TI1 LMV712Q1MM Low power, low noise, high output, rrio dual operational amplifier Datasheet

LMV712-N, LMV712-N-Q1
www.ti.com
SNOS534I – FEBRUARY 2001 – REVISED JANUARY 2014
LMV712-N, LMV712-N-Q1 Low Power, Low Noise, High Output, RRIO Dual Operational
Amplifier with Independent Shutdown
Check for Samples: LMV712-N, LMV712-N-Q1
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
1
2
•
•
•
•
•
•
•
•
•
•
•
•
(Typical Unless Otherwise Noted)
LMV712-N is available in Automotive AECQ100 Grade 1 version
5MHz GBP
Slew Rate 5V/µs
Low Noise 20nV/√Hz
Supply Current 1.22mA/Channel
VOS< 3mV Max
Ensured 2.7V and 5V Specifications
Temperature Range -40°C to 125°C
Rail-to-Rail Inputs and Outputs
Unity Gain Stable
Small Package: 10-Pin WSON, 10-Pin VSSOP
and 10-Bump DSBGA
1.5µA Shutdown ICC
2.2µs Turn On
Power Amplifier Control Loop
Cellular Phones
Portable Equipment
Wireless LAN
Radio Systems
Cordless Phones
DESCRIPTION
The LMV712-N duals are high performance BiCMOS
operational amplifiers intended for applications
requiring Rail-to-Rail inputs combined with speed and
low noise. They offer a bandwidth of 5MHz and a
slew rate of 5 V/µs and can handle capacitive loads
of up to 200pF without oscillation.
The LMV712-N is ensured to operate from 2.7V to
5.5V and offers two independent shutdown pins. This
feature allows disabling of each device separately
and reduces the supply current to less than 1µA
typical. The output voltage rapidly ramps up smoothly
with no glitch as the amplifier comes out of the
shutdown mode.
The LMV712-N with the shutdown feature is offered
in space saving 10-Bump DSBGA and 10-Pin WSON
packages. It is also offered in 10-Pin VSSOP
package. These packages are designed to meet the
demands of small size, low power, and low cost
required by cellular phones and similar battery
operated portable electronics.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2014, Texas Instruments Incorporated
LMV712-N, LMV712-N-Q1
SNOS534I – FEBRUARY 2001 – REVISED JANUARY 2014
www.ti.com
Typical Application Circuit
Figure 1. P.A. Control Loop
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
ESD Tolerance
(1) (2)
(3)
Human Body Model
1.5kV
Machine Model
150V
Differential Input Voltage
±Supply Voltage
(V+) +0.4V to (V−) −0.4V
Voltage at Input/Output Pin
Supply Voltage (V+ - V−)
6V
Output Short Circuit V+
(4)
−
(4)
Output Short Circuit V
Current at Input Pin
±10mA
Current at Output Pin
±50mA
Storage Temp Range
−65°C to 150°C
Junction Temperature TJMAX (5)
150°C
Soldering specification for WSON SnPb:
Infrared or Convection (20sec)
235°C
Soldering specification for all other packages:
see product folder at www.ti.com and
http://www.ti.com/lit/SNOA549
(1)
(2)
(3)
(4)
(5)
2
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for
availability and specifications.
Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Shorting circuit output to either V+ or V− will adversely affect reliability.
The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.
Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMV712-N LMV712-N-Q1
LMV712-N, LMV712-N-Q1
www.ti.com
SNOS534I – FEBRUARY 2001 – REVISED JANUARY 2014
Recommended Operating Conditions
(1)
Supply Voltage
2.7V to 5.5V
Temperature Range
−40°C ≤ TJ ≤ 85°C
LMV712
−40°C ≤ TJ ≤ 125°C
LMV712-Q1
Thermal Resistance
10-Pin VSSOP
235°C/W
10-Pin WSON
53.4°C/W
10-Bump DSBGA
196°C/W
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
2.7V Electrical Characteristics
Unless otherwise specified, all limits ensured for V+ = 2.7V, V − = 0V, VCM = 1.35V and TA = 25°C and RL > 1MΩ. Boldface
limits apply at the temperature extremes (−40°C ≤T J ≤85°C for LMV712 and −40°C ≤T J ≤125°C for LMV712-Q1).
