Product Folder Sample & Buy Support & Community Tools & Software Technical Documents OPT8241 SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 OPT8241 3D Time-of-Flight Sensor 1 Features 2 Applications • • 1 • • • • • • • • • Imaging Array: – 320 × 240 Array – 1/3” Optical Format – Pixel Pitch: 15 µm – Up to 150 Frames per Second Optical Properties: – Responsivity: 0.35 A/W at 850 nm – Demodulation Contrast: 45% at 50 MHz – Demodulation Frequency: 10 MHz to 100 MHz Output Data Format: – 12-Bit Phase Correlation Data – 4-Bit Common-Mode (Ambient) Chipset Interface: – Compatible with TI's Time-of-Flight Controller OPT9221 Sensor Output Interface: – CMOS Data Interface (50-MHz DDR, 16-Lane Data, Clock and Frame Markers) – LVDS: – 600 Mbps, 3 Data Pairs – 1-LVDS Bit Clock Pair, 1-LVDS Sample Clock Pair Timing Generator (TG): – Addressing Engine with Programmable Region of Interest (ROI) – Modulation Control – De-Aliasing – Master, Slave Sync Operation I2C Slave Interface for Control Power Supply: – 3.3-V I/O, Analog – 1.8-V Analog, Digital, I/O – 1.5-V Demodulation (Typical) Optimized Optical Package (COG-78): – 8.757 mm × 7.859 mm × 0.7 mm – Integrated Optical Band-Pass Filter (830 nm to 867 nm) – Optical Fiducials for Easy Alignment Operating Temperature: 0°C to 70°C Depth Sensing: – Location and Proximity Sensing – 3D Scanning – 3D Machine Vision – Security and Surveillance – Gesture Controls – Augmented and Virtual Reality 3 Description The OPT8241 time-of-flight (ToF) sensor is part of the TI 3D ToF image sensor family. The device combines ToF sensing with an optimally-designed analog-to-digital converter (ADC) and a versatile, programmable timing generator (TG). The device offers quarter video graphics array (QVGA 320 x 240) resolution data at frame rates up to 150 frames per second (600 readouts per second). The built-in TG controls the reset, modulation, readout, and digitization sequence. The programmability of the TG offers flexibility to optimize for various depth-sensing performance metrics (such as power, motion robustness, signal-to-noise ratio, and ambient cancellation). Device Information(1) PART NUMBER OPT8241 PACKAGE BODY SIZE (NOM) COG (78) 7.859 mm × 8.757 mm (1) For all available packages, see the package option addendum at the end of the data sheet. Block Diagram OPT8241 ILLUM_P ILLUM_N ILLUM_EN DMIX0, DMIX1 Modulation Block CLK Generator Mix Drivers CLK, CTRL MCLK Row Sensor Core Reset Column Analog Timing Generator Addressing Engine CLK, CTRL Analog Processing VD_IN Analog CLK, CTRL CLK, CTRL VD_FR VD_QD VD_SF HD_QD Temperature Sensor ADC REG I2C Digital Serializer Output Block LVDS CMOS Data CLKOUT 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. OPT8241 SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 7 1 1 1 2 3 6 Absolute Maximum Ratings ...................................... 6 ESD Ratings.............................................................. 6 Recommended Operating Conditions....................... 6 Thermal Information .................................................. 7 Electrical Characteristics........................................... 7 Timing Requirements ................................................ 8 Switching Characteristics .......................................... 8 Optical Characteristics .............................................. 9 Typical Characteristics ............................................ 10 Detailed Description ............................................ 11 7.1 Overview ................................................................. 11 7.2 Functional Block Diagram ....................................... 11 7.3 Feature Description................................................. 12 7.4 Device Functional Modes........................................ 13 7.5 Programming .......................................................... 13 8 Application and Implementation ........................ 14 8.1 Application Information............................................ 14 8.2 Typical Applications ................................................ 15 9 Power Supply Recommendations...................... 24 10 Layout................................................................... 24 10.1 Layout Guidelines ................................................. 24 10.2 Layout Example .................................................... 26 10.3 Mechanical Assembly Guidelines ......................... 27 11 Device and Documentation Support ................. 28 11.1 11.2 11.3 11.4 11.5 Documentation Support ........................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 28 28 28 28 28 12 Mechanical, Packaging, and Orderable Information ........................................................... 28 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (June 2015) to Revision B Page • Changed equations to correct format throughout document ................................................................................................. 1 • Changed name of Function column in Pin Functions table ................................................................................................... 4 • Changed SCL and SDATA pin descriptions in Pin Functions table ...................................................................................... 5 • Added parameter names to Sensor section of Electrical Characteristics table .................................................................... 