/SS pin open (6)
Standby quiescent current
50
100
Min duty cycle (OFF) (6)
ISTBY
MAX (1)
SD/SS pin = 0 V,
VIN = 60 V
TJ = 25°C
1.3
TJ = –40°C to 125°C
1.2
1.9
3
Output = 0 V
Output = −1 V
TJ = 25°C
2.8
A
50
µA
5
30
mA
5
10
mA
90
200
TJ = –40°C to 125°C
250
µA
SHUTDOWN AND SOFT-START CONTROL (see Test Circuits)
TJ = 25°C
VSD
Shutdown threshold voltage
TJ = –40°C to 125°C
1.3
Low (shutdown mode)
High (soft-start mode)
0.6
2
VOUT = 20% of nominal output voltage
2
VOUT = 100% of nominal output voltage
3
VSS
Soft-start voltage
ISD
Shutdown current
VSHUTDOWN = 0.5 V
ISS
Soft-start current
VSoft-start = 2.5 V
V
V
5
10
µA
1.5
5
µA
92%
96%
98%
0.7
0.3
1
FLAG AND DELAY CONTROL (see Test Circuits)
Regulator dropout detector threshold
voltage
Low (flag ON)
VFSAT
Flag output saturation and voltage
ISINK = 3 mA
IFL
Flag output leakage current
VFLAG = 60 V
Delay pin threshold voltage
Delay pin source current
Delay pin saturation
(1)
(2)
(3)
(4)
(5)
(6)
6
0.3
Low (flag ON)
1.21
High (flag OFF) and VOUT regulated
VDELAY = 0.5 V
Low (flag ON)
1.25
1.25
TJ = 25°C
TJ = –40°C to 125°C
V
µA
1.29
3
6
70
350
400
mV
mV
mV
All limits specified at room temperature and at temperature extremes. All room temperature limits are 100% production tested. All limits
at temperature extremes are specified via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to
calculate Average Outgoing Quality Level (AOQL).
Typical numbers are at 25°C and represent the most likely norm.
The switching frequency is reduced when the second stage current limit is activated. The amount of reduction is determined by the
severity of current overload.
No diode, inductor or capacitor connected to output pin.
Feedback pin removed from output and connected to 0 V to force the output transistor switch ON.
Feedback pin removed from output and connected to 12 V for the 3.3-V, 5-V, and the ADJ version to force the output transistor switch
OFF.
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6.6 Electrical Characteristics – 3.3-V Version
TJ = 25°C (unless otherwise noted) (1)
PARAMETER
VOUT
Output voltage
4.5 V ≤ VIN ≤ 60 V, 0.2 A ≤ ILOAD ≤ 1 A
η
Efficiency
VIN = 12 V, ILOAD = 1 A
(1)
(2)
(3)
MIN (2) TYP (3)
TEST CONDITIONS
TJ = 25°C
3.168
TJ = –40°C to 125°C
3.135
MAX (2)
3.3
3.432
3.465
UNIT
V
77%
External components such as the catch diode, inductor, input and output capacitors can affect switching regulator system performance.
When the LM2590HV is used as shown in Test Circuits, system performance will be as shown in system parameters section of
Electrical Characteristics.
All limits specified at room temperature and at temperature extremes. All room temperature limits are 100% production tested. All limits
at temperature extremes are specified via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to
calculate Average Outgoing Quality Level (AOQL).
Typical numbers are at 25°C and represent the most likely norm.
6.7 Electrical Characteristics – 5-V Version
TJ = 25°C (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
VOUT
Output voltage
7 V ≤ VIN ≤ 60 V, 0.2 A ≤ ILOAD ≤ 1 A
η
Efficiency
VIN = 12 V, ILOAD = 1 A
(1)
(2)
(3)
TJ = 25°C
TJ = –40°C to 125°C
MIN (2)
TYP (3)
4.8
5
4.75
MAX (2)
5.2
5.25
UNIT
V
82%
External components such as the catch diode, inductor, input and output capacitors can affect switching regulator system performance.
When the LM2590HV is used as shown in Test Circuits, system performance will be as shown in system parameters section of
Electrical Characteristics.
All limits specified at room temperature and at temperature extremes. All room temperature limits are 100% production tested. All limits
at temperature extremes are specified via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to
calculate Average Outgoing Quality Level (AOQL).
Typical numbers are at 25°C and represent the most likely norm.