Symbol
Parameter
VOS
Input Offset Voltage
IB
Input Bias Current
CMRR
PSRR
Condition
Common Mode Rejection Ratio
Power Supply Rejection Ratio
CMVR
Common Mode Voltage Range
ISC
Output Short Circuit Current
Typ
Max
VSSOP
WSON
0.4
3
3.2
DSBGA
3
7
9
LMV712
5.5
115
130
LMV712-Q1
5.5
3740
VCM = 0.85V and
VCM = 1.85V
Min
(1)
(2)
0V ≤ VCM ≤ 2.7V
50
45
75
2.7V ≤ V+ ≤ 5V,
VCM = 0.85V
70
68
90
2.7V ≤ V+ ≤ 5V,
VCM = 1.85V
70
68
90
For CMRR ≥ 50dB
−0.3
2.9
3
Sourcing
VO = 0V
15
12
25
Sinking
VO = 2.7V
25
22
50
2.62
2.60
2.68
RL = 10kΩ to 1.35V
0.01
VO
Output Swing
RL = 600Ω to 1.35V
VO(SD)
2.52
2.50
Output Voltage in Shutdown
On Mode
IS
Supply Current per Channel
Shutdown Mode
(1)
(2)
(1)
Units
mV
pA
dB
dB
dB
−0.2
V
mA
mA
V
0.12
0.15
2.55
V
V
0.05
0.23
0.30
V
10
200
mV
1.22
1.7
1.9
mA
0.12
1.5
2.0
uA
All limits are ensured by testing or statistical analysis.
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMV712-N LMV712-N-Q1
3
LMV712-N, LMV712-N-Q1
SNOS534I – FEBRUARY 2001 – REVISED JANUARY 2014
www.ti.com
2.7V Electrical Characteristics (continued)
Unless otherwise specified, all limits ensured for V+ = 2.7V, V − = 0V, VCM = 1.35V and TA = 25°C and RL > 1MΩ. Boldface
limits apply at the temperature extremes (−40°C ≤T J ≤85°C for LMV712 and −40°C ≤T J ≤125°C for LMV712-Q1).
Symbol
AVOL
Parameter
Large Signal Voltage Gain
Condition
Min
(1)
Sourcing
RL = 10kΩ
VO = 1.35V to 2.3V
LMV712
80
76
LMV712-Q1
69
Sinking
RL = 10kΩ
VO = 0.4V to 1.35V
LMV712
80
76
LMV712-Q1
69
Sourcing
RL = 600Ω
VO = 1.35V to 2.2V
LMV712
80
76
LMV712-Q1
64
Sinking
RL = 600Ω
VO = 0.5V to 1.35V
LMV712
80
76
LMV712-Q1
VSD
Shutdown Pin Voltage Range
GBWP
Gain-Bandwidth Product
SR
Slew Rate
φm
Phase Margin
en
Input Referred Voltage Noise
On Mode
Shutdown Mode
Max
(1)
115
Units
dB
115
113
dB
113
97
dB
97
100
dB
62
100
2.0 to 2.7
V
0 to 0.8
0 to 1
V
5
MHz
5
V/µs
f = 1kHz
60
Deg
20
nV/√Hz
2.2
Turn-On Time from Shutdown
TON
(3)
(2)
2.4 to 2.7
(3)
Turn-On Time from Shutdown
Typ
4
4.6
6
8
DSBGA
μs
μs
Number specified is the slower of the positive and negative slew rates.
5V Electrical Characteristics
Unless otherwise specified, all limits ensured for V+ = 5V, V − = 0V, VCM = 2.5V and TA = 25°C and RL > 1MΩ. Boldface limits
apply at the temperature extremes.
