Product Folder Sample & Buy Support & Community Tools & Software Technical Documents DS280BR810 SNLS511A – SEPTEMBER 2015 – REVISED NOVEMBER 2015 DS280BR810 Low Power 28 Gbps 8 Channel Linear Repeater 1 Features • 1 • • • • • • • • • • • Octal-Channel Multi-Protocol Linear Equalizer Supporting up to 28 Gbps Interfaces Low Power Consumption: 93 mW / Channel (typical) No Heat Sink Required Linear Equalization for Seamless Support of CR4/KR4 Link Training Extends Channel Reach by 15dB+ Beyond Normal ASIC-to-ASIC Capability Ultra-Low Latency: 100 ps (typical) Low Additive Random Jitter Small 8 mm x 13 mm BGA Package with Integrated RX and TX AC Coupling Capacitors for Easy Flow-Through Routing Unique Pinout Allows Routing High-Speed Signals Underneath the Package Pin-Compatible Retimer Available Single 2.5 V ±5% Power Supply -40°C to +85°C Operating Temperature Range The DS280BR810's small package dimensions, optimized high-speed signal escape, and the pincompatible retimer portfolio make the DS280BR810 ideal for high-density backplane applications. Simplified equalization control, low power consumption, and ultra-low additive jitter make it suitable for front-port interfaces such as 100GSR4/LR4/CR4. The small 8 mm x 13 mm footprint easily fits behind numerous standard front-port connectors like QSFP28, SFP28, CFP2/CFP4, and CDFP without the need for a heat sink. Integrated AC coupling capacitors (RX and TX) eliminate the need for external capacitors on the PCB. The DS280BR810 has a single power supply and minimal need for external components. These features reduce PCB routing complexity and bill of materials (BOM) cost. A pin-compatible retimer device is available for longer reach applications. The DS280BR810 can be configured either via the SMBus or through an external EEPROM. Up to 16 devices can share a single EEPROM. Device Information 2 Applications • • • Backplane/Mid-Plane Reach Extension Front-Port Eye Opener for Optical and Passive Copper (100G-SR4/LR4/CR4) QSFP28, SFP28, CFP2, CFP4, CDFP PART NUMBER DS280BR810 The linear nature of the DS280BR810’s equalization preserves the transmit signal characteristics, thereby allowing the host and link partner ASICs to freely negotiate transmit equalizer coefficients (100GCR4/KR4). This transparency to the link training protocol facilitates system-level interoperability with minimal effect on the latency. Each channel operates independently, which allows the DS280BR810 to support individual lane Forward Error Correction (FEC) pass-through. BODY SIZE (NOM) nFBGA(135) 8.0 mm x 13.0 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic 3 Description The DS280BR810 is an extremely low-power, highperformance eight-channel linear equalizer supporting multi-rate, multi-protocol interfaces up to 28 Gbps. It is used to extend the reach and improve the robustness of high-speed serial links for front-port, backplane, and chip-to-chip applications. PACKAGE (1) . . . RX0P RX0N . . . . . . TX0P TX0N . . . RX7P RX7N TX7P TX7N EN_SMB SDA(1) SDC(1) VDD SMBus 1 NŸ Slave mode . . . To system SMBus Address straps (pull-up, pulldown, or float) ADDR0 ADDR1 SMBus Slave mode READ_EN_N ALL_DONE_N 2.5V 1 F (2x) 0.1 F (4x) VDD GND Float for SMBus Slave mode, or connect to next GHYLFH¶V 5($'_EN_N for SMBus Master mode (1) SMBus signals need to be pulled up elsewhere in the system. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DS280BR810 SNLS511A – SEPTEMBER 2015 – REVISED NOVEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device and Documentation Support.................... 1 1 1 2 3 5.1 5.2 5.3 5.4 6 Community Resources.............................................. Trademarks ............................................................... Electrostatic Discharge Caution ................................ Glossary .................................................................... 3 3 3 3 Mechanical, Packaging, and Orderable Information ............................................................. 3 4 Revision History Changes from Original (September 2015) to Revision A • 2 Page Deleted < ............................................................................................................................................................................... 1 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: DS280BR810 DS280BR810 www.ti.com SNLS511A – SEPTEMBER 2015 – REVISED NOVEMBER 2015 5 Device and Documentation Support 5.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 5.2 Trademarks E2E is a trademark of Texas Instruments. 5.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 5.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: DS280BR810 3 PACKAGE OPTION ADDENDUM www.ti.com 27-Oct-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS280BR810ZBFR ACTIVE NFBGA ZBF 135 1000 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DS280BR8 DS280BR810ZBFT ACTIVE NFBGA ZBF 135 250 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DS280BR8 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 27-Oct-2015 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 12-Feb-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS280BR810ZBFR NFBGA ZBF 135 1000 330.0 24.4 8.4 13.4 1.9 12.0 24.0 Q2 DS280BR810ZBFT NFBGA ZBF 135 250 178.0 24.4 8.4 13.4 1.9 12.0 24.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 12-Feb-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS280BR810ZBFR NFBGA ZBF 135 1000 367.0 367.0 45.0 DS280BR810ZBFT NFBGA ZBF 135 250 213.0 191.0 55.0 Pack Materials-Page 2 PACKAGE OUTLINE ZBF0135A NFBGA - 1.35 mm max height SCALE 1.300 PLASTIC BALL GRID ARRAY 13.1 12.9 A B BALL A1 CORNER 8.1 7.9 1.35 MAX C SEATING PLANE 0.46 TYP 0.25 BALL TYP 0.2 C 11.2 TYP SYMM (0.9) TYP J (0.8) TYP H G 6.4 TYP F SYMM E D C 135X B 0.8 TYP BALL A1 CORNER A 1 2 3 4 5 6 7 8 0.51 0.41 0.15 0.08 C A C B 9 10 11 12 13 14 15 0.8 TYP 4221691/A 11/2014 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com EXAMPLE BOARD LAYOUT ZBF0135A NFBGA - 1.35 mm max height PLASTIC BALL GRID ARRAY (0.8) TYP 135X ( 0.4) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 A (0.8) TYP B C D SYMM E F G H J SYMM LAND PATTERN EXAMPLE SCALE:8X ( 0.4) METAL 0.05 MAX METAL UNDER SOLDER MASK 0.05 MIN SOLDER MASK OPENING SOLDER MASK DEFINED NON-SOLDER MASK DEFINED (PREFERRED) ( 0.4) SOLDER MASK OPENING SOLDER MASK DETAILS NOT TO SCALE 4221691/A 11/2014 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99). www.ti.com EXAMPLE STENCIL DESIGN ZBF0135A NFBGA - 1.35 mm max height PLASTIC BALL GRID ARRAY ( 0.4) TYP (0.8) TYP A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 B (0.8) TYP C D SYMM E F G H J SYMM SOLDER PASTE EXAMPLE BASED ON 0.15 mm THICK STENCIL SCALE:8X 4221691/A 11/2014 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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