6.8 Electrical Characteristics – Adjustable Version
TJ = 25°C (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
VFB
Feedback voltage
4.5 V ≤ VIN ≤ 60 V, 0.2 A ≤ ILOAD ≤ 1 A,
VOUT programmed for 3 V
(see Test Circuits)
η
Efficiency
VIN = 12 V, VOUT = 3 V, ILOAD = 1 A
(1)
(2)
(3)
TJ = 25°C
TJ = –40°C to 125°C
MIN (2)
TYP (3)
MAX (2)
1.193
1.23
1.267
1.18
1.28
UNIT
V
76%
External components such as the catch diode, inductor, input and output capacitors can affect switching regulator system performance.
When the LM2590HV is used as shown in Test Circuits, system performance will be as shown in system parameters section of
Electrical Characteristics.
All limits specified at room temperature and at temperature extremes. All room temperature limits are 100% production tested. All limits
at temperature extremes are specified via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to
calculate Average Outgoing Quality Level (AOQL).
Typical numbers are at 25°C and represent the most likely norm.
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Figure 1. Timing Diagram for 5-V Output
8
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6.9 Typical Characteristics
Figure 2. Normalized Output Voltage
Figure 3. Line Regulation
Figure 4. Efficiency
Figure 5. Switch Saturation Voltage
Figure 6. Switch Current Limit
Figure 7. Dropout Voltage
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Typical Characteristics (continued)
10
Figure 8. Operating Quiescent Current
Figure 9. Shutdown Quiescent Current
Figure 10. Minimum Operating Supply Voltage
Figure 11. Feedback Pin Bias Current
Figure 12. Flag Saturation Voltage
Figure 13. Switching Frequency
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Typical Characteristics (continued)
Figure 14. Soft-Start
Figure 15. Shutdown/Soft-Start Current
Figure 16. Delay Pin Current
Figure 17. Soft-Start Response
Figure 18. Shutdown/Soft-start Threshold Voltage
Figure 19. Internal Gain-Phase Characteristics
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Typical Characteristics (continued)
Horizontal Time Base: 2 µs/div.
VIN = 20 V, VOUT = 5 V, ILOAD = 1 A,
L = 52 µH, COUT = 100 µF, COUT ESR = 100 mΩ
Output Pin Voltage, 10 V/div.
Inductor Current, 0.5 A/div.
Output Ripple Voltage, 50 mV/div.
Figure 20. Continuous Mode Switching Waveforms
Horizontal Time Base: 50 µs/div.
VIN = 20 V, VOUT = 5 V, ILOAD = 250 mA,
L = 52 µH, COUT = 100 µF, COUT ESR = 100 mΩ
Output Voltage, 100 mV/div. (AC)
250-mA to 1-A Load Pulse
Figure 22. Load Transient Response
for Continuous Mode
12
Horizontal Time Base: 2 µs/div.
VIN = 20 V, VOUT = 5 V, ILOAD = 250 mA,
L = 52 µH, COUT = 150 µF, COUT ESR = 100 mΩ
Output Pin Voltage, 10 V/div.
Inductor Current, 0.25 A/div.
Output Ripple Voltage, 100 mV/div.
Figure 21. Discontinuous Mode Switching Waveforms
Horizontal Time Base: 200 µs/div.
VIN = 20 V, VOUT = 5 V, ILOAD = 250 mA to 1 A,
L = 15 µH, COUT = 150 µF, COUT ESR = 90 mΩ
Output Voltage, 100 mV/div. (AC)
250-mA to 1-A Load Pulse
Figure 23. Load Transient Response
for Discontinuous Mode
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7 Parameter Measurement Information
7.1 Test Circuits
Rpull up
ERROR OUTPUT
FEEDBACK
FLAG
+VIN
LM2590HV
FIXED OUTPUT
(VOUT)
REGULATED OUTPUT
OUTPUT
L1
UNREGULATED
DC INPUT
GND
+
SD/SS DELAY
CIN
CSS
CDELAY
+
COUT
D1
L
O
A
D
3 µH
L
O
180 µF A
D
+
LOW ESR
SHORT LEADS
SHUTDOWN INPUT
OPTIONAL POST RIPPLE
FILTER
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Component Values shown are for VIN = 15 V,
VOUT = 5 V, ILOAD = 1 A.