Symbol
Parameter
VOS
Input Offset Voltage
IB
Input Bias Current
Condition
VCM = 0.85V and
VCM = 1.85V
Min
Typ
Max
VSSOP
WSON
0.4
3
3.2
DSBGA
3
7
9
5.5
115
130
(1)
LMV712
(2)
LMV712-Q1
CMRR
(1)
(2)
4
Common Mode Rejection Ratio
(1)
Units
mV
pA
3600
0V ≤ VCM ≤ 5V
50
45
80
dB
All limits are ensured by testing or statistical analysis.
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMV712-N LMV712-N-Q1
LMV712-N, LMV712-N-Q1
www.ti.com
SNOS534I – FEBRUARY 2001 – REVISED JANUARY 2014
5V Electrical Characteristics (continued)
Unless otherwise specified, all limits ensured for V+ = 5V, V − = 0V, VCM = 2.5V and TA = 25°C and RL > 1MΩ. Boldface limits
apply at the temperature extremes.
Symbol
PSRR
CMVR
ISC
Parameter
Condition
Typ
70
68
90
70
68
90
(1)
2.7V ≤ V+ ≤ 5V,
VCM = 0.85V
Power Supply Rejection Ratio
Min
+
2.7V ≤ V ≤ 5V,
VCM = 1.85V
For CMRR ≥ 50dB
Common Mode Voltage Range
Output Short Circuit Current
(2)
−0.3
5.2
5.3
Sourcing
VO = 0V
20
18
35
Sinking
VO = 5V
25
21
50
4.92
4.90
4.98
RL = 10kΩ to 2.5V
0.01
VO
Output Swing
4.82
4.80
RL = 600Ω to 2.5V
VO(SD)
Output Voltage in Shutdown
On Mode
IS
Supply Current per Channel
Shutdown Mode
AVOL
Large Signal Voltage Gain
Sourcing
RL = 10kΩ
VO = 2.5V to 4.6V
LMV712
80
76
LMV712-Q1
69
Sinking
RL = 10kΩ
VO = 0.4V to 2.5V
LMV712
80
76
LMV712-Q1
69
Sourcing
RL = 600Ω
VO = 2.5V to 4.6V
LMV712
80
76
LMV712-Q1
69
Sinking
RL = 600Ω
VO = 0.4V to 2.5V
LMV712
80
76
LMV712-Q1
VSD
Shutdown Pin Voltage Range
GBWP
Gain-Bandwidth Product
SR
Slew Rate
φm
Phase Margin
en
Input Referred Voltage Noise
(3)
Max
(1)
Units
dB
dB
−0.2
V
V
mA
mA
V
0.12
0.15
4.85
V
V
0.05
0.23
0.30
V
10
200
mV
1.17
1.7
1.9
mA
0.12
1.5
2.0
uA
130
dB
130
130
dB
130
110
dB
110
107
dB
69
107
On Mode
4.5 to 5
3.5 to 5
Shutdown Mode
0 to 0.8
0 to 1.5
V
5
MHz
5
V/µs
(3)
f = 1kHz
V
60
Deg
20
nV/√Hz
Number specified is the slower of the positive and negative slew rates.
Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMV712-N LMV712-N-Q1
5
LMV712-N, LMV712-N-Q1
SNOS534I – FEBRUARY 2001 – REVISED JANUARY 2014
www.ti.com
5V Electrical Characteristics (continued)
Unless otherwise specified, all limits ensured for V+ = 5V, V − = 0V, VCM = 2.5V and TA = 25°C and RL > 1MΩ. Boldface limits
apply at the temperature extremes.
Symbol
Parameter
Condition
Min
(1)
Turn-On Time for Shutdown
TON
Turn-On Time for Shutdown
6
6
8
DSBGA
Typ
Max
Units
1.6
4
4.6
μs
(2)
(1)
μs
Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMV712-N LMV712-N-Q1
LMV712-N, LMV712-N-Q1
www.ti.com
SNOS534I – FEBRUARY 2001 – REVISED JANUARY 2014
Typical Performance Characteristics
Unless otherwise specified, VS = +5V, single supply, TA = 25°C.
