Diodes DMT6016LPS-13 60v n-channel enhancement mode mosfet Datasheet

DMT6016LPS
60V N-CHANNEL ENHANCEMENT MODE MOSFET
®
POWERDI
ADVANCED INFORMATION
Product Summary
Features
V(BR)DSS
RDS(ON)
60V
15mΩ @ VGS = 10V
24mΩ @ VGS = 4.5V
ID
TC = +25°C
32 A
24 A
Description
This MOSFET is designed to minimize the on-state resistance (RDS(ON))
and maintain superior switching performance, making it ideal for high
efficiency power management applications.
Thermally Efficient Package - Cooler Running Applications
High Conversion Efficiency
Low RDS(ON) – Minimizes On-State Losses





Low Input Capacitance
Fast Switching Speed
<1.1mm Package Profile – Ideal for Thin Applications
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Mechanical Data


Applications






Load Switch
Adaptor Switch
Notebook PC
Case: POWERDI5060-8
Case Material: Molded Plastic, “Green” Molding Compound;
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram Below
Weight: 0.097 grams (Approximate)



D
POWERDI5060-8
Pin1
S
D
S
D
S
D
G
D
G
S
Top View
Top View
Pin Configuration
Internal Schematic
Bottom View
Ordering Information (Note 4)
Part Number
DMT6016LPS-13
Notes:
Case
POWERDI5060-8
Packaging
2,500 / Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
POWERDI5060-8
D
D
D
D
=Manufacturer’s Marking
T6016LS = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Digit of Year (ex: 14 = 2014)
WW = Week Code (01 to 53)
T6016LS
YY WW
DMT6016LPS
S
S
Document number: DS37218 Rev. 5 - 2
S
G
1 of 7
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February 2015
© Diodes Incorporated
DMT6016LPS
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Steady
State
ADVANCED INFORMATION
Continuous Drain Current (Note 6) VGS = 10V
t < 10s
TC = +25°C
TC = +70°C
TA = +25°C
TA = +70°C
Value
60
±20
32
25
ID
A
14.8
11.9
60
2
15.3
11.7
ID
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Maximum Continuous Body Diode Forward Current (Note 6)
Avalanche Current (Note 8) L = 0.1mH
Avalanche Energy (Note 8) L = 0.1mH
Units
V
V
IDM
IS
IAS
EAS
A
A
A
A
mJ
Thermal Characteristics
Characteristic
Symbol
PD
Total Power Dissipation (Note 5)
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 5)
RJA
Total Power Dissipation (Note 6)
PD
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 6)
RJA
Thermal Resistance, Junction to Case (Note 7)
Operating and Storage Temperature Range
Electrical Characteristics
RJC
TJ, TSTG
Units
W
°C/W
W
°C/W
°C/W
°C
(@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 9)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 9)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
60
—
—
—
—
—
—
1
±100
µA
VGS(th)
Static Drain-Source On-Resistance
RDS (ON)
VSD
1
—
—
—
—
—
—
0.7
2.5
15
24
1.2
Ciss
Coss
Crss
RG
Qg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
trr
Qrr
—
—
—
—
—
—
—
—
—
—
—
—
—
—
864
282
27
1.3
8.4
17
3.1
4.3
3.4
5.2
13
7
22
11
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 10)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes:
Value
1.23
102
52
2.7
49
24
4.8
-55 to +150
V
nA
V
mΩ
V
Test Condition
VGS = 0V, ID = 250µA
VDS =48V, VGS = 0V
VGS = 20V, VDS = 0V
VDS = VGS, ID = 250µA
VGS = 10V, ID = 20A
VGS = 4.5V, ID = 18A
VGS = 0V, IS = 1A
pF
VDS = 30V, VGS = 0V,
f = 1MHz
Ω
VDS = 0V, VGS = 0V, f = 1MHz
nC
VDS = 30V, ID = 10A
ns
VGS = 10V, VDS = 30V,
RG = 6Ω, ID = 10A
ns
nC
IF = 10A, di/dt = 100A/µs
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1-inch square copper plate.
7. Thermal resistance from junction to soldering point (on the exposed drain pad).
8. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C.
9. Short duration pulse test used to minimize self-heating effect.
10. Guaranteed by design. Not subject to product testing.
DMT6016LPS
Document number: DS37218 Rev. 5 - 2
2 of 7
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February 2015
© Diodes Incorporated
DMT6016LPS
30
30.0
VDS = 5.0V
VGS = 10V
27.0
VGS = 4.0V
27
VGS = 4.5V
24
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
21.0
18.0
15.0
VGS = 3.5V
12.0
9.0
3.0
18
15
12
9
TA = 150°C
0
1
2
3
4
V DS, DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
VGS = 4.5V
0.02
0.015
VGS = 10V
0.01
0.005
0
0
3
6
9 12 15 18 21 24 27
ID, DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
30
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ( )
1.8
VGS = 10V
ID = 10A
1.6
1.4
VGS = 4.5V
ID = 6A
1.2
1
0.8
0.6
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Figure 5 On-Resistance Variation with Temperature
DMT6016LPS
Document number: DS37218 Rev. 5 - 2
