Preliminary Information
This document contains information on a new product. The parametric information, although not
fully characterized, is the result of testing initial devices.
M02066
3.3 Volt Laser Driver IC for Applications to 3 Gbps Data Sheet
The M02066 is a highly integrated, programmable laser driver intended for SONET/SDH applications with FEC to 3
Gbps. Using differential PECL data and clock inputs, the M02066 supplies the bias and modulation current
required to drive an edge-emitting laser. The modulation output can be DC-coupled to the laser diode, giving a
significant power saving over AC-coupled operation.
The M02066 includes automatic power control to maintain a constant average laser output power over temperature
and life. In addition, the modulation current can be temperature compensated to minimize variation in extinction
ratio over temperature.
Output flags indicate laser end of life as well as failure of the APC circuitry to maintain average output power.
General Note: This product was previously called the CX02066.
Features
Applications
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Short reach and Metro SONET/SDH
Datacomms Modules
Add/Drop Multiplexers
Digital Cross Connects
Preliminary Information
•
•
High speed operation; suitable for applications to 3 Gbps.
Typical rise/fall times of 90 ps.
DC or AC coupled modulation drive.
Differential data and clock inputs to minimize pattern dependent
jitter.
Independently Programmable Laser Bias and Modulation currents.
Bias current to 100 mA and modulation current to 85 mA at VCC =
3.3 V
Automatic Laser Power Control, with programmable temperature
compensation and ‘Slow-Start’.
Bias and modulation current monitor
Operates with +3.3 Volt supply
Functionally compatible with MAX 3869
The M02066-21 and M02066-51 are available in a BCC+24
package. The M02066-82 is available in a TQFP32 package.
Available in RoHS compliant packages
Functional Block Diagram
V
CC
CEN
O UTO UT+
RD
R
SHUNT
C
D
DATA
SHUNT
G NDA
Q
CLK
X100
DIS
ENA
BIAS
MON
X1
60
M OD
MON
I
BIAS
X60
I
BIAS
PD
Failure
Detect
I
M OD
V REF
OCA SET
OCA
O CA
R
RTCSTART
R M O DSET
02066-DSH-001-D
RTCSLO PE
60
C
M PC
M PC SET
FAIL
NO T E: BCC+24 Package
PD and M PC SET are com m on on Pin 13
BIAS MO N and M O D MON are com m on on Pin 4
R M PCSET
V CC
Mindspeed Technologies®
Preliminary Information / Mindspeed Proprietary and Confidential
November 2006
Ordering Information
Part Number
Package
M02066-21
BCC+24 package with 20 ps or less DCD
M02066-51
BCC+24 package with 50 ps or less DCD
M02066-82
TQFP32 package with 80 ps or less DCD
M02066-EVME
BCC+24 electrical evaluation board
M02066-T-EVM
Optical evaluation board, TO-can laser
M02066G-21 *
BCC+24 RoHS compliant package, with 20 ps or less DCD
M02066G-51 *
BCC+24 RoHS compliant package, with 50 ps or less DCD
M02066G-82 *
TQFP32 RoHS compliant package, with 80 ps or less DCD
* The letter “G” designator after the part number indicates that the device is RoHS-compliant. Refer to www.mindspeed.com for additional
information.
Revision
Level
Date
ASIC Revision
D
Preliminary
November 2006
x
Description
Added RoHS package information, updated format, no specification
changes.
NC
C MPC
VCC
27
26
25
MPC SET
TC SLOPE
28
MOD SET
29
OCA SET
30
V CC
3
22
VCC
CLK
4
21
V CC
5
20
OUT-
CLK
6
19
OUT+
VCC
CEN
7
18
8
17
VCC
BIAS
4mm
16
PD
D IN
GND A
GND A
GND
VCC
13
12
PD
23
15
11
24
2
14
10
1
OCA
9
GND
CMPC
GNDA
8
OUT+
OUT-
7
14
5mm
V CC
D IN
13
6
MODSET
TCSTART
TCSLOPE
FAIL
5
BIAS
VCC
VCC
1
6
15
4
OCASET
12
17
19
11
3
20
9
18
21
10
2
22
ENA
DIS
GND
MON
FAIL
OCA
23
GND
BIAS
MON
MODMON
1
31
CLK
CLK
DIN
DIN
4mm
CEN
32
TQFP32 Top View
VCC
BCC+24L Top View
24
Preliminary Information
Revision History
5mm
02066-DSH-001-D
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Preliminary Information / Mindspeed Proprietary and Confidential
ii
1.0 Product Specification
1.1
Absolute Maximum Ratings
These are the absolute maximum ratings at or beyond which the IC can be expected to fail or be damaged.