Supply Current Per Channel
vs.
Supply Voltage
Supply Current
vs.
Supply Voltage (Shutdown)
1.5
0.6
85°C
1.3
0.5
25°C
IS (µA)
IS (mA)
1.1
-40°C
0.4
0.9
0.3
0.7
0.5
2.7 3.0
3.5
4.0
4.5
0.2
2.7 3.0
5.0
3.5
4.0
4.5
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
Figure 2.
Figure 3.
VOS
vs.
VCM
IB
vs.
VCM Over Temp
5.0
100
0
+85°C
-200
+70°C
10
-40°C
-600
IBIAS (pA)
VOS (µV)
-400
25°C
+50°C
1
+25°C
-800
0°C
0.1
85°C
-25°C
-1000
-40°C
0.01
-1200
0
1
2
3
4
5
0
3
4
5
Figure 4.
Figure 5.
Output Positive Swing
vs.
Supply Voltage, RL = 600Ω
Output Negative Swing
vs.
Supply Voltage, RL = 600Ω
100
140
90
VOUT FROM GND (mV)
25°C
85°C
120
+
VOUT FROM V (mV)
2
VCM (V)
160
100
80
-40°C
60
40
2.7
1
VCM (V)
25°C
85°C
80
70
60
-40°C
50
3.0
3.5
4.0
4.5
5.0
40
2.7
VS (V)
3.0
3.5
4.0
4.5
5.0
VS (V)
Figure 6.
Figure 7.
Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMV712-N LMV712-N-Q1
7
LMV712-N, LMV712-N-Q1
SNOS534I – FEBRUARY 2001 – REVISED JANUARY 2014
www.ti.com
Typical Performance Characteristics (continued)
Unless otherwise specified, VS = +5V, single supply, TA = 25°C.
Sourcing Current
vs.
Output Voltage, VS = 2.7V
Sourcing Current
vs.
Output Voltage, VS = 5V
35
30
85°C
85°C
30
25
25
ISOURCE (mA)
ISOURCE (mA)
25°C
20
-40°C
15
10
-40°C
25°C
20
15
10
5
5
0
-0.3
0
0.2
0.7
1.2
1.7
2.2
0
2.7
1
+
2
3
4
VOUT FROM V (V)
VOUT (V)
Figure 8.
Figure 9.
Sinking Current
vs.
Output Voltage, VS = 2.7V
Sinking Current
vs.
Output Voltage, VS = 5V
90
70
85°C
85°C
80
60
70
50
25°C
60
25°C
40
ISINK (mA)
ISINK (mA)
5
30
-40°C
20
-40°C
50
40
30
20
10
10
0
0
-10
-0.3
-10
0.2
0.7
1.7
1.2
VOUT (V)
2.2
0
2.7
1
2
3
4
5
VOUT (V)
Figure 10.
Figure 11.
PSRR
vs.
Frequency VS = 2.7V
PSRR
vs.
Frequency VS = 5V
100
100
90
90
80
80
NEGATIVE
NEGATIVE
70
PSRR (dB)
PSRR (dB)
70
60
50
40
POSITIVE
30
60
50
40
POSITIVE
30
20
20
10
10
0
0
10
100
1k
10k
100k
1M
10
Figure 12.
8
100
1k
10k
100k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 13.
Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMV712-N LMV712-N-Q1
LMV712-N, LMV712-N-Q1
www.ti.com
SNOS534I – FEBRUARY 2001 – REVISED JANUARY 2014
Typical Performance Characteristics (continued)
Unless otherwise specified, VS = +5V, single supply, TA = 25°C.
CMRR
vs.
Frequency
CMRR
vs.
Frequency
100
100
VS = 2.7V
90
90
dVCM = 0.2V TO 1.2V
80
80
70
CMRR (dB)
60
50
40
60
50
40
30
30
20
20
10
10
0
0
10
100
1k
10k
dVCM = 2V TO 3V
10
1M
100k
VS = 5V
100
1k
FREQUENCY (Hz)
Open Loop Frequency Response
vs.