7 • Changed depth resolution description in Table 5 ................................................................................................................ 21 Changes from Original (June 2015) to Revision A • 2 Page Released to production........................................................................................................................................................... 1 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 OPT8241 www.ti.com SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 5 Pin Configuration and Functions NBN Package COG-78 Top View (Representative, Not to Scale) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 A NC GPO[0] SDATA GND VMIXH VMIXH GND GND VMIXH VMIXH GND ILLUM_P ILLUM_N DVDDH GND ILLUM_ EN AVDDH AVDD_ PLL NC B GPO[1] SCLK SUB_ BIAS MCLK C VD_IN RSTZ NC DEMOD_ CLK D HD_QD AVDD RFU TP2 E VD_QD AVSS PVDD QPORT F VD_FR REFM AVSS_ PLL IOVDD G IOVSS REFP AVDD DVSS H IOVDD AVSS AVSS DVDD J CMOS[14] VD_SF TP1 SUM_M K CMOS[13] CMOS[15] SUM_P DIFF1_M L CMOS[12] CMOS[11] DIFF1_P DCLKM M NC CMOS[10] CMOS[9] CMOS[8] CLKOUT CMOS[7] CMOS[6] CMOS[5] CMOS[4] CMOS[3] CMOS[2] CMOS[1] CMOS[0] PCLK_P PCLK_M DIFF0_P DIFF0_M DCLKP Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 NC 3 OPT8241 SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 www.ti.com Pin Functions PIN NAME AVDD AVDD_PLL AVDDH DESCRIPTION NO. FUNCTION I/O BANK D3, G17 Power — 1.8-V analog VDD A18 Power — 1.8-V PLL VDD A17 Power — 3.3-V analog VDD E3, H3, H17 GND — Analog ground AVSS_PLL F17 GND — PLL GND CLKOUT M5 O IOVDD Parallel data clock output CMOS[0] M13 O IOVDD Parallel data output bit 0 CMOS[1] M12 O IOVDD Parallel data output bit 1 CMOS[2] M11 O IOVDD Parallel data output bit 2 CMOS[3] M10 O IOVDD Parallel data output bit 3 CMOS[4] M9 O IOVDD Parallel data output bit 4 CMOS[5] M8 O IOVDD Parallel data output bit 5 CMOS[6] M7 O IOVDD Parallel data output bit 6 CMOS[7] M6 O IOVDD Parallel data output bit 7 CMOS[8] M4 O IOVDD Parallel data output bit 8 CMOS[9] M3 O IOVDD Parallel data output bit 9 CMOS[10] M2 O IOVDD Parallel data output bit 10 CMOS[11] L3 O IOVDD Parallel data output bit 11 CMOS[12] L1 O IOVDD Parallel data output bit 12 CMOS[13] K1 O IOVDD Parallel data output bit 13 CMOS[14] J1 O IOVDD Parallel data output bit 14 CMOS[15] K3 O IOVDD Parallel data output bit 15 DCLKM L19 O LVDS Negative LVDS bit clock DCLKP M18 O LVDS Positive LVDS bit clock DEMOD_CLK C19 I IOVDD Demodulation clock input (optional). This pin has a weak internal pulldown resistor. DIFF0_M M17 O LVDS Negative LVDS DIFF0 data pin DIFF0_P M16 O LVDS Positive LVDS DIFF0 data pin DIFF1_M K19 O LVDS Negative LVDS DIFF1 data pin Positive LVDS DIFF1 data pin AVSS DIFF1_P L17 O LVDS DVDD H19 Power — 1.8-V digital VDD DVDDH A14 Power — 3.3-V digital VDD DVSS G19 GND — Digital GND GND Ground A4, A7, A8, A11, A15 GND — GPO[0] A2 O IOVDD General-purpose output GPO[1] B1 O IOVDD General-purpose output HD_QD D1 O IOVDD Quad-frame line sync output ILLUM_EN A16 O DVDDH Illumination enable ILLUM_N A13 O DVDDH Illumination modulation signal; active low Illumination modulation signal; active high ILLUM_P A12 O DVDDH IOVDD H1, F19 Power — 1.8-V to 3.3-V IOVDD IOVSS G1 GND — I/O GND MCLK B19 I IOVDD A1, A19, C17, M1, M19 NC — M15 O LVDS NC PCLK_M 4 Main clock input for TG. This pin has a weak internal pulldown resistor. No connection Negative LVDS pixel clock Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 OPT8241 www.ti.com SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 Pin Functions (continued) PIN NAME NO. FUNCTION I/O BANK DESCRIPTION PCLK_P M14 O LVDS PVDD E17 Power — Positive LVDS pixel clock QPORT E19 I/O IOVDD REFM F3 Analog In — Connect REFM to GND REFP G3 Analog Out — ADC reference; connect a 10-nF capacitor close to REFM and REFP. RFU D17 RFU — Reserved for future use RSTZ C3 I IOVDD Sensor reset input. This pin has a weak internal pullup resistor. SCL B3 I IOVDD Clock I2C slave interface SDATA A3 I/O IOVDD Data I2C slave interface SUB_BIAS B17 Power — SUM_M J19 O LVDS Negative LVDS sum data SUM_P K17 O LVDS Positive LVDS sum data TP1 J17 O — Debug pin 1, connect to a test pad on the board TP2 D19 O — Debug pin 2, connect to a test pad on the board VD_FR F1 O IOVDD Frame sync output VD_IN C1 I IOVDD Frame sync input (optional) VD_QD E1 O IOVDD Quad-frame sync output VD_SF J3 O — Sub-frame sync output VMIXH A5, A6, A9, A10 Power — Mix driver power 3.3-V pixel VDD Debug port. Pullup with an external 1-kΩ resistor to IOVDD instead. Substrate bias Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 5 OPT8241 SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT IOVDD Digital I/O supply –0.3 4.0 V AVDDH Analog supply –0.3 4.0 V DVDDH Digital I/O supply –0.3 4.0 V PVDD Pixel supply –0.3 4.0 V AVDD Analog supply –0.3 2.2 V VMIXH Mix supply –0.3 2.5 V DVDD Digital supply –0.3 2.2 V AVDD_PLL PLL supply –0.3 2.2 V VI Input voltage at input pins –0.3 VCC + 0.3 (2) V TJ Operating junction temperature 0 125 °C Tstg Storage temperature –40 125 °C (1) (2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. VCC refers to the I/O bank voltage. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±1000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±250 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX IOVDD Digital I/O supply 1.7 1.8 to 3.3 3.6 V AVDDH Analog supply 3.0 3.3 3.6 V DVDDH Digital I/O supply 3.0 3.3 3.6 V PVDD Pixel supply 3.0 3.3 3.6 V AVDD Analog supply 1.7 1.8 1.9 V VMIXH Mix supply 1.4 1.5 2.0 V DVDD Digital supply 1.7 1.8 1.9 V AVDD_PLL PLL supply 1.7 1.8 1.9 V TA Operating ambient temperature 70 °C 6 0 Submit Documentation Feedback UNIT Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 OPT8241 www.ti.com SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 6.4 Thermal Information OPT8241 THERMAL METRIC (1) NBN (COG) UNIT 78 PINS Without underfill 79.2 °C/W With underfill 41.0 °C/W 18.6 °C/W 51.0 °C/W Junction-to-top characterization parameter 6.3 °C/W Junction-to-board characterization parameter 51.1 °C/W Junction-to-case (bottom) thermal resistance 18.6 °C/W RθJA Junction-to-ambient thermal resistance RθJC(top) Junction-to-case (top) thermal resistance RθJB Junction-to-board thermal resistance ψJT ψJB RθJC(bot) (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6.5 Electrical Characteristics All specifications at TA = 25°C, VAVDDH = 3.3 V, VAVDD = 1.8 V, VVMIXH = 1.5 V, VDVDD = 1.8 V, VDVDDH = 3.3 V, VPVDD = 3.3 V, VSUB_BIAS = 0 V, integration duty cycle = 10%, system clock frequency = 48 MHz, modulation frequency = 50 MHz, and 850 nm illumination, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SENSOR V Maximum rows 240 Rows H Maximum columns 320 Columns PP Pixel pitch 15 μm 9 mA POWER (Normal Operation) IAVDD_PLL PLL supply current IAVDD Analog supply current IDVDDH 3.3-V digital supply current IAVDDH 3.3-V analog supply current IPVDD Pixel VDD current IVMIXH IIOVDD IDVDD Demodulation current Without dynamic power-down 40 With dynamic power-down 20 5 Without dynamic power-down 17 With dynamic power-down 7 10% integration duty cycle 70 100% integration duty cycle 600 2 I/O supply current (CMOS mode) 20 I/O supply current (LVDS mode) 2 Digital supply current mA mA mA mA mA mA 45 mA POWER (Standby) IIOVDD I/O supply current 0.7 mA IAVDD_PLL PLL supply current 0.3 mA IAVDD Analog supply current 0.3 mA IDVDD Digital supply current 0.6 mA IDVDDH 3.3-V digital supply current 1.1 mA IAVDDH 3.3-V analog supply current 0.2 mA IVMIXH Demodulation current 0 mA IPVDD Pixel VDD current 0 mA Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 7 OPT8241 SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 www.ti.com Electrical Characteristics (continued) All specifications at TA = 25°C, VAVDDH = 3.3 V, VAVDD = 1.8 V, VVMIXH = 1.5 V, VDVDD = 1.8 V, VDVDDH = 3.3 V, VPVDD = 3.3 V, VSUB_BIAS = 0 V, integration duty cycle = 10%, system clock frequency = 48 MHz, modulation frequency = 50 MHz, and 850 nm illumination, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT CMOS I/Os VIH VIL Input low-level threshold VOH Output high level VOL Output Low Level II Input pin leakage current CI Input capacitance IOH 0.3 × VCC V (1) IOH = –2 mA VCC (1) – 0.45 IOH = –8 mA VCC (1) – 0.5 V V IOL = 2 mA 0.35 IOL = 8 mA 0.65 Pins with pullup, pulldown resistor ±50 Pins without pullup, pulldown resistor ±10 V µA 5 pF 10 Output current IOL (1) 0.7 × VCC (1) Input high-level threshold mA 10 VCC is equal to IOVDD or DVDDH, based on the I/O bank listed in the Pin Functions table. 6.6 Timing Requirements MIN NOM MAX MCLK duty cycle 48% 52% MCLK frequency 12 50 VD_IN pulse duration UNIT MHz 2 × MCLK period ns RTSZ low pulse duration (reset) 100 ns 6.7 Switching Characteristics over operating free-air temperature range (unless otherwise noted); VDVDD = 1.8 V, VDVDDH = 3.3 V, and VIOVDD = 1.8 V PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DDR LVDS MODE tSU Data setup time Data valid to zero crossing of DCLKP, DCLKM 0.48 ns tH Data hold time Zero crossing of DCLKP, DCLKM to data becoming invalid 0.54 ns tFALL, tRISE Data fall time, data rise time Rise time measured from –100 mV to +100 mV 0.35 ns tCLKRISE, tCLKFALL Output clock rise time, output clock fall time Rise time measured from –100 mV to +100 mV 0.35 ns PARALLEL CMOS MODE tSU Data setup time Data valid to zero crossing of CLKOUT 1.5 ns tH Data hold time Zero crossing of CLKOUT to data becoming invalid 3.5 ns tFALL, tRISE Data fall time, data rise time Rise time measured from 30% to 70% of IOVDD 2.5 ns tCLKRISE, tCLKFALL Output clock rise time, output clock fall time Rise time measured from 30% to 70% of IOVDD 2.2 ns 8 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 OPT8241 www.ti.com SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 6.8 Optical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN Glass side AOI MAX Top UNIT Side Passband (50% relative transmittance (1)) 0° incident angle 813 to 893 nm 30° incident angle 798 to 877 nm Passband (90% relative transmittance (1)) 0° incident angle 830 to 881 nm 30° incident angle 838 to 867 Recommended angle of incidence Maximum absolute transmittance (1) TYP nm 0 35 Degrees 0° incident angle 87.34% at 863 nm 30° incident angle 81.89% at 855 nm Relative transmittance is a ratio of transmittance to maximum absolute transmittance at the same angle of incidence. DCLKM Output Clock DCLKP tSU Dn(1) Output Data Pair (1) tH tSU tH Dn+1(1) Dn = bits D0, D2, D4, and so forth. Dn+1 = bits D1, D3, D5, and so forth. Figure 1. LVDS Switching Diagram Output Clock CLKOUT tSU tH tSU tH Output Data CMOSn (2) Dn(1) Dn(1) Dn = bits D0, D1, D2, and so forth. Figure 2. CMOS Switching Diagram Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 9 OPT8241 SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 www.ti.com 6.9 Typical Characteristics At VAVDDH = 3.3 V, VAVDD = 1.8 V, VVMIXH = 1.5 V, VDVDD = 1.8 V, VDVDDH = 3.3 V, VPVDD = 3.3 V, VSUB_BIAS = 0 V, and integration duty cycle = 10%, unless otherwise noted. 