Material Content Data Sheet Sales Product Name TLE7270-2E Issued MA# MA000970646 Package PG-SSOP-14-2 28. August 2013 Weight* 83.26 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 1.717 2.06 0.009 0.01 0.034 0.04 414 0.689 0.83 8276 27.978 33.60 34.48 336032 344825 0.257 0.31 0.31 3092 3092 0.099 0.12 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 2.06 20618 20618 103 1194 4.572 5.49 45.022 54.08 59.69 540746 596850 0.976 1.17 1.17 11724 11724 0.768 0.92 0.92 9220 9220 0.285 0.34 0.854 1.03 54910 3418 1.37 10253 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 13671 1000000