RL
Open Loop Frequency Response
vs.
RL
80
VS = 2.7V
VS = 5V
70
60
60
10k:
50
RL = 10k:
600:
90
20
60
40
RL = 600:
RL = 600:
30
90
60
20
10
30
10
30
0
0
0
0
10k:
-10
-20
1k
10k
100k
RL = 10k:
-10
1M
-20
1k
10M
10k
FREQUENCY (Hz)
80
70
100k
1M
10M
FREQUENCY (Hz)
Figure 16.
Figure 17.
Open Loop Frequency Response
vs.
CL
Open Loop Frequency Response
vs.
CL
80
VS = 2.7V
VS = 5V
70
CL = 0pF
CL = 0pF
60
90
50
60
50
60
30
CL = 100pF
30
20
0
CL = 1000pF
CL = 1000pF
10
0
-20
1k
100k
CL = 100pF
30
30
0
CL = 1000pF
20
CL = 1000pF
0
CL = 100pF
-10
CL = 0pF
10k
40
10
CL = 100pF
-10
GAIN (dB)
90
PHASE (Deg)
60
40
PHASE (Deg)
600:
30
GAIN (dB)
50
PHASE (Deg)
GAIN (dB)
1M
Figure 15.
80
GAIN (dB)
100k
Figure 14.
70
40
10k
FREQUENCY (Hz)
PHASE (Deg)
CMRR (dB)
70
1M
10M
-20
1k
FREQUENCY (Hz)
CL = 0pF
10k
100k
1M
10M
FREQUENCY (Hz)
Figure 18.
Figure 19.
Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMV712-N LMV712-N-Q1
9
LMV712-N, LMV712-N-Q1
SNOS534I – FEBRUARY 2001 – REVISED JANUARY 2014
www.ti.com
Typical Performance Characteristics (continued)
Unless otherwise specified, VS = +5V, single supply, TA = 25°C.
Voltage Noise
vs.
Frequency
Voltage Noise
vs.
Frequency
1000
1000
INPUT VOLTAGE NOISE (nV/ Hz)
INPUT VOLTAGE NOISE (nV/ Hz)
VS = 2.7V
VCM = 1.35V
VSD = 2.7V
100
10
VS = 5V
VCM = 2.5V
VSD = 5V
100
10
1
1
1
10
100
1k
FREQUENCY (Hz)
10k
1
100k
100
1k
FREQUENCY (Hz)
10k
100k
Figure 21.
Non-Inverting Large Signal Pulse Response, VS = 2.7V
Non-Inverting Large Signal Pulse Response, VS = 5V
OUTPUT
OUTPUT
(1V/div)
(1V/div)
INPUT
INPUT
Figure 20.
TIME (500ns/div)
TIME (500ns/div)
Figure 23.
Non-Inverting Small Signal Pulse Response, VS = 2.7V
Non-Inverting Small Signal Pulse Response, VS = 5V
OUTPUT
OUTPUT
(50mV/div)
(50mV/div)
INPUT
INPUT
Figure 22.
TIME (500ns/div)
TIME (500ns/div)
Figure 24.
10
10
Figure 25.
Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMV712-N LMV712-N-Q1
LMV712-N, LMV712-N-Q1
www.ti.com
SNOS534I – FEBRUARY 2001 – REVISED JANUARY 2014
Typical Performance Characteristics (continued)
Unless otherwise specified, VS = +5V, single supply, TA = 25°C.
INPUT
Inverting Large Signal Pulse Response, VS = 5V
OUTPUT
OUTPUT
(1V/div)
(1V/div)
INPUT
Inverting Large Signal Pulse Response, VS = 2.7V
TIME (500ns/div)
Figure 26.
Figure 27.