40 1.4 1.2 ISUB_BIAS (mA) Normalized IVMIXH 30 1 0.8 0.6 20 10 0.4 0 0.2 0 0 0.3 0.6 0.9 1.2 1.5 VVMIXH (V) 1.8 2.1 2.4 2.7 -10 -8 -7 -6 -5 -4 -3 VSUB_BIAS (V) -2 -1 0 Normalized to VMIXH = 1.5 V Figure 3. Normalized VMIXH Supply Current vs VMIXH Supply Voltage Figure 4. VSUB_BIAS Supply Current vs VSUB_BIAS Supply Voltage 90 80 Incident Angle = 0 q Incident Angle = 30 q Transmitivity (%) 70 60 50 40 30 20 10 0 350 450 550 650 750 850 Light Wavelength (nm) 950 1050 Figure 5. Optical Filter Transitivity vs Light Wavelength 10 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 OPT8241 www.ti.com SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 7 Detailed Description 7.1 Overview The OPT8241 is a high-performance quarter video graphics array (QVGA) resolution, 3D sensor device that senses depth information based on the time of flight (ToF) technique. The OPT8241 has a CMOS image sensor core with an integrated analog-to-digital converter (ADC), an addressing engine for the sensor core, an lowvoltage differential signaling (LVDS) serializer, and an I2C slave device. The device supports configurable timings to optimize power and performance. The OPT8241 includes the following blocks: • Timing generator (TG) • Sensor core • Addressing engine • ADC and overload detection • Modulation block • Output block • Temperature sensor • I2C control interface 7.2 Functional Block Diagram OPT8241 ILLUM_P Modulation Block DMIX0, DMIX1 CLK Generator Mix Drivers MCLK ILLUM_N ILLUM_EN CLK, CTRL Sensor Core Reset Row Column Analog Addressing Engine CLK, CTRL Timing Generator Analog Processing VD_IN Analog Temperature Sensor CLK, CTRL ADC REG CLK, CTRL I2C Digital Serializer VD_FR VD_QD LVDS Output Block VD_SF CMOS Data HD_QD CLKOUT Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 11 OPT8241 SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 www.ti.com 7.3 Feature Description 7.3.1 Output Block The output block provides the output data, clock, and frame boundary signals. The positions of the following frame boundary marker signals are programmable. Table 1 lists signals that can be used by the host processor to reconstruct the frame. Table 1. Output Frame Marker Signals SIGNAL TYPE VD_FR Output DESCRIPTION Frame sync VD_SF Output Sub-frame sync VD_QD Output Quad sync HD_QD Output Row sync 7.3.1.1 Serializer and LVDS Output Interface The sensor has an option for a serial LVDS interface. The digitized data from the ADCs are serialized and sent on three LVDS data pairs and one LVDS pixel clock pair. The DIFF0, DIFF1 pairs provide the differential data (A-B). The differential data for each pixel is 12 bits long. The pixel clock pair is 0 for the first six data bits and 1 for the next six data bits. The pixel clock can be used by the external host to identify the boundary of the 12-bit data for each pixel. The LVDS waveforms are shown in Figure 6. DCLKP, DCLKM PCLK_P, PCLK_M DIFFx_P, DIFFx_M SUM_P, SUM_M D11 D10 « D5 D6 « D1 D0 D11 Bits 11-0 Channel 0: A - B DIFF0_P, DIFF0_M Bits 11-0 Channel 1: A - B DIFF1_P, DIFF1_M SUM_P, SUM_M Bits 11-8 Bits 7-4 Channel 0: A + B Channel 1: A + B Bits 3-0 0000 Figure 6. LVDS Output Waveforms 12 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 OPT8241 www.ti.com SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 7.3.1.2 Parallel CMOS Output Interface The sensor has options for both serial and parallel data output interfaces. The output data on the parallel CMOS interface toggles on both edges of the clock (DDR rate) with the output clock frequency being equal to the system clock frequency. The CMOS parallel data waveforms are shown in Figure 7. VD HD CLKOUT (50 MHz) CMOS[15:0] Frame ID Channel 1, Pixel 1, Row 1 CMOS[15:0] Channel 1, Pixel 1, Row 2 Channel 2, Pixel 1, Row 1 CMOS[15:12] CMOS[11:0] A+B A-B Channel 2, Pixel 1, Row 2 Figure 7. CMOS Output waveforms Following the VD start, the first sample set is a frame ID that denotes the quadrant (quad) number. The frame ID format is given in Table 2. Table 2. Frame ID Word Format 15 14 13 12 11 10 9 8 0 1 0 1 0 1 0 1 7 6 5 4 SF[3:0] 3 2 1 0 Q[3:0] Note that Q[3:0] is the quad number and SF[3:0] denotes the sub-frame number. 7.3.2 Temperature Sensor The on-die temperature sensor can measure temperatures in the range of –25°C to 125°C. The temperature is updated every 3 ms. The temperature value is stored in a register that can be read through the I2C interface. 7.4 Device Functional Modes All OPT8241 control commands are directed through the OPT9221 time-of-flight controller. For more details on the functional modes of the chipset, see the OPT9221 datasheet. 7.5 Programming The device registers are programmed by the OPT9221 time-of-flight controller. Therefore, in a typical system, the I2C interface is connected to the OPT9221 sensor control I2C bus; see the OPT9221 datasheet for more details. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 13 OPT8241 SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information ToF cameras provide the complete depth map of a scene. In contrast with the scanning type light detection and ranging (LIDAR) systems, the depth map of the entire scene is captured at the same instant with an array of ToF pixels. A broad classification of applications for a 3D camera include: • Presence detection, • Object location, • Movement detection, and • 3D scanning. The OPT8241 ToF sensor, along with TI's OPT9221 ToF controller, forms a two-chip solution for creating a 3D camera. The block diagram of a complete 3D ToF camera implementation using the OPT8241 is shown in Figure 8. Illumination Optics Illumination Modulation Scene DDR Timing Generation + ADC Computation (OPT9221) Depth Data Pixel Array Lens OPT8241 Figure 8. 3D ToF Camera The TI ToF estimator tool can be used to estimate the performance of a ToF camera with various configurations. The estimator allows control of the following parameters: • Depth resolution • 2D resolution (number of pixels) • Distance range • Frame rate • Field of view (FoV) • Ambient light (in watts × nm × m2 around the sensor filter bandwidth) • Reflectivity of the objects For more details on how to choose the above parameters, see the white paper on the ToF system design. 14 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 OPT8241 www.ti.com SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 8.2 Typical Applications 8.2.1 Presence Detection for Industrial Safety Processing 3D information and a separate foreground from the background is computationally less intensive when compared to using color information from a reg, green, blue (RGB) camera. 3D information can also be used to extract the form of the object and classify the object detected as being a human, robot, vehicle, and so forth, as shown in Figure 9. Figure 9. Industrial Safety 8.2.1.1 Design Requirements Table 3. Industrial Safety Requirements SPECIFICATION VALUE UNITS COMMENTS Depth resolution 7.5 Percentage of distance Temporal standard deviation of measured distance without the use of any software filters Frame rate 30 Frames per second For reactions fast enough to trigger a machine shut down Field of view 74.4 × 59.3 Degrees (H × V) Example only, requirements may vary Minimum distance 1 Meters Example only, requirements may vary Maximum distance 5 Meters Example only, requirements may vary Minimum reflectivity of objects at which the depth resolution is specified 40 Percentage 320 × 240 Rows x columns Number of pixels Assuming Lambertian reflection Using a full array 2 Ambient light Illumination source 0.1 W × nm × m around 850 nm Laser — Low-intensity diffused sunlight Laser + diffuser for diffusing light uniformly through the scene Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 15 OPT8241 SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 www.ti.com 8.2.1.2 Detailed Design Procedure Using the TI ToF estimator tool, the ToF camera design requirements can be input and the power numbers required for achieving the desired specifications can be obtained. The choice of inputs to the estimator tool is explained in the following section. 8.2.1.2.1 Frequencies of Operation The frequencies of operation are limited by the sensor bandwidth because the illumination source is a laser. Frequencies around 75 MHz can be used to obtain a good demodulation figure of merit. Two frequencies are used to implement de-aliasing and extend the unambiguous range because frequencies around 75 MHz provide a very short unambiguous range. The two frequencies chosen for de-aliasing are 70 MHz and 80 MHz. The unambiguous range is now given by Equation 1. C 299792458.0 ms Unambiguous Range 14.990 m 2 u GCD f1, f2 2 u GCD 70 MHz, 80 MHz (1) For the purpose of power requirement calculations, the average frequency of 75 MHz can be used in the estimator tool. 8.2.1.2.2 Number of Sub-Frames and Quads In this example, two sub-frames and six quads are used to obtain good dynamic range and account for wide ranges of reflectivity and distance. Also, six quads (minimum) are required for implementing de-aliasing. A depth resolution of 5% instead of the requirement of 7.5% is used as the resolution input to the estimator tool to allow for margins resulting from the additional noise when using de-aliasing. 8.2.1.2.3 Field of View (FoV) Field of view in the horizontal direction is 74.4 degrees. The diagonal FoV can be calculated using Equation 2. FoV Diagonal ª5 § 74.4 · º 2 u tan1 « u tan ¨ ¸ » | 87q © 2 ¹¼ ¬4 (2) The ratio of 5/4 is used to represent the ratio of the diagonal length to the horizontal length of the sensor. 8.2.1.2.4 Lens A lens with a 1/3” image circle must be chosen. The FoV of the lens must match the requirements (that is, the FoV must be equal to 87 degrees, as calculated in Equation 2). A lower f.no is always better. For this example, use an f.no of 1.2. 8.2.1.2.5 Integration Duty Cycle An integration duty cycle of less than 50% is chosen to keep the sensor cool in an industrial housing with no airflow. Choosing an even lower integration duty cycle can result in a marked increase in the peak illumination power. Higher peak illumination power results in a higher number of illumination elements and, thus, an increase in system cost. 16 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 OPT8241 www.ti.com SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 8.2.1.2.6 Design Summary A screen shot of the system estimator tool is shown in Figure 10. Figure 10. Screen Shot of the Estimator Tool The illumination peak optical power of 1.98 W can be supplied using one high-power laser. 