TI ECJ-1VC1H100D The following sections describe the function of individual circuits. Datasheet

ADS528x EVM User's Guide
User's Guide
January 2008
SLAU205
2
SLAU205 – January 2008
Submit Documentation Feedback
Contents
1
2
3
4
Overview .................................................................................................................... 5
1.1
Purpose............................................................................................................ 5
1.2
EVM Basic Functions ............................................................................................ 6
1.3
ADS528x EVM Quick Start Procedure ........................................................................ 7
Circuit Description ...................................................................................................... 8
2.1
Schematic Diagram .............................................................................................. 8
2.2
Circuit Function ................................................................................................... 8
TI ADC SPI Control Interface ....................................................................................... 10
3.1
Installing the ADC SPI Control Software .................................................................... 10
3.2
Using the TI ADC SPI Interface Software ................................................................... 10
ADC Evaluation ......................................................................................................... 13
............................................................................................ 13
4.2
Coherent Input Frequency Selection ......................................................................... 14
Errata ....................................................................................................................... 15
5.1
Silkscreen Errata ............................................................................................... 15
Physical Description .................................................................................................. 16
6.1
PCB Layout ...................................................................................................... 16
6.2
Bill of Materials .................................................................................................. 20
6.3
PCB Schematics ................................................................................................ 23
4.1
5
6
Hardware Selection
Important Notices ............................................................................................................... 28
SLAU205 – January 2008
Submit Documentation Feedback
Table of Contents
3
List of Figures
1
2
3
4
5
6
7
8
9
10
11
ADS5281 EVM ............................................................................................................... 6
TI ADC SPC Interface Screen ........................................................................................... 10
Top Silkscreen .............................................................................................................. 16
Ground Plane ............................................................................................................... 17
Power Plane ................................................................................................................ 18
Bottom Silkscreen .......................................................................................................... 19
EVM Schematics (Sheet 1 of 5) .......................................................................................... 23
EVM Schematics (Sheet 2 of 5) .......................................................................................... 24
EVM Schematics (Sheet 3 of 5) .......................................................................................... 25
EVM Schematics (Sheet 4 of 5) .......................................................................................... 26
EVM Schematics (Sheet 5 of 5) .......................................................................................... 27
List of Tables
1
2
3
4
4
Three-Pin Jumper List ....................................................................................................... 7
EVM Power-Supply Options ................................................................................................ 8
ADS528X Frequently Used Registers ................................................................................... 12
Bill of Materials ............................................................................................................. 20
List of Figures
SLAU205 – January 2008
Submit Documentation Feedback
User's Guide
SLAU205 – January 2008
1
Overview
This preliminary user's guide gives a general overview of the ADS5281/82/87 (ADS528X) QFN evaluation
module (EVM) and provides a general description of the features and functions to be considered while
using this module. The EVM is pictured in Figure 1.
1.1
Purpose
The EVM provides a platform for evaluating the eight-channel ADS528X analog-to-digital converter (ADC)
under various signal, reference, and supply conditions. This document should be used in combination with
the EVM schematic diagram supplied. The ADS5281 and ADS5282 are 12-bit ADCs, whereas the
ADS5287 is a 10-bit ADC.
Windows is a trademark of Microsoft Corporation.
On Semiconductor is a trademark of Semiconductor Components Industries, L.L.C.
Xilinx is a trademark of Xilinx, Inc.
SLAU205 – January 2008
Submit Documentation Feedback
5
www.ti.com
Overview
Figure 1. ADS5281 EVM
1.2
EVM Basic Functions
Eight analog inputs to the ADC are provided via external SMA connectors.
The EVM provides an external SMA connector for input of the ADC clock. The ADC can be clocked using
either a single-ended or differential clock. Provisions are made on the EVM to allow users to evaluate the
ADC using a single-ended PECL clock and a differential transformer-coupled clock.
Digital output from the EVM is via a high-speed, high-density Samtec output header. The digital output
connector mates directly to the TSW1200 Rev B or through an adapter to the TI ADSDeSer-50EVM, both
of which deserialize the serial data stream into parallel CMOS data.
Power connections to the EVM are via banana jack sockets. Separate sockets are provided for the ADC
analog and ADC digital supplies and for the auxiliary circuits.
6
SLAU205 – January 2008
Submit Documentation Feedback
www.ti.com
Overview
1.3
ADS528x EVM Quick Start Procedure
The ADS528x EVM provides a flexible means of evaluating the ADS528x in a number of modes of
operation. A basic setup procedure that can be used as a board confidence check is as follows:
1. Verify all jumper settings against the schematic jumper list in Table 1.
Table 1. Three-Pin Jumper List
JUMPER
FUNCTION
LOCATION: PINS 1–2
LOCATION: PINS 2–3
DEFAULT
JP2
ADC internal or external reference
selection
ADC internal reference
ADC external reference
1–2
JP3 (SMT)
EVM clock input selection
Transformer coupled
Single-ended PECL
1–2
JP4 (SMT)
ADC CLKP
Transformer
Single-ended PECL
1–2
JP5 (SMT)
ADC CLKM
Transformer
GND
1–2
JP8
Selects power management
configuration
ADC powered by LDO (3.3 V)
ADC powered by J4 (3.3 V)
1–2
JP9
Selects power management
configuration
ADC powered by LDO (1.8 V)
ADC powered by J5 (1.8 V)
1–2
2. Connect a 5-V supply to J1 and its return to J2.
3. Switch power supplies on.
4. Using a function generator with 50-Ω output, generate a 0-V offset, 1.5-Vpp sine-wave clock into J26.
The frequency of the clock must be within the specification for the device speed grade.
