Material Content Data Sheet Sales Product Name BSC032NE2LS MA# MA001343728 Package PG-TDSON-8-6 Issued 27. March 2015 Weight* 118.05 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal non noble metal inorganic material non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper gold carbon black epoxy resin silicondioxide tin silver silver tin lead iron phosphorus copper iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7439-89-6 7723-14-0 7440-50-8 7439-89-6 7723-14-0 7440-50-8 0.303 0.26 0.038 0.03 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.26 2571 2571 320 0.011 0.01 37.762 31.99 32.03 319891 96 320307 0.054 0.05 0.05 455 455 0.088 0.07 748 6.265 5.31 37.767 31.99 37.37 319937 373758 1.452 1.23 1.23 12297 12297 0.166 0.14 0.14 1402 1402 0.012 0.01 0.010 0.01 0.463 0.39 0.011 0.01 0.003 0.00 11.320 9.59 0.022 0.02 0.007 0.01 22.292 18.88 53073 103 82 0.41 3919 29 9.60 95896 2. 3. 57 18.91 188839 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 96021 189 Important Remarks: 1. 4104 96 189085 1000000