Microchip AN999 A broad portfolio of high performance, best-in-class serial memory products to meet all your design requirements. Datasheet

Serial Memory Products
Serial Memory Products
■ Serial EEPROM
■ Serial SRAM
www.microchip.com/memory
Serial Memory Products
A broad portfolio of high performance, best-in-class Serial Memory Products
to meet all your design requirements.
Microchip offers the broadest range of Serial EEPROM devices (from 128 bits to 1 Mbit) over the widest operating
voltage (1.7 to 5.5V) and temperature ranges (up to 150ºC). Innovative low-power designs and extensive testing
have ensured industry leading endurance and best-in-class quality at low costs.
SPI-compatible Serial SRAM devices are available in 64 and 256 Kbit options and up to 20 MHz. These low power
devices provide additional external serial RAM with high-speed performance and are available in standard 8-pin
packages.
Microchip Supports Your Designs Throughout The Product Life Cycle
2
Serial Memory Products
Serial Memory Advantages
Serial Memory Products
Outstanding Quality
Innovative Products
Reliable Supply
Serial EEPROM
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Serial SRAM
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SPI, I2C™, Microwire, UNI/O® Bus
Non-Volatile Memory
128 bits-1Mbit
1.7V-5.5V
■ 1M Cycles E/W Endurance
■ Fast Read/Write Times
■ Low Power Consumption
SPI Bus, 20 MHz
Volatile Memory
8, 32 Kbytes
1.5V-1.95V; 2.7V-3.6V
■ Infinite Endurance
■ Zero Write Speeds
■ Low Power
Key Features
Key Benefits
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■ Lower system costs – innovative products, tiny packages,
low power consumption, fewer I/O pins, small form factor
■ Save I/O pins on the MCU – more compact designs, add
additional features
■ Secure data with write-protect options
■ Highest quality EEPROMs
– Zero PPM initiatives – Triple-test flow
– >1M cycles E/W endurance
■ Faster time to market
– Short lead times
– Complete tools support
■ Robust designs – broad operating conditions
■ Long product life cycles
■ Global sales & engineering support
Serial architecture – I2C, SPI, UNI/O, Microwire
Broad range of densities
Tiny 3, 5, 6 and 8-pin packages, die & wafer
Innovative, low power designs
Industry leading endurance
Wide temperature and voltage range
Fast read and write times
Flexible:
– Byte write capability
– Package options
– Custom programming options
– Application-specific serial memory
■ Microchip owned fabs, In-house testing
■ Automotive flow on all products
Serial EEPROM Bus Comparison
Parameter
I2 C
Microwire
UNI/O
SPI
Density Range
128b-1 Mbit
1 Kb-16 Kb
1 Kb-16 Kbit
1Kb-1 Mbit
Speed
Up to 1 MHz
Up to 3 MHz
Up to 100 KHz
Up to 20 MHz
2: Clock, Data
4: Clock, CS, DI, DO
1: Clock/Data
4: SCK, CS, DI, DO
Package Options
PDIP, SOIC, SOIJ, TSSOP,
MSOP, 2x3 T-DFN, 6x5 DFN,
SOT-23, SC70, WLCSP
PDIP, SOIC, TSSOP,
MSOP, 2x3 T-DFN,
SOT-23
PDIP, SOIC, TSSOP,
MSOP, 2x3 T-DFN,
SOT-23, TO92, WLCSP
PDIP, SOIC, SOIJ, TSSOP,
MSOP, 2x3 T-DFN,
6x5 DFN, SOT-23
Security Options
HW
HW
SW
HW, SW
I/O Pins
Pricing
Least Expensive
Most Expensive
Serial Memory Products
3
Serial EEPROM
Innovative designs combined with in-house fabrication and outstanding testing
methodology has helped create the industry’s highest quality Serial EEPROM.
Microchip offers a broad selection of standard and application specific Serial EEPROM devices that are available in
all the standard serial busses – I2C, SPI, Microwire and the new single I/O UNI/O® bus.
Serial EEPROMs
Standard
EEPROMs
Specialty/Application
Specific EEPROMs
I2C™
UNI/O® Bus
MAC Address Chips
128b-1 Mb; 1.7V-5.5V
1 Kb-16 Kb; 1.8V-5.5V
EUI-48™ & EUI-64™ Node Address
Microwire
SPI
Partial Array Write Protect
1 Kb-16 Kb; 1.8V-5.5V
1 Kb-1 Mb; 1.8V-5.5V
½, ¼ and Whole Array WP Options
DIMM-DDR2/3
Packages
Reversible S/W Write Protect; I2C
Extended Temperature
.
.
