ETC CT06V5T1R0 Surface mount fuse Datasheet

Surface Mount Fuse
(Thin Film Chip Fuse)
Pb
Document No
TCT-060S001A
Issued date
2014/02/25
Page
1/6
RoHS
1. Scope
This specification applies for the fuse series of surface mount fuse made by TA-I.
2. Construction
Termination
Marking
Sn Plating
Over Coat
Ceramic Substrate: Al2O3
Cu / Ni Plating
Fuse Element: Cu/Sn
3. Type Designation
CT
06
T
V5
R50
2
Chip Fuse
Rated Voltage
Packaging
Size
V3:32VDC./32VAC.
06:0603(1608)
T: Paper Tape (4K)
Rated
Current
R50:0.50A
V5:50VDC./32VAC.
TA-I TECHNOLOGY CO., LTD
Surface Mount Fuse
(Thin Film Chip Fuse)
Pb
Document No
TCT-060S001A
Issued date
2014/02/25
Page
2/6
RoHS
4. Dimensions
Unit: mm
Dimensions (mm)
Type
(Size code)
CT06
(0603)
L
W
C
d
t
1.65±0.2
0.85±0.2
0.5±0.2
0.5±0.2
0.8±0.20
5. Marking
Symbol for Rating Current
Symbol
Rating Current(A)
B
0.2
C
D
0.25 0.315
E
F
K
L
M
P
N
S
T
3
U
W
Y
0.4
0.5
0.8
1
1.25
1.5
1.6
2
2.5
3
3.15
4
5
TA-I TECHNOLOGY CO., LTD
Surface Mount Fuse
(Thin Film Chip Fuse)
Pb
Document No
TCT-060S001A
Issued date
2014/02/25
Page
3/6
RoHS
6. Applications and ratings
Marking
Rated
Current
CT06V5TR20
B
0.20A
Resistance*
(mΩ)
Typical
3000
CT06V5TR25
C
0.25A
1500
CT06V5TR315
D
0.315A
750
CT06V5TR40
E
0.40A
496
CT06V5TR50
F
0.50A
343
CT06V5TR80
CT06V5T1R0
CT06V5T1R25
CT06V5T1R50
CT06V5T1R60
CT06V3T2R0
CT06V3T2R50
CT06V3T3R00
CT06V3T3R15
CT06V3T4R0
CT06V3T5R0
K
L
M
P
N
S
T
3
U
W
Y
0.80A
1.00A
1.25A
1.50A
1.60A
2.00A
2.50A
3.00A
3.15A
4.00A
5.00A
142
88
63
60
56
34
24.5
20
19
13
10
Part
Designation
Fusing
Time
Open within
2 min.at 200%
rated current
Rated
Voltage
Breaking
Capacity
50V DC /
32V AC
50A
50V DC
32V AC
32V DC/AC
50A
32V DC/AC
*Resistance was measured with less than 10% of rated current.
7.Pre-Arcing time
Rated Current
1.25×In (Min)
2.0×In (Max)
10.0×In (Max)
0.2~5A(Type F)
1 hrs
120s
10ms
Note:
Pre-arcing time at 10 times rated current according to the following types:
Type FF: less than 1ms
Type F: from 1ms to 10ms
Type T: greater than 10ms to 100ms
Type TT: greater than 100ms to 1000ms
TA-I TECHNOLOGY CO., LTD
Surface Mount Fuse
(Thin Film Chip Fuse)
Pb
RoHS
Document No
TCT-060S001A
Issued date
2014/02/25
Page
4/6
8. Reliability Tests
Parameter
Requirement
Test Method
Reference Standard
Carrying capacity
No fusing
Rated current ,4hr
UL248-14
Fusing Time
Within 2 minute
200% of its rated current
IEC60127-4-9.2.1
Without
permanent
The rated voltage of the fuse and shall
arcing、
Breaking capacity
be maintained for 30 s after the fuse
has operated.
