Diodes DMP1018UCB9 Qualified to aec-q101 standards for high reliability Datasheet

DMP1018UCB9
P-CHANNEL ENHANCEMENT MODE MOSFET
NEW PRODUCT
ADVANCED
ADVANCE INFORMATION
INFORMATION
Product Summary
Features
VDSS
RDS(on)
Qg
Qgd
ID
-12V
12mΩ
4.9nC
1.1nC
-7.6A

LD-MOS technology with the lowest Figure of Merit:
RDS(on) = 12mΩ to Minimize On-State Losses

Vgs(th) = -0.8V typ. for a Low Turn-On Potential

CSP with Footprint 1.5mm × 1.5mm

Height = 0.62mm for Low Profile
Qg = 4.9nC for Ultra-Fast Switching
Typ. @ VGS = -4.5V, TA = +25°C
Description
st
This 1 generation Lateral MOSFET (LD-MOS) is engineered to

ESD = 3kV HBM Protection of Gate

Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
minimize on-state losses and switch ultra-fast, making it ideal for high

Halogen and Antimony Free. “Green” Device (Note 3)
efficiency power transfer. Using Chip-Scale Package (CSP) to

Qualified to AEC-Q101 Standards for High Reliability
increase power density by combining low thermal impedance with
minimal RDS(on) per footprint area.
Mechanical Data
Applications