8.2.1.3 Application Curve 250 U = 10 % U = 40 % U = 100 % 225 Depth Resolution (mm) 200 175 150 125 100 75 50 25 0 1 1.4 1.8 2.2 2.6 3 3.4 3.8 Object Distance (m) 4.2 4.6 5 ρ represents object reflectivity Figure 11. Example Industrial Safety Object Distance vs Depth Resolution Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 17 OPT8241 SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 www.ti.com 8.2.2 People Counting and Locating Locating and tracking people is a complex problem to solve using regular RGB cameras. With the additional information of distance to each point in the scene, the algorithmic challenges become more surmountable, as shown in Figure 9. Figure 12. People Counting 8.2.2.1 Design Requirements Table 4. People Counting Requirements VALUE UNITS Depth resolution SPECIFICATION 200 mm Frame rate 15 Frames per second 100.0 × 83.6 Degrees (H × V) Minimum distance 1 Meters Example only, requirements may vary Maximum distance 6 Meters Example only, requirements may vary Typical reflectivity of objects 40 Percentage Field of view Number of pixels Ambient light Illumination source 18 320 × 240 Rows × columns 0 W × nm × m2 around 850 nm LED — Submit Documentation Feedback COMMENTS For basic identification of shapes Reasonable update rate for moderate object movement speeds Higher FoVs are better for more coverage but are worse from a power requirement point of view Assuming objects reflect very little infrared light and assuming Lambertian reflection. Using a full array Indoor lighting conditions LED + lens optics Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 OPT8241 www.ti.com SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 8.2.2.2 Detailed Design Procedure Using the TI ToF estimator tool, the ToF camera design requirements can be input and the power numbers required for achieving the desired specifications can be obtained by following the procedures discussed in this section. 8.2.2.2.1 Frequencies of Operation The frequencies of operation are limited by the LED bandwidth because the source of illumination is an LED. Frequencies around 24 MHz can be used to obtain a good demodulation figure of merit if a fast-switching infrared (IR) LED is used. The unambiguous range is given by Equation 3. C 299792458.0 ms Unambiguous Range 6.246 m (3) 2u f 2 u 24 MHz 8.2.2.2.2 Number of Sub-Frames and Quads In this example, one sub-frame and four quads are used to minimize the effects of the sensor reset noise. 8.2.2.2.3 Field of View (FoV) Field of view in the horizontal direction is 74.4 degrees. The diagonal field of view can be calculated using Equation 2. FoV Diagonal ª5 § 100.0 · º 2 u tan1 « u tan ¨ ¸ » | 112.3q © 2 ¹¼ ¬4 (4) The ratio of 5/4 is used to represent the ratio of the diagonal length to the horizontal length of the sensor. 8.2.2.2.4 Lens A lens with a 1/3” image circle must be chosen. The field of view of the lens must match the requirements (that is, the FoV must be equal to 112.3 degrees, as calculated in Equation 4 ). A lower f.no is always better. For this example, use an f.no of 1.2. 8.2.2.2.5 Integration Duty Cycle An integration duty cycle of 60% is chosen to keep the peak illumination power requirements low. Higher peak illumination power results in a higher number of illumination elements and, thus, an increase in system cost. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 19 OPT8241 SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 www.ti.com 8.2.2.2.6 Design Summary A screen shot of the system estimator tool is shown in Figure 13. Figure 13. Screen Shot of the Estimator Tool The illumination peak optical power of 2.0 W can be supplied using a single high-power LED. 8.2.2.3 Application Curve 200 U = 10 % U = 40 % U = 100 % 180 Depth Resolution (mm) 160 140 120 100 80 60 40 20 0 1 1.5 2 2.5 3 3.5 4 4.5 Object Distance (m) 5 5.5 6 ρ represents object reflectivity Figure 14. Example People-Counting Object Distance vs Depth Resolution 20 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 OPT8241 www.ti.com SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 8.2.3 People Locating and Identification A skeletal structure can be used to classify identified shapes (such as humans, machines, pets, and so forth). Other possibilities include classification of people (such as children and elderly). Even identification of humans by matching the shape and movement to an existing database is possible. Such information can lend itself for use in a variety of retail solutions, home safety, security, and public and private surveillance systems, as shown in Figure 15. Figure 15. People Counting and Identification 8.2.3.1 Design Requirements Table 5. People Counting and Identification Requirements SPECIFICATION VALUE UNITS Depth resolution 1.5 Percentage of distance Frame rate 15 Frame per second 100.0 x 83.6 Degrees (H X V) Minimum distance 1 Meters Example only, requirements may vary Maximum distance 6 Meters Example only, requirements may vary Typical reflectivity of objects 40 Percentage Field of view No of pixels Ambient light Illumination source 320 x 240 Rows x columns 0 W × nm × m2 around 850 nm Laser — COMMENTS To obtain skeletal structure and gait accurately and identify humans from other objects. Reasonable update rate for moderate object movement speeds Higher FoVs are better for more coverage but worse from a power requirement point of view Assuming objects reflect very little infrared light and assuming Lambertian reflection Using full array Indoor lighting conditions Laser + diffuser for diffusing light uniformly through the scene Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 21 OPT8241 SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 www.ti.com 8.2.3.2 Detailed Design Procedure Using the TI ToF estimator tool, the ToF camera design requirements can be input and the power numbers required for achieving the desired specifications can be obtained. The choice of inputs to the estimator tool is explained in the following section. 