1 of 3 Creation Date : December 13, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGJ3E3C0G2D391J080AA TDK item description CGJ3E3C0G2D391JT**** Applications Feature Series High Reliability Grade Mid Mid Voltage (100 to 630V) AEC-Q200 AEC-Q200 CGJ3(1608) [EIA 0603] Status Production (Not Recommended for New Design) Size Length(L) 1.60mm ±0.10mm Width(W) 0.80mm ±0.10mm Thickness(T) 0.80mm ±0.10mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.30mm Min. 0.70mm to 1.00mm(Flow Soldering) Recommended Land Pattern (PA) 0.60mm to 0.80mm(Reflow Soldering) 0.80mm to 1.00mm(Flow Soldering) Recommended Land Pattern (PB) 0.60mm to 0.80mm(Reflow Soldering) 0.60mm to 0.80mm(Flow Soldering) Recommended Land Pattern (PC) 0.60mm to 0.80mm(Reflow Soldering) Electrical Characteristics Capacitance 390pF ±5% Rated Voltage 200VDC Temperature Characteristic C0G(0±30ppm/°C) Q (Min.) 1000 Insulation Resistance (Min.) 10000MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 Yes Packing Punched (Paper)Taping [180mm Reel] Package Quantity 4000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : December 13, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGJ3E3C0G2D391J080AA Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance CGJ3E3C0G2D391J080AA ESR CGJ3E3C0G2D391J080AA Capacitance CGJ3E3C0G2D391J080AA CGJ3E3C0G2D391J080AA Temperature Characteristic CGJ3E3C0G2D391J080AA(No Bias) DC Bias Characteristic CGJ3E3C0G2D391J080AA(DC Bias = 100V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Multilayer Ceramic Chip Capacitors CGJ3E3C0G2D391J080AA Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : December 13, 2017 (GMT)