5. Use a frequency generator with a 50-Ω output to provide a 5-MHz, 0-V offset, –1-dBFS-amplitude
sine-wave signal into J9. This provides a transformer-coupled differential input signal to the ADC.
6. Connect the USB cable, open the PC software and provide a reset command. For first-time use, see
Section 3.1 for installation instructions.
7. Connect J8 to the ADS5281DeSerAdapter+ADSDeser-50EVM or TSW1200 deserializer card to
evaluate the ADC digital data using a logic analyzer.
Note:
Software Operation: Users must use the accompanying software to issue a reset command
before taking measurements. In addition to providing the ADS528X with the initialization
register writes detailed in the data sheet, the accompanying software also sets the state of
ADC pins ADCRESET and PD. Failure to do so can cause improper operation.
SLAU205 – January 2008
Submit Documentation Feedback
7
www.ti.com
Circuit Description
2
Circuit Description
2.1
Schematic Diagram
The schematic diagram for the EVM is in Section 6.3.
2.2
Circuit Function
The following sections describe the function of individual circuits. Refer to the relevant data sheet for
device operating characteristics.
2.2.1
Power
Power is supplied to the EVM via banana jack sockets. By default, the EVM is configured to use a power
management solution to supply the ADC and analog and digital power supplies, allowing users to power
the board with a single 5-V power supply. The ADC power management solution is based on TI's
TPS77533 and TPS73218, which supply 3.3 V and 1.8 V, respectively. In addition, the EVM offers the
capability to supply to the ADC independent 3.3-V analog and 1.8-V digital supplies. The circuit board
uses only one ground plane, and the heat slug is tied to ground with multiple vias to provide for thermal
dissipation. Table 2 offers a snapshot of the power-supply options.
Table 2. EVM Power-Supply Options
EVM Banana Jack
2.2.2
DESCRIPTION
J1
Auxiliary circuit 5-V digital supply: PECL driver and USB circuitry
J2
Single ground plane
J4
ADS528x 3.3-V analog supply (only active when JP8 = 2–3)
J5
ADS528x 1.8-V digital supply (only active when JP9 = 2–3)
Clock Input
A single-ended square or sinusoidal clock input should be applied to J26. The clock frequency should not
exceed the maximum speed rating found in the data sheet. Several different clocking options exist to allow
flexible evaluation of the ADC.
In the default case, a single-ended clock is converted to a differential clock using a Mini-Circuits TC1-1T
transformer. When using this option, the ADC should be configured in differential clock mode by writing
0x8001 to ADC register address 0x42. By default, after a software reset this option is asserted to coincide
with the EVM default.
A second EVM option allows the ADC to be configured in single-ended mode. This is provided to the ADC
using an On Semiconductor™ MC100EPT21 amplifier, which provides for sine-wave to square-wave
conversion. This configuration can be used for both ADS528X and ADS527X devices. To use this mode,
use the surface-mount jumpers JP3, JP4, and JP5, and configure each one of them to have positions 2–3
shorted.
2.2.3
External References
The EVM offers the ability to force external references to the ADC. By default, the ADC is configured to
use the references generated internal to the ADC. To force the ADC to use external references, users
must short JP2 pads 2–3, which in turn grounds the INT/EXT pin of the ADC. Users can then use J6 pin 1
to force a REFB and pin 3 to force a REFT voltage. GND should be connected to J6 pin 2.
8
SLAU205 – January 2008
Submit Documentation Feedback
www.ti.com
Circuit Description
2.2.4
Analog Inputs
The EVM provides eight analog inputs, using an SMA connector for each of the eight channels of the
ADC. SMA channel inputs are J9, J10, J13, J14, J17, J18, J21, and J22. By default, the ADC accepts a
single-ended input and translates it to a differential signal using a Mini Circuits TC1-1T transformer. The
ADC inputs are dc-biased by feeding the ADC VCM voltage to the transformer center tap on the
secondary windings. Provisions have also been made on the EVM to allow for differential inputs using two
SMAs per input channel.
2.2.5
Digital Outputs
The serial LVDS digital outputs can be accessed through the J8 output connector. The EVM is designed
to be interfaced to the TI TSW1200 Rev B deserializer card, which plugs into J8. In addition, the EVM can
be interfaced to the ADSDeSer-50EVM using a translation card, the ADS5281DeSerAdapter. Both the
TSW1200 Rev B and the ADSDeSer-50EVM contain the required parallel 100-Ω termination resistor that
must be placed at the receiver to terminate each LVDS data pair properly.
Note:
TSW1200 Rev B: Users wishing to use the TSW1200 for deserialization should note that the
minimium ADC sampling frequency this can be operated at is 32 MHz. The TSW1200 uses a
digital clock manager (DCM) with a minimium operational frequency of 32 MHz.
Full documentation on the TI ADSDeSer-50EVM deserializer is found in the ADSDeSer-50EVM Evaluation
Module User's Guide (SBAU091) and Connecting Xilinx FPGAs to Texas Instruments ADS527x Series
ADCs, Xilinx™ application report XAPP774. The VHDL deserializer source code can be found on the
Xilinx Web site.