Functional operation at these levels is not implied.
Table 1-1.
Absolute Maximum Ratings
Rating
Units
Power supply (VCC-GND)
-0.5 to +6.0
V
Operating ambient
-40 to +85
°C
Storage temperature
-65 to +150
°C
Maximum laser bias current
120
mA
Maximum laser modulation current (through OUT+/OUT2+, OUT-/OUT2-)
100
mA
1.2
Table 1-2.
Preliminary Information
Parameter
Recommended Operating Conditions
Recommended Operating Conditions
Parameter
Rating
Units
3.3 ± 10%
V
Junction temperature (die)
-40 to + 120
°C
Operating ambient
-40 to + 85
°C
Power supply (VCC-GND)
02066-DSH-001-D
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Product Specification
1.3
DC Characteristics
VCC=+3.3V ± 10%, TA=-40 °C to +85 °C, unless otherwise noted.
Table 1-3.
DC Characteristics
Parameter
Conditions
Min
Typ
Max
Units
IBIAS = 50 mA IMOD = 50 mA
Excluding IBIAS and IMOD
-
57
-
mA
Supply current
IBIAS = 100 mA IMOD = 85 mA
Excluding IBIAS and IMOD
-
70
75
mA
Bias current adjust range
Limited by OCASET across temperature
range
2
-
100
mA
Bias current with output disabled
Tx_Disable = HIGH
-
-
300
µA
100(1)
-
-
mA
Change in OCASET over temperature
-
200
-
µA/°C
Monitor diode reverse bias voltage
-
2.1
-
V
Monitor diode current adjustment range
10
-
1500
µA
TTL/CMOS input HIGH voltage
(CEN, DIS)
2.0
-
-
V
TTL/CMOS input LOW voltage
(CEN, DIS)
-
-
0.8
V
CMOS output HIGH voltage
(FAIL, OCA)
2.4
-
-
V
CMOS output LOW voltage
(FAIL, OCA)
-
-
0.4
V
2.5
-
-
kΩ
VCC-(VIN(Diff)/4)
V
VCC-0.47
V
TA = +85 °C (adjustable)
Maximum bias current limit
Differential input impedance
Data and clock inputs
VCC-1.7
Common-mode input voltage
Self-biased common mode input voltage
Data and clock inputs
VCC-1.7
-
Preliminary Information
Supply current
NOTE:
(VCC = +3.3 V ±10%, TA = 40 °C to + 85 °C, unless otherwise noted)
1. ROCASET = 0 Ω
02066-DSH-001-D
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Product Specification
1.4
AC Characteristics
VCC = +3.3V ±10%, TA = -40 °C to +85 °C, unless otherwise noted.
Table 1-4.
AC Characteristics
Parameter
Conditions
Differential input voltage
Min.
Typ.
Max.
Units.