CIN — 470-µF, 50-V aluminum electrolytic Nichicon PM Series
COUT — 220-µF, 25-V aluminum electrolytic Nichcon PM Series
D1 — 2-A, 60-V Schottky Rectifier, 21DQ06 (international rectifier)
L1 — 68 µH, see Inductor Selection Procedure
Figure 24. Fixed Output Voltage Versions
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Test Circuits (continued)
FEEDFORWARD CAPACITOR
CFF
TO REGULATED
OUTPUT VOLTAGE
R1
R2
1 NŸ
Rpull up
FEEDBACK
ERROR OUTPUT
(VOUT)
REGULATED OUTPUT
FLAG
+VIN
LM2590HV
ADJUSTABLE
OUTPUT
L1
+
UNREGULATED
DC INPUT
GND
SD/SS DELAY
CIN
CSS
CDELAY
D1
+
COUT L
O
A
D
SHUTDOWN INPUT
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Select R1 to be approximately 1 kΩ, use a 1% resistor for best stability.
Component values shown are for VIN = 20 V,
VOUT = 10 V, ILOAD = 1 A.
CIN — 470-µF, 35-V aluminum electrolytic Nichicon PM Series
COUT — 220-µF, 35-V aluminum electrolytic Nichicon PM Series
D1 — 2-A, 60-V Schottky Rectifier, 21DQ06 (international rectifier)
L1 — 100 µH, see Inductor Selection Procedure
R1 — 1 kΩ, 1%
R2 — 7.15 k, 1%
CFF — 3.3 nF
Typical Values
CSS — 0.1 µF
CDELAY — 0.1 µF
RPULL UP — 4.7 k (use 22 k if VOUT is ≥ 45 V)
† Resistive divider is required to avoid exceeding maximum rating of 45 V, 3 mA on or into flag pin.
†† Small signal Schottky diode to prevent damage to feedback pin by negative spike when output is shorted.
Required if VIN > 40 V
Figure 25. Adjustable Output Voltage Versions
14
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8 Detailed Description
8.1 Overview
The LM2590HV SIMPLE SWITCHER® regulator is an easy to use non-synchronous step-down DC-DC converter
with a wide input voltage range up to 60 V. It is capable of delivering up to 1-A DC load current with excellent line
and load regulation. These devices are available in fixed output voltages of 3.3-V, 5-V, 12-V and an adjustable
output version. The family requires few external components and the pin arrangement was designed for simple,
optimum PCB layout.
8.2 Functional Block Diagram
(7)
(3)
ERROR SHUTDOWN /
FLAG SOFT-START
(5)
DELAY
220 mV
220 mV
+
CURRENT
1.235V
SOURCE
REFERENCE
BIAS
START
UP
2.5V
REGULATOR
Soft-start
VIN (1)
+
+
COMP.
±
FLAG &
DELAY
2.5V
CURRENT
LIMIT
±
COMP.
(6) FEEDBACK
GM
+
+ AMP
±
R2
ACTIVE
CPACITOR
R1= 2.5 NŸ
±
COMP.
LATCH
+
FREQ. SHIFT
+
OP AMP
±
3.3V, R2 = 4.2 NŸ
5V, R2 = 7.6 NŸ
12V, R2 = 21.8 NŸ
ADJ, R2 = 0 Ÿ
R1 = OPEN
3A
SWITCH
+
150 kHz
OSC.
DRIVER
RESET
THERMAL
LIMIT
EMITTER
OUTPUT (2)
GND (4)
+
COMP.
VREF X 0.95
±
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8.3 Feature Description
8.3.1 Undervoltage Lockout
Some applications require the regulator to remain off until the input voltage reaches a predetermined voltage.
Figure 26 contains a undervoltage lockout circuit for a buck configuration, while Figure 27 and Figure 28 are for
the inverting types (only the circuitry pertaining to the undervoltage lockout is shown). Figure 26 uses a Zener
diode to establish the threshold voltage when the switcher begins operating. When the input voltage is less than
the Zener voltage, resistors R1 and R2 hold the SHUTDOWN/SOFT-START pin low, keeping the regulator in the
shutdown mode. As the input voltage exceeds the Zener voltage, the Zener conducts, pulling the
SHUTDOWN/SOFT-START pin high, allowing the regulator to begin switching. The threshold voltage for the
undervoltage lockout feature is approximately 1.5 V greater than the Zener voltage.