SLAU205 – January 2008
Submit Documentation Feedback
9
www.ti.com
TI ADC SPI Control Interface
3
TI ADC SPI Control Interface
This section describes the software designed to communicate with the ADC three-wire SPI interface. The
information is to be used in conjunction with the device data sheet, which explains the valid registers of
the device.
3.1
Installing the ADC SPI Control Software
The ADC SPI control software can be installed on a personal computer by running the setup.exe file
located on the CD. This file installs the graphical user interface (GUI) along with the USB drivers needed
to communicate to the USB port that resides on the EVM. After the software is installed and the USB
cable has been plugged in for the first time, the user is prompted to complete the installation of the USB
drivers. When prompted, users should allow the Windows™ operating system to search for device drivers,
and it should automatically find the TI ADC SPI interface drivers. See Figure 2.
Note:
First-time operation: For proper installation of the necessary USB drivers, users should
install the accompanying software before connecting the USB cable to the EVM for the first
time. Not doing so could cause problems in communicating to the EVM.
Figure 2. TI ADC SPC Interface Screen
3.2
Using the TI ADC SPI Interface Software
Once the software is installed and the USB cable is connected, three primary modes of operating the
software are available: SPI register write, SPI register write using a script file, and ADS528X frequently
used registers.
10
SLAU205 – January 2008
Submit Documentation Feedback
www.ti.com
TI ADC SPI Control Interface
3.2.1
SPI Register Write
The most basic mode of operation allows full control of writing to individual register addresses. In the top
left corner of the interface screen (Figure 2), select the ADS528X ADC from the ADC SPI Protocol
drop-down list. Next, type the hexadecimal (hex) Address Bytes(s) in and Data Byte(s), which can be
found in the device data sheet. When you are ready to send this command to the ADC, press Enter on
your keyboard or click the Send Data button. The graph indicator is updated with the patterns sent to the
ADC. The default inputs to both the Address Byte(s) and Data Byte(s) fields are hex inputs as designated
by the small x in the control. Users can change the default input style by clicking on the x to binary,
decimal, octal, or hex. Multiple register writes can be written simply by changing the contents of the
Address Byte(s) and Data Byte(s) fields and pressing "Enter" or "Send Data" again.
3.2.2
SPI Register Write Using a Script File
For situations where the same multiple registers must be written on a frequent basis, users can easily
save a script file representing all of the register writes they have performed after a Reset has been issued
by simply clicking on the Save Script button. This can easily be loaded at a later time by using the Load
Script button. When ready to write the contents of the script file to the ADC, users can press the Load
Script button and be prompted for the file location of their script file. The commands are sent to the ADC
when the user acknowledges the selection of the file. Please note that the graph indicator and the
frequently used register buttons are not updated when a script file is used.
Conversely, users can by using a text editor easily create a script file containing all ADC register writes.
An example script file is located in the \\Install Directory\ADC SPI Control\Script
Files\ADS5281_Init.reg_ADS528X. Users who wish to take advantage of writing their own script files
should start by using the ADS5281_Init.reg_ADS528X as a template file. When editing script files
manually, make sure there is no carriage return following the last register write.
3.2.2.1
ADS528X Frequently Used Registers
For ease of use, several buttons have been added that allow one-click register writes of commonly used
features found in Table 3. These buttons represent a subset of the available features found on the
ADS528X. The buttons are found in the ADS528X tab, as these commands are specific to the ADS528X
ADC only. The software writes to the ADC both the contents of the associated address and data when the
button is clicked. When the ADS528X Reset button is pressed, it issues a software reset to the ADC, and
it resets the button values to match the contents inside of the ADC. The graph indicator plots the SPI
commands written to the ADC when a button has been pressed.
SLAU205 – January 2008
Submit Documentation Feedback
11
www.ti.com
TI ADC SPI Control Interface
Table 3. ADS528X Frequently Used Registers
Default Value
Alternate Value
ADS528X Reset
12
Description
Issues a software reset and also sends the initialization
routine outlined in the data sheet. Furthermore, the clock is
set to differential, which matches the default EVM
configuration. A Reset should take place before any
evaluation is done.
Standby: Off
Standby: On
Toggles the ADC standby.
Powerdown: Off
Powerdown: On
Toggles the ADC power down.
PD: Powerdown
PD: Standby
Assigns the ADS528X PD pin either a power-down or
standby function.
Clock: Standby
Clock: Differential
Sets the ADC to accept either a single-ended or a
differential clock. By defualt the ADS528X EVM is
configured for a differential clock.
LSB first
MSB first
Toggles the ADC output format.
Testmode: None
Output = Ramp, Output = Deskew,
Output = Synch
Sets the ADC to ignore the analog input and to apply a test
pattern on the digital output.
Duty Cycle Correction: Off
Duty Cycle Correction: On
Toggles the duty-cycle correction feature.
Termination: Off
Termination: On
Enables the ability to provide a series source termination
on the output signals.
ADCLK: None
ADCLK: 260, 150, 94, 125, 80, 66,
55 Ω
Changes the value of the source termination on ADCLK.
Note that Termination must be On for values to take effect.
LCLK: None
LCLK: 260, 150, 94, 125, 80, 66,
55 Ω
Changes the value of the source termination on LCLK.
Note that Termination must be On for values to take effect.
