MAMG-001214-090PSM L-Band 90 W 2-Stage Fully Matched GaN Module Surface Mount Laminate Package Rev. V2 Features Compact Size (14x24 mm 2) GaN on SiC D-Mode Transistor Technology Fully Matched, De-Coupled DC and RF Typical Bias: 45 V, Class AB Intended for Pulsed RADAR Applications Output Power > 90 W, with 30 dB Gain and 60% Power Added Efficiency Up to 3 ms Pulse Width and 10% Duty Cycle MTTF = 600 years (TJ < 200°C) Thermally Enhanced Laminate LGA Package RoHS* Compliant. Lead Free Reflow Compatible MSL-3 Functional Schematic Description The MAMG-001214-090PSM is a 2-stage GaN power module in a “True SMT” laminate package. The module is fully matched. Under pulsed conditions, it can deliver output power greater than 90 W, with 30 dB typical associated gain and 60% typical power added efficiency. Flexible design allows for gate and/or drain pulsing. Additional features include a gate voltage sense port for use in temperature compensation or pulse droop compensation. The overall package size is very small, only 14x24 mm 2. The module’s compact size, combined with excellent RF performance makes this product an ideal solution for pulsed RADAR applications where low cost, light weight and small size are the key. 1 Ordering Information Pin Configuration Pin No. Function 1 RF IN 2 VG 3 Part Number Package 3 VD1 MAMG-001214-090PSM Bulk Packaging 4 NC 4 MAMG-0T1214-090PSM 100 Piece Reel 5 VG sense 5 MAMG-L21214-090PSM Evaluation Board2 6 Ground 7 VD2 8 RF OUT 9 NC 4 1. Reference Application Note M513 for reel size information. 2. Includes one module surface-mounted onto board. * Restrictions on Hazardous Substances, European Union Directive 2002/95/EC. 3. One common gate voltage for both stages in the module. 4. Do not connect. 5. Do not connect to ground if not used. 1 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport MAMG-001214-090PSM L-Band 90 W 2-Stage Fully Matched GaN Module Surface Mount Laminate Package Rev. V2 Electrical Specifications 6 Parameter Symbol Min. Typ. Max. Units RF FUNCTIONAL TESTS: Freq. = 1200-1400 MHz, VDD = 45 V, IDQ = 300 mA, TA = 25°C, ZL = 50 Ω, Pulse Width = 1 ms, Duty Cycle = 10%, PIN = 19 dBm 49.1 49.8 - dBm 82 99 - W GP 30.1 30.9 - dB PAE 56 60 - % Droop - 0.3 0.4 dB 2F0 - -40 - dBc 3 Harmonic 3F0 - -52 - dBc Load Mismatch Stability VSWR-S - 5:1 - - Load Mismatch Tolerance VSWR-T - 6:1 - - Peak Output Power 7 POUT Power Gain Power Added Efficiency Pulse Droop 8 2nd Harmonic rd 6. Typical RF performance measured in RF evaluation board (see layout on page 4). 7. Peak output power measured at center of pulse. 8. Pulse droop measured between 10% and 90% of pulse. Absolute Maximum Ratings 9,10,11,12,13 Parameter Absolute Maximum Input Power 26 dBm Drain Supply Voltage (pulsed), VDD +55 V Gate Supply Voltage Range, VGG -9 V to -2.5 V Supply Current, IDD 4.0 A Power Dissipation, Pulsed Mode @ 85ºC 80 W Junction Temperature14 200 °C Operating Temperature -40°C to +85°C Storage Temperature -65°C to +150°C ESD Maximum - Human Body Model (HBM) 600 V ESD Maximum - Charged Device Model (CDM) 300 V 9. 10. 11. 12. 13. Exceeding any one or combination of these limits may cause permanent damage to this device. MACOM does not recommend sustained operation near these survivability limits. For saturated performance it is recommended that the sum of (3 * VDD + abs (VGG)) < 175 V. CW operation is not recommended. Operating at nominal conditions with TJ ≤ 200°C will ensure MTTF > 1 x 106 hours. Junction temperature directly affects device MTTF and should be kept as low as possible to maximize lifetime. 