Diodes DMNH6042SK3Q-13 60v 175â°c n-channel enhancement mode mosfet Datasheet

DMNH6042SK3Q
Green
60V 175°C N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
RDS(ON) Max
ID Max
TC = +25°C

Rated to +175°C – Ideal for High Ambient Temperature
Environments
50mΩ @ VGS = 10V
25A

65mΩ @ VGS = 4.5V
22A
100% Unclamped Inductive Switching – Ensures More Reliable
and Robust End Application

Low On-Resistance

Low Input Capacitance

Lead-Free Finish; RoHS Compliant (Notes 1 & 2)

Halogen and Antimony Free. “Green” Device (Note 3)

Qualified to AEC-Q101 Standards for High Reliability

PPAP Capable (Note 4)
BVDSS
60V
Features
Description and Applications
This MOSFET is designed to meet the stringent requirements of
Automotive applications. It is qualified to AEC-Q101, supported up by
a PPAP and is ideal for use in:

Driving Solenoids

Driving Relays
Mechanical Data

Power Management Functions

Case: TO252 (DPAK)

Case Material: Molded Plastic, ―Green‖ Molding Compound; UL
Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020

Terminal Finish - Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208

Weight: 0.315 grams (Approximate)
Top View
Pin Out Top View
Equivalent Circuit
Ordering Information (Note 5)
Part Number
DMNH6042SK3Q-13
Notes:
Case
TO252 (DPAK)
Packaging
2,500/Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Refer to http://www.diodes.com/product_compliance_definitions.html.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
H6042S
YYWW
DMNH6042SK3Q
Document number: DS38902 Rev. 2 - 2
= Manufacturer’s Marking
H6042S = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Two Digits of Year (ex: 16 = 2016)
WW = Week Code (01 to 53)
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Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 8) VGS = 10V
TC = +25°C
TC = +70°C
Steady
State
Value
60
±20
25
17
40
25
3.5
65
ID
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Maximum Continuous Body Diode Forward Current (Note 8)
Avalanche Current (Note 9) L = 10mH
Avalanche Energy (Note 9) L = 10mH
IDM
IS
IAS
EAS
Units
V
V
A
A
A
A
mJ
Thermal Characteristics
Characteristic
Symbol
PD
Total Power Dissipation (Note 6)
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 6)
Value
2
73
36
3.5
43
21
3.2
-55 to +175
RθJA
Total Power Dissipation (Note 7)
PD
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 7)
Thermal Resistance, Junction to Case (Note 8)
Operating and Storage Temperature Range
RθJA
RθJC
TJ, TSTG
Units
W
°C/W
W
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 10)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 10)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
60
—
—
—
—
—
—
1
±100
V
µA
nA
VGS = 0V, ID = 250μA
VDS = 60V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(TH)
RDS(ON)
—
30
45
0.8
3.0
50
65
1.2
V
Static Drain-Source On-Resistance
1.0
—
—
—
mΩ
VDS = VGS, ID = 250μA
VGS = 10V, ID = 6A
VGS = 4.5V, ID = 6A
VGS = 0V, IS = 2.6A
tD(ON)
tR
tD(OFF)
tF
tRR
—
—
—
—
—
—
—
—
—
—
—
—
—
584
83
24
3.8
4.2
8.8
1.8
1.8
3.4
1.9
10.1
4.5
12.9
—
—
—
—
—
—
—
—
—
—
—
—
—
pF
pF
pF
Ω
nC
nC
nC
nC
ns
ns
ns
ns
ns
QRR
—
5.4
—
nC
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 11)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes:
VSD
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
V
Test Condition
VDS = 25V, VGS = 0V,
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
VDS = 44V, ID = 5.2A
VGS = 10V, VDS = 30V,
RG = 6Ω, ID = 1A
IF = 2.6A, di/dt = 100A/μs
6. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
7. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
8. Thermal resistance from junction to soldering point (on the exposed drain pad).
9. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C.
10. Short duration pulse test used to minimize self-heating effect.
11. Guaranteed by design. Not subject to product testing.
DMNH6042SK3Q