OUT: None
OUT: 260, 150, 94, 125, 80, 66,
55 Ω
Changes the value of the source termination on the outputs
Note that Termination must be On for values to take effect.
ADCLK: 3.5 mA
ADCLK: 0.5–7.5 mA
Changes the output source current on ADCLK.
LCLK: 3.5 mA
LCLK: 0.5–7.5 mA
Changes the output source current on LCLK.
OUT: 3.5 mA
OUT: 0.5–7.5 mA
Changes the output source current on OUT.
Power Down: Off (per channel
control)
Power Down: On (per channel
control)
On an individual-channel basis, allows the user to toggle
power down.
Swap Inputs: Off (per channel
control)
Swap Inputs: On (per channel
control)
On an individual-channel basis, allows the user to toggle
power down.
Low-Frequency Noise
Suppression: Off (per channel
control)
Low-Frequency Noise Suppression:
On (per channel control)
On an individual-channel basis, allows the user to toggle
the low-frequency noise-suppression mode.
Gain = 0 db–12 dB (per
channel control)
Gain = 0 db–12 dB (per channel
control)
On an individual-channel basis, allows the user to apply
gain.
SLAU205 – January 2008
Submit Documentation Feedback
www.ti.com
ADC Evaluation
4
ADC Evaluation
This section describes how to set up a typical ADC evaluation system that is similar to what TI uses to
perform testing for data-sheet generation. Consequently, the information in this section is generic in nature
and is applicable to all high-speed, high-resolution ADC evaluations. This section covers signal tone
analysis, which yields ADC data-sheet figures of merit such as signal-to-noise ratio (SNR) and spurious
free dynamic range (SFDR).
4.1
Hardware Selection
To reveal the true performance of the ADC under evaluation, great care should be taken in selecting both
the ADC signal source and ADC clocking source.
4.1.1
Analog Input Signal Generator
When choosing the quality of the ADC analog input source, consider both harmonic distortion performance
of the signal generator and the noise performance of the source.
In many cases, the harmonic distortion performance of the signal generator is inferior to that of the ADC,
and additional filtering is needed if users expect to reproduce the ADC SFDR numbers found in the data
sheet. Users can easily evaluate the harmonic distortion of their signal generator by hooking it directly to a
spectrum analyzer and measuring the power of the output signal and comparing that to the power of the
integer multiples of the output-signal frequency. If the harmonic distortion is worse than the ADC under
evaluation, the ADC digitizes the performance of the signal generator and the true ADC SFDR is masked.
To alleviate this, it is recommended that users provide additional LC filtering after the signal generator
output.
Another important metric when deciding on a signal generator is its noise performance. As with the
distortion performance, if the noise performance is worse than that of the ADC under evaluation, the ADC
digitizes the performance of the source. Noise can be broken into two components, broadband noise and
close-in phase noise. Broadband noise can be improved by the LC filter added to improve distortion
performance; however, the close-in phase noise typically cannot be improved by additional filtering.
Therefore, when selecting an analog signal source, it is important to review the manufacturer's
phase-noise plots and take care to choose a signal generator with the best phase-noise performance.
4.1.2
Clock Signal Generator
Equally important in the high-performance ADC evaluation setup is the selection of the clocking source.
Most modern ADCs, the ADS61xx included, accept either a sinusoidal or a square-wave clock input. The
key metric in selecting a clocking source is selecting a source with the lowest jitter. This becomes
increasingly important as the ADC input frequency (fin) increases, because the ADC SNR evaluation
setups can become jitter-limited (tj) as shown by the following equation.
SNR (dBc) = 20 log (2π × fin × tj(rms))
In theory, a square-wave source with femtosecond jitter would be ideal for an ADC evaluation setup.
However, in practical terms, most commercially available square-wave generators offer jitter measured in
picoseconds, which is too great for high-resolution ADC evaluation setups. Therefore, most evaluation
setups rely on the ADC internal clock buffer to convert a sinusoidal input signal into an ultralow-jitter
square wave. When selecting a sinusoidal clocking source, it has been shown that phase noise has a
direct impact on jitter performance. Consequently, great scrutiny should be applied to the phase-noise
performance of the clocking signal generator. TI has found that high-Q monolithic crystal filters can
improve the phase noise of the signal generator, and these filters become essential elements of the
evaluation setup when high ADC input frequencies are being evaluated.
SLAU205 – January 2008
Submit Documentation Feedback
13
www.ti.com
ADC Evaluation
4.2
Coherent Input Frequency Selection
Typical ADC analysis requires users to collect the resulting time-domain data and perform a Fourier
transform to analyze the data in the frequency domain. A stipulation of the Fourier transform is that the
signal must be continuous-time; however, this is impractical when looking at a finite set of ADC samples,
usually collected from a logic analyzer. Consequently, users typically apply a window function to minimize
the time-domain discontinuities that arise when analyzing a finite set of samples. For ADC analysis,
window functions have their own frequency signatures or lobes that distort both SNR and SFDR
measurements of the ADC.
