AVX NC12J00392 Ntc smd thermistor Datasheet

NTC SMD Thermistors
NC 12 – NC 20
Chip thermistors are a high quality and low cost device especially developed for surface mounting applications. They are
widely used for temperature compensation but can also
achieve temperature control of printed circuits. Its silver -
palladium - platinum metallization provides a high degree of
resistance to dewetting of the terminations during soldering
(typically 260°C / 30 s).
NC 12
IEC SIZE : 0805
Types
NC 20
IEC SIZE : 1206
3.2 (.126) ± 0.4 (.016)
2 (.079) ± 0.3 (.012)
DIMENSIONS:
millimeters (inches)
1.6 (.063)
± 0.25 (.010)
1.25 (.049)
± 0.2 (.008)
0.5 (.020)
... 1.5 (.059)
0.5 (.020)
... 1.3 (.051)
0.2 (.008) min
0.2 (.008) min
0.2 (.008) min
Terminations
0.2 (.008) min
Silver – palladium – platinum metallization
Marking
On packaging only
Climatic category
40/125/56
Operating temperature
-55°C to +150°C
Tolerance on Rn (25°C)
±5%, ±10%, ±20%
Maximum dissipation at 25°C
Thermal dissipation factor
Thermal time constant
0.12 W
0.24 W
2 mW/°C
4 mW/°C
5s
7s
Resistance - Temperature characteristics: pages 36 to 40.
APPLICATIONS
•
•
•
•
•
•
•
•
•
LCD compensation
Battery packs
Mobile phones
CD players
Heating systems
Air-conditioning systems
Temperature control of Switch Mode Power Supplies
Compensation of pressure sensors
Protection of power transistors in various electronic circuits
HOW TO ORDER
10
NC 20
K0
0103
M
BA
Type
Material Code
K
(See tables pages 11, 36-40)
Resistance
10,000 Ω
Tolerance
M (±20%)
J (±5%)
K (±10%)
Suffix: Packaging
– –: Bulk
BA: Plastic tape
(180mm diam. reel)
BE: Plastic tape (1/2 reel)
BC: Plastic tape
(330mm diam. reel)
BB: Cardboard tape
(180mm diam. reel)
BF: Cardboard tape (1/2 reel)
BD: Cardboard tape
(330mm diam. reel)
NTC SMD Thermistors
NC 12 – NC 20
TABLE OF VALUES
NC 20
IEC SIZE : 1206
NC 12
IEC SIZE : 0805
Types
Rn at 25°C
(Ω)
NC 12 KC 0 180
NC 12 KC 0 220
NC 12 KC 0 270
NC 12 KC 0 330
NC 12 KC 0 390
NC 12 KC 0 470
NC 12 KC 0 560
NC 12 KC 0 680
NC 12 KC 0 820
NC 12 KC 0 101
NC 12 MC 0 121
NC 12 MC 0 151
NC 12 MC 0 181
NC 12 MC 0 221
NC 12 MC 0 271
NC 12 MC 0 331
NC 12 MC 0 391
NC 12 MC 0 471
NC 12 MC 0 561
NC 12 MC 0 681
NC 12 MC 0 821
NC 12 MC 0 102
NC 12 MC 0 122
NC 12 MC 0 152
NC 12 MC 0 182
NC 12 MC 0 222
NC 12 MC 0 272
NC 12 MC 0 332
NC 12 J 0 0332
NC 12 J 0 0392
NC 12 J 0 0472
NC 12 J 0 0562
NC 12 K 0 0682
NC 12 K 0 0822
NC 12 K 0 0103
NC 12 K 0 0123
NC 12 L 0 0153
NC 12 L 0 0183
NC 12 M 0 0223
NC 12 M 0 0273
NC 12 M 0 0333
NC 12 M 0 0393
NC 12 N 0 0473
NC 12 N 0 0563
NC 12 L 2 0683
NC 12 N 0 0823
NC 12 P 0 0104
NC 12 P 0 0124
NC 12 P 0 0154
NC 12 P 0 0184
NC 12 Q 0 0224
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1,000
1,200
1,500
1,800
2,200
2,700
3,300
3,300
3,900
4,700
5,600
6,800
8,200
10,000
12,000
15,000
18,000
22,000
27,000
33,000
39,000
47,000
56,000
68,000
82,000
100,000