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Feature Description (continued)
VIN
+VIN
24V
LM2590HV
± 5.0
1
Z1
12V
R2
47 kŸ
CIN
470 µF
7
SD /SS
4
GND
+
R1
20 kŸ
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Figure 26. Undervoltage Lockout for a Buck Regulator
Figure 27 and Figure 28 apply the same feature to an inverting circuit. Figure 27 features a constant threshold
voltage for turn on and turn off (Zener voltage plus approximately 1 V). If hysteresis is needed, the circuit in
Figure 28 has a turn ON voltage which is different than the turn OFF voltage. The amount of hysteresis is
approximately equal to the value of the output voltage. Since the SD/SS pin has an internal 7-V Zener clamp, R2
is needed to limit the current into this pin to approximately 1 mA when Q1 is on.
+VIN
24V
D1
VIN
1
R1
10 NŸ
CIN
470 µF
+
7 SD/SS
Q1
R3
10 NŸ
R2
33 NŸ
Z1
12V
LM2590HV
±5.0
4 GND
R4
20 NŸ
Q1 - 2N3906
±VOUT
±5V
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Figure 27. Undervoltage Lockout Without Hysteresis for an Inverting Regulator
D1
VIN
+VIN
24V
Z1
12V
CIN
470 µF
LM2590HV
± 5.0
1
R2
47 NŸ
7
SD/SS
4 GND
+
R1
20 NŸ
± VOUT
±5V
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Figure 28. Undervoltage Lockout With Hysteresis for an Inverting Regulator
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Feature Description (continued)
8.3.2 SHUTDOWN/SOFT-START
This reduction in start up current is useful in situations where the input power source is limited in the amount of
current it can deliver. In some applications Soft-start can be used to replace undervoltage lockout or delayed
startup functions.
If a very slow output voltage ramp is desired, the Soft-start capacitor can be made much larger. Many seconds or
even minutes are possible.
If only the shutdown feature is needed, the Soft-start capacitor can be eliminated.
Figure 29. Typical Circuit Using SHUTDOWN/SOFT-START and Error Flag Features
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Feature Description (continued)
Figure 30. Soft-Start, Delay, Error Output
8.4 Device Functional Modes
8.4.1 Shutdown Mode
The SD/SS pin provides electrical ON and OFF control for the LM2590HV. When the voltage of this pin is less
than 0.6 V, the device is in shutdown mode. The typical standby current in this mode is 90 µA.
8.4.2 Active Mode
When the SD/SS pin is left floating or pull above 2 V, the device will start switching and the output voltage will
rise until it reaches a normal regulation voltage.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 Feedforward Capacitor, CFF
(Adjustable output voltage version only)
A feedforward capacitor shown across R2 in Test Circuits is used when the output voltage is greater than 10 V or
when COUT has a very low ESR. This capacitor adds lead compensation to the feedback loop and increases the
phase margin for better loop stability.
If the output voltage ripple is large (>5% of the nominal output voltage), this ripple can be coupled to the
feedback pin through the feedforward capacitor and cause the error comparator to trigger the error flag. In this
situation, adding a resistor, RFF, in series with the feedforward capacitor, approximately 3 times R1, will attenuate
the ripple voltage at the feedback pin.
9.1.2 Input Capacitor, CIN
A low-ESR aluminum or tantalum bypass capacitor is needed between the input pin and ground pin. It must be
located near the regulator using short leads. This capacitor prevents large voltage transients from appearing at
the input, and provides the instantaneous current needed each time the switch turns on.
The important parameters for the input capacitor are the voltage rating and the RMS current rating. Because of
the relatively high RMS currents flowing in the input capacitor of the buck regulator, this capacitor must be
chosen for its RMS current rating rather than its capacitance or voltage ratings, although the capacitance value
and voltage rating are directly related to the RMS current rating. The voltage rating of the capacitor and its RMS
ripple current capability must never be exceeded.
9.1.3 Output Capacitor, COUT
An output capacitor is required to filter the output and provide regulator loop stability. Low-impedance or low-ESR
Electrolytic or solid tantalum capacitors designed for switching regulator applications must be used. When
selecting an output capacitor, the important capacitor parameters are; the 100-kHz equivalent series resistance
(ESR), the RMS ripple current rating, voltage rating, and capacitance value. For the output capacitor, the ESR
value is the most important parameter. The ESR must generally not be less than 100 mW or there will be loop
instability. If the ESR is too large, efficiency and output voltage ripple are effected. So ESR must be chosen
carefully.
9.1.4 Catch Diode
Buck regulators require a diode to provide a return path for the inductor current when the switch turns off. This
must be a fast diode and must be located close to the LM2590HV using short leads and short printed circuit
traces.