TI uses the concept of coherent sampling to work around the use of a window function. The central
premise of coherent sampling entails that the input signal into the ADC is carefully chosen such that when
a continuous-time signal is reconstructed from a finite sample set, no time-domain discontinuities exist. To
achieve this, the input frequency must be an integer multiple of the ratio of the ADC sample rate (fs) and
the number of samples collected from the logic analyzer (Ns). The ratio of fs to Ns is typically referred to as
the fundamental frequency (ff). Determining the ADC input frequency is a two-step process. First, the
users select the frequency of interest for evaluating the ADC; then, they divide this by the fundamental
frequency. This typically yields a non-integer value, which should be rounded to the nearest odd,
preferably prime, integer. Once that integer, or frequency bin (fbin), has been determined, users multiply
this with the fundamental frequency to obtain a coherent frequency to program into their ADC input signal
generator. The procedure is summarized as follows.
ff = fs/Ns
fbin = Odd_round(fdesired/ff)
Coherent frequency = ff × fbin
14
SLAU205 – January 2008
Submit Documentation Feedback
www.ti.com
Errata
5
Errata
This section describes the known issues with Rev B of the EVM.
5.1
Silkscreen Errata
The JP2 silkscreen incorrectly identifies the internal (INT) and external (EXT) reference selection. The
ADC internal reference is selected by shorting pins 1–2 on JP2, which corresponds to the silkscreen
designators of HI or EXT. This will be amended in Rev. C of the EVM.
SLAU205 – January 2008
Submit Documentation Feedback
15
www.ti.com
Physical Description
6
Physical Description
This section describes the physical characteristics and PCB layout of the EVM.
6.1
PCB Layout
The EVM is constructed on a 4-layer, 0.062-inch (1.58-mm) thick PCB using FR-4 material. The individual
layers are shown in Figure 3 through Figure 6. The layout features a common ground plane; however,
similar performance can be had with careful layout using a split ground plane.
K001
Figure 3. Top Silkscreen
16
SLAU205 – January 2008
Submit Documentation Feedback
www.ti.com
Physical Description
K002
Figure 4. Ground Plane
SLAU205 – January 2008
Submit Documentation Feedback
17
www.ti.com
Physical Description
K003
Figure 5. Power Plane
18
SLAU205 – January 2008
Submit Documentation Feedback
www.ti.com
Physical Description
K004
Figure 6. Bottom Silkscreen
SLAU205 – January 2008
Submit Documentation Feedback
19
www.ti.com
Physical Description
6.2
Bill of Materials
Table 4. Bill of Materials
Reference
Not Installed
Part
Footprint
Manufacturer
Tolerance
33 µF
TANT_B
B45196H1336K2 Kemet
09
10%
C2, C4, C24,
C34
1 µF
603
ECJ-1VB0J105K Panasonic
10%
C7, C11
22 µF
TANT_A
B45196H1226K1 Kemet
09
10%
C8, C9, C10,
C12, C13, C14,
C18, C20, C26,
C27, C28, C30,
C36, C37, C41,
C43, C47, C49,
C53, C55, C59,
C60, C61, C72
0.1 µF
603
ECJ1VB1C104K
10%
C15, C16, C17,
C22
0.01 µF
603
06035C103KAT2 AVX
A
10%
C29
10 µF
1206
ECJ3YB1C106K
Panasonic
10%
C33
2.2 µF
603
ECJ-1VB0J225K Panasonic
10%
C35, C38, C42,
C44, C48, C50,
C54, C56
10 pF
603
ECJ1VC1H100D
0.5 pF
C40, C39, C45
0.1 µF
402
ECJ-0EB1A104K Panasonic
10%
C46, C51, C74,
C75
0.1 µF
SMD_0603
GRM188R71H10 Murata
4KA93D
10%
C52
0.01 µF
SMD_0603
C0603C103K1R
ACTU
10%
C57, C58
27 pF
SMD_0603
GRM1885C2A27 Murata
0JA01D
5%
C73
10 µF
TANT_A
TAJA106K016R
10%
JP2, JP8, JP9
HEADER 3POS
.1 CTR
Panasonic
Panasonic
Kemet
AVX
Short pins 1–2
with shunt
connectors
DigiKey #
S9000-ND
CONN JUMPER
SHORTING
S9000-ND
DigiKey
JP3, JP4, JP5
NO PART
J1, J4, J5
RED
ST-351A
ALLIED
ELECTRONICS
J2
BLK
ST-351B
ALLIED
ELECTRONICS
J6
HEADER 4
J8
QTH-060-02-FD-A
QTH-040-01-FD-DP-A