ignition、
bursting of fuse
Insulation
0.1MΩ and
Measure with DC twice the rated
Resistance
more
voltage after breaking capacity
IEC60127-1
IEC60127-4-9.3.1
IEC60127-4-9.3.3
Bending Test
No mechanical
damages
Distance between holding points:
90mm, Bending:3mm,1time ,30sec
IEC60115-1-4.33
Resistance to
solder Heat
∣△ R∣<20%
260℃±5℃,10±1second
IEC60028-2-58
Solderability
95% coverage
minimum
235℃±5℃, 2±0.2second
(Solder : Sn96.5 / Ag3.0 / Cu0.5)
IEC60028-2-58
Temperature Rise
△ T<70℃
125% of its rated current, Measure of
surface temperature rise
IEC60127-4-9.7
Resistance to Dry
∣△ R∣<20%
155℃±5℃,96 hrs
Heat
No evident
damages on
15 s with a piece of cloth soaked in
Resistance to
protective
water and again for 15 s with a piece of
Solvent
coating and
cloth soaked in petroleum spirit.
marking
Thermal Shock ∣△ R∣<10%
-55℃/+25℃/+155℃/+25℃, 10 cycles
Humidity
∣△ R∣<20%
40±2°C/90~95%RH,1000 hrs
IEC60115-1-4.23.2
JIS C5201-1-4.23.2
IEC60127-1-6.2
MIL-STD 202-107G
MIL-STD-202G
Method 103B
9. Storage Conditions:
Temperature: 5℃~35℃,Humidity:40%~75%
10. Shelf Life:
2 years from manufacturing date
TA-I TECHNOLOGY CO., LTD
Surface Mount Fuse
(Thin Film Chip Fuse)
Pb
Document No
TCT-060S001A
Issued date
2014/02/25
Page
5/6
RoHS
11. Label
F type(Pre-Arcing time)
Date Code
Rating current
Type
QTY: 5000 PCS
F
LOT NO:
Maker's Name
Rating current
Customer Code
T005F0005K
1005
R50
200%
CT06V5T
TA-I TECHNOLOGY CO.,LTD
Lead Free
0603 50VDC/32VAC (T) F 0.5A 200%
36H00823-00M CT06V5TR50
13.09.12
Part Designation
Date
Customer Label
12. Recommended land patterns
TA-I TECHNOLOGY CO., LTD
Surface Mount Fuse
(Thin Film Chip Fuse)
Pb
RoHS
Document No
TCT-060S001A
Issued date
2014/02/25
Page
6/6
13. Recommend IR – Reflow profile : (solder : Sn96.5 / Ag3 / Cu0.5)
Peak : 250
5
℃ , 5 sec
0
Pre – heat Zone : 150 to 180 ℃, 90±30 sec
Soldering Zone : 230℃ or higher , 30±10 sec
14. ECN
Engineering Change Notice: The customer will be informed with ECN if there is significant
modification on the characteristics and materials described in Approval Sheet.
15.Approvals
IEC60127-1&IEC60127-4
15. Manufacturing Country & City :
TA-I TECHNOLOGY CO., LTD. ( Taiwan– Tao Yuan )
TAIT : No.26, Lane 470, Nan-Shan Rd., Sec.2, Lu-Chu Hsiang,Taoyuan, Taiwan
Tel: (+886) 3-3246169
Fax : (+886) 3-3246167
Associated companies :
(1) TA-I TECHNOLOGY ( SU ZHOU ) CO., LTD. ( China – Su Zhou)
No.675,Luxiang North Road,Songling Town, Wujiang, China (215200)
Tel :(+86) 512-63457879 Fax : (+86) 512-63457869
(2) TA-I TECHNOLOGY ELECTRONIC (DONGGUAN ) CO., LTD. ( China –Dongguan )
Chang xie Road,shien-Ma shiang Changping Town, Dongguan City,Guangdong
Tel : (+86) 769-8339-4790〜3 Fax : (+86) 769-8339-4794
(3) TAI OHM ELECTRONICS ( M ) SDN. BHD. ( Malaysia – Penang )
Plot 564-D ,Lorong Perusahaan Baru 2, Kawasan Perusahaan Perai, 13600 Perai,
Penang, Malaysia. Tel :(+60) 4- 3900480
Fax : (+60) 4-3901481
(4) P.T.TAI ELECTRONIC Indonesia ( Indonesia – Jakarta )
Blok T1 E,F, Jl. Jababeka IV CikarangIndustrial Estate Bekasi, 17530 Indonesia
Tel :(+62) 21-44820254 Fax : (+62) 21-44820256
TA-I TECHNOLOGY CO., LTD
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