Infineon MA001014864 Material content data sheet Datasheet

Material Content Data Sheet
Sales Product Name
BSZ042N06NS
MA#
MA001014864
Package
PG-TSDSON-8-26
Issued
17. June 2015
Weight*
36.77 mg
Construction Element
Material Group
Substances
CAS#
if applicable
Weight
[mg]
Average
Mass
[%]
chip
leadframe
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
< 10%
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
phosphorus
zinc
iron
copper
phosphorus
zinc
iron
copper
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7723-14-0
7440-66-6
7439-89-6
7440-50-8
0.629
1.71
0.002
0.01
0.010
0.03
268
0.197
0.54
5351
7.988
21.73
22.31
217271
222957
0.027
0.07
0.07
725
725
0.037
0.10
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
*deviation
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
1.71
17110
17110
67
1002
1.897
5.16
16.486
44.83
50.09
448405
501011
0.400
1.09
1.09
10885
10885
0.020
0.06
0.06
553
553
0.023
0.06
0.019
0.05
0.895
2.43
0.001
0.00
0.005
0.01
128
0.094
0.26
2556
3.816
10.38
0.001
0.00
0.005
0.01
138
0.101
0.28
2755
4.112
11.19
51604
637
510
2.54
24331
10.65
103787
2.
3.
11.48
111851
Sum in total: 100.00
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Infineon Technologies AG
Address
81726 München
Internet
www.infineon.com
106503
34
Important Remarks:
1.
25478
32
114778
1000000
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