Samtec
J9, J10, J13,
J14, J17, J18,
J21, J22, J26
SMA
142-0701-201
Johmson
Components
SMA
142-0701-201
Johmson
Components
CONN USB TYP
B FEM
897-43-004-90000000
Milmax
J11, J12, J15,
J16, J19, J20,
J23, J24
J25
20
Part Number
C1, C3, C23,
C25
NOT
INSTALLED
SMD_BRIDGE_
0603
Short pins 1–2
using 0-Ω
resistors
JUMPER4
SLAU205 – January 2008
Submit Documentation Feedback
www.ti.com
Physical Description
Table 4. Bill of Materials (continued)
Reference
Not Installed
Part
Footprint
Part Number
Manufacturer
Tolerance
L1, L2, L3, L7
68 Ω at 100 MHz 603
MI0603J680R-10 Steward
L5
1 kΩ at 100 MHZ SMD_0805
BLM21AG102SN Murata
1D
R1, R2
2Ω
603
ERJ3GEYJ2R0V
Panasonic
5%
R3
0Ω
603
ERJ3GEY0R00V
Panasonic
5%
R4
56.2 kΩ
603
ERJ-3EKF5622V Panasonic
1%
R5, R6, R7, R8,
R10, R12, R13,
R14, R15, R16,
R17, R18, R20,
R22, R23, R24,
R25, R26, R27,
R28, R30, R32,
R33, R34, R35,
R36, R37, R38,
R40, R42, R43,
R44, R49
49.9 Ω
603
ERJ3EKF49R9V
Panasonic
1%
R9, R11, R19,
R21, R29, R31,
R39, R41
0Ω
603
ERJ3GEY0R00V
Panasonic
1%
121 Ω
603
ERJ-3EKF1210V Panasonic
1%
R46
10 Ω
603
ERJ3EKF10R0V
Panasonic
1%
R47, R52
49.9 Ω
402
ERJ2RKF49R9X
Panasonic
1%
R53, R56
10 kΩ
603
ERJ-3EKF1002V Panasonic
1%
R57
4.7 kΩ
603
ERJ3GEYJ472V
Panasonic
5%
R59
1.5 kΩ
SMD_0603
ERJ-3EKF1501V Panasonic
5%
R60
2.21 kΩ
SMD_0603
ERJ-3EKF2211V Panasonic
1%
R61
10 kΩ
SMD_0603
ERJ3GEYJ103V
Panasonic
5%
499 Ω
402
ERJ-2RKF4990X Panasonic
1%
0Ω
SMD_0603
ERJ3GEY0R00V
Panasonic
5%
26.7 Ω
SMD_0603
ERJ3EKF26R7V
Panasonic
1%
10 kΩ
603
ERJ-3EKF1002V Panasonic
1%
R77
28 kΩ
603
RC0603FR0728KL
Yageo
1%
R78
56.2 kΩ
603
RC0603FR0756K2L
Yageo
1%
TP1, TP3, TP4,
TP5
T POINT R
TESTPOINT
5002
Keystone
TP2
T POINT R
TESTPOINT
5001
Keystone
T1, T2, T3, T4,
T5, T6, T7, T8,
T9
TC1-1T
XFMR_TC4-1W
TC1-1T
Mini Circuits
U1
ADS528X_
QFN64
QFN64
ADS528X
TI
U3
MC100EPT21
R45, R48
NOT
INSTALLED
R62, R67
R63
NOT
INSTALLED
R64, R65
R68
NOT
INSTALLED
SLAU205 – January 2008
Submit Documentation Feedback
MC100EPT21DT On
G
Semiconductor
21
www.ti.com
Physical Description
Table 4. Bill of Materials (continued)
Reference
22
Not Installed
Part
Footprint
Part Number
Manufacturer
U5
93C66B
TSSOP8
93C66B-I/ST
Microchip
U8
FT245BM
PQFN32
FT245BM
Future
Technology
Devices
U10
TPS73201SOT23
DBV5
TPS73218DBVT
TI
U11
TPS77533D
SOIC8
TPS77533D
TI
Y2
6.0000 MHz
ECS-60-325PDN-TR
ECS
MP2
Screw, machine,
ph 4-40 × 3/8
PMS 440 0038
PH
Building
Fasteners
MP3
Stand-off, hex,
.5/4-40THR
1902C
Keystone
Electronic
Tolerance
PCB legs
SLAU205 – January 2008
Submit Documentation Feedback
5V
1
2
3
4
C28
.1uF
16V
+3.3V
J4
RED
BLK
J2
GND
RESET
NC
OUT1
OUT
TPS77533D
GND
EN
IN
IN1
U11
3.3V_SMA
8
7
6
5
JP8
C29
10uF
16V
1
3
GND
5V_IN
2
L2
L7
2
68 @ 100MHz
1
6.3V
+ 33UF
C1
2
68 @ 100MHz
1
68 @ 100MHz
1
2
L1
3.3V_IN
1
2
5V
1
C2
6.3V
C3
+ 33UF
C24
1uF
6.3V
+3.3V_AUX
1uF
6.3V
C4
+3.3V_AVDD
6.3V
1uF
C23
+ 33UF
6.3V
2
RED
3.3V
1
2
1
2
2
1
2
1
C26
.1uF
16V
GND
5V
OUT
U10
EN
GND
NC/FB
IN
4
5
1.8V_SMA
TPS73201-SOT23
3
2
1
RED
J5
1.8V
GND
R78
56.2K
R77
28K
C27
.1uF
16V
JP9
GND
C30
.1uF
16V
1
3
2
L3
1
2
68 @ 100MHz
+
1
2
SLAU205 – January 2008
Submit Documentation Feedback
C25
33UF
6.3V
S001
GND
C34
1uF
6.3V
+1.8V_LVDD
2
6.3
1
J1
+5V_IN
www.ti.com
Physical Description
PCB Schematics
Figure 7. EVM Schematics (Sheet 1 of 5)
23
1.8V_IN
1.8V
TP2
1
2
3
4
VCM
REF_T
R53
10K
PD
C33
2.2uF
22uF
C11
C7
22uF
1
2
1
2
C13
.1uF
C8
.1uF
OUT1P
OUT1N
2
IN4P
IN4N
IN3P
IN3N
IN2P
IN2N
IN1P
IN1N
10 ohm
R46
1
2
1
J6
2
1
+
1
R1
2 ohm
R2
2 ohm
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
65
REFT
REFB
IN1P
IN1N
AVSS
IN2P
IN2N
AVSS
IN3P
IN3N
AVSS
IN4P
IN4N
LVSS
PD
LVSS
OUT1P
OUT1N
GND
R56
10K
+3.3V_AVDD
2
2
ADCRESET
C9
.1uF
1
REFT
REFB
SCLK
SDATA
CS
U1
ADS528X_QFN64
OUT2P
OUT2N
OUT3P
OUT3N
OUT4P
OUT4N
REF_B
CLKN
CLKP
ADCLKP
