Material Content Data Sheet Sales Product Name BSP92P H6327 MA# MA001096072 Package PG-SOT223-4-21 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip noble metal non noble metal inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal < 10% gold tin silicon silicon titanium chromium copper copper carbon black epoxy resin silicondioxide tin silver 7440-57-5 7440-31-5 7440-21-3 7440-21-3 7440-32-6 7440-47-3 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 Weight [mg] 113.50 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.031 0.03 0.008 0.01 269 0.346 0.31 0.010 0.01 0.051 0.04 447 0.152 0.13 1340 50.489 44.49 44.67 444858 446734 0.018 0.02 0.02 158 158 0.604 0.53 69 0.35 3051 2. 3. 5323 9.062 7.98 50.747 44.71 53.22 447132 79845 532300 1.464 1.29 1.29 12899 12899 0.513 0.45 0.45 4520 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 3389 89 Important Remarks: 1. Sum [ppm] 4520 1000000