5-SC70
(LT)
2 x 2 mm
3-SOT
(TT)
3 x 2.5 mm
5 & 6-SOT
(OT)
3 x 3 mm
.
.
.
8-TDFN
(MC/MNY)
2 x 3 mm
8-MSOP
(MS)
3 x 5 mm
8-TSSOP
(ST)
3 x 6.5 mm
-55ºC to 150ºC
VESA Monitors
DDC1™/DDC2™ Interface
Very Low Voltage
8-SOIC (SN)
5 x 6 mm
8-DFN (MF)
5 x 6 mm
8-SOIC (SM)
5 x 8 mm
8-PDIP (P)
8 x 9.5 mm
1.5V EEPROM
Die/Wafer
WL-CSP
Robust Design
Quality
■ ESD Protection
> 4000V Human Body Model (HBM)
> 400V Machine Model (MM)
> 1000V Charged Device Model
■ Latch-up protection > 200 mA on all pins
■ ESD Induced Latch-up > 100V (MM) on VDD; >400V on all I/O
> 1M cycles Endurance and > 200 years data retention
■ Up to 150°C Operation (reads and writes)
■ Power-On Reset (POR) and Brown-Out Reset (BOR)
– Effective protection against noisy automotive environments
– Eliminates false writes
■ Schmitt Trigger input filters for noise reduction
■ Complete traceability including die location on wafer
■ Microchip delivers highest quality
EEPROMs in the world
■ World-class line yields (over 99%)
■ ISO/TS16949-compliant
■ Industry leader with triple test flow –
every cell of every part is tested
three times
■ Near zero PPM field bit fails
■ Statistical process control and
continuous improvement procedures
in all facilities
■ Robustness and reliability designed in
■ Automotive grade/flow
4
Serial Memory Products
Memory Package Matrix
Memory Packages – more memory in less space!
Serial EEPROM devices from Microchip are available in a wide variety of tiny, innovative packages to help minimize
your design – save board space and cost!
■ WLCSP – die-sized package – smallest form factor EEPROM package in the world!
■ SC70 – smallest 5-lead EEPROM package!
■ 5-SOT-23 available up to 64 Kbit; 8-TDFN up to 128 Kbit, 8-SOIC up to 1 Mbit (I2C)
Density
I2C™
Max
Speed
SOIC
SN
SOT-23
OT/TT
TSSOP
TS
TDFN
MNY/MC
PDIP
P
MSOP
MS
SOIJ
SM
DFN
MF
SC70
LT
5x6
3x3
3x6.5
2x3
8x9.5
3x5
5x8
5x6
TO92
TO
Wafer
W/S/WF
WLCSP
CS
2x2
Die
Die
5
X
Bus 1.7V-5.5V
128bit-2K
400 KHz
X
5
X
X
X
X
4K-32K
400 KHz
X
5
X
X
X
X
64K
1 MHz
X
5
X
X
X
X
X
128K
1 MHz
X
X
X
X
X
X
256K
1 MHz
X
X
X
X
512K
1 MHz
X
X
1 Mbit
1 MHz
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Microwire Bus 1.8V-5.5V
1K-16K
3 MHz
X
6
X
X
X
X
X
6
X
X
X
X
X
X
X
X
X
SPI Bus 1.8V-5.5V
1K-4K
10 MHz
X
8K-64K
10 MHz
X
X
128K, 256K
10 MHz
X
X
X
X
X
X
512K
20 MHz
X
14
X
X
X
X
1 Mbit
20 MHz
X
X
X
X
UNI/O® Single-Wire Bus 1.8V-5.5V
1K-16K
100 KHz
X
3
X
X
X
X
X
X
Package Sizes
.
.
5-SC70
(LT)
2 x 2 mm
3-SOT
(TT)
3 x 2.5 mm
.
.
5 & 6-SOT
(OT)
3 x 3 mm
.
.
.
8-TDFN
(MC/MNY)
2 x 3 mm
8-MSOP
(MS)
3 x 5 mm
8-TSSOP
(ST)
3 x 6.5 mm
8-SOIC (SN)
5 x 6 mm
WLCSP – World’s Smallest EEPROM Package
WLCSP from Microchip is bumped die with a redistribution layer to route
the bond pads to the bumps.
■ True ‘die-sized’ packages
■ Industry’s smallest package, form factor
■ Lowest profile package
■ Available in I2C, UNI/O buses
■ Compatible with standard surface mount assembly lines
■ Fit a large density into a small space
■ Applications: mobile phones, security cameras, sensors, servers,
networking, RF, medical, portable electronics
8-DFN (MF)
5 x 6 mm
8-SOIC (SM)
5 x 8 mm
8-PDIP (P)
8 x 9.5 mm
Die/Wafer
WL-CSP
Wafer Level
Chip Scale Packaging
Actual Size
Enlarged to Show
Detail
WLCSP 4 Kbit I2C
<1 x 1 mm
Serial Memory Products
5
Application-Specific EEPROMs
Innovative EEPROM options to help you get to market faster and deliver the highest
performance at lowest costs.