ADCLKN
LCLKP
LCLKN
2
1
2
1
1
2
3
1
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
56.2K
R4
1
C18
2
+3.3V_AVDD
OUT8N
OUT8P
IN5N
IN5P
IN6N
IN6P
IN7N
IN7P
IN8N
IN8P
TP1
1
C20
1
C22
2
.1uF
2
.001uF
+1.8V_LVDD
1
2
C17 .001uF
1
2
C14 .1uF
DEFAULT: SHORT 1 & 2
IN8N
IN8P
AVSS
IN7N
IN7P
AVSS
IN6N
IN6P
AVSS
IN5N
IN5P
AVSS
LVSS
LVDD
OUT8N
OUT8P
+3.3V_AVDD
2
.1uF
VCM
JP2
R3
0 OHM
2
1
2
C16 .001uF
1
2
C15 .001uF
+3.3V_AVDD
1
2
C12 .1uF
+3.3V_AVDD
1
2
C10 .1uF
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
RESET
SCLK
SDATA
CS
AVDD
CLKN
CLKP
AVDD
INT/EXT
REFT
REFB
VCM
TP
ISET
AVDD
AVDD
OUT2P
OUT2N
OUT3P
OUT3N
OUT4P
OUT4N
ADCLKP
ADCLKN
LCLKP
LCLKN
OUT5P
OUT5N
OUT6P
OUT6N
OUT7P
OUT7N
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
OUT5P
OUT5N
OUT6P
OUT6N
OUT7P
OUT7N
+
24
REFT
REFB
+3.3V_AVDD
OUT1N
OUT1P
OUT2N
OUT2P
OUT3N
OUT3P
OUT4N
OUT4P
ADCLKN
ADCLKP
LCLKN
LCLKP
OUT5N
OUT5P
OUT6N
OUT6P
OUT7N
OUT7P
OUT8N
OUT8P
126
128
62
64
66
68
70
72
74
76
78
80
82
84
86
88
90
92
94
96
98
100
102
104
106
108
110
112
114
116
118
120
122
124
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
GND
GND
61
63
65
67
69
71
73
75
77
79
81
83
85
87
89
91
93
95
97
99
101
103
105
107
109
111
113
115
117
119
GND
GND
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
125
127
61
63
65
67
69
71
73
75
77
79
81
83
85
87
89
91
93
95
97
99
101
103
105
107
109
111
113
115
117
119
121
123
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
J8B
QTH-060-02-F-D-A
GND
GND
62
64
66
68
70
72
74
76
78
80
82
84
86
88
90
92
94
96
98
100
102
104
106
108
110
112
114
116
118
120
GND
GND
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
J8A
QTH-060-02-F-D-A
S002
www.ti.com
Physical Description
Figure 8. EVM Schematics (Sheet 2 of 5)
SLAU205 – January 2008
Submit Documentation Feedback
J21
J17
J13
EN D
S MA
SMA
4
3
2
5
EN D
S MA
EN D
S MA
SMA
EN D
S MA
SMA
0 ohm
6
T1
TC1-1T
1
2
5
1
1
2
VCM
.1uF
C36
VCM
IN2_P
IN1_N
IN1_P
R15
49.9
R10
49.9
R5
C42
10pF
C35
10pF
IN2P
IN1N
IN1P
J14
J10
EN D
S MA
SMA
SMA
R29
R39
R43
49.9
IN4-N
IN4-P
R33
49.9
IN3-N
IN3-P
R23
49.9
IN2-N
0 ohm
0 ohm
T3
1
2
5
6
3
T7
TC1-1T
4
1
2
5
6
3
T5
TC1-1T
4
1
2
5
6
3
4
1
1
2
2
2
.1uF
C53
VCM
.1uF
C47
VCM
.1uF
C41
IN4_N
IN4_P
IN3_N
IN3_P
IN2_N
49.9
R40
49.9
R35
49.9
R30
49.9
R25
49.9
R20
49.9
C48
10pF
C54
10pF
IN4N
IN4P
IN3N
IN3P
IN2N
J22
J18
S MA
EN D
S MA
SMA
EN D
S MA
SMA
S MA
J24
49.9
R38
SMA
1
EN D
S MA
J20
49.9
R28
1
1
EN D
S MA
J16
49.9
R18
SMA
SMA
1
EN D
1
S MA
J12
49.9
R8
SMA
1
EN D
1
1
1
IN2-P
R19
0 ohm
3
EN D
S MA
J23
49.9
R37
SMA
1
EN D
S MA
J19
49.9
R27
SMA
1
EN D
S MA
J15
49.9
R17
SMA
1
R13
49.9
IN1-N
R9
TC1-1T
4
EN D
1
IN1-P
EN D
S MA
J11
49.9
R7
SMA
1
4
3
2
5
4
3
2
5
SMA
2
4
3
2
5
2
1
2
1
2
1
1
4
3
2
5
4
3
2
5
4
3
2
5
4
3
2
5
4
3
2
5
4
3
2
5
4
3
2
5
4
3
2
5
4
3
2
5
R11
R31
R24
49.9
IN6-N
R21
IN6-P
R14
49.9
IN5-N
R41
R44
49.9
IN8-N
IN8-P
R34
49.9
IN7-N
IN7-P
1
1
IN5-P
0 ohm
0 ohm
0 ohm
0 ohm
1
2
5
6
3
T8
TC1-1T
4
1
2
5
6
3
T6
TC1-1T
4
1
2
5
6
3
T4
TC1-1T
4
1
2
5
6
3
T2
TC1-1T
4
1
1
2
2
2
.1uF
C55
VCM
.1uF
2
VCM
.1uF
C43
IN7_N
IN7_P
IN8_N
IN8_P
IN5_N
IN5_P
IN6_N
IN6_P
VCM
.1uF
C49
1
1
C37
VCM
R6
49.9
R42
49.9
R36
49.9
R32
49.9
R26
49.9
R22
49.9
R16
49.9
R12
49.9
2
1
2
C56
10pF
C44
10pF
C38
10pF
C50
10pF
1
4
3
2
5
4
3
2
5
4
3
2
5
2
1
2
SLAU205 – January 2008
Submit Documentation Feedback
1
J9
S003
IN8N
IN8P
IN7N
IN7P
IN6N
IN6P
IN5N
IN5P
www.ti.com
Physical Description
Figure 9. EVM Schematics (Sheet 3 of 5)
25
R52
49.9
.1W
1%
C45
2
3
1
.1UF
16V 10%
1
2
JP3
2
1
26
C39
.1UF
16V
10%
R62
499
.1W
1%
1
AMS
D NE
1
2
3
4
J26
NC1
D
D
VBB
U3
VCC
Q
NC2
VEE
MC100EPT21
R49
49.9
1/10W
1%
GND
SMA
R67
499
.1W
1%
4
3
2
5
8
7
6
5
3
4
GND
C72
.1uF
16V
2
5
TC1-1T
1
6
T9
R47
0.1uf
1
49.9
0.1W 1%
C40
2
+3.3V_AUX
GND
C60
.1uF
16V
Do Not Install
R48