300
—
1860
mV
2.5
—
85
mA
—
—
300
µA
4
= 2 x (DIN HIGH - DIN LOW)
(clock inputs follow same relationship)
Modulation current range
Modulation current with output disabled
DIS=HIGH
ppm/°C
Adjustable
500
—
10
Programmable temperature at which
modulation current TC compensation
enables
Programmed by choice of RTCSET
20
—
60
°C
Modulation output rise time
Modulation output fall time
20% to 80% into 25 Ω (1)
20% to 80% into 25 Ω
—
—
90
90
—
—
ps
Overshoot of modulation output current
Into 25 Ω load
-10
—
+10
%
ps
Modulation output pulse width distortion
Measured using alternating 1-0 pattern
RMODSET = 7 kΩ
20(2)
Modulation output pulse width distortion
Measured using alternating 1-0 pattern
RMODSET = 7 kΩ
50(3)
ps
Modulation output pulse width distortion
Measured using alternating 1-0 patternRMODSET = 7
kΩ
80(4)
ps
Modulation output random jitter
rms 12 kHz to 20 MHz
4
mUI
—
—
(2)
ps
Total output jitter (data input latch enabled) Peak-to-peak. Measured into 25 Ω load using 1867
MHz Bessel filter: 223-1 PRBS at 2.488 Gbps; using
clock inputs (includes PWD, random and
deterministic)
—
—
42
Total output jitter (data input latch enabled) Peak-to-peak. Measured into 25 Ω load using 1867
MHz Bessel filter: 223-1 PRBS at 2.488 Gbps; using
clock inputs (includes PWD, random and
deterministic)
—
—
72(3)
ps
Total output jitter (data input latch enabled) Peak-to-peak. Measured into 25 Ω load using 1867
MHz Bessel filter: 223-1 PRBS at 2.488 Gbps; using
clock inputs (includes PWD, random and
deterministic)
—
—
100(4)
ps
Preliminary Information
Programmable range for modulation
current temperature coefficient
NOTES:
(VCC = +3.3 V ±10%, TA = 40 °C to + 85 °C, unless otherwise noted)
1. IMOD = 28 mA
2.
Applies only to the M02066-21.
3.
Applies only to the M02066-51.
4.
Applies only to the M02066-82.
02066-DSH-001-D
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2.0 Pin Description
2.1
Table 2-1.
Pin Descriptions
Pin Descriptions (BCC+24)
Name
1
CEN
Clock enable input (TTL/CMOS). Set HIGH or not connected to use CLK inputs, LOW when not using CLK inputs
2
DIS
Bias and modulation output disable (TTL/CMOS). LOW for normal operation
3
GND
Ground
4
MON
Monitor output, connect a resistor between this pin and VCC to monitor the sum of bias and modulation currents
5
FAIL
Mean power control failure indicator (TTL/CMOS). Goes LOW when control loop is no longer able to maintain constant
current at PD
6
OCA
Over-current alarm (TTL/CMOS). Goes LOW when IBIAS exceeds the preset bias current limit
7
VCC
Power supply
8
BIAS
Laser bias current output
9
VCC
Power supply
10
OUT+
Positive modulation current output. Sinks current when DIN is HIGH
11
OUT-
Negative modulation current output. Sinks current when DIN is HIGH
12
GNDA
Ground for output stage. (inductor to ground)
13
PD
14
CMPC
Mean power control loop dominant pole capacitor
15
GND
Ground
16
TCSLOPE
Connecting a resistor between this pin and ground sets the temperature coefficient of IMODSET (using the internal IC
temperature)
17
TCSTART
Secondary temperature coefficient of IMOD. A resistor on this pin to ground sets the temperature at which the
temperature compensation starts
18
MODSET
Modulation current set. Connect a resistor between this pin and ground to set
19
OCASET
Over current alarm set. Connect a resistor between this pin and ground to set
20
VCC
Power supply
21
DIN
Positive data input (PECL). Self biased
02066-DSH-001-D
Function
Monitor photo diode input. This input is connected to the monitor photodiode anode for automatic power control. A
resistor between this pin and ground sets the mean optical power
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Preliminary Information
Pin No.
Pin Description
Table 2-1.
Pin Descriptions (BCC+24) (Continued)
Pin No.
Name
Function
22
DIN
Negative data input (PECL). Self biased
23
CLK
Positive clock input (PECL). Self biased. Connect to Vcc if not used
24
CLK
Negative clock input (PECL). Self biased. Can be disconnected if not used
NOTE:
The center pad must be connected to ground through an array of vias for good electrical and thermal performance.
Table 2-2.
