Diodes DMP2066LVT-13 P-channel enhancement mode mosfet Datasheet

DMP2066LVT
P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
RDS(ON) max
ID max
TA = +25°C
45mΩ @ VGS = -4.5V
-4.5A
65mΩ @ VGS = -2.5V
-3.8A
V(BR)DSS
NEW PRODUCT
-20V
Features and Benefits






Description
This new generation MOSFET is designed to minimize the on-state
resistance (RDS(on)), and yet maintain superior switching performance,
making it ideal for high-efficiency power management applications.
Applications


Mechanical Data





General Purpose Interfacing Switch
Power Management Functions
Low On-Resistance
Low Gate Threshold Voltage
Low Input Capacitance
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability

Case: SOT26
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish  Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.015 grams (Approximate)
D
SOT26
D
1
6
D
D
2
5
D
G
3
4
S
G
S
Top View
Pin-Out
Top View
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMP2066LVT-7
DMP2066LVT-13
Notes:
Case
SOT26
SOT26
Packaging
3,000/Tape & Reel
10,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds4. For packaging details, go to our website at http://www.diodes.com.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
SOT26
26P = Product Type Marking Code
YM = Date Code Marking for SAT (Shanghai Assembly/ Test site)
Y or = Year (ex: A = 2013)
M = Month (ex: 9 = September)
Shanghai A/T Site
Date Code Key
Year
Code
Month
Code
2011
Y
Jan
1
2012
Z
Feb
2
DMP2066LVT
Document number: DS36578 Rev. 4 - 2
Mar
3
2013
A
Apr
4
May
5
2014
B
Jun
6
1 of 6
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2015
C
Jul
7
Aug
8
2016
D
Sep
9
Oct
O
2017
E
Nov
N
Dec
D
February 2015
© Diodes Incorporated
DMP2066LVT
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
Value
Unit
Drain-Source Voltage
Characteristic
VDSS
-20
V
Gate-Source Voltage
VGSS
8
V
ID
-4.5
-3.7
A
IDM
-20
A
IS
-2.0
A
NEW PRODUCT
Drain Current (Note 5) Continuous
TA = +25°C
TA = +70°C
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Body-Diode Continuous Current (Note 5)
Thermal Characteristics
(@TA = +25°C, unless otherwise specified.)
Characteristic
Total Power Dissipation (Note 5)
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 6)
Operating and Storage Temperature Range
Electrical Characteristics
Symbol
Value
Units
PD
1.2
W
RθJA
100
74
°C/W
PD
1.8
W
RθJA
70
46
°C/W
TJ, TSTG
-55 to +150
°C
(@TA = +25°C, unless otherwise specified.)
Characteristic
STATIC PARAMETERS (Note 7)
Symbol
Min
Typ
Max
Unit
BVDSS
-20


V
ID = -250µA, VGS = 0V
IDSS


-1
-10
μA
VDS = -16V, VGS = 0V
VDS = -16V, VGS = 0V
Zero Gate Voltage Drain Current @TJ = +150°C (Note 8)
IDSS
—
—
-100
μA
VDS = -16V, VGS = 0V
Gate-Body Leakage Current
IGSS


100
nA
VDS = 0V, VGS = 8V
VGS(th)
-0.4

-1.5
V
VDS = VGS, ID = -250µA
Static Drain-Source On-Resistance
RDS (ON)

25
33
45
65
mΩ
VGS = -4.5V, ID = -4.5A
VGS = -2.5V, ID = -3.8A
Static Drain-Source On-Resistance @ TJ = +125°C (Note 8)
RDS (ON)


72
mΩ
VGS = -4.5V, ID = -4.5A
VSD
-0.5
-0.72
-1.4
V
IS = -2.1A, VGS = 0V
ID(ON)
10
—
—
A
VDS ≦5V, VGS = 4.5V
Input Capacitance
Ciss

1,496
2,990
pF
Output Capacitance
Coss

130
260
pF
Reverse Transfer Capacitance
Crss

116
230
pF
Total Gate Charge
QG

14.4
25
Gate-Source Charge
QGS

2.6
5
Gate-Drain Charge
QGD

2.7
5.5
Turn-On Delay Time
td(on)

8.5
30
tr

11
60
td(off)

