B120E thru B1200E Schottky Barrier Rectifiers Reverse Voltage 20 to 200V Forward Current 1.0A P b Lead(Pb)-Free FEATURES * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * Low power loss,high efficiency * For use in low voltage high frequency inverters, free wheeling,and polarity protection applications * Guardring for over voltage protection * High temperature soldering guaranteed: 260°C/10 seconds at terminals Mechanical Data CATHODE Case: SOD-323HE molded plastic over sky die Terminals: Tin Plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.011 g Handling precautin:None ANODE We declare that the material of product is Haloggen free (green epoxy compound) 1.Electrical Characteristic Maximum & Thermal Characteristics Ratings at 25℃ ambient temperature unless otherwise specified. Parameter Symbol symbol device marking code B120E B130E B140E B150E B160E B180E B1100E B1150E B1200E 12 13 14 15 16 18 110 115 120 100 150 200 Unit Maximum repetitive peak reverse voltage VRRM 20 30 40 50 60 80 Maximum RMS voltage VRMS 14 21 28 35 42 56 70 105 140 V Maximum DC blocking voltage VDC 20 30 40 50 60 80 100 150 200 V V Maximum average forward rectified current at Tc = 75°C IF(AV) 1.0 A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 22 A Typical thermal resistance (Note 1) RθJA RθJL 220 50 °C/W TJ –55 to +125 °C TSTG –55 to +150 °C Operating junction temperature range storage temperature range Electrical Characteristics Ratings at 25 ℃ ambient temperature unless otherwise specified. Parameter Symbol symbol Maximum instantaneous forward voltage at(IF = 0.7 A, TJ = 25°C) (IF = 1.0 A, TJ = 25°C) VF Maximum DC reverse current at rated DC blocking voltage TA = 25°C TJ = 125°C IR Typical junction capacitance at 4.0V, 1MHz CJ B120E B130E B140E 0.48 0.55 0.25 10 B150E B160E 0.7 B180E B1100E 0.85 0.03 10 0.13 10 160 B1150E B1200E 0.9 0.92 Unit V mA PF NOTES: 1. 8.0mm2 (.013mm thick) land areas WEITRON http://www.weitron.com.tw 1/5 05-May-2016 B120E thru B1200E 2.Ratings and Characteristic Curves ( TA = 25 C unless otherwise noted ) 60 Hz Resistive or Inductive Load 1.0 0.5 0 。 Instantaneous Forward Current (A) 100 1.0 0.1 0.01 0.2 Junction Capacitance (pF) 10 1 0.1 1.0 10 t,Pulse duration,sec WEITRON http://www.weitron.com.tw Tj=125 1.0 Tj=75 0.1 0.01 2/5 Fig 6. Typical Junction Capacitance TJ = 25 C f = 1.0 MHz Vsig = 100 10 100 Tj=25 0.001 0 20 40 60 80 Percent of Rated Peak Reverse Voltage (%) 1000 100 10 100 Number of Cycles at 60Hz Typical Reverse Characteristics 10 typical transient thermal impedance 1000 1 Fig 4. 0.4 0.6 0.8 1.0 1.2 Instantaneous Forward Voltage (V) Fig 5. 0.01 11 0 Instantaneous Reverse Current (mA) 10 TJ = 25 25! C Pulse width = 300µs 1% Duty Cycle TJ = TJ max 8.3ms Single Half Sine-wave 22 25 50 75 100 125 150 175 Case Temperature, ℃ Typical Instantaneous Forward Characteristics Maximum Non-repetitive Peak Forward Surge Current 。 0 Fig 3. 。 Transient thermal impedance( C/W) Fig. 2 Forward Current Derating Curve Peak forward surge current (A) Average Forward Rectified Current (A) Fig. 1 0.1 1 Reverse Voltage (V) 10 05-May-2016 B120E thru B1200E 3. dimension: J A D SOD-323HE D C I I B G F E H K 負極 MILLIMETERS MIN MAX 2.30 2.70 1.20 1.35 1.75 1.95 0.30Typ 0.55 0.75 0.10 0.20 0.50 0.55 0.50 0.55 0.40 0.60 1.15 1.55 0.8Typ DIM A B C D E F G H I J K 正極 INCHES MIN MAX 0.091 0.106 0.047 0.053 0.069 0.077 0.012Typ 0.022 0.030 0.004 0.008 0.020 0.022 0.020 0.022 0.016 0.024 0.045 0.061 0.032Typ Suggested solder pad layout D B A E C Dimensions in inches and (millimeters) WEITRON PACKAGE A B C D E SOD-323HE 0.032(0.8) 0.032(0.8) 0.085(2.15) 0.032(0.8) 0.032(0.8) http://www.weitron.com.tw 3/5 05-May-2016 B120E thru B1200E 5.Suggested thermal profile for soldering process 1. Storage environment Temperature=5~40 ℃ Humidity=55±25% 2. Reflow soldering of surface-mount device Pt Critical Zone TL to TP TP Ramp-up Temperature TL Ts max TL Ts min ts preheat Ramp-down 25 time t25℃ to Peak 3. Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(TL to TP) <3℃/sec Preheat - Temperature Min(Tsmin) 150℃ - Temperature Max(Tsmax) - Time(min to max)(t s) 200℃ 60~120sec Tsmax to T L - Ramp-up Rate Time maintained above: - Temperature (T L) 60-260sec Peak Temperature(TP) 255 -0/+5℃ Ramp-down Rate Time 25 ℃ to Peak Temperature WEITRON 217℃ - Time(t L) Time within 5 ℃ of actual Peak Temperature(T P) http://www.weitron.com.tw <3sec 10~30sec <6℃/sec <6minutes 4/5 05-May-2016 B120E thru B1200E 6.High reliability test capabilities Item Test Solder Resistance Solderability High Temperature Reverse Bias Forward Operation Life Intermittent Operation Life Condition at 260±5℃ for 10±2sec immerse at 245±5℃ for 5 sec VR=80% rate at Tj=125℃ for 168hrs Rated average rectifier current TA=25℃, IF=IO Pressure Cooker 15PSIG at TA=121℃ for 4hrs JESD22-A102 Temperature Cycling -55℃ to +125℃ dwelled for 30 min. and transferred for 5min. Total 10 cycles MIL-STD-750D METHOD-1051 Thermal Shock 0℃ for 5min. Rise to 100℃ for 5min. Total 10 cycles MIL-STD-750D METHOD-1056 Forward Surge 8.3ms single half sine-wave superimposed on rated load,one surge MIL-STD-750D METHOD-4066-2 Humidity at TA=85℃, MIL-STD-750D METHOD-1021 High Temperature Storage Life at 150℃ for 1000hrs WEITRON http://www.weitron.com.tw RH =85% for 1000hrs 5/5 Reference MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 MIL-STD-750D METHOD-1027 MIL-STD-750D METHOD-1036 MIL-STD-750D METHOD-1031 05-May-2016