Inverting Small Signal Pulse Response, VS = 2.7V
Inverting Small Signal Pulse Response VS = 5V
(50mV/div)
OUTPUT
OUTPUT
(50mV/div)
INPUT
INPUT
TIME (500ns/div)
TIME (500ns/div)
TIME (500ns/div)
Figure 28.
Figure 29.
Turn on Time Response VS = 5V
Input Common Mode Capacitance
vs.
VCM VS = 5V
SHUTDOWN
PULSE
30
26
CCM TO GROUND
FMEAS = 1MHz
FOLLOWER CONFIG
24
VOUT FOLLOWS VIN (VCM)
OUTPUT
VOLTAGE
CDIFF (pF)
(2V/div)
28
22
20
18
16
14
12
10
0
TIME (2µs/div)
1
2
3
4
5
VCM (V)
Figure 30.
Figure 31.
Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMV712-N LMV712-N-Q1
11
LMV712-N, LMV712-N-Q1
SNOS534I – FEBRUARY 2001 – REVISED JANUARY 2014
www.ti.com
APPLICATION INFORMATION
Theory Of Operation
The LMV712-N dual op amp is derived from the LMV711 single op amp. Figure 32 contains a simplified
schematic of one channel of the LMV712-N.
V
+
VBIAS
IP
MP3
Q2
MP1
IN
MP2
+
MP4
Q1
MN2
IN
-
CLASS AB
CONTROL
OUT
MN3
MN1
Q3
Q4
Q6
Q5
IN
V
MN4
VBIAS
-
SD
BIAS
CONTROL
Figure 32.
Rail-to-Rail input is achieved by using in parallel, one NMOS differential pair (MN1 and MN2) and one PMOS
differential pair (MP1 and MP2). When the common mode input voltage (VCM) is near V+, the NMOS pair is on
and the PMOS pair is off. When VCM is near V−, the NMOS pair is off and the PMOS pair is on. When VCM is
between V+ and V−, internal logic decides how much current each differential pair will get. This special logic
ensures stable and low distortion amplifier operation within the entire common mode voltage range.
Because both input stages have their own offset voltage (VOS) characteristic, the offset voltage of the LMV712-N
becomes a function of VCM. VOS has a crossover point at 1.4V above V−. Refer to the "VOS vs. VCM" curve in the
Typical Performance Characteristics section. Caution should be taken in situations where input signal amplitude
is comparable to VOS value and/or the design requires high accuracy. In these situations, it is necessary for the
input signal to avoid the crossover point.
The current coming out of the input differential pairs gets mirrored through two folded cascode stages (Q1, Q2,
Q3, Q4) into the "class AB control" block. This circuitry generates voltage gain, defines the op amp's dominant
pole and limits the maximum current flowing at the output stage. MN3 introduces a voltage level shift and acts as
a high impedance to low impedance buffer.
The output stage is composed of a PMOS and a NPN transistor in a common source/emitter configuration,
delivering a rail-to-rail output excursion.
The MN4 transistor ensures that the LMV712-N output remains near V− when the amplifier is in shutdown mode.
Shutdown Pin
The LMV712-N offers independent shutdown pins for the dual amplifiers. When the shutdown pin is tied low, the
respective amplifier shuts down and the supply current is reduced to less than 1µA. In shutdown mode, the
amplifier's output level stays at V−. In a 2.7V operation, when a voltage between 1.5V to 2.7V is applied to the
shutdown pin, the amplifier is enabled. As the amplifier is coming out of the shutdown mode, the output
waveform ramps up without any glitch. This is demonstrated in Figure 33.
12
Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMV712-N LMV712-N-Q1
LMV712-N, LMV712-N-Q1
SNOS534I – FEBRUARY 2001 – REVISED JANUARY 2014
OUTPUT
VOLTAGE
(2V/div)
SHUTDOWN
PULSE
www.ti.com
TIME (2µs/div)
Figure 33.
A glitch-free output waveform is highly desirable in many applications, one of which is power amplifier control
loops. In this application, the LMV712-N is used to drive the power amplifier's power control. If the LMV712-N did
not have a smooth output ramp during turn on, it would directly cause the power amplifier to produce a glitch at
its output. This adversely affects the performance of the system.