61
130
tf

25
100
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
@ TJ = +55°C (Note 8)
Gate Threshold Voltage
Diode Forward Voltage
On State Drain Current (Note 8)
Test Condition
DYNAMIC PARAMETERS (Note 8)
Rise Time
Turn-Off Delay Time
Fall Time
Notes:
VDS = -15V, VGS = 0V
f = 1.0MHz
nC
VDS = -10V, VGS = -4.5V,
ID = -4.5A
ns
VDS = -5V, VGS = -4.5V,
ID = -1A, RG = 6.0Ω
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
DMP2066LVT
Document number: DS36578 Rev. 4 - 2
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February 2015
© Diodes Incorporated
15
15
ID, DRAIN CURRENT (A)
20
ID, DRAIN CURRENT (A)
20
10
10
5
0
0
0.5
1
1.5 2 2.5 3 3.5
4 4.5
V DS, DRAIN -SOURCE VOLTAGE(V)
Figure 1 Typical Output Characteristics
0.5
1
1.5
2
2.5
VGS, GATE SOURCE VOLTAGE(V)
Figure 2 Typical Transfer Characteristics
3
0.05
0.06
RDS(ON), DRAIN-SOURCE ON-RESISTANCE()
R DS(ON), DRAIN-SOURCE ON-RESISTANCE()
5
0
0
5
0.08
VGS = 1.8V
VGS = 2.5V
0.04
VGS= 4.5V
0.02
0
0
5
10
15
ID, DRAIN SOURCE CURRENT
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
20
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ( )
1.7
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Normalized)
NEW PRODUCT
DMP2066LVT
1.5
1.3
1.1
0.9
0.7
0.5
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Figure 5 On-Resistance Variation with Temperature
DMP2066LVT
Document number: DS36578 Rev. 4 - 2
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TA=150°C
VGS = 10V
TA=85°C
TA=125°C
0.04
0.03
0.02
TA=25°C
TA=-55°C
0.01
0
0
5
10
15
ID, DRAIN CURRENT (A)
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
20
0.06
0.05
0.04
0.03
0.02
0.01
0
-50
-25
0
25
50
75
100 125 150
TJ, JUNCTION TEMPERATURE ( C)
Figure 6 On-Resistance Variation with Temperature
February 2015
© Diodes Incorporated
VGS(th), GATE THRESHOLD VOLTAGE (V)
IS, SOURCE CURRENT (A)
1
0.8
ID= 1mA
0.6
ID= -250µA
0.4
16
12
TA= 25C
8
4
0.2
0
0.2
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE ( C)
Figure 7 Gate Threshold Variation vs. Ambient Temperature
0.4
0.6
0.8
1
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 8 Diode Forward Voltage vs. Current
10000
100000
f = 1MHz
CT, JUNCTION CAPACITANCE (pF)
TA = 150C
IDSS, LEAKAGE CURRENT (nA)
10000
1000
100
TA = 85 C
10
C ISS
1000
COSS
CRSS
TA = 25C
1
100
0
5
10
15
20
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 9 Typical Drain-Source Leakage Current vs. Voltage
0
-4
-8
-12
-16
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10 Typical Junction Capacitance
-20
5
VGS, GATE SOURCE VOLTAGE (V)
NEW PRODUCT
DMP2066LVT
20
1.2
4
3
2
1
0
0
2
4
6
8
10 12 14
16
QG, TOTAL GATE CHARGE (nC)
Figure 11 Gate Charge Characteristics
DMP2066LVT
Document number: DS36578 Rev. 4 - 2
18
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© Diodes Incorporated
DMP2066LVT
Package Outline Dimensions
TSOT26
D
NEW PRODUCT
e1
E
E1
L2
c
4x1
e
L

6x b
A
A2
A1
TSOT26
Dim Min Max Typ
A
1.00


A1
0.01 0.10

A2
0.84 0.90

D
2.90


E
2.80


E1
1.60


b
0.30 0.45

c
0.12 0.20

e
0.95


e1
1.90


L
0.30 0.50
L2
0.25


θ
0°
8°
4°
θ1
4°
12°

All Dimensions in mm
Suggested Pad Layout
TSOT26
C
C
Dimensions Value (in mm)
C
0.950
X
0.700
Y
1.000
Y1
3.199
Y1
Y (6x)
X (6x)
DMP2066LVT
Document number: DS36578 Rev. 4 - 2
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February 2015
© Diodes Incorporated
DMP2066LVT
IMPORTANT NOTICE
NEW PRODUCT
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
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Copyright © 2015, Diodes Incorporated
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DMP2066LVT
Document number: DS36578 Rev. 4 - 2
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© Diodes Incorporated
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