Because of their very fast switching speed and low forward voltage drop, Schottky diodes provide the best
performance, especially in low output voltage applications (5 V and lower). Ultra-fast recovery, or high-efficiency
rectifiers are also a good choice, but some types with an abrupt turnoff characteristic may cause instability or
EMI problems. Ultra-fast recovery diodes typically have reverse recovery times of 50 ns or less. The diode must
be chosen for its average or RMS current rating and maximum voltage rating. The voltage rating of the diode
must be greater than the DC input voltage (not the output voltage).
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Application Information (continued)
9.1.5 Inverting Regulator
The circuit in Figure 31 converts a positive input voltage to a negative output voltage with a common ground. The
circuit operates by bootstrapping the regulator’s ground pin to the negative output voltage, then grounding the
feedback pin, the regulator senses the inverted output voltage and regulates it.
This example uses the LM2590HV 5-V to generate a −5-V output, but other output voltages are possible by
selecting other output voltage versions, including the adjustable version. Since this regulator topology can
produce an output voltage that is either greater than or less than the input voltage, the maximum output current
greatly depends on both the input and output voltage.
To determine how much load current is possible before the internal device current limit is reached (and power
limiting occurs), the system must be evaluated as a buck-boost configuration rather than as a buck. The peak
switch current in Amperes, for such a configuration is given in Equation 1.
where
•
•
L is in µH
f is in Hz
(1)
The maximum possible load current, ILOAD, is limited by the requirement that IPEAK ≤ ICLIM. While checking for this,
take ICLIM to be the lowest possible current limit value (minimum across tolerance and temperature is 2.3 A for
the LM2590HV). Also to account for inductor tolerances, we must take the minimum value of Inductance for L in
the equation above (typically 20% less than the nominal value). Further, the above equation disregards the drop
across the Switch and the diode. This is equivalent to assuming 100% efficiency, which is never so. Therefore
expect IPEAK to be an additional 10% to 20% higher than calculated from the above equation. Refer to AN-1197
Selecting Inductors for Buck Converters (SNVA038) for examples based on positive to negative configuration.
The maximum voltage appearing across the regulator is the absolute sum of the input and output voltage, and
this must be limited to a maximum of 60 V. In this example, when converting 20 V to −5 V, the regulator would
see 25 V between the input pin and ground pin. The LM2590HV has a maximum input voltage rating of 60 V. An
additional diode is required in this regulator configuration. Diode D1 is used to isolate input voltage ripple or
noise from coupling through the CIN capacitor to the output, under light or no load conditions. Also, this diode
isolation changes the topology to closely resemble a buck configuration thus providing good closed loop stability.
A Schottky diode is recommended for low input voltages, (because of its lower voltage drop) but for higher input
voltages, a IN5400 diode could be used. Because of differences in the operation of the inverting regulator, the
standard design procedure is not used to select the inductor value. In the majority of designs, a 33-µH, 4-A
inductor is the best choice. Capacitor selection can also be narrowed down to just a few values. This type of
inverting regulator can require relatively large amounts of input current when starting up, even with light loads.
Input currents as high as the LM2590HV current limit (approximately 4 A) are needed for 2 ms or more, until the
output reaches its nominal output voltage. The actual time depends on the output voltage and the size of the
output capacitor. Input power sources that are current limited or sources that can not deliver these currents
without getting loaded down, may not work correctly. Because of the relatively high startup currents required by
the inverting topology, the soft-start feature shown in Figure 31 is recommended. Also shown in Figure 31 are
several shutdown methods for the inverting configuration. With the inverting configuration, some level shifting is
required, because the ground pin of the regulator is no longer at ground, but is now at the negative output
voltage. The shutdown methods shown accept ground referenced shutdown signals.
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Application Information (continued)
Figure 31. Inverting, –5-V Regulator With Shutdown and Soft-Start
9.2 Typical Application
+VIN
+12V
Unregulated
DC Input
Feedback
1
10 NŸ
Error Flag
6
LM2590HV ± 5.0
Flag
3
Shutdown/Soft - start
7 SD /SS
+
CIN
330 µF
5 Delay
CSS
0.1 µF
33 µH
Output
2
4 Gnd
+
D1
1N5824
+5.0V
Regulated
Output
COUT
220 µF 1A Load
CDELAY
0.1 µF
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Figure 32. LM2590HV 5-V Example Application
9.2.1 Design Requirements
Table 1 lists the example values for this typical application.