To enable the amplifier, the shutdown pin must be pulled high. It should not be left floating in the event that any
leakage current may inadvertently turn off the amplifier.
Printed Circuit Board Consideration
To properly bypass the power supply, several locations on a printed circuit board need to be considered. A 6.8µF
or greater tantalum capacitor should be placed at the point where the power supply for the amplifier is introduced
onto the board. Another 0.1µF ceramic capacitor should be placed as close as possible to the power supply pin
of the amplifier. If the amplifier is operated in a single power supply, only the V+ pin needs to be bypassed with a
0.1µF capacitor. If the amplifier is operated in a dual power supply, both V+ and V− pins need to be bypassed.
It is good practice to use a ground plane on a printed circuit board to provide all components with a low inductive
ground connection.
Surface mount components in 0805 size or smaller are recommended in the LMV712-N application circuits.
Designers can take advantage of the DSBGA, VSSOP and WSON miniature sizes to condense board layout in
order to save space and reduce stray capacitance.
Capacitive Load Tolerance
The LMV712-N can directly drive 200pF in unity-gain without oscillation. The unity-gain follower is the most
sensitive configuration to capacitive loading. Direct capacitive loading reduces the phase margin of amplifiers.
The combination of the amplifier's output impedance and the capacitive load induces phase lag. This results in
either an under-damped pulse response or oscillation. To drive a heavier capacitive load, Figure 34 can be used.
Figure 34.
In Figure 34, the isolation resistor RISO and the load capacitor CL form a pole to increase stability by adding more
phase margin to the overall system. The desired performance depends on the value of RISO. The bigger the RISO
resistor value, the more stable VOUT will be. But the DC accuracy is degraded when the RISO gets bigger. If there
were a load resistor in Figure 34, the output voltage would be divided by RISO and the load resistor.
Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMV712-N LMV712-N-Q1
13
LMV712-N, LMV712-N-Q1
SNOS534I – FEBRUARY 2001 – REVISED JANUARY 2014
www.ti.com
The circuit in Figure 35 is an improvement to the one in Figure 34 because it provides DC accuracy as well as
AC stability. In this circuit, RF provides the DC accuracy by using feed-forward techniques to connect VIN to RL.
CF and RISO serve to counteract the loss of phase margin by feeding the high frequency component of the output
signal back to the amplifier's inverting input, thereby preserving phase margin in the overall feedback loop.
Increased capacitive drive is possible by increasing the value of CF. This in turn will slow down the pulse
response.
Figure 35.
Latchup
CMOS devices tend to be susceptible to latchup due to their internal parasitic SCR (silicon controlled rectifier)
effects. The input and output pins look similar to the gate of the SCR. There is a minimum current required to
trigger the SCR gate lead. The LMV712-N is designed to withstand 150mA surge current on all the pins. Some
resistive method should be used to isolate any capacitance from supplying excess current to the pins. In addition,
like an SCR, there is a minimum holding current for any latchup mode. Limiting current to the supply pins will
also inhibit latchup susceptibility.