120,000
150,000
180,000
220,000
Material
Code
KC
MC
B (K)
(B/B
(1) ± 5%
(2) ± 3%
3470 ± 5%
3910 ± 3%
)
at 25°C
(%/°C)
– 3.9
– 4.4
J
3480 ± 3%
– 3.9
K
3630 ± 3%
– 4.0
L
3790 ± 3%
– 4.2
M
3950 ± 3%
– 4.4
N
4080 ± 3%
– 4.6
L2
N
3805 ± 3%
4080 ± 3%
– 4.1
– 4.6
P
4220 ± 3%
– 4.7
Q
4300 ± 3%
-4.7
Types
Rn at 25°C
(Ω)
NC 20 KC 0 100
10
NC 20 KC 0 120
12
NC 20 KC 0 150
15
NC 20 KC 0 180
18
NC 20 KC 0 220
22
NC 20 KC 0 270
27
NC 20 KC 0 330
33
NC 20 KC 0 390
39
NC 20 KC 0 470
47
NC 20 KC 0 560
56
NC 20 KC 0 680
68
NC 20 KC 0 820
82
NC 20 KC 0 101
100
NC 20 MC 0 121
120
NC 20 MC 0 151
150
NC 20 MC 0 181
180
NC 20 MC 0 221
220
NC 20 MC 0 271
270
NC 20 MC 0 331
330
NC 20 MC 0 391
390
NC 20 MC 0 471
470
NC 20 MC 0 561
560
NC 20 MC 0 681
680
NC 20 MC 0 821
820
NC 20 MC 0 102
1,000
NC 20 MC 0 122
1,200
NC 20 MC 0 152
1,500
NC 20 I 0 0182
1,800
NC 20 I 0 0222
2,200
NC 20 I 0 0272
2,700
NC 20 I 0 0332
3,300
NC 20 J 0 0392
3,900
NC 20 J 0 0472
4,700
NC 20 J 0 0562
5,600
NC 20 J 0 0682
6,800
NC 20 K 0 0822
8,200
NC 20 K 0 0103
10,000
NC 20 K 0 0123
12,000
NC 20 K 0 0153
15,000
NC 20 L 0 0183
18,000
NC 20 L 0 0223
22,000
NC 20 M 0 0273
27,000
NC 20 M 0 0333
33,000
NC 20 M 0 0393
39,000
NC 20 M 0 0473
47,000
NC 20 N 0 0563
56,000
NC 20 N 0 0683
68,000
NC 20 N 0 0823
82,000
NC 20 N 0 0104
100,000
NC 20 P 0 0124
120,000
NC 20 P 0 0154
150,000
NC 20 P 0 0184
180,000
NC 20 P 0 0224
220,000
NC 20 Q 0 0274
270,000
NC 20 Q 0 0334
330,000
NC 20 Q 0 0394
390,000
NC 20 Q 0 0474
470,000
NC 20 R 0 0564
560,000
NC 20 R 0 0684
680,000
NC 20 R 0 0824
820,000
NC 20 R 0 0105 1,000,000
Material
Code
B (K)
(B/B
(1) ± 5%
(2) ± 3%
)
at 25°C
(%/°C)
KC
3470 ± 5%
– 3.9
MC
3910 ± 3%
– 4.4
I
3250 ± 5%
– 3.7
J
3480 ± 3%
– 3.9
K
3630 ± 3%
– 4.0
L
3790 ± 3%
– 4.2
M
3950 ± 3%
– 4.4
N
4080 ± 3%
– 4.6
P
4220 ± 3%
– 4.7
Q
4300 ± 3%
– 4.7
R
4400 ± 3%
– 4.8
11
Packaging for Automatic Insertion
NTC Chip Thermistors / NC/NB Series
AUTOMATIC INSERTION
5.5 (.217)
±0.2 (.008)
Max
3°
30µ ± 5µ
T
K
Designation
Tape width
Tape thickness
Pitch of the sprocket holes
Diameter of the sprocket holes
Symbol
W
T
P0
D0
Distance
Distance (center to center)
Distance (center to center)
Sizes of the
NC 12 (0805)
cavities
E
F
P2
A0
B0
K
Value
8
0.4 max.
4
1.5
-0
1.75
3.5
2
1.5
2.4
1.4 max.
NC 20 (1206)
A0
B0
K
1.95
3.55
1.5 max.
A1
B1
B0
F
R = 0.3 (.012) Max.
The mechanical and dimensional reel characteristics are in
accordance with the IEC publication 286-3.
(.008)
Hole 1 (.039) +0.2
-0
Cover Tape
Max
3°
Super 8 Plastic Tape Packaging:
D0
P2
E
P0
Max
3°
Max
3°
A0
Direction of
unreeling
Tolerance
±0.2
±0.1
±0.1
±0.1
±0.05
±0.1
±0.1
±0.1
K ±0.1
(size is adjustable)
(K = t1 +0.2)
±0.1
±0.1
K ±0.1
(size is adjustable)
(K = t1 +0.2)
+0
ø180 (7.09) - 2 (.079)
+ 0.15 (.006)
Reel
ø 62 (2.44)
± 1.5 (.059)
Direction of unreeling
ø 12.75 (.502) - 0
Reel
according to
ISO/DIS 3639-2
8.4 (.331)
14.4 (.567)
max.