8.2.3.2.1 Frequencies of Operation The frequencies of operation are limited by the sensor bandwidth because the illumination source is a laser. Frequencies around 75 MHz can be used to obtain a good demodulation figure of merit. Two frequencies are used to implement de-aliasing and extend the unambiguous range because frequencies around 75 MHz provide a very short unambiguous range. The two frequencies chosen for de-aliasing are 70 MHz and 80 MHz. The unambiguous range is now given by Equation 5. C 299792458.0 ms Unambiguous Range 14.990 m 2 u GCD f1, f2 2 u GCD 70 MHz, 80 MHz (5) For the purpose of power requirement calculations, the average frequency of 75 MHz can be used in the estimator tool. 8.2.3.2.2 Number of Sub-Frames and Quads In this example, one sub-frame and six quads are used to minimize the effects of the sensor reset noise. A depth resolution of 1% instead of the requirement of 1.5% is used as the resolution input to the estimator tool to allow for margins resulting from the additional noise when using de-aliasing. 8.2.3.2.3 Field of View (FoV) Field of view in the horizontal direction is 74.4 degrees. The diagonal FoV can be calculated using Equation 6. FoV Diagonal ª5 § 100.0 · º 2 u tan1 « u tan ¨ ¸ » | 112.3q © 2 ¹¼ ¬4 (6) The ratio of 5/4 is used to represent the ratio of the diagonal length to the horizontal length of the sensor. 8.2.3.2.4 Lens A lens with a 1/3” image circle must be chosen. The FoV of the lens must match the requirements (that is, the FoV must be equal to 112.3 degrees, as calculated in Equation 6). A lower f.no is always better. For this example, use an f.no of 1.2. 8.2.3.2.5 Integration Duty Cycle An integration duty cycle of 70% is chosen to keep the peak illumination power requirements low. Higher peak illumination power results in a higher number of illumination elements and, thus, an increase in system cost. 22 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 OPT8241 www.ti.com SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 8.2.3.2.6 Design Summary A screen shot of the system estimator tool is shown in Figure 16. Figure 16. Screen Shot of the Estimator Tool The illumination peak optical power of 3.54 W can be supplied using two high-power lasers. 8.2.3.3 Application Curve 60 U = 10 % U = 40 % U = 100 % 54 Depth Resolution (mm) 48 42 36 30 24 18 12 6 0 1 1.5 2 2.5 3 3.5 4 4.5 Object Distance (m) 5 5.5 6 ρ represents object reflectivity Figure 17. Example People Identification Object Distance vs Depth Resolution Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 23 OPT8241 SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 www.ti.com 9 Power Supply Recommendations The sensor reset noise is sensitive to AVDDH and PVDD supplies. Therefore, linear regulators are recommended for supplying power to the AVDD and PVDD supplies. DC-DC regulators can be used to supply power to the rest of the supplies. Ripple voltage on the VMIX and the SUB_BIAS supplies must be kept at a minimum (< 50 mV) to minimize phase noise resulting from differences between quads. The VMIX regulator must have the bandwidth to supply surge current requirements within a short time of less than 10 µs after the integration period begins because VMIX currents have a pulsed profile. There is no strict order for the power-on or -off sequence. The VMIX supplies are recommended to be turned on after all supplies have ramped to 90% of their respective values to avoid any power-up surges resulting from high VMIX currents in a non-reset device state. 10 Layout 10.1 Layout Guidelines 10.1.1 MIX Supply Decapacitors The VMIXH supply has a peak load current requirement of approximately 600 mA during the integration phase. Moreover, a break-before-make circuit is used during the reversal of the demodulation polarity to avoid high through currents. The break-before-make strategy results in a pulse with a drop and a subsequent rise of demodulation current. The pulse duration is typically approximately 1 ns. In order to effectively support the rise in currents, VMIXH decoupling capacitors must be placed very close to the package. Furthermore, use multiple capacitors to reduce the effect of equivalent series inductance and resistance of the decoupling capacitors. Use a combination of 10-nF and 1-nF capacitors per VMIXH pin. Using vias for routing the trace from decoupling capacitors to the package pins must be avoided. 10.1.2 LVDS Transmitters Each LVDS data output pair must be routed as a 100-Ω differential pair. When used with the OPT9221, 100-Ω termination resistors must be placed close to the OPT9221. 