INA250-Q1 SBOS805 – JULY 2016 INA250-Q1, Automotive 36-V, Low- or High-Side, Bidirectional, Zero-Drift Current-Shunt Monitor with Precision Integrated Shunt Resistor 1 Features 2 Applications • • • • • • • • • • • • Qualified for Automotive Applications AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range – Device HBM ESD Classification Level 2 – Device CDM ESD Classification Level C5 Precision Integrated Shunt Resistor: – Shunt Resistor: 2 mΩ – Shunt Resistor Tolerance: 0.1% (Maximum) – 15 A Continuous from –40°C to +85°C – 0°C to 125°C Temperature Coefficient: 10 ppm/°C High Accuracy: – Gain Error (Shunt and Amplifier): 0.3% (Maximum) – Offset Current: 50 mA (Maximum, INA250A2Q1) Four Available Gains: – INA250A1-Q1: 200 mV/A – INA250A2-Q1: 500 mV/A – INA250A3-Q1: 800 mV/A – INA250A4-Q1: 2 V/A Wide Common-Mode Range: –0.1 V to 36 V Specified Operating Temperature: –40°C to +125°C Body Control Modules DC/DC Converter Battery Management Systems Engine Control Systems Suspension Systems 3 Description The automotive qualified INA250-Q1 is a voltageoutput, current-sensing amplifier family that integrates an internal precision shunt resistor to enable highaccuracy current measurements at common-mode voltages that may vary from 0 V to 36 V, independent of the supply voltage. The INA250-Q1 family is available in four output voltage scales: 200 mV/A, 500 mV/A, 800 mV/A, and 2 V/A. This device is fully tested and specified for continuous currents up to 10 amps at the maximum temperature of 125°C. The INA250-Q1 device operates from a single 2.7-V to 36-V supply and draws a maximum of 300 µA of supply current. All INA250-Q1 gain versions are specified over the extended operating temperature range (–40°C to +125°C), and are available in a TSSOP-16 package. Device Information(1) PART NUMBER INA250-Q1 PACKAGE TSSOP (16) BODY SIZE (NOM) 5.00 mm × 4.40 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic Device Supply (2.7 V to 36 V) CBYPASS 0.1 µF Power Rail (0 V to 36 V) IN+ SH+ VIN+ VS REF Microcontroller + OUT ADC ± IN- SH- VIN- GND ADC Load Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of development. Subject to change or discontinuance without notice. PRODUCT PREVIEW 1 INA250-Q1 SBOS805 – JULY 2016 www.ti.com Table of Contents 1 2 3 4 5 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device and Documentation Support.................... 5.2 5.3 5.4 5.5 5.6 1 1 1 2 3 6 5.1 Receiving Notification of Documentation Updates.... 3 Documentation Support ........................................... Community Resources.............................................. Trademarks ............................................................... Electrostatic Discharge Caution ................................ Glossary .................................................................... 3 3 3 3 3 Mechanical, Packaging, and Orderable Information ............................................................. 4 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES July 2016 * Initial release. PRODUCT PREVIEW 2 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: INA250-Q1 INA250-Q1 www.ti.com SBOS805 – JULY 2016 5 Device and Documentation Support 5.1 Receiving Notification of Documentation Updates To receive notification of documentation updates — go to the product folder for your device on ti.com. In the upper right-hand corner, click the Alert me button to register and receive a weekly digest of product information that has changed (if any). For change details, check the revision history of any revised document. 5.2 Documentation Support 5.2.1 Related Documentation • INA250EVM User Guide 5.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 5.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 5.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 5.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: INA250-Q1 3 PRODUCT PREVIEW TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. INA250-Q1 SBOS805 – JULY 2016 www.ti.com 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. PRODUCT PREVIEW 4 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: INA250-Q1 PACKAGE OPTION ADDENDUM www.ti.com 3-Jul-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) INA250A1QPWRQ1 PREVIEW TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 Q250A1 INA250A2QPWRQ1 PREVIEW TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 Q250A2 INA250A3QPWRQ1 PREVIEW TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 Q250A3 INA250A4QPWRQ1 PREVIEW TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 Q250A4 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 3-Jul-2016 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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