14. Junction Temperature (TJ) = TC + ӨJC * ((V * I) - (POUT - PIN)). Typical Transient Thermal Resistance ӨJC = 1.7 °C/W (3 ms pulses, 10% duty cycle) 2 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport MAMG-001214-090PSM L-Band 90 W 2-Stage Fully Matched GaN Module Surface Mount Laminate Package Evaluation Board Outline Rev. V2 Parts List Part Value Case Style C1 100 F Radial C2 10 nF 0603 Parts are measured and sampled in the evaluation board shown on the left. The board is made of 8-mil thick RO4003C and is bolted onto a Ni-plated Aluminum plate. Electrical and thermal ground is provided using a Cu-filled via-hole array (pictured below). Very few external components are used, as DC blocks are not required. Bias Sequencing Turning the device ON 1. Set VG to the pinch-off value (VP), typically -6 V. 2. Turn on VD to nominal voltage (50 V). 3. Increase VG to desired quiescent current. 4. Apply RF power to desired level. Turning the device OFF 1. Turn off RF power. 2. Decrease VG down to VP. 3. Turn off VD. 4. Turn off VG. Evaluation Board Via-Hole Array & Landing Pattern15,16,17 15. All dimensions are in inches. 16. Landing pattern indicates solder mask opening. Cu-filled viaholes under the ground are used for optimal thermal performance. Recommended pattern: 8-mil diameter, 8-mil spacing. 17. Layout drawing available upon request. 3 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport MAMG-001214-090PSM L-Band 90 W 2-Stage Fully Matched GaN Module Surface Mount Laminate Package Rev. V2 Package Outline18,19 18. All dimensions are in inches. 19. Reference Application Note S2083 for lead-free solder reflow recommendations. Plating is Ni/Pd/Au. Handling Procedures Please observe the following precautions to avoid damage: Static Sensitivity Gallium Nitride Devices and Circuits are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. 4 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport MAMG-001214-090PSM L-Band 90 W 2-Stage Fully Matched GaN Module Surface Mount Laminate Package Rev. V2 Applications Section Typical Large-Signal Performance Curves: Freq. = 1.3 GHz, 1 ms Pulses, 10% Duty Cycle, VDD = 45 V, IDQ = 300 mA, TA = 25°C Power Added Efficiency vs. Input Power 51 65 50 60 PAE (%) Output Power (dBm) Output Power vs. Input Power 49 48 55 50 47 45 46 40 12 14 16 18 20 22 Input Power (dBm) 12 14 16 18 20 Input Power (dBm) 2F0 and 3F0 Harmonics vs. Input Power Harmonics (dBc) -40 -45 -50 -55 2F0 3F0 -60 12 14 16 18 Input Power (dBm) 20 22 5 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport 22 MAMG-001214-090PSM L-Band 90 W 2-Stage Fully Matched GaN Module Surface Mount Laminate Package Rev. V2 Applications Section Typical Large-Signal Performance Curves Over Frequency: 1 ms Pulses, 10% Duty Cycle, VDD= 45 V, IDQ = 300 mA, TA = 25°C Output Power vs. Frequency Power Added Efficiency vs. Frequency 50.4 66 65 50.2 PAE (%) Pout (dBm) 50.3 50.1 64 63 50.0 62 49.9 49.8 61 1.20 1.25 1.30 1.35 Frequency (GHz) 1.40 1.20 1.25 1.30 1.35 Frequency (GHz) Pulse Droop vs. Frequency 0.5 Pulse Droop (dB) 0.4 0.3 0.2 300 us, 10% duty 3 ms, 10% duty 0.1 0.0 1.20 1.25 1.30 1.35 Frequency (GHz) 1.40 6 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport 1.40 MAMG-001214-090PSM L-Band 90 W 2-Stage Fully Matched GaN Module Surface Mount Laminate Package Rev. V2 Applications Section Typical Large-Signal Performance Curves Over Temperature: 1 ms Pulses, 10% Duty Cycle, VDD= 45 V, IDQ = 300 mA PAE vs. Frequency 110 66 105 64 100 62 95 PAE (%) Output Power (W) Output Power vs. Frequency 90 -40°C 0°C +25°C +50°C +85°C 85 80 75 60 58 -40°C +25°C 56 +85°C 54 1.20 1.25 1.30 1.35 Frequency (GHz) 1.40 1.20 1.25 1.30 1.35 Frequency (GHz) Pulse Droop vs. Frequency 0.7 -40 C 0 C +25 C +50 C +85 C Pulse Droop (dB) 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.20 1.25 1.30 1.35 Frequency (GHz) 1.40 7 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport 1.40