Material Content Data Sheet Sales Product Name IPG20N10S4L-35 MA# MA000940700 Package PG-TDSON-8-4 Issued 29. August 2013 Weight* 96.58 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 2.055 2.13 0.045 0.05 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 2.13 21278 21278 463 0.013 0.01 44.654 46.24 46.30 462340 139 462942 0.795 0.82 0.82 8228 8228 0.090 0.09 935 6.409 6.64 38.636 40.00 46.73 400031 467326 1.308 1.35 1.35 13539 13539 0.048 0.05 0.000 0.00 0.063 0.07 0.051 0.05 2.415 2.50 66360 497 0.05 1 524 2.62 25010 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 498 655 26189 1000000