Serial Memory Products – Application Examples
Automotive
Quality, PPAP, long product life
cycles, AEC Q-100 & TSO-16949
compliant, in-house testing,
triple-test flow
Transmission, ABS, Power Train, Airbag,
Entertainment System, Mirror Controllers,
GPS, Steering Control
Medical
Outstanding quality, and reliability,
tiny packages, low power, Microchip
owned fabs
Blood Glucose Meters, Hearing Aid,
Medical Imaging Devices, XRAY, Oxygen
Concentrator,
ECG
Industrial
Applications
Robust designs, high endurance,
wide operating range, custom part
options
Metering, Industrial Control, Security
Systems, Alarm Systems, Sensor
Networks, Battery Chargers
Consumer
Microchip Strengths
Short lead times, excellent supply,
innovative packages, application
specific options, low power
LCD TV, Set Top Box, Printers, Blue Tooth,
Wireless, Laptop, Mouse, Networking,
DDR2/3, Camera, POS, Appliances
Specialty EEPROM Applications
Application/Market
Design Challenge
Solution
Products
Benefits
Monitors, Projectors,
Flat Panel Display
DDC1™ & DDC2™, EDID
& E-EDID specification
Vesa products
24LCS21A,
24LCS22A
Quick, easy plug & play options
Networking, Ethernet,
Wi-Fi, ZigBee®
EUI-48™/EUI-64™ MAC
Address
MAC address chips
24AA02E48,
11AA02E48,
25AA02E48
Easy access, Low-cost,
Plug & play, Additional EEPROM
PCs and Laptops –
DRAM DIMM Modules
DDR1/2/3 Specification
DIMM SPD products,
24LCS52, 34XX02,
Temp sensor with EEPROM MCP98242
Industrial, Consumer
Electronics
Systems that require
locked and/or
re-writeable memory
Write-protect options
I2C, SPI, UNI/O and
Microwire Options
available
One lower cost device replace two
stand-alone parts
HDCP Chipset (TV)
Adding HDCP keys to
your chipset
Secure wafer
programming service
4K/8K – I2C, SPI,
Microwire
Secure, No code duplication, Lower
overall costs, Factory-programmed
serialization
Industrial
Need devices to operate
beyond -40C to +125C
Automotive
Automotive Qualification
Consumer Electronics,
Need Very Low Voltage
Medical
6
Serial Memory Products
High temp. EEPROMs:
up to 150°C
1 Kbit, I2C and
Low temp EEPROMs:
1-256 Kbit SPI
down to -55°C
Special manufacturing flow All
Very Low Voltage EEPROMs
Customizable software enabled WP
Robust design, Reduce chances of
field failures
Robust design, Hassle-free solution
24VL014, 24VL024, Low power operation, Reduced
34VL02
system voltage
More Speciality EEPROMs
EUI-48™/EUI-64™ MAC Address Chips
Need fast, easy and inexpensive access to MAC
addresses? Use pre-programmed MAC address chips
from Microchip. No serialization needed; unique ID.
EUI-48 Programmed Serial EEPROMs provide low cost and easy access
to IEEE MAC Addresses. These plug-and-play devices allow you to quickly
add a MAC address to your networking application eliminating the need for
programming and serialization on the MCU – helping you save cost and get
to market quicker. For more information visit: www.microchip.com/MAC
24AA02E48
100 KHz
25AA02E48
10 MHz
11AA02E48
100 KHz
I2C
SPI
UNI/O
Plug-and-Play Devices
Flexibility and Low Cost Access
EUI-48 address embedded in a 2K-bit Serial EEPROM
Quickly add EUI-48 to your networking application
and get to market faster
■ Quick and easy access to IEEE MAC addresses –
■ Buy code only when needed.
Read code directly off Serial EEPROM
2
■ No added programming and serialization cost –
■ Available in SPI, I C and UNI/O bus
Reduce System Costs
■ At least 1.5 Kb of Serial EEPROM memory
■
Come with no volume restrictions.
■ Available in SOIC and SOT-23 packages
■ Additional EEPROM to store configuration settings
■ Write-protected codes
■ Unique ID
■ EUI-48 and EUI-64 compatible
– EUI-48: Networking, Ethernet, Wi-Fi (IEEE 802.11),
Bluetooth
– EUI-64: ZigBee (IEEE802.15.4), MiWi™, FireWire, IPv6
■ Can be custom programmed in any memory density. Contact Microchip sales for more information.