Document number: DS38902 Rev. 2 - 2
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30.0
30
VGS = 8.0V
VGS = 5.0V
VDS = 5V
25
20.0
VGS = 10V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
25.0
VGS = 4.5V
15.0
VGS = 4.0V
10.0
20
15
10
TJ = 175oC
TJ = 150oC
TJ = 125oC
TJ = 85oC
5
5.0
VGS = 3.3V
0
0.0
1
2
3
4
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
0.08
0.07
0.06
VGS = 4.5V
0.05
0.04
0.03
VGS = 10V
0.02
0.01
0
0
1
5
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0
0.09
TJ = 175oC
0.07
0.06
TJ =
0.05
150oC
TJ = 125oC
TJ = 85oC
0.04
0.03
TJ = 25oC
0.02
TJ = -55oC
ID = 5.1A
0.07
0.06
0.05
0.04
0.03
ID = 4.4A
0.02
0.01
2
4
6
8
10 12 14 16 18
VGS, GATE-SOURCE VOLTAGE (V)
20
Figure 4. Typical Transfer Characteristic
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
VGS = 10V
6
0.08
2
0.08
2
3
4
5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
0.1
4
6
8 10 12 14 16 18 20
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs Drain Current and
Gate Voltage
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
TJ = 25oC
TJ = -55oC
2.4
2.2
VGS = 10V, ID = 5.1A
2
1.8
1.6
1.4
1.2
1
VGS = 4.5V, ID = 4.4A
0.8
0.6
0.4
0.01
0
5
10
15
20
25
30
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs Drain Current and
Temperature
DMNH6042SK3Q
Document number: DS38902 Rev. 2 - 2
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-50
-25
0
25
50
75
100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Temperature
August 2016
© Diodes Incorporated
DMNH6042SK3Q
2.8
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.1
0.09
0.08
VGS = 4.5V, ID = 4.4A
0.07
0.06
0.05
0.04
0.03
VGS = 10V, ID = 5.1A
0.02
2.6
2.4
2.2
2
1.8
ID = 250µA
1.6
1.4
1.2
1
0.01
-50
-50
0
25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Temperature
-25
30
-25
0
25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs Junction
Temperature
1000
f = 1MHz
CT, JUNCTION CAPACITANCE (pF)
VGS = 0V
25
IS, SOURCE CURRENT (A)
ID = 1mA
20
TA = 175oC
15
TA = 150oC
TA = 125oC
10
TA = 85oC
TA = 25oC
5
TA = -55oC
Ciss
Coss
100
Crss
10
0
0
0.3
0.6
0.9
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
0
1.2
5
10 15 20 25 30 35 40 45 50 55 60
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
100
10
PW = 10µs
RDS(ON)
Limited
ID, DRAIN CURRENT (A)
8
VGS (V)
6
4
VDS = 44V, ID = 5.2A
10
PW = 1s
PW = 100ms
PW = 10ms
1
PW = 1ms
TJ(Max) = 175℃
TC = 25℃
PW = 100µs
Single Pulse
DUT on Infinite Heatsink
VGS = 10V
2
0
0.1
0
2
4
6
8
10
Qg (nC)
Figure 11. Gate Charge
DMNH6042SK3Q
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0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12. SOA, Safe Operation Area
100
August 2016
© Diodes Incorporated
DMNH6042SK3Q
1
D=0.9
D=0.7
r(t), TRANSIENT THERMAL RESISTANCE
D=0.5
D=0.3
0.1
D=0.1
D=0.05
0.01
D=0.02
D=0.01
RθJC (t) = r(t) * RθJC
RθJC = 3.2℃/W
Duty Cycle, D = t1/t2
D=0.005
D=Single Pulse
0.001
1E-06
1E-05
0.0001
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIME (sec)
Figure 13. Transient Thermal Resistance
DMNH6042SK3Q
Document number: DS38902 Rev. 2 - 2
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DMNH6042SK3Q
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
TO252 (DPAK)
E
A
b3
7° ± 1°
c
L3
D
A2
L4
e
H
b(3x)
b2(2x)
Gauge Plane
0.508
D1
E1
Seating Plane
a
L
A1
2.74REF
TO252 (DPAK)
Dim Min Max Typ
A 2.19 2.39 2.29
A1 0.00 0.13 0.08
A2 0.97 1.17 1.07
b 0.64 0.88 0.783
b2 0.76 1.14 0.95
b3 5.21 5.46 5.33
c
0.45 0.58 0.531
D 6.00 6.20 6.10
D1 5.21
e
2.286
E 6.45 6.70 6.58
E1 4.32
H 9.40 10.41 9.91
L 1.40 1.78 1.59
L3 0.88 1.27 1.08
L4 0.64 1.02 0.83
a
0°
10°
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
TO252 (DPAK)
X1
Y1
Dimensions
C
X
X1
Y
Y1
Y2
Y2
C
Value (in mm)
4.572
1.060
5.632
2.600
5.700
10.700
Y
X
DMNH6042SK3Q
Document number: DS38902 Rev. 2 - 2
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
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