121
1/10W
1%
Do Not Install
R45
121
1/10W
1%
1
C59
2
C61
2
CLKP
.1uF 16V
1
.1uF 16V
CLK+
CLK-
2
JP4
3
1
GND
3
1
JP5
2
S004
CLKN
www.ti.com
Physical Description
Figure 10. EVM Schematics (Sheet 4 of 5)
SLAU205 – January 2008
Submit Documentation Feedback
5V
2
1K @ 100MHZ
1
L5
1
2
R63
Do Not Install
0 OHM
2
1
C52
.01uF
2
8
7
6
5
3
2
1
1
26.7
R65
2
R64 26.7
2
R57
4.7K
U5
1
2
3
4
1
R60
2.21K
CS
CLK
DI
DOUT
93C66B
VCC
ORG
NC
VSS
CONN USB TYP B FEM
4
1
J25
Do Not Install
R68
1
2
10K
Do Not Install
.1uF
1
5V
1
R61
10K
1
2
3
4
5
6
7
8
1
2
EESK
EEDATA
VCC
RESET
RSTOUT
3V3OUT
USBDP
USBDM
C57
27pF
5V
6.0000MHz
FT245BM
U8
+3.3V_AUX
1
D1
D2
D3
D4
D5
D6
D7
GND
2
5V
1
2
2
R59 1.5K
5V
2
C51
1
2
32
31
30
29
28
27
26
25
EECS
TEST
AVCC
AGND
XTOUT
XTIN
VCC
D0
GND
PWREN
SI/WU
RXF
VCCIO
TXE
WR
RD
9
10
11
12
13
14
15
16
24
23
22
21
20
19
18
17
C58
27pF
SCLK
PD
1
2
TP5
TP3
ADCRESET
CS
SDATA
+
PD
TP4
ADCRESET
CS
SDATA
SCLK
C73
10uF
1
2
5V
C74
.1uF
1
2
SLAU205 – January 2008
Submit Documentation Feedback
C46
.1uF
1
2
Y2
S005
C75
.1uF
www.ti.com
Physical Description
Figure 11. EVM Schematics (Sheet 5 of 5)
27
EVALUATION BOARD/KIT IMPORTANT NOTICE
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES
ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must have
electronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be complete
in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmental
measures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit does
not fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling
(WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from
the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER
AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF
MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims
arising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and all
appropriate precautions with regard to electrostatic discharge.
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY
INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or
services described herein.
Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. This
notice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/or
safety programs, please contact the TI application engineer or visit www.ti.com/esh.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used.
FCC Warning
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES
ONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radio
frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which are
designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may
cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may
be required to correct this interference.
EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the input voltage range of –3 V to 3.8 V and the output voltage range of –3 V to 3.8 V.
Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questions
concerning the input range, please contact a TI field representative prior to connecting the input power.
Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.
Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification,
please contact a TI field representative.
During normal operation, some circuit components may have case temperatures greater than 50°C. The EVM is designed to operate
properly with certain components above 25°C as long as the input and output ranges are maintained. These components include but are
not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified
using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation,
please be aware that these devices may be very warm to the touch.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2008, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2008, Texas Instruments Incorporated
Similar pages