Table 1. Design Parameters
PARAMETER
VALUE
Regulated output voltage (3.3 V, 5 V, or adjustable), VOUT
5V
Maximum input voltage, VIN(max)
24 V
Maximum load current, ILOAD(max)
1A
Switching frequency, F
Fixed at a nominal 150 kHz
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9.2.2 Detailed Design Procedure
9.2.2.1 Inductor Selection Procedure
For a quick-start, refer to the nomographs provided in Figure 33 to Figure 35. To widen the choices to a more
general selection of available inductors, the nomographs provide the required inductance and also the energy in
the core expressed in microjoules (µJ), as an alternative to just prescribing custom parts. The following points
need to be highlighted:
1. The energy values shown on the nomographs apply to steady operation at the corresponding x-coordinate
(rated maximum load current). However under start-up, without soft-start, or a short-circuit on the output, the
current in the inductor will momentarily/repetitively hit the current limit ICLIM of the device, and this current
could be much higher than the rated load, ILOAD. This represents an overload situation, and can cause the
Inductor to saturate (if it has been designed only to handle the energy of steady operation). However most
types of core structures used for such applications have a large inherent air gap (for example powdered iron
types or ferrite rod inductors), and so the inductance does not fall off too sharply under an overload. The
device is usually able to protect itself by not allowing the current to ever exceed ICLIM. But if the DC input
voltage to the regulator is over 40 V, the current can slew up so fast under core saturation, that the device
may not be able to act fast enough to restrict the current. The current can then rise without limit till
destruction of the device takes place. Therefore to ensure reliability, TI recommends that if the DC input
voltage exceeds 40 V the inductor must always be sized to handle an instantaneous current equal to ICLIM
without saturating, irrespective of the type of core structure or material.
2. Use Equation 2 to calculate the energy under steady operation.
where
•
•
L is in µH
IPEAK is the peak of the inductor current waveform with the regulator delivering ILOAD
(2)
These are the energy values shown in the nomographs. See Example 1.
3. The energy under overload is Equation 3.
(3)
If VIN > 40 V, the inductor must be sized to handle eCLIM instead of the steady energy values. The worst case
ICLIM for the LM2590HV is 3 A. The energy rating depends on the inductance. See Example 2.
4. The nomographs were generated by allowing a greater amount of percentage current ripple in the Inductor
as the maximum rated load decreases (see Figure 36). This was done to permit the use of smaller inductors
at light loads. However, Figure 36 shows only the median value of the current ripple. In reality there may be
a great spread around this because the nomographs approximate the exact calculated inductance to
standard available values. Refer to AN-1197 Selecting Inductors for Buck Converters (SNVA038) for detailed
calculations if a certain maximum inductor current ripple is required for various possible reasons. Also
consider the rather wide tolerance on the nominal inductance of commercial inductors.
5. Figure 35 shows the inductor selection curves for the Adjustable version. The y-axis is Et, in Vµsecs. It is the
applied volts across the inductor during the ON time of the switch (VIN-VSAT-VOUT) multiplied by the time for
which the switch is on in µsecs. See Example 3.
9.2.2.1.1 Example 1: VIN ≤ 40 V, 5-V Version, VIN = 24 V, Output = 5 V at 1 A
1. A first pass inductor selection is based upon Inductance and rated max load current. We choose an inductor
with the Inductance value indicated by the nomograph (see Figure 34) and a current rating equal to the
maximum load current. We therefore quick-select a 68-μH, 1-A inductor (designed for 150 kHz operation) for
this application
2. We must confirm that it is rated to handle 50 µJ (see Figure 34) by either estimating the peak current or by a
detailed calculation as shown in AN-1197 Selecting Inductors for Buck Converters (SNVA038), and also that
the losses are acceptable.
9.2.2.1.2 Example 2: VIN > 40 V, 5-V Version, VIN = 48 V, Output = 5 V at 1.5 A
1. A first pass inductor selection is based upon Inductance and the switch current limit. We choose an inductor
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with the Inductance value indicated by the nomograph (see Figure 34) and a current rating equal to ICLIM. We
therefore quick-select a 68-µH, 4-A inductor (designed for 150 kHz operation) for this application.
2. We must confirm that it is rated to handle eCLIM by the procedure shown in AN-1197 Selecting Inductors for
Buck Converters (SNVA038) and that the losses are acceptable. Here eCLIM is Equation 4.