Pin Descriptions (TQFP 32)
Name
1, 4, 7, 16,
18, 21, 25,
32
VCC
Power supply
2
DIN
Positive data input (PECL). Self biased
3
DIN
Negative data input (PECL). Self biased
5
CLK
Positive clock input (PECL). Self biased. Connect to Vcc if not used
6
CLK
Negative clock input (PECL). Self biased. Can be disconnected if not used
8
CEN
Clock enable input (TTL/CMOS). Set HIGH or not connected to use CLK inputs, LOW when not using CLK
inputs
9
ENA
Bias and modulation output enable (TTL/CMOS). HIGH for normal operation
10
GND
Ground
11
BIASMON
Bias monitor and temperature- dependent bias current limit. Connect a resistor between this pin and VCC to
monitor
12
MODMON
Modulation current monitor. Connect a resistor between this pin and VCC to monitor
13
FAIL
Mean power control failure indicator (TTL/CMOS). Goes LOW when control loop is no longer able to maintain
constant current at IPIN
14
OCA
Over-current alarm (TTL/CMOS). Goes LOW when IBIAS exceeds the preset bias current limit
15
GND
Ground
17
BIAS
Laser bias current output
19
OUT+
Positive modulation current output. Sinks current when DIN is HIGH
20
OUT-
Negative modulation current output. Sinks current when DIN is HIGH
22
GNDA
Ground for output stage (inductor to ground)
23
GNDA
Ground for output stage (inductor to ground)
24
PD
26
CMPC
02066-DSH-001-D
Function
Monitor photo diode input. This input is connected to the monitor photodiode anode for automatic power
control.
Mean power control dominant pole capacitor
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Preliminary Information
Pin No.
Pin Description
Table 2-2.
Pin Descriptions (TQFP 32) (Continued)
Pin No.
Name
Function
27
NC
28
TCSLOPE
Connecting a resistor between this pin and ground sets the temperature coefficient of IMODSET (using the
internal IC temperature)
29
MPCSET
A resistor between this pin and ground sets the mean optical power
30
MODSET
Modulation current set. Connect a resistor between this pin and ground to set
31
OCASET
Over current alarm set. Connect a resistor between this pin and ground to set
Not connected and may be grounded for compatibility with MAX3869
NOTE:
TCSTART is internally connected to 0 V in the TQFP32.
The center pad must be connected to ground through an array of vias for good electrical and thermal performance.
Preliminary Information
02066-DSH-001-D
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3.0 Functional Description
3.1
Overview
The M02066 laser driver consists of a high-speed modulation driver and a laser bias generator with mean power
control (MPC). It is optimized for high speed, low power operation at 3.3V supply. To minimize the patterndependent jitter of the input signal, the device accepts an input clock signal for data retiming. This feature can be
enabled using the external CEN pin.
CX02068 Block Diagram
V
Preliminary Information
Figure 3-1.
CC
CEN
O UTO UT+
RD
R
SHUNT
C
D
DATA
SHUNT
G NDA
Q
CLK
X100
DIS
ENA
BIAS
MON
X1
60
MOD
MON
I
BIAS
X60
I
BIAS
PD
Failure
Detect
I
MOD
O CA SET
OCA
O CA
R
RTCSTART
RTCSLO PE
R MO DSET
02066-DSH-001-D
FAIL
V REF
60
C
MPC
MPC SET
NOT E: BCC+24 Package
PD and MPC SET are com m on on Pin 13
BIAS MON and MO D MO N are com m on on Pin 4
R M PCSET
V CC
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Functional Description
3.2
Features
High speed operation; suitable for applications to 3 Gbps.
•
Typical rise/fall times of 90 ps.
•
DC or AC coupled modulation drive.
•
Differential data and clock inputs to minimize pattern dependent jitter.
•
Independently Programmable Laser Bias and Modulation currents.
•
Bias current to 100 mA and modulation current to 85 mA at VCC = 3.3 V
•
Automatic Laser Power Control, with programmable temperature compensation and ‘Slow-Start’.
•
Bias and modulation current monitor
•
Operates with +3.3 Volt supply
•
Functionally compatible with MAX 3869
•
The M02066-21 and M02066-51 are available in a BCC+24 package. The M02066-82 is available in a TQFP32
package.
•
Available in RoHS compliant packages
02066-DSH-001-D
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Preliminary Information
•
Functional Description
3.3
Modulator
The M02066 modulation output is optimized for driving a 25Ω load; the minimum required voltage at OUT+ and
OUT- is 0.6V. To interface with the laser diode, a matching resistor (RD) is required for impedance matching. An
RC shunt network is necessary to compensate for the laser diode parasitic inductance, thereby improving the
optical eye.
Typical values are RSHUNT = 39Ω, CSHUNT = 3.9 pF.
These values will need to be optimized for a specific laser.Any capacitive loading at the cathode of a laser diode will
degrade the optical output performance. An inductor is used to isolate the BIAS pin from the laser cathode. See
Figure 3-1.