Partial Array Write-Protect I2C EEPROMs
Microchip’s family of partial array write-protect (WP) EEPROMs offers hardware write-protect capability for only a part of the
memory array. These I2C EEPROM devices are available from 1 Kb-64 Kbit.
1/2 Array WP
1/4 Array WP
User data, real-time updates,
data that changes
Calibration parameters, unique ID,
data that never changes
1 Kbit-16 Kbit
32 & 64 Kbit
I2C and SPI Serial EEPROMs with Optional Range from -55°C to +150°C
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Automotive turbo chargers and exhaust gas recirculation
Automotive fan motors, air valves, flaps and spark plugs
Aerospace
Mining (certifications for use in explosive atmospheres available)
150oC
Serial Memory Products
7
UNI/O® EEPROM
Using UNI/O EEPROM can free up MCU pins for new features.
Microchip’s new UNI/O Serial EEPROM uses only ONE connection to the
host microcontroller. This compares to two or three pins for I2C, and three
to six pins for Microwire or SPI buses. This new, proprietary bus offers
advanced features like a status register and write-protection on demand,
along with all I/O and memory array and command functions through a
single pin.
2.5-5.5V
11LC010
11LC020
11LC040
11LC080
11LC160
1.8-5.5V
11AA010
11AA020
11AA040
11AA080
11AA160
1 Kb
2 Kb
4 Kb
8 Kb
16 Kb
Single I/O EEPROM
Save I/O Pins
One I/O for clock, data & control
A single I/O EEPROM can simplify your design and
reduce system cost
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Single I/O interface
1-16 Kbit memory densities
1.8-5.5V operating voltage
10-100 KHz operating frequency
Status register, SW write-protect
3-pin SOT-23, 8-pin SOIC, MSOP & TDFN
1M Erase/Write cycles
■ Free up pins on the MCU
– Add new features to your application
– Move to a smaller MCU – reduce cost
■ Free up pins on your connector
– Smaller connector – lower cost
■ Single I/O interface – more compact design
The UNI/O Advantage
UNI/O®
VCC
VCC
VCC
SDA
SCL
WP
MCU
R2
I2C™
R1
VCC
SDA
SCL
WP
MCU
Single I/O, No pull-up
resistors needed.
UNI/O®
I2C™
VCC
■ Save board space
■ Save pins on the MCU
■ Add additional features
■ UNI/O software drivers available for many popular microcontrollers See Ap Note section for more information.
■ Convert UNI/O from 3-pins to 2-pins – check out Ap Note AN1213.
www.microchip.com/unio
8
Serial Memory Products
Serial SRAM
Do you need a simple, inexpensive way to add RAM to
your application? Microchip offers external RAM where
you need it.
Microchip’s new serial SRAM family provides a way to easily and
inexpensively add external RAM to almost any application. These serial
devices use less power and fewer I/O connections than traditional parallel
SRAM. And, they allow designers to use a smaller microcontroller rather than
moving to a larger microcontroller just to get more on-board RAM.
256 Kb
23A256
16 MHz
23K256
20 MHz
64 Kb
23A640
16 MHz
23K640
20 MHz
1.5V-1.95V
2.7V-3.6V
■ Applications: metering, POS terminals, printers, internet radio,
ethernet, Wi-Fi
■ Replace parallel RAM
■ Any application needing low cost RAM
Increased Performance
Flexible RAM Expansion
Quickly and easily add external high-speed SRAM
■
■
■
■
■
■
8 and 32 Kbyte options
20 MHz clock speed
Low standby and operating currents
Fast writes with zero latency
Unlimited endurance
8-SOIC, 8-TSSOP, 8-PDIP
Add features to your current microcontroller
and get to market faster
■
■
■
■
■
Add functionality to your current design
No need to buy a large microcontroller just for the RAM
Familiar 4-pin SPI interface
Cost reduce your current design
Scratchpad, buffering, high endurance applications
The Serial Advantage – Not Just Price
Feature
Traditional Parallel SRAM
Microchip Serial SRAM
I/O Connection to MCU
16-20
4
Standby Current
3 mA
1 μA
Active Current
50 mA
1-10 mA
3.0V
1.7V
Lowest Operating Voltage
Footprint
Smallest Packages
100
mm2
20 mm2
28-TSSOP, 28-SOIC
8-TSSOP, 8-SOIC
Parallel
SRAM
www.microchip.com/sram
Serial Memory Products
9
Wafer-Level Burn-In
Microchip’s best-in-class field performance is the combined result of world class
manufacturing, wafer level burn-in and wafer probe quality screens.