(4)
9.2.2.1.3 Example 3: VIN ≤ 40 V, Adjustable Version, VIN = 20 V, Output = 10 V at 2 A
1. Since input voltage is less than 40 V, a first pass inductor selection is based upon Inductance and rated max
load current. We choose an inductor with the Inductance value indicated by the nomograph Figure 35 and a
current rating equal to the maximum load. But we first need to calculate Et for the given application. The
Duty cycle is Equation 5.
where
•
•
VD is the drop across the catch diode (0.5 V for a Schottky)
VSAT the drop across the switch (1.5 V)
(5)
So this yields Equation 6.
(6)
2. The switch ON time is calculated with Equation 7.
where
•
f is the switching frequency in Hz
(7)
So this yields Equation 8.
(8)
3. Therefore, looking at Figure 33, quick-select a 47-μH, 2-A inductor (designed for 150 kHz operation) for this
application.
4. Confirm that it is rated to handle 200 µJ (see Figure 35) by the procedure shown in AN-1197 Selecting
Inductors for Buck Converters (SNVA038) and that the losses are acceptable. (If the DC Input voltage had
been greater than 40 V we would need to consider eCLIM as in Example 2). This completes the simplified
inductor selection procedure. For more general applications and better optimization, refer to AN-1197
Selecting Inductors for Buck Converters (SNVA038).
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9.2.3 Application Curves
For continuous mode operation
24
Figure 33. LM2590HV 3.3-V
Figure 34. LM2590HV 5-V
Figure 35. LM2590HV Adjustable Voltage
Figure 36. Current Ripple Ratio
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10 Power Supply Recommendations
The LM2590HV is designed to operate from an input voltage supply up to 60 V. This input supply must be well
regulated and able to withstand maximum input current and maintain a stable voltage.
11 Layout
11.1 Layout Guidelines
As in any switching regulator, layout is very important. Rapidly switching currents associated with wiring
inductance can generate voltage transients which can cause problems. For minimal inductance and ground
loops, with reference to Test Circuits, the wires indicated by heavy lines must be wide printed circuit traces and
must be kept as short as possible. For best results, external components must be located as close to the
switcher lC as possible using ground plane construction or single point grounding.
If open-core inductors are used, special care must be taken as to the location and positioning of this type of
inductor. Allowing the inductor flux to intersect sensitive feedback, lC groundpath and COUT wiring can cause
problems.
When using the adjustable version, take special care as to the location of the feedback resistors and the
associated wiring. Physically locate both resistors near the IC, and route the wiring away from the inductor,
especially an open-core type of inductor.
11.2 Layout Examples
CIN = 470-µF, 50-V aluminum electrolytic Panasonic HFQ Series
COUT = 330-µF, 35-V aluminum electrolytic Panasonic HFQ Series
D1 = 5-A, 40-V Schottky rectifier, 1N5825
L1 = 47-µH, L39 Renco through-hole
RPULL UP = 10k
CDELAY = 0.1 µF
CSD/SS = 0.1 µF
Thermalloy heat sink #7020
Figure 37. Typical Through-Hole PCB Layout, Fixed Output (1x Size), Double-Sided
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Layout Examples (continued)
CIN = 470-µF, 50-V aluminum electrolytic Panasonic HFQ Series
COUT = 220-µF, 35-V aluminum electrolytic Panasonic HFQ Series
D1 = 5-A, 40-V Schottky Rectifier, 1N5825
L1 = 47-µH, L39 Renco, through-hole
R1 = 1 kΩ, 1%
R2 = Use formula in Detailed Design Procedure
CFF = See Feedforward Capacitor, CFF
RFF = See Feedforward Capacitor, CFF
RPULL UP = 10k
CDELAY = 0.1 µF
CSD/SS= 0.1 µF
Thermalloy heat sink #7020
Figure 38. Typical Through-Hole PCB Layout, Adjustable Output (1x Size), Double-Sided
11.3 Thermal Considerations
The LM2590HV is available in two packages, a 5-pin TO-220 (T) and a 5-pin surface-mount TO-263 (S). The
TO-220 package needs a heat sink under most conditions. The size of the heatsink depends on the input
voltage, the output voltage, the load current and the ambient temperature. Higher ambient temperatures require
more heat sinking. The TO-263 surface-mount package tab is designed to be soldered to the copper on a printed
circuit board. The copper and the board are the heat sink for this package and the other heat producing
components, such as the catch diode and inductor. The PCB copper area that the package is soldered to must
be at least 0.4 in2, and ideally must have 2 or more square inches of 2 oz. (0.0028) in. copper. Additional copper
area improves the thermal characteristics, but with copper areas greater than approximately 6 in2, only small
improvements in heat dissipation are realized. If further thermal improvements are needed, double-sided,
multilayer PC board with large copper areas or airflow are recommended. The curves shown in Figure 39 show
the LM2590HV (TO-263 package) junction temperature rise above ambient temperature with a 2-A load for
various input and output voltages. This data was taken with the circuit operating as a buck switching regulator
with all components mounted on a PCB to simulate the junction temperature under actual operating conditions.