The modulator output stage is designed to drive up to 85mA in either AC-coupled or DC-coupled mode. DCcoupled performance depends on the laser used.
RMODSET determines the modulation current according to the following formula: IMOD = 350/RMODSET
Figure 3-2 shows the modulation current for a given RMODSET resistor.
Preliminary Information
Figure 3-2.
Modulation Current vs. RMODSET
Imod (mA)
Modulation C urrent in m A
90.00
80.00
70.00
60.00
50.00
40.00
30.00
20.00
10.00
0.00
0
02066-DSH-001-D
10
20
Rmo d se t (koh ms)
30
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40
9
Functional Description
3.4
Mean Power Control Loop
To maintain constant average optical power, the M02066 incorporates a control loop to compensate for the
changes in laser threshold current over temperature and lifetime. A monitor photodiode mounted in the laser
package is used to convert the optical power into a photocurrent. The MPC loop adjusts the laser bias current so
that the voltage at PD is matched to an on-chip reference voltage. The external resistor (RMPCSET) sets the optical
power.
RMPCSET = 1.28/IPIN
IPIN is the mean current from the monitor photodiode at the required mean laser power level (see laser
datasheet).The time constant of the loop is determined by CMPC. In some applications the internal capacitance at
CMPC may be sufficient and an external CMPC will not be required.
Table 3-1.
MPC Loop Bandwidth
6 dB cutoff frequency
0
17 MHz
1 nF
100 kHz
10 nF
10 kHz
100 nF
1 kHz
Preliminary Information
CMPC
(at 6 dB cut off frequency) vs CMPC (for nominal process)
Figure 3-3 shows the bias current vs RMPCSET over the full operating temperature range.
Figure 3-3.
Bias Current vs. RMPCSET
120
Bias current
(mA)
100
80
60
40
20
0
0
5000
10000
15000
20000
25000
30000
50
85
35000
R M PCSET Ω
-40
0
25
Symbols shown indicate °C
NOTE:
This curve will scale with monitor photodiode current transfer efficiency.
02066-DSH-001-D
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Functional Description
There are two safety features integrated into the MPC loop; an Over-Current Alarm and an MPC loop failure alarm.
The Over-Current Alarm (OCA) circuit limits the maximum bias current generated by the M02060. The bias current
limit is set by an external resistor to ground, ROCA. When this limit is exceeded the OCA pin is asserted LOW.
Figure 3-4 shows the maximum bias current limit vs ROCA.
Figure 3-4.
Typical limiting current vs ROCA (at 25 °C)
100
90
IOCA (mA)
80
70
60
50
40
30
10
0
0
10000
20000
30000
40000
ROCA (Ω)
3.5
Safety Logic
Safety logic is provided in order to limit the maximum bias current. The bias current at which the safety logic trips
is set by an external resistor to ground (ROCA) from the OCASET pin. When the bias current limit is reached alarm
flag OCA is asserted LOW. A loop failure alarm is also provided to detect when the bias current can no longer be
adjusted to achieve the desired average optical power.
3.6
Data Input Latch
To minimize input data pattern-dependent jitter, a differential clock signal can be connected to the data input latch.
If CEN is HIGH, the input data is retimed by the rising edge of CLK+. If CEN is LOW, the input data is directly
connected to the output stage. If CEN is left floating it will be pulled HIGH by the internal circuitry. When this latch
function is not used, connect CLK+ to VCC and leave CLK- unconnected.
3.7
Enable Control
The M02066 incorporates a dual laser driver enable function. When ENA is LOW or DIS is HIGH, both the bias
and modulation currents are off. DIS and ENA are available on the M02066 die only, DIS is available on the BCC
package only, ENA is available on the TQPF package.
02066-DSH-001-D
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Preliminary Information
20
Functional Description
3.8
Current Monitors
The M02066 features bias and modulation current monitor outputs. The BIASMON output sinks a current equal to
nominally 1/60 of the laser bias current (IBIAS). The MODMON output sinks a current equal to nominally 1/60 of the
laser peak to peak modulation current (IMOD). BIASMON and MODMON should be connected through a pull-up
resistor to VCC. Choose a pull-up resistor value that ensures a voltage at BIASMON greater than VCC-1.6V and a
voltage at MODMON greater than VCC - 1.0V. These pins should be tied to VCC if not used.