+0.15 (.006)
+ 0.5 (.020)
ø 20.5 (.087) - 0
QUANTITY PER REEL
Type
NC - NB 12
NC 20 - NB 20
16
Suffix
BA
BE
BA
BE
Qty Per Reel
4000
2000
3000
1500
W
Upper side
Bottom side
Packaging for Automatic Insertion
NTC Chip Thermistors / NC/NB Series
AUTOMATIC INSERTION
8mm Paper Tape Packaging:
10 PITCHES CUMULATIVE
TOLERANCE ON TAPE
0.20mm (0.008)
P0
The mechanical and dimensional reel characteristics
are in accordance with the IEC publication 286-3.
BOTTOM
COVER
TAPE
D0
T
P2
E1
TOP
COVER
TAPE
F
W
E2
B0
G
T1
T1
Designation
Symbol
W
T
P0
Tape width
Tape thickness
Pitch of the sprocket holes
Diameter of the sprocket holes
Value
8
1.1 max.
4
1.5
-0/+0.1
1.75
3.5
2
0.10 max.
6.25 min.
0.75 min.
4
2
D0
Distance
Distance (center to center)
Distance (center to center)
Cover tape thickness
Distance
Distance
Component pitch
0805/0603
0402
CAVITY SIZE
SEE NOTE 1
A0
CENTER LINES
OF CAVITY
E1
F
P2
T1
E2
G
P1
P1
User Direction of Feed
Tolerance
-.0.1/+0.3
±0.1
±0.1
±0.1
±0.05
±0.05
±0.1
±0.1
+0
ø180 (7.09) - 2 (.079)
+ 0.15 (.006)
Reel
ø 62 (2.44)
± 1.5 (.059)
Direction of unreeling
ø 12.75 (.502) - 0
Reel
according to
ISO/DIS 3639-2
8.4 (.331)
14.4 (.567)
max.
+0.15 (.006)
Upper side
Bottom side
+ 0.5 (.020)
ø 20.5 (.087) - 0
QUANTITY PER REEL
Type
NB - NC 12
NB 21
NB 23
Suffix
BB
BF
BB
BF
Qty Per Reel
4000
2000
10000
5000
17
Surface Mounting Guide
Chip Thermistor – Application Notes
STORAGE
Wave
Good solderability is maintained for at least twelve months,
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
300
Preheat
Solder Temp.
SOLDERABILITY / LEACHING
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.
Terminations will resist leaching for at least the immersion
times and conditions recommendations shown below.
P/N
Termination
Type
AgPdPt
Nickel Barrier
NC
NB
Solder
Tin/Lead
60/40
60/40
Solder
Temp ºC
260 ± 5
260 ± 5
T
200
230ºC
to
250ºC
150
100
50
0
Immersion
Time Seconds
15 max
30 ± 1
NB products are compatible with a wide range of soldering
conditions consistent with good manufacturing practice for
surface mount components. This includes Pb free reflow
processes with peak temperatures up to 270ºC.
Recommended profiles for reflow and wave soldering are
shown below for reference.
NC products are recommended for lead soldering application
or gluing techniques.
Natural
Cooling
250
1 to 2 min
3 sec. max
(Preheat chips before soldering)
T/maximum 150°C
a) The visual standards used for evaluation of solder joints
will need to be modified as lead free joints are not as bright
as with tin-lead pastes and the fillet may not be as large.
b) Resin color may darken slightly due to the increase in
temperature required for the new pastes.
c) Lead-free solder pastes do not allow the same self alignment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to be
modified.
Reflow
300
D2
RECOMMENDED
SOLDERING PAD
LAYOUT
Natural
Cooling
Preheat
Solder Temp.
250
200
D5
REFLOW SOLDERING
100
50
Case
Size
0
1min
1min
Temperature °C
0402
NB23
0603
NB21
0805
NB12
1206
NB20
D1
D2
D3
D4
D5
1.70
(.067)
2.30
(.091)
3.00
(.118)
4.00
(.157)
0.60
(.024)
0.80
(.031)
1.00
(.039)
1.00
(.039)
0.50
(.020)
0.70
(.028)
1.00
(.039)
2.00
(.079)
0.60
(.024)
0.80
(0.31)
1.00
(.039)
1.00
(.039)
0.50
(.020)
0.75
(.030)
1.25
(.049)
2.50
(.098)
WAVE SOLDERING
50
100
150
• Pre-heating: 150°C ±15°C / 60-90s
• Max. Peak Gradient: 2.5°C/s
• Peak Temperature: 245°C ±5°C
• Time at >230°C: 40s Max.
18
P/N
10 sec. max
(Minimize soldering time)
300
250
200
150
100
50
0
0
D3
D4
Dimensions in
mm (inches)
220ºC
to
250ºC
150
D1
200
250
Time (s)
300
Case
Size
P/N
0603
NB21
0805
NB12
1206
NB20
D1
D2
D3
D4
D5
3.10
(.122)
4.00
(.157)
5.00
(.197)
1.20
(.047)
1.50
(.059)
1.50
(.059)
0.70
(.028)
1.00
(.039)
2.00
(.079)
1.20
(.047)
1.50
(.059)
1.50
(.059)
0.75
(.030)
1.25
(.049)
1.60
(.063)
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