Microchip’s Triple Test Flow is currently the most robust testing procedure for serial EEPROM devices in the
industry. It tests each cell of each die three times and also performs extensive endurance and data retention tests
to ensure quality and reliability.
Infant mortality of Microchip serial EEPROMs is among the lowest in the industry due to this extensive testing,
excellent fabrication and highly reliable memory cell design.
Microchip’s Triple Test and
Wafer-level Burn-in Procedure
Traditional Burn-in
(Old Technology)
General purpose non-specific testing procedure
for random logic cells
■ Non-specific and untargeted testing
mechanism – Increases failure rates.
■ Expensive, time consuming and inefficient.
■ Introduces defect modes like bent leads
and EOS that sometimes go undetected.
Moving beyond traditional burn-in to wafer level burn-in with the Triple
Test Flow specifically targeted for memory cells has helped create the
industry’s most reliable memory products.
■ Extensive Testing – Every cell in every die is tested three times,
including specific endurance and data retention tests to ensure
highest quality.
■ HVST, LVHF and TVPP tests target specific defects.
■ Maverick, SBY and GBN target overall failure patterns and trends.
■ Insight into failure modes along with flexible test flow ensures
continues improvement.
Triple Test Flow
Microchip tests every cell in wafer form twice, then performs a final test after assembly.
Retention Bake
1: Wafer Probe
Full functional
tests on 100% of
die and bits;
85ºC or 125ºC
5000 erase/write
cycles on all bits
2: Wafer Probe
2nd 100% bit
test (25ºC)
full-functional
screen
Main Goals – Zero Defects
3:
Assembly
& Final
Test
■ Full verification of data sheet parameters for
functional compliance at die and package
level.
■ Removal of manufacturing defects to ensure
highest quality and reliability.
■ Screening out of functional devices that may
fail in the future.
• 250ºC up to 24 hours
• Equivalent to 100
years at 85ºC
Key Aspects:
Endurance Testing
MAVERICK
HVST
TVPP
Any die with charge loss in
any cell between the
2 probes is rejected to
prevent infant mortality
Key Aspects:
Functional Test
Verify Margins
GBN
EDIO
LVHF
SBY
Wafer Probe Quality Screens
Microchip performs additional in-house testing during wafer
probe to ensure quality and eliminate any devices that are
outside the normal distribution or might possibly fail in the
future.
High Voltage Stress Test (HVST)
HVST targets weak devices with oxide defects in RAM and logic
circuits by stressing the oxides at higher than normal voltages.
Time at Vpp (TVPP)
TVPP targets oxide defects in EEPROM cells, charge pumps
and other high-voltage circuits. Programming voltages (VPP) are
applied to the memory array for an extended period of time in
order to highlight any weak devices.
Low Voltage High Frequency (LVHF)
LVHF targets signal paths that are partially blocked and therefore
more resistive than normal. LVHF eliminates these devices by
requiring them to operate faster than specified and at voltages
lower than specified.
10
Serial Memory Products
Good Die in a Bad Neighborhood (GBN) and
Edge Die Ink Out (EDIO)
Special algorithms target devices that function, but are
suspect because of their proximity to clusters of failing
devices or edge die.
Failing Die
Rejected by
GBN screen
Passing Die
Rejected by
EDIO screen
Rejected by
EDIO screen
(Concept)
What Does All of This Mean?
■ <<1 PPM Field Failures
■ Best-in-class endurance
■ Industry-leading data retention
Consistent, Reliable Supply of the Highest Quality Products
Microchip: A leader in non-volatile memory for over 20 years.
Perfected testing mechanisms along with streamlined
in-house fabrication ensures the highest efficiency,
shortest lead times and lowest costs.
“Quality Comes First” is at the top of the list of
Guiding Values for Microchip Technology. As an
ISO/TS-16949 certified supplier since 2003,
Microchip’s Aggregate System uniquely supports our
commitment to exceptional quality. In an environment
where enterprise-wide commitment to continuous
improvement is demonstrated and every employee is
responsible for quality.
■ EEPROMs built at Microchip owned fabs (Gresham,
OR, Tempe, AZ)
■ No obsolescence policy – industry’s longest product
life cycles
■ 100% in-house testing on all of our products
■ AECQ100, TS19649 and automotive grade compliant
■ Industry’s shortest lead times
■ Excellent global sales and technical support
With more than 20 years of experience in serving the demanding requirements of customers worldwide, Microchip
Technology has a proven track record of success in delivering the total product solution to our valued customers
that is cost effective and reliable.
Corporate Headquarters
Chandler, Arizona
Fab 4
Gresham, Oregon
Fab 2
Tempe, Arizona
Product Assembly/Test
Bangkok, Thailand
www.microchip.com/quality
Serial Memory Products
11
Resources to Get You Started Quickly
Reduce development time and cost with our development tools.