10.1.3 Optical Centering The lens mount placement on the printed circuit board (PCB) must be such that the lens optical center aligns with the pixel array optical center. Note that the pixel array center is different from the package center. 24 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 OPT8241 www.ti.com SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 Layout Guidelines (continued) 10.1.4 Image Orientation The sensor orientation for obtaining an upright image is shown in Figure 18. Captured Image Sensor Pin 1 T Scene Lens 240, 320 T 240, 0 L L R R Readout 0, 320 B 0, 0 B When used with the OPT9221, the default sensor readout direction is shown in grey. Figure 18. Sensor Orientation for Obtaining an Upright Image 10.1.5 Thermal Considerations In some applications, special care must be taken to avoid high sensor temperatures because demodulation power is considerably high for the size of the package. Lower sensor temperatures help lower the thermal noise floor as well as reduce the leakage currents. Two recommended methods for achieving better package to PCB thermal coupling are listed below: • Use a thermal pad below the sensor on both sides of the PCB with stitched vias. • Use a compatible underfill. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 25 OPT8241 SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 www.ti.com 10.2 Layout Example Figure 19. Example Layout 26 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 OPT8241 www.ti.com SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 10.3 Mechanical Assembly Guidelines 10.3.1 Board-Level Reliability TI chip-on-glass products are designed and tested with underfill to ensure excellent board-level reliability in intended applications. If a customer chooses to underfill a chip-on-glass product, following the guidelines below is recommended to maximize the board level reliability: • The underfill material must extend partially up the package edges. Underfill that ends at the bottom (ball side) of the die degrades reliability. • The underfill material must have a coefficient of thermal expansion (CTE) closely matched to the CTE of the solder interconnect. • The underfill material must have a glass transition temperature (Tg) above the expected maximum exposure temperature. Thermoset ME-525 is a good example of a compatible underfill. 10.3.2 Handling To avoid dust particles on the sensor, the sensor tray must only be opened in a cleanroom facility. In case of accidental exposure to dust, the recommended method to clean the sensors is to use an IPA solution with a micro-fiber cloth swab with no lint. Do not handle the sensor edges with hard or abrasive materials (such as metal tweezers) because the sensor package has a glass outline. Such handling may lead to cracks that can negatively affect package reliability and image quality. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 27 OPT8241 SBAS704B – JUNE 2015 – REVISED OCTOBER 2015 www.ti.com 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation OPT9221 Data Sheet, SBAS703 Introduction to the Time-of-Flight (ToF) System Design, SBAU219 11.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 28 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: OPT8241 PACKAGE OPTION ADDENDUM www.ti.com 8-Oct-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) OPT8241NBN ACTIVE COG NBN 78 240 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 0 to 70 OPT8241 OPT8241NBNL ACTIVE COG NBN 78 2400 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 0 to 70 OPT8241 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 8-Oct-2017 Addendum-Page 2 PACKAGE OUTLINE NBN0078A COG - 0.745 mm max height SCALE 1.800 CHIP ON GLASS 8.797 8.717 A B (0.0172) PIXEL AREA CTR BALL 1 CORNER INDEX AREA 7.899 7.819 (1.17945) PIXEL AREA CTR PIXEL AREA (0.1) DIE (0.04) (0.5) DETAIL A SEE DETAIL A 0.745 MAX DETAIL A SCALE 14.000 (0.06) C SEATING PLANE 0.213 TYP 0.187 0.05 C BALL TYP (8.37) TYP (0.19) TYP (0.194) TYP (5.95) M L K DIE J H (7.48) TYP PKG G (6.91) F E D C B A 44X (0.68) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 36X (0.465) PKG 78X 0.285 0.235 4222085/A 06/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C. 4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls. www.ti.com EXAMPLE BOARD LAYOUT NBN0078A COG - 0.745 mm max height CHIP ON GLASS 4X (3.255) 20X (3.305) 36X (0.465) 4X (2.79) 44X (0.68) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 A B C 12X (3.74) 78X ( 0.22) 26X (3.79) D E F SYMM G H J K L M SYMM LAND PATTERN EXAMPLE SCALE:10X 0.05 MAX METAL UNDER SOLDER MASK 0.05 MIN ( 0.22) METAL ( 0.22) SOLDER MASK OPENING SOLDER MASK OPENING NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4222085/A 06/2015 NOTES: (continued) 5. PCB pads shift from original positions to prevent solder balls from touching sensor. X and Y direction: 0.05 mm. Corner pads: 0.03 mm. 6. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For information, see Texas Instruments literature number SSYZ015 (www.ti.com/lit/ssyz015). www.ti.com EXAMPLE STENCIL DESIGN NBN0078A COG - 0.745 mm max height CHIP ON GLASS 4X (3.255) 20X (3.305) 36X (0.465) TYP 4X (2.79) 44X (0.68) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 A B C 12X (3.74) D METAL TYP 26X (3.79) E SYMM F G H J K (R0.05) TYP L M 78X ( 0.25) SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:12X 4222085/A 06/2015 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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