Material Content Data Sheet Sales Product Name XMC1302-T038X0200 AA MA# MA001406974 Package PG-TSSOP-38-9 Issued 14. September 2015 Weight* 118.36 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper palladium copper carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-05-3 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 1.097 0.93 0.015 0.01 0.060 0.05 506 1.199 1.01 10129 48.679 41.13 0.003 0.00 0.308 0.26 0.192 0.16 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.93 9272 9272 127 42.20 411298 0.26 2599 2. 3. 7.494 6.33 56.362 47.63 54.12 476206 541143 2.200 1.86 1.86 18586 18586 0.337 0.28 0.28 2850 2850 0.102 0.09 0.307 0.26 63314 866 0.35 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 2625 1623 Important Remarks: 1. 422060 26 2598 3464 1000000