Competitive market conditions force businesses to examine every aspect of their product life cycle to maximize
productivity and minimize expense. Easy-to-learn, low-cost common development tools are one way to reduce risk
and get to market quicker.
MPLAB® Starter Kit for Serial Memory Products
UNI/O® Bus Parasitic Power Demo Board
(DV243003)
(AC243004)
Reduce time to market and
create a rock-solid design using
the MPLAB Starter Kit for Serial
Memory Products. It includes
everything necessary to quickly
develop a robust and reliable
Serial EEPROM design, and greatly reduces the time
required for system integration and hardware/software
fine-tuning.
■ 3.3V and 5.0V on-board voltage selection
■ Supports Microchip UNI/O bus, I²C, SPI and
Microwire Serial EEPROMs
■ 1.8V to 5.5V external voltage support
■ Includes free copy of MPLAB IDE
■ USB interconnect
The UNI/O Bus Parasitic Power
Demo Board is designed to
illustrate how a standard
half-wave rectifier and
capacitor circuit can be used
to parasitically extract power
for a UNI/O device from the
SCIO signal as described in application note, AN1213
“Powering a UNI/O® Bus Device Through SCIO”. This
reduces the number of connections necessary for
adding a UNI/O device to your application down to two:
SCIO and VSS.
Total Endurance™ Software
Total Endurance Software provides a comprehensive
model that helps estimate the endurance and reliability
of Microchip Serial EEPROM devices. By providing
operating conditions based on your application, all
design trade-offs affecting reliability can be accurately
estimated both graphically and numerically in PPM,
FIT and MTBF modes, saving time and ensuring a truly
robust design.
www.microchip.com/devtools
12
Serial Memory Products
Serial EEPROM PIM PICtail™ Pack (AC243003)
The Serial EEPROM PIM PICtail
Modules are a series of boards
designed around Microchip
Serial EEPROM devices. The
boards are designed to interface
with the PICtail Plus connector
as well as the MPLAB Starter Kit
for Serial Memory Products and
the PICkit 3, allowing you to get
started right out of the box.
■ Plug-and-play with PICtail Plus connector and PICkit 3
connector
■ Test points for oscilloscope connections for firmware
debugging (I²C and UNI/O only)
■ Microwire Buses are included for maximum flexibility
in developing your application
Reference Code Resources
Looking for reference code to interface with our serial memory?
Select your serial protocol, microcontroller and preferred implementation below.
Memory Application Notes – PIC® MCUs
Protocol
UNI/O
Bus
Memory
Type
EEPROM
Recommended
Usage
Implementation
PIC10
PIC12
PIC16
PIC18
AN1194
(General Usage)
Assembly – Firmware Delay
AN11741
AN11741
AN11882
AN11741
AN11882
AN1183
Assembly – Hardware Delay
AN11962
AN11962
AN1187
C – Hardware Delay
AN12512
AN12512
AN1191
AN982
AN974
AN979
AN976
AN989
AN1213
(Parasitic Power)
Assembly – Bit Bang
Assembly – Hardware Port
I²C
EEPROM
AN982
PIC32
AN1236
AN1028
C – Bit Bang
C – Hardware Port
Microwire
PIC24/
dsPIC33
EEPROM
AN997
AN1100
AN991
AN1079
Assembly – Bit Bang
AN993
AN999
Assembly – Hardware Port
AN975
AN1020
AN1029
C – Bit Bang
AN1004
C – Hardware Port
EEPROM
AN1023
Assembly – Bit Bang
AN909
AN1006
Assembly – Hardware Port
AN966
AN1000
AN1040
SPI
SRAM
All
EEPROMs
C – Bit Bang
AN1018
AN1096
C – Hardware Port
AN1040
AN1069
AN1269
AN1262
AN1245
–
AN1019
EEPROM Endurance Tutorial
AN1287
AN536
Basic Serial EEPROM Operation
AN603
Continuous Improvement
AN1277
Note 1: Written for baseline (12-bit program word) cores.
2: Written for mid-range (14-bit program word) cores.