DC-DC Converters

Battery Management

Load Switch
ESD PROTECTED TO 3kV

Case: U-WLB1515-9

Terminal Connections: See Diagram Below
G
S
S
S
S
S
D
D
D
Top-View
Pin Configuration
Equivalent Circuit
Ordering Information (Note 3)
Part Number
DMP1018UCB9-7
Notes:
Case
U-WLB1515-9
Packaging
3,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
EW = Product Type Marking Code
YM = Date Code Marking
Y or Y = Year (ex: B = 2014)
M or M = Month (ex: 9 = September)
EW
YM
Date Code Key
Year
Code
Month
Code
2012
Z
Jan
1
2013
A
Feb
2
DMP1018UCB9
Document number: DS36149 Rev. 3 - 2
Mar
3
2014
B
Apr
4
May
5
2015
C
Jun
6
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2016
D
Jul
7
Aug
8
2017
E
Sep
9
Oct
O
2018
F
Nov
N
Dec
D
November 2014
© Diodes Incorporated
DMP1018UCB9
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
NEW PRODUCT
ADVANCED
ADVANCE INFORMATION
INFORMATION
Continuous Drain Current (Note 5) VGS = -4.5V
Steady
State
Steady
State
Pulsed Drain Current (Pulse duration 10μs, duty cycle ≤1%)
Continuous Drain Current (Note 6) VGS = -4.5V
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
Value
-12
-6
-7.6
-6.0
ID
Units
V
V
A
-5.5
-4.3
-60
ID
IDM
A
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Total Power Dissipation (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 5)
Thermal Resistance, Junction to Ambient (Note 6)
Operating and Storage Temperature Range
Symbol
PD
PD
RθJA
RθJA
TJ, TSTG
Value
1.0
1.8
126.8
69
-55 to +150
Units
W
W
°C/W
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
@TC = +25°C
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage (Note 6)
Reverse Recovery Charge
Reverse Recovery Time
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Series Gate Resistance
Total Gate Charge (4.5V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes:
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
-12
—
—
—
—
—
—
-1
-100
V
μA
nA
VGS = 0V, ID = -250μA
VDS = -9.6V, VGS = 0V
VGS = -6.0V, VDS = 0V
VGS(th)
-0.4
—
|Yfs|
VSD
Qrr
trr
—
—
—
—
-1.3
18
22
—
-1
—
—
V
RDS (ON)
-0.8
12
15
5.5
-0.7
30.2
71.4
VDS = VGS, ID = -250μA
VGS = -4.5V, ID = -2A
VGS = -2.5V, ID = -2A
VDS = -6V, ID = -2A
VGS = 0V, IS = -2A
Ciss
Coss
Crss
RG
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
—
—
—
—
—
—
—
—
—
—
—
457
272
120
21.23
4.9
0.6
1.1
4.45
12
100
93
—
—
—
—
—
—
—
—
—
—
—
m
S
V
nC
ns
pF
pF
pF
Ω
nC
nC
nC
ns
ns
ns
ns
Test Condition
Vdd = -5V, IF = -2A,
di/dt = 200A/μs
VDS = -6V, VGS = 0V,
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1.0MHz
VGS = -4.5V, VDS = -6V,
ID = -2A
VDD = -6V, VGS = -4.5V,
IDS = -2A, RG = 2Ω,
5. Device mounted on FR-4 PCB with minimum recommended pad layout.
6. Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz (0.071-mm thick) Cu.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
DMP1018UCB9
Document number: DS36149 Rev. 3 - 2
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November 2014
© Diodes Incorporated
DMP1018UCB9
20
10
VGS = -3.0V
VGS = -2.5V
VDS = -5.0V
8
VGS = -1.8V
-ID, DRAIN CURRENT (A)
-ID, DRAIN CURRENT (A)
15
10
VGS = -1.5V
5
6
4
TA = 150C
T A = 125C
2
TA = 85 C
T A = 25C
VGS = -1.2V
0.5
1.0
1.5
2.0
2.5
-VDS, DRAIN -SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
3.0
0.025
0.020
VGS = -2.5V
VGS = -4.5V
0.010
VGS = -6.0V
0.005
0
1
2
3
4
5
6
7
8
9
-ID, DRAIN SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
VGS = -4.5V
ID = -5A
1.5
1.3
VGS = -2.5V
ID = -1A
1.1
0.9
0.7
0.5
-50
Document number: DS36149 Rev. 3 - 2
0.5
1.0
1.5
2.0
-VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
TA = 150C
TA = 125C
0.015
TA = 85 C
TA = 25 C
0.010
TA = -55C
0.005
0
0
2
4
6
8
-ID, DRAIN SOURCE CURRENT (A)
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
10
0.030
0.025
VGS = -2.5V
ID = -1A
0.020
0.015
VGS = -4.5V
ID = -5A
0.010
0.005
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Figure 5 On-Resistance Variation with Temperature
DMP1018UCB9
0
VGS = -4.5V
10
1.7
TA = -55 C
0.020
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
0.030
0.015
0
RDS(on), DRAIN-SOURCE ON-RESISTANCE ()
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
0
0
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
NEW PRODUCT
ADVANCED
ADVANCE INFORMATION
INFORMATION
VGS = -2.0V
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0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Figure 6 On-Resistance Variation with Temperature
November 2014
© Diodes Incorporated
DMP1018UCB9
10
VGS(TH), GATE THRESHOLD VOLTAGE (V)
-IS, SOURCE CURRENT (A)
1.2
1.0
0.8
-ID = 1mA
0.6
-ID = 250µA
0.4
8
TA= 25C
6
4
2
0.2
0
-50
0
10,000
100
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Figure 7 Gate Threshold Variation vs. Ambient Temperature
0
0.2
0.4
0.6
0.8
1.0
1.2 1.4
-VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 8 Diode Forward Voltage vs. Current
-IGSS, LEAKAGE CURRENT (nA)
CT, JUNCTION CAPACITANCE (pF)
f = 1MHz
1,000
Ciss
C oss
100
10
Crss
0
2
4
6
8
10
-VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 9 Typical Junction Capacitance
10
TA = 150°C
1
TA = 125°C
TA = 85°C
0.1
0.01
12
6
TA = 25°C
T A = -55°C
2
3
4
5
6
-VGS, GATE-SOURCE VOLTAGE (V)
Figure 10 Typical Gate-Source Leakage Current vs. Voltage
1
100
5
-ID, DRAIN CURRENT (A)
-VGS, GATE-SOURCE VOLTAGE (V)
NEW PRODUCT
ADVANCED
ADVANCE INFORMATION
INFORMATION
1.4
VDS = -6V
ID = -2A
4
3
2
10
1
0.1
1
0
0.01
0
1
2
3
4
5
6
7
Qg, TOTAL GATE CHARGE (nC)
Figure 11 Gate-Charge Characteristics
DMP1018UCB9
Document number: DS36149 Rev. 3 - 2
8
0.1
1
10
100
-VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12 SOA, Safe Operation Area
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DMP1018UCB9
r(t), TRANSIENT THERMAL RESISTANCE
NEW PRODUCT
ADVANCED
ADVANCE INFORMATION
INFORMATION
1
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.9
D = 0.05
D = 0.02
0.01
D = 0.01
R JA(t) = r(t) * RJA
D = 0.005
RJA = 70°C/W
Duty Cycle, D = t1/ t2
Single Pulse
0.001
0.0001
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIMES (sec)
Figure 13 Transient Thermal Resistance
100
1,000
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
D
6X-Ø b
PIN ID
e
E
e
e
A3
A2
e
U-WLB1515-9
Dim Min
Max
Typ
A
0.62
A2
0.36
0.36
A3 0.020 0.030 0.025
b
0.27
0.37
0.32
D
1.47
1.51
1.49
E
1.47
1.51
1.49
e
0.50
All Dimensions in mm
A
SEATING PLANE
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
D
Dimensions
C1
C
C1
C2
D
C
C
Value
(in mm)
0.50
1.00
1.00
0.25
C2
DMP1018UCB9
Document number: DS36149 Rev. 3 - 2
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© Diodes Incorporated
DMP1018UCB9
IMPORTANT NOTICE
NEW PRODUCT
ADVANCED
ADVANCE INFORMATION
INFORMATION
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
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DMP1018UCB9
Document number: DS36149 Rev. 3 - 2
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© Diodes Incorporated
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