Figure 3-5.
Typical Eye Diagram
2.5 Gbps optical eye @ -3 dBm
(1.87 GHz filter)
Temperature Compensation
The reduction in slope efficiency of typical laser diodes caused by increased temperature can be compensated by
utilising the TCSTART and TCSLOPE features of the M02066. Under closed loop conditions the average optical
power will be maintained by the Mean Power Control loop, compensating for factors such as temperature and age.
However, as the laser slope efficiency reduces with increasing temperature the laser diode will require a greater
peak to peak current swing in order to maintain the same peak to peak optical output swing. To this end the
M02066 senses temperature and can be programmed to increase the modulation current amplitude accordingly.
Two external resistors are used to program the temperature compensation.
The temperature (TCSTART) at which the compensation begins to take effect is set by a resistor (RTCSTART) from
the TCSTART pin to ground. The rate of increase of modulation current with temperature (beyond TCSTART) is set
by a resistor (RTCSLOPE) from the TCSLOPE pin to ground.
As a safety feature, the M02066 limits the increased modulation current to twice the initial (ambient) modulation
current.
The effects of the two programming resistors are shown schematically in the Temperature Compensation graph
below.
If using the TQFP package; only TCSLOPE is programmable, TCSTART is connected to 0 V.
02066-DSH-001-D
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Preliminary Information
3.9
Functional Description
For more details on temperature compensation see the appropriate applications note.
Figure 3-6.
Temperature Compensation
LOP
T CS
R
R
TCS
L OP
E1
E2
80 m A
TC SLO PE
1
2
Preliminary Information
0 mA
02066-DSH-001-D
T C START
RTCSTART 2
-4 0 ° C
RTCSTART 1
IM O D
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+80 °C
13
4.0 Packaging Specification
4.1
Packaging Specification
GND
VCC
DIN
DIN
VCC
CEN
VCC
ENA
OCASET
DIS
Preliminary Information
GND
CLK
VCC
CLK
Bare Die Information
GND
VCC
Figure 4-1.
MODSET
GND
GND
BIASMON
MPCSET
MODMON
TCSTART
FAIL
GND
GND
TCSLOPE
OCA
GND
GND
VCC
CMPC
VCC
02066-DSH-001-D
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PD
GNDA
GNDA
VCC
OUTN
OUTN
OUTP
OUTP
VCC
GNDA
Pad opening 84 x 84 µ
Die size 1790 x 1718 µ
BIAS
Dimensions:
14
Packaging Specification
Table 4-1.
Pad Centers
X
Y
PIN
X
Y
PIN
X
Y
PIN
X
Y
CEN
-727
550
BIAS
-550
-711
VCC
727
-550
GND
550
711
ENA
-727
440
GNDA
-440
-711
CMPC
727
-440
VCC
440
711
DIS
-727
330
VCC
-330
-711
GND
727
-33-
DIN
330
711
GND
-727
220
*OUTP
-210
-711
TCSLOPE
727
-220
DIN
220
711
BIASMON
-727
110
*OUTP
-210
-711
GND
727
-110
VCC
110
711
MODMON
-727
0
*OUTN
100
-711
TCSTART
727
0
GND
0
711
FAIL
-727
-110
*OUTN
100
-711
MPCSET
727
110
VCC
-110
711
GND
-727
-220
VCC
220
-711
GND
727
220
CLK
-220
711
OCA
-727
-330
GNDA
330
-711
MODSET
727
330
CLK
-330
711
GND
-727
-440
GNDA
440
-711
OCASET
727
440
VCC
-440
711
VCC
-727
-550
PD
550
-711
VCC
727
550
GND
-550
711
Preliminary Information
PIN
NOTE:
* Single pad/double bond
02066-DSH-001-D
Mindspeed Technologies®
Preliminary Information / Mindspeed Proprietary and Confidential
15
Packaging Specification
Figure 4-2.