Memory Application Notes – Third-Party MCUs
Protocol
Implementation
8051
Assembly – Hardware Delay
AN1184
C – Hardware Delay
AN1185
Assembly – Bit Bang
AN1147
Assembly – Hardware Port
AN1190
C – Bit Bang
AN1195
C – Hardware Port
AN1113
Assembly – Bit Bang
AN1198
Assembly – Hardware Port
AN1197
C – Bit Bang
AN1193
C – Hardware Port
AN1073
MSP430
UNI/O Bus
AN1186
I²C
SPI
www.microchip.com/appnotes
Serial Memory Products
13
Product Specifications
I2C™ Memory Products
Device
Density
(Organization)
24XX00
Max
Clock
Frequency
Operating
Voltage
(AA, LC, C)
Temperature
(I, E, H)
Endurance
(E/W
Cycles)
Data
Retention
Write
Protect
(Hardware)
Packages
128 bits (x8)
400 kHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
No
24XX01/014
1 Kbit (x8)
400 kHz
1.7V-5.5V
-40°C to +150ºC
1M
200 years
W, ½
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, SC70
24XX02/024
2 Kbits (x8)
400 kHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
W, ½
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, SC70
24XX04
4 Kbits (x8)
400 kHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
W, ½
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP
24XX08
8 Kbits (x8)
400 kHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
W, ½
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP
24XX16
16 Kbits (x8)
400 kHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
W, ½
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP
24XX32
32 Kbits (x8)
400 kHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
W, ¼
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP
24XX64/65
64 Kbits (x8)
1 MHz
1.7V-5.5V
-40°C to +125ºC
1M/10M
200 years
W, ¼
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP
24XX128
128 Kbits (x8)
1 MHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
Yes
PDIP, SOIC, TSSOP, 2x3 T-DFN, 6x5 DFN, MSOP, WLCSP
24XX256
256 Kbits (x8)
1 MHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
Yes
PDIP, SOIC, TSSOP, 6x5 DFN, MSOP, WLCSP
24XX512
512 Kbits (x8)
1 MHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
Yes
PDIP, SOIC, TSSOP, 6x5 DFN, WLCSP
24XX1025
1 Mbit (x8)
1 MHz
1.7V-5.5V
-40°C to +125ºC
1M
200 years
Yes
PDIP, SOIC, SOIJ, 6x5 DFN
UNI/O® Bus EEPROM Products
Density
(Organization)
Max
Clock
Frequency
Operating
Voltage
(AA, LC)
Temperature
(I, E)
Endurance
(E/W
Cycles)
Data
Retention
Write
Protect
(Software)
Packages
11XX010
1 Kbit (x8)
100 kHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP
11XX020
2 Kbits (x8)
100 kHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP
11XX040
4 Kbits (x8)
100 kHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP
Device
11XX080
8 Kbits (x8)
100 kHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP
11XX160
16 Kbits (x8)
100 kHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP
Microwire EEPROM Products
Density
(x8 or x16)
Max
Clock
Frequency
Operating
Voltage
(AA, LC, C)
Temperature
(I, E)
Endurance
(E/W
Cycles)
Data
Retention
Write
Protect
(Hardware)
Read
Current
93XX46A/B/C
1 Kbit
3 MHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
No
1 mA
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP
93XX56A/B/C
2 Kbits
3 MHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
No
1 mA
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP
93XX66A/B/C
4 Kbits
3 MHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
No
1 mA
PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP
93XX76A/B/C
8 Kbits
3 MHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
Yes
1 mA
PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP
93XX86A/B/C
16 Kbits
3 MHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
Yes
1 mA
PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP
Device
Packages
A: x8 Organization, B: x16 Organization, C: Selectable x8 or x16 Organization
SPI EEPROM Products
Device
Density
(Organization)
Max Clock
Frequency
Operating
Voltage
(AA, LC)
Temperature
(I, E, H)
Endurance
(E/W
Cycles)
Data
Retention
Write Protect
(Software)
Packages
25XX010A
1 Kbit (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP, SOT-23
25XX020A
2 Kbits (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP, SOT-23
25XX040A
4 Kbits (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP, SOT-23
25XX080C/D
8 Kbits (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN
25XX160C/D
16 Kbits (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN
25XX320A
32 Kbits (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN
25XX640A
64 Kbits (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN
25XX128
128 Kbits (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, 6x5 DFN
25XX256
256 Kbits (x8)
10 MHz
1.8V-5.5V
-40°C to +150ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, TSSOP, 6x5 DFN
25XX512
512 Kbits (x8)
20 MHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
W, ½, ¼
PDIP, SOIC, 6x5 DFN
25XX1024
1 Mbit (x8)
20 MHz
1.8V-5.5V
-40°C to +125ºC
1M
200 years
W, ½, ¼
PDIP, SOIJ, 6x5 DFN
1. Voltage Range: AA = 1.7- 5.5V; LC = 2.5-5.5V; C = 4.5-5.5V
2. I = -40ºC to 85ºC; E = -40ºC to 125ºC; H = -40ºC to 150ºC
3. Pb-Free, Halogen Free and RoHS Compliant
4. Write Protect: W = Whole Array, ½ = Half Array, ¼ = Quarter Array
5. ESD protection > 4 kV (HBM); > 400V (MM) on all pins
6. H Temp is SOIC only
Serial SRAM Products
Device
Density
Organization)
Max
Clock Frequency
Operating
Voltage (A, K)
Temperature
(I, E)
Read Current
(mA)
Max Standby
Current
Packages
23x640
8KB (64 Kbits)
20 MHz
1.8V, 3V
-40°C to +125ºC
3 mA
4 μA
PDIP, SOIC, TSSOP
23X256
32 KB (256 Kbits)
20 MHz
1.8V, 3V
-40°C to +125ºC
3 mA
4 μA
PDIP, SOIC, TSSOP
1. Voltage Range: A = 1.5- 1.95V; K = 2.7V-3.6V
2. All Devices are Pb-Free, RoHS Compliant and Halogen Free
For up to date product information visit: www.microchip.com/memory
14
Serial Memory Products
Serial Memory Ordering Information
Part Number Suffix Designations
Ordering information for Microchip SEEPROM products.
