CSM Series Board Mount Heat Sink For TO-220 Devices The economically priced CSM Series is suitable for use with TO-220 devices found in active components as well as power resistors. With surface areas ranging from 1188 Sq. mm to 6645 Sq. mm, the CSM family comes in 5 configurations, all of them with Black Anodized surface treatment. These heatsinks offer a range of thermal performance from 18.0 to 9.8 C/W. Each device offers solder able mounting feet and anywhere from 1, 2 or 3 mounting holes are available for convenient device attachment. SERIES S P ECI F ICATI O N S Heatsink Part Number CSM221-12AE CSM221-28AE CSM221-40AE CSM222-30AE CSM223-50AE Surface Area (in2 / mm2) 1.84 / 1,188 4.30 / 2,772 6.14 / 3,960 6.25 / 4,029 10.30 / 6,645 *Free convection at 10 watts dissipation Weight (oz / g) 0.13/ 3.7 0.3 / 8.5 0.43 / 12.2 0.5 / 14.2 0.6 / 17.0 Length L Thermal (mm) Res.* (°C/W) 12 18.0 28 12.8 40 12.1 30 11.3 50 9.8 characteristics Heat Dissipation Heat dissipation is the total for ALL DEVICES attached to the heat sink Air Velocity (ft./min.) 300 400 500 600 700 800 900 135 9 120 8 105 7 90 6 75 5 60 4 45 15 0 3 CSM221-12AE CSM221-28AE CSM221-40AE 30 0 2 300 400 4 6 8 10 Heat Dissipated (watts) Solder Foot Cold-rolled Steel, surface tin plated. 1000 10 2 Thermal Resistance from Case Surface to Ambient (°C/watts) Case Temp. Rise above Ambient (°C) 150 Heat Sink Aluminum Alloy 6063-T5 or Equivalent with either degreased or black anodized finish. Interface for improvement, use thermal joint comThermal pound, 0.005 Grafoil (TGon 800 by Laird), Resistance or phase change material (Hi-Flow by Bergquist) Insulator (Optional) Sil-Pad 900-S, K6 800-S and K10 by Bergquist 1 0 12 14 900 1000 10 Case Temp. Rise above Ambient (°C) 500 600 700 800 135 9 120 8 105 7 90 6 75 5 60 4 45 3 CSM222-30AE CSM223-50AE 30 2 15 0 Thermal Resistance from Case Surface to Ambient (°C/watts) Air Velocity (ft./min.) 150 1 0 2 4 6 8 10 Heat Dissipated (watts) 12 14 0 (continued) 164 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • [email protected] CSM Series Board Mount Heat Sink For TO-220 Devices d i m e n s i on s Dimensions in mm; M3*0.5P thread Tapping. JIS-2b standard chamfer 0.3m CSM221-40AE CSM221-12AE 6 ±.20 7 ±0.20 12.50 26 ±0.20 13 ±0.20 12.50 9 31.20 31.20 16.60 ±0.20 16.60 ±0.20 φ3.50 +0/-0.20 2.50 6 9 ±.10 12 7 3.40 2.50 13 ±0.10 26 40 13.50 ±0.20 3.40 CSM222-30AE CSM221-28AE 6.50 ±0.20 3.50 +0-0.20 15 ±0.20 14.90 ±0.20 12.50 14.27 9 10.10 31.20 31.20 16.60 ±0.20 16.60 ±0.20 2.50 2 ±0.10 15 24 ±0.10 28 3.50 +0/-.20 2.50 Φ1.20 3.40 22 27 ±0.10 29.80 CSM223-50AE 18 ±0.20 3.50 +0-0.20 13 ±0.20 3 Φ1.20 how to order 10.45 RoHS Compliant CSM221-12AE 31.20 16.60 ±0.20 Series Extrusion type 3.50 +0-0.20 2.50 35 45 ±0.10 Φ1.20 3.40 50 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • [email protected] 165 Extrusion Black width anodized