Material Content Data Sheet Sales Product Name BTS56033-LBA MA# MA001141734 Package PG-TSON-24-3 Issued 29. August 2013 Weight* 181.12 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal < 10% silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver silver tin lead 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 5.920 3.27 0.021 0.01 0.084 0.05 465 1.685 0.93 9304 68.425 37.78 38.77 377793 387678 1.663 0.92 0.92 9183 9183 0.192 0.11 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.27 32688 32688 116 1057 9.862 5.45 85.697 47.30 52.86 473152 54453 528662 2.547 1.41 1.41 14060 14060 0.378 0.21 0.21 2087 2087 0.116 0.06 0.093 0.05 4.435 2.45 641 513 2.56 24488 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 25642 1000000