This curve can be used for a quick check for the approximate junction temperature for various conditions, but be
aware that there are many factors that can affect the junction temperature. When load currents higher than 2 A
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Thermal Considerations (continued)
are used, double-sided or multilayer boards with large copper areas or airflow might be needed, especially for
high ambient temperatures and high output voltages. For the best thermal performance, wide copper traces and
generous amounts of printed circuit board copper must be used in the board layout. One exception to this is the
output (switch) pin, which must not have large areas of copper. Large areas of copper provide the best transfer
of heat (lower thermal resistance) to the surrounding air, and moving air lowers the thermal resistance even
further. Package thermal resistance and junction temperature rise numbers are all approximate, and there are
many factors that will affect these numbers. Some of these factors include board size, shape, thickness, position,
location, and even board temperature. Other factors are, trace width, total printed circuit copper area, copper
thickness, single- or double-sided, multilayer board and the amount of solder on the board. The effectiveness of
the PCB to dissipate heat also depends on the size, quantity and spacing of other components on the board, as
well as whether the surrounding air is still or moving. Furthermore, some of these components such as the catch
diode will add heat to the PCB and the heat can vary as the input voltage changes. For the inductor, depending
on the physical size, type of core material and the DC resistance, it could either act as a heat sink taking heat
away from the board, or it could add heat to the board.
Figure 39. Junction Temperature Rise, TO-263
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
AN-1197 Selecting Inductors for Buck Converters (SNVA038)
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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27-Jan-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM2590HVS-3.3/NOPB
ACTIVE
DDPAK/
TO-263
KTW
7
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM2590HVS
-3.3 P+
LM2590HVS-5.0/NOPB
ACTIVE
DDPAK/
TO-263
KTW
7
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM2590HVS
-5.0 P+
LM2590HVS-ADJ
NRND
DDPAK/
TO-263
KTW
7
TBD
Call TI
Call TI
-40 to 125
LM2590HVS
-ADJ P+
LM2590HVS-ADJ/NOPB
ACTIVE
DDPAK/
TO-263
KTW
7
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM2590HVS
-ADJ P+
LM2590HVSX-3.3/NOPB
ACTIVE
DDPAK/
TO-263
KTW
7
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM2590HVS
-3.3 P+
LM2590HVSX-5.0/NOPB
ACTIVE
DDPAK/
TO-263
KTW
7
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM2590HVS
-5.0 P+
LM2590HVSX-ADJ/NOPB
ACTIVE
DDPAK/
TO-263
KTW
7
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM2590HVS
-ADJ P+
LM2590HVT-5.0/NOPB
ACTIVE
TO-220
NDZ
7
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM2590HVT
-5.0 P+
LM2590HVT-ADJ/NOPB
ACTIVE
TO-220
NDZ
7
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM2590HVT
-ADJ P+
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
27-Jan-2016
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Jan-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM2590HVSX-3.3/NOPB DDPAK/
TO-263
KTW
7
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LM2590HVSX-5.0/NOPB DDPAK/
TO-263
KTW
7
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LM2590HVSX-ADJ/NOPB DDPAK/
TO-263
KTW
7
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Jan-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM2590HVSX-3.3/NOPB
DDPAK/TO-263
KTW
7
500
367.0
367.0
45.0
LM2590HVSX-5.0/NOPB
DDPAK/TO-263
KTW
7
500
367.0
367.0
45.0
LM2590HVSX-ADJ/NOPB
DDPAK/TO-263
KTW
7
500
367.0
367.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
NDZ0007B
TA07B (Rev E)
www.ti.com
MECHANICAL DATA
KTW0007B
TS7B (Rev E)
BOTTOM SIDE OF PACKAGE
www.ti.com
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