TDK C2012C0G1E103J060AA Multilayer ceramic chip capacitor Datasheet

1 of 3
Creation Date : May 08, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C2012C0G1E103J060AA
TDK item description C2012C0G1E103JT****
Applications
Commercial Grade
Feature
General General (Up to 50V)
Series
C2012 [EIA 0805]
Status
Production
Size
Length(L)
2.00mm ±0.20mm
Width(W)
1.25mm ±0.20mm
Thickness(T)
0.60mm ±0.15mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.50mm Min.
1.00mm to 1.30mm(Flow Soldering)
Recommended Land Pattern (PA)
0.90mm to 1.20mm(Reflow Soldering)
1.00mm to 1.20mm(Flow Soldering)
Recommended Land Pattern (PB)
0.70mm to 0.90mm(Reflow Soldering)
0.80mm to 1.10mm(Flow Soldering)
Recommended Land Pattern (PC)
0.90mm to 1.20mm(Reflow Soldering)
Electrical Characteristics
Capacitance
10nF ±5%
Rated Voltage
25VDC
Temperature Characteristic
C0G(0±30ppm/°C)
Q (Min.)
1000
Insulation Resistance (Min.)
10000MΩ
Other
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
No
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
4000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : May 08, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C2012C0G1E103J060AA
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
C2012C0G1E103J060AA
ESR
C2012C0G1E103J060AA
Capacitance
C2012C0G1E103J060AA
C2012C0G1E103J060AA
Temperature Characteristic
C2012C0G1E103J060AA(No Bias)
DC Bias Characteristic
C2012C0G1E103J060AA(DC Bias =
12.5V )
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Multilayer Ceramic Chip Capacitors
C2012C0G1E103J060AA
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : May 08, 2017 (GMT)
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