3 of 7
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TA = 85°C
TA = 25°C
TA = -55°C
0
1.5
5
0.03
0.025
T A = 125°C
3
VGS = 3.0V
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
0.0
21
6
6.0
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
ADVANCED INFORMATION
24.0
2
2.5
3
3.5
4
4.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
5
0.025
VGS = 10V
TA = 150°C
TA = 125°C
0.02
TA = 85°C
0.015
T A = 25°C
0.01
0.005
TA = -55°C
0
2
4
6
8 10 12 14 16 18
ID, DRAIN CURRENT (A)
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
20
0.04
0.035
0.03
VGS = 4.5V
ID = 6A
0.025
0.02
VGS = 10V
ID = 10A
0.015
0.01
0.005
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Figure 6 On-Resistance Variation with Temperature
February 2015
© Diodes Incorporated
DMT6016LPS
30
24
2.5
2
IS, SOURCE CURRENT (A)
VGS(th), GATE THRESHOLD VOLTAGE (V)
27
ID = 1mA
ID = 250µA
1.5
21
18
15
TA = 85°C
9
TA = 125°C
TA = 25°C
6
3
0
0.5
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Figure 7 Gate Threshold Variation vs. Ambient Temperature
10000
TA = 125°C
1000
TA = 85°C
100
10
TA = 25°C
1
0.1
TA = -55°C
0
0.3
0.6
0.9
1.2
1.5
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 8 Diode Forward Voltage vs. Current
10000
TA = 150°C
CT, JUNCTION CAPACITANCE (pF)
IDSS, DRAIN LEAKAGE CURRENT (nA)
TA = 150°C
12
1
Ciss
1000
Coss
100
C rss
10
1
5
10
15
20
25
30
V DS, DRAIN-SOURCE VOLTAGE (V)
Figure 9 Typical Drain-Source Leakage Current vs. Voltage
0
0
5
10
15
20
25
30
35
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10 Typical Junction Capacitance
40
100
10
RDS(on)
Limited
8
ID, DRAIN CURRENT (A)
V GS GATE THRESHOLD VOLTAGE (V)
ADVANCED INFORMATION
3
VDS = 30V
ID = 10A
6
4
2
0
0
2
4
6
8
10 12 14 16
Qg, TOTAL GATE CHARGE (nC)
Figure 11 Gate Charge
DMT6016LPS
Document number: DS37218 Rev. 5 - 2
18
4 of 7
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10
DC
PW = 10s
1
PW = 1s
PW = 100ms
PW = 10ms
0.1
TJ(max) = 150°C
TA = 25°C
VGS = 10V
Single Pulse
DUT on 1 * MRP Board
0.01
0.01
PW = 1ms
PW = 100µs
0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12 SOA, Safe Operation Area
100
February 2015
© Diodes Incorporated
DMT6016LPS
r(t), TRANSIENT THERMAL RESISTANCE
ADVANCED INFORMATION
1
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
D = 0.005
RJA(t) = r(t) * RJA
RJA = 102°C/W
Duty Cycle, D = t1/ t2
D = Single Pulse
0.001
0.00001
DMT6016LPS
Document number: DS37218 Rev. 5 - 2
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIME (sec)
Figure 13 Transient Thermal Resistance
5 of 7
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10
100
1000
February 2015
© Diodes Incorporated
DMT6016LPS
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
POWERDI®5060-8
D
Detail A
ADVANCED INFORMATION
D1
0(4X)
c
A1
E1 E
e
01 (4X)
1
b (8X)
e/2
1
L
b2 (4X)
D3
A
K
D2
E3 E2
M
b3 (4X)
M1
Detail A
L1
G
POWERDI®5060-8
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0.00
0.05
b
0.33
0.51
0.41
b2
0.200
0.350 0.273
b3
0.40
0.80
0.60
c
0.230
0.330 0.277
D
5.15 BSC
D1
4.70
5.10
4.90
D2
3.70
4.10
3.90
D3
3.90
4.30
4.10
E
6.15 BSC
E1
5.60
6.00
5.80
E2
3.28
3.68
3.48
E3
3.99
4.39
4.19
e
1.27 BSC
G
0.51
0.71
0.61
K
0.51
L
0.51
0.71
0.61
L1
0.100
0.200 0.175
M
3.235
4.035 3.635
M1
1.00
1.40
1.21
Θ
10º
12º
11º
Θ1
6º
8º
7º
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
POWERDI®5060-8
X4
Y2
X3
Y3
Y5
Y1
X2
Y4
X1
Y7
Y6
G1
C
X
DMT6016LPS
Document number: DS37218 Rev. 5 - 2
G
Y(4x)
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Dimensions
C
G
G1
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Value (in mm)
1.270
0.660
0.820
0.610
4.100
0.755
4.420
5.610
1.270
0.600
1.020
0.295
1.825
3.810
0.180
6.610
February 2015
© Diodes Incorporated
DMT6016LPS
IMPORTANT NOTICE
ADVANCED INFORMATION
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
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website, harmless against all damages.
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final and determinative format released by Diodes Incorporated.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
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failure of the life support device or to affect its safety or effectiveness.
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
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DMT6016LPS
Document number: DS37218 Rev. 5 - 2
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February 2015
© Diodes Incorporated
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