24 AA 02 T - I /SN
Package Type:
MNY/MC/MF 8-TDFN/DFN
SN
8-SOIC (150 mil)
LT
5-SC70
TT/OT
3/5/6 SOT-23
W/WF/S
Wafer/Die
ST
8-TSSOP
CS
WLCSP – die size
P
8-PDIP
TO
TO92
SM
8-SOIJ (208 mil)
MS
8-MSOP
Operating Temperature Range:
I:
Industrial (-40°C to +85°C)
E:
Extended Industrial Range (-40°C to +125°C)
H:
Extended (-40°C to +150°C)
Tape and Reel
T:
Tape and Reel
blank:
Standard (bulk)
Density:
00:
128 bits
32/320:
32 Kbit
01/010/014: 1 Kbit
64/640:
64 Kbit
02/020/024: 2 Kbit
128:
128 Kbit
04/040:
4 Kbit
256:
256 Kbit
08/080:
8 Kbit
512:
512 Kbit
16/160:
16 Kbit
1024/1025: 1 Mbit
Voltage Range:
AA
1.8V-5.5V
LC
2.5V-5.5V
C
4.5V-5.5V
K
1.8-3.6V
A
1.5-1.95V
VL
1.5V-3.6V
Bus Type:
24/34: I2C
25:
SPI
93:
Microwire
11:
UNI/O Bus
23:
SRAM (SPI)
Programming & Special Services
We can pre-program your EEPROMs before they ship.
Microchip offers custom programming options in package
and die:
■ QTP – All devices are programmed with same data
■ SQTP – Each device is programmed with unique data
Get started today… additional resources at:
Do you have special product requirements?
www.microchip.com/memory
Microchip offers customized versions of existing products:
■ Lower VDD (<1.5V in some cases)
■ Extreme temperature (< -55ºC to >+150ºC)
■ More endurance, up to 10M cycles
■ Lower current specs (read, write, standby)
■ Higher speed
■ Customer design modifications:
– Different I2C and UNI/O addresses
– Custom voltage ranges
■
■
■
■
■
■
Datasheets and application notes (with code)
Verilog, IBIS models
Usage recommendation ap notes
Webinars at www.microchip.com/webinars
Samples at www.microchip.com/samples
Tools and demo boards
Serial Memory Products
15
Support
Training
Microchip is committed to supporting its customers
in developing products faster and more efficiently. We
maintain a worldwide network of field applications
engineers and technical support ready to provide product
and system assistance. In addition, the following service
areas are available at www.microchip.com:
■ Support link provides a way to get questions
answered fast: http://support.microchip.com
■ Sample link offers evaluation samples of any
Microchip device: http://sample.microchip.com
■ Forum link provides access to knowledge base and
peer help: http://forum.microchip.com
■ Buy link provides locations of Microchip Sales Channel
Partners: www.microchip.com/sales
If additional training interests you, then Microchip can
help. We continue to expand our technical training options,
offering a growing list of courses and in-depth curriculum
locally, as well as significant online resources – whenever
you want to use them.
■ Regional Training Centers: www.microchip.com/rtc
■ MASTERs Conferences: www.microchip.com/masters
■ Worldwide Seminars: www.microchip.com/seminars
■ eLearning: www.microchip.com/webseminars
■ Resources from our Distribution and Third Party Partners
www.microchip.com/training
Sales Office Listing
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Tel: 678-957-9614
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Tel: 774-760-0087
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3/26/09
The Microchip name and logo, the Microchip logo, MPLAB, PIC and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries. PICkit, PICtail and Total Endurance is a trademark of Microchip Technology
Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are property of their respective companies.
© 2010, Microchip Technology Incorporated, All Rights Reserved. Printed in the U.S.A. 3/10
DS22239A
*DS22239A*
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