14
Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMV712-N LMV712-N-Q1
LMV712-N, LMV712-N-Q1
www.ti.com
SNOS534I – FEBRUARY 2001 – REVISED JANUARY 2014
CONNECTION DIAGRAMS
*Connect thermal pad to V- or leave floating
10
-IN A
9
2
3
-
+
OUT B
+
+
+IN A
V
V
8
-
-IN B
4
OUT A 1
-IN A
2
+IN A
3
7
5
6
SD A
-
+IN B
V
SD B
SD A
10 V
-
+
+
4
5
-
1
OUT A
-
+
9
OUT B
8
-IN B
7
+IN B
6
SD B
Figure 36. 10-Pin VSSOP (Top View)
Figure 37. 10-Pin WSON (Top View)
A2
+
V
A2
+
V
A1
OUT
A
A3
OUTB
A3
OUTB
A1
OUT
A
B1
-INA
B
3
-INB
B
3
-INB
B1
-INA
C1
+INA
C3
+INB
C
3
+INB
C1
+INA
D1
SDA
D3
SDB
D3
SDB
D1
SDA
-
-
V
D2
V
D2
Figure 38. 10-Bump DSBGA (Top View)
Figure 39. 10-Bump DSBGA (Bottom View)
Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMV712-N LMV712-N-Q1
15
LMV712-N, LMV712-N-Q1
SNOS534I – FEBRUARY 2001 – REVISED JANUARY 2014
www.ti.com
REVISION HISTORY
Changes from Revision H (Feb 2013) to Revision I
•
Page
Added Q1 part ...................................................................................................................................................................... 1
Changes from Revision G (February 2013) to Revision H
•
16
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 15
Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMV712-N LMV712-N-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMV712LD/NOPB
ACTIVE
WSON
NGY
10
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
A62
LMV712LDX/NOPB
ACTIVE
WSON
NGY
10
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
A62
LMV712MM
NRND
VSSOP
DGS
10
1000
TBD
Call TI
Call TI
-40 to 85
A61
LMV712MM/NOPB
ACTIVE
VSSOP
DGS
10
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
A61
LMV712MMX
NRND
VSSOP
DGS
10
TBD
Call TI
Call TI
-40 to 85
A61
LMV712MMX/NOPB
ACTIVE
VSSOP
DGS
10
3500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
A61
LMV712Q1MM/NOPB
ACTIVE
VSSOP
DGS
10
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
AUA
LMV712Q1MMX/NOPB
ACTIVE
VSSOP
DGS
10
3500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
AUA
LMV712TL/NOPB
ACTIVE
DSBGA
YPA
10
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
AU2A
LMV712TLX/NOPB
ACTIVE
DSBGA
YPA
10
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
AU2A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2015
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMV712-N, LMV712-N-Q1 :
• Catalog: LMV712-N
• Automotive: LMV712-N-Q1
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
LMV712LD/NOPB
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
WSON
NGY
10
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LMV712LDX/NOPB
WSON
NGY
10
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LMV712MM
VSSOP
DGS
10
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV712MM/NOPB
VSSOP
DGS
10
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV712MMX/NOPB
VSSOP
DGS
10
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV712Q1MM/NOPB
VSSOP
DGS
10
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV712Q1MMX/NOPB
VSSOP
DGS
10
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV712TL/NOPB
DSBGA
YPA
10
250
178.0
8.4
1.68
2.13
0.76
4.0
8.0
Q1
LMV712TLX/NOPB
DSBGA
YPA
10
3000
178.0
8.4
1.68
2.13
0.76
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMV712LD/NOPB
WSON
NGY
10
1000
213.0
191.0
55.0
LMV712LDX/NOPB
WSON
NGY
10
4500
367.0
367.0
35.0
LMV712MM
VSSOP
DGS
10
1000
210.0
185.0
35.0
LMV712MM/NOPB
VSSOP
DGS
10
1000
210.0
185.0
35.0
LMV712MMX/NOPB
VSSOP
DGS
10
3500
367.0
367.0
35.0
LMV712Q1MM/NOPB
VSSOP
DGS
10
1000
210.0
185.0
35.0
LMV712Q1MMX/NOPB
VSSOP
DGS
10
3500
367.0
367.0
35.0
LMV712TL/NOPB
DSBGA
YPA
10
250
210.0
185.0
35.0
LMV712TLX/NOPB
DSBGA
YPA
10
3000
210.0
185.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NGY0010A
LDA10A (Rev B)
www.ti.com
MECHANICAL DATA
YPA0010
0.600
±0.075
D
E
TLP10XXX (Rev D)
D: Max = 2.048 mm, Min =1.987 mm
E: Max = 1.565 mm, Min =1.504 mm
4215069/A
NOTES:
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
www.ti.com
12/12
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
Similar pages