TQFP32 Package Information
C0.50
±.05X45
°
F1
/±.05
PIN 1 ID. 0 0.50
N
Exposed Pad
1
E
E1
-A-
F2
-B-
Chamfer .203 (4X
-DD1
BOTTOM VIEW
D
TOP VIEW
DETAIL X
Preliminary Information
DETAIL A
0.17 MAX.
A2
A
aaa M
C
b
b
DETAIL A
SIDE VIEW
12° TYP.
01
A3
R1
GAGE PLANE
0.25
-HR
A1 A3
0
12° TYP.
SEATING PLANE
e
ccc
L
L1
Table 4-2.
STAND
OFF
-C-
-C-
COPLANARITY
DETAIL X
TQFP32 Package Dimensions
Dim
Tol.
5 x 5 x 1.0 mm
Dim
Tol.
5 x 5 x 1.0 mm
N
Lead count
32
e
Typ.
0.50
A
Max.
1.20
b
±0.05
0.22
A1
±0.05
0.05
0
***
0° - 7°
A2
±0.05
1.00
01
±4°
6°
A3
±0.05
0.4365
R
Max.
0.15
D
±0.15
7.00
R1
Typ.
0.15
D1
±0.05
5.00
aaa
Max.
0.08
E
±0.15
7.00
ccc
Max.
0.08
E1
±0.05
5.00
F1
±0.10
2.67
L
+0.15/-0.15
0.60
F2
±0.10
2.67
L1
Ref.
1.00
02066-DSH-001-D
Mindspeed Technologies®
Preliminary Information / Mindspeed Proprietary and Confidential
16
Packaging Specification
BCC+24L Package Information
0.20 Z
TOP VIEW
0.05 Z
Figure 4-3.
(PIN 1 CORNER)
4.00 ± 0.10
4.00 ±
0.10
X
0.67 ± 0.025
0.15
0.075 ± 0.025
Preliminary Information
Y
Z
0.80 MAX
0.10
0.08 M Z X Y
0.45 ± 0.03
0.08 M Z X Y
0.30 ± 0.03
0.08 M Z X Y
0.45 ± 0.03
2.20
2.20
0.45 ± 0.03
0.08 M Z X Y
DETAIL "B" (20X)
DETAIL "A"
DETAIL "C" (3X)
"B"
0.50 T YP.
C.L(PKG. )
C.L(PKG.)
3.20
0.50 ±
3.15
C0.2
0.08 M Z X Y
0.50 ± 0.10
0.40 ± 0.03
0.08 M Z X Y
3.15
0.50 TYP.
0.45 ± 0.03
BOTTOM VIEW
"A"(PIN 1 CORNER)
Table 4-3.
3.20
"C"
Features
DIE
BCC+24
TQFP
ENA
YES
NO
YES
DIS
YES
YES
NO
BIASMON
YES
(1)
YES
MODMON
YES
(1)
YES
TEMPCOMP
YES
YES
(2)
SIZE (mm)
1.79 x 1.72
4x4
5x5
NOTES:
1.
BIASMON and MODMON current sinks are common on pin 4.
2.
RTCSTART = 0 Ω (internally bonded) RTCSLOPE can be used on pin 28.
02066-DSH-001-D
Mindspeed Technologies®
Preliminary Information / Mindspeed Proprietary and Confidential
17
www.mindspeed.com
General Information:
Telephone: (949) 579-3000
Headquarters - Newport Beach
4000 MacArthur Blvd., East Tower
Newport Beach, CA 92660
Information in this document is provided in connection with Mindspeed Technologies® ("Mindspeed®") products.
These materials are provided by Mindspeed as a service to its customers and may be used for informational
purposes only. Except as provided in Mindspeed’s Terms and Conditions of Sale for such products or in any
separate agreement related to this document, Mindspeed assumes no liability whatsoever. Mindspeed assumes
no responsibility for errors or omissions in these materials. Mindspeed may make changes to specifications and
product descriptions at any time, without notice. Mindspeed makes no commitment to update the information and
shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its
specifications and product descriptions. No license, express or implied, by estoppel or otherwise, to any
intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MINDSPEED PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR INCIDENTAL
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CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
Mindspeed products are not intended for use in medical, lifesaving or life sustaining applications. Mindspeed
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02066-DSH-001-D
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Preliminary Information / Mindspeed Proprietary and Confidential
18
Preliminary Information
© 2006 Mindspeed Technologies®, Inc. All rights reserved.