Datasheet Beam-forming Signal Processing IC for Ultra- Directional Microphone Effect Automotive Grade BU8332CKV-M General Description Applications BU8332CKV-M enables cardioid directivity through beam-forming technology using two omnidirectional microphones placed 10mm apart. Beam forming technology provides sharper directivity than unidirectional microphones. Features include selection of different polar patterns of response, adjustable sharpness of directivity via zoom function and switchable direction sensitivity. The processor enables hands-free calling and improves speech recognition in a variety of devices. ■ Hands-free Operation / Speech Recognition in Car Navigation Systems ■ Portable Devices such as Mobile Phones, Smart Phones, Headset, or Game Machines ■ Applications that Require Voice Input Key Specifications Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Directional Microphone Function (Beam-forming) Microphone Pitch: 10mm Selectable Polar Patterns of Response Adjustable Sharpness of Directivity Switchable Direction Sensitivity Digital Block Powered by Internal 1.5V Regulator Built-in Microphone Bias and Pre-amplifier Analog Microphone Inputs (Differential or Single Ended)x 2ch Analog Line Output PCM Output 2-wire Host Interface(Slave Address : 0x61) Stand-alone Operation with External EEPROM Operating Power Supply Range: 3.0V to 3.6V Operating Temperature Range: -40℃ to +85℃ Operating Current: 15mA(Typ) Deep Standby Current: 1μA(Typ) Polar Pattern Type: “Cardioid”, “Bidirectional”, “Hyper-cardioid” Package W(Typ) x D(Typ) x H(Max) 9.00mm x 9.00mm x 1.625mm VQFP48 Typical Application Circuit 3.3V MCLK MICBIAS1 MICBIAS2 MIC BIAS Regulator PLL XTLO MIC1INP 2ch mcrophone input MICIN MIC1INN LINEOUT DAC ADC Analog output LINEOUT Beam-Forming PCMCLK MIC2INP PCMFS PCM I/F ADC PCMIN MIC2INN Digital output PCM I/F PCMOUT EEPROM I/F (SPI) 2-wire HOST I/F SCL SDA Setting resister RSTB LR SPICLK SPICSB SPIDI SPIDO Figure 1 Typical Application Circuit ○Product structure:Silicon monolithic integrated circuit www.rohm.co.jp © 2014 ROHM Co., Ltd. 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TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M Pin Configuration 25 AVDD 26 AVSS 27 TMON0 28 MIC2INN 29 MIC2INP 30 TMON1 31 MIC1INN 32 MIC1INP 33 COMOUT 34 COMIN 35 MICBIAS2 36 MICBIAS1 (TOP VIEW) BGFLT 37 24 TMODE0 LINEOUT 38 23 TMODE1 AVSS 39 22 TMODE2 AVDD 40 21 RSTB DVDD1 41 20 SDA REGON 42 19 SCL BU8332CKV-M DVDD2 43 18 DVDDIO STBYB 44 17 PCMCLK SPICLK 45 16 PCMFS SPICSB 46 15 PCMIN SPIDI 47 14 PCMOUT 9 XTLO PLLCAP 12 8 DVSS PLLVDD 11 7 DVDDIO MCLK 10 6 4 NC DVDD2 3 NC 5 2 TMODE3 NC 1 13 DVSS LR SPIDO 48 Figure 2 Pin Configuration Pin Description Symbol I/O 1 LR I To select directional axis (“L”: Left, ”Open”: Right) Power supply system DVDDIO 2 TMODE3 I Test pin (Open) DVDDIO A 3 NC - NC - - 4 NC - NC - - 5 NC - NC - - 6 DVDD2 - Digital power supply2 (Controlled by STBYB) - B 7 DVDDIO - I/O power supply - - 8 DVSS - Digital GND - - Pin No. Function www.rohm.co.jp © 2014 ROHM Co., Ltd. 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TSZ22111・15・001 2/26 I/O equal circuit A TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M Pin No. Symbol I/O 9 XTLO O Oscillator output Power supply system DVDDIO 10 MCLK I External clock input / Oscillator input DVDDIO Function 11 PLLVDD - PLL power supply 12 PLLCAP O PLL filter pin (Recommended 56nF to DVSS) I/O equal circuit C C - - PLLVDD D 13 DVSS - Digital GND - - 14 PCMOUT O PCM signal output DVDDIO E 15 PCMIN I PCM signal input DVDDIO F 16 PCMFS I PCM frame signal input DVDDIO F 17 PCMCLK I PCM clock input DVDDIO F 18 DVDDIO - I/O power supply - - 19 SCL I Serial Clock input for 2-wire Host Interface DVDDIO J 20 SDA I/O Serial Data for 2-wire Host Interface (Data input or output) DVDDIO H 21 RSTB I Reset pin (“L” : Power down) DVDDIO G 22 TMODE2 I Test pin (Connect to DVSS) DVDDIO F 23 TMODE1 I Test pin (Connect to DVSS) DVDDIO F 24 TMODE0 I Test pin (Connect to DVSS) DVDDIO F 25 AVDD - Analog power supply - - 26 AVSS - Analog GND - - 27 TMON0 O Test pin (Open) AVDD D 28 29 MIC2INN MIC2INP I I Analog microphone input (2-) Analog microphone input (2+) AVDD AVDD D D 30 TMON1 O Test pin (Open) AVDD D 31 MIC1INN I Analog microphone input (1-) AVDD D 32 MIC1INP I AVDD D 33 COMOUT O AVDD D 34 COMIN I Analog microphone input (1+) Analog reference voltage output (Recommended 1μF to AVSS) Analog reference voltage (Recommended 1μF to AVSS) AVDD D 35 MICBIAS2 O Microphone bias output2 AVDD D 36 MICBIAS1 O Microphone bias output1 AVDD D 37 BGFLT O Bias filter pin (Recommended 0.1μF to AVSS) AVDD D 38 LINEOUT O Line output AVDD D 39 AVSS - Analog GND - - 40 AVDD - Analog power supply - - 41 DVDD1 - Digital power supply1 (Direct input) - - 42 REGON I To control 1.5V regulator (“L”:OFF, “H”:ON) 43 DVDD2 - 44 STBYB I 45 SPICLK O Digital power supply2 (Controlled by STBYB) To control standby (“L” : Power down, ”H” : Normal) SPI clock output 46 SPICSB O 47 SPIDI I 48 SPIDO O DVDDIO I - B DVDDIO I DVDDIO E SPI chip select output DVDDIO E SPI data input DVDDIO F SPI data output DVDDIO E “H” level is voltage value of DVDDIO, ”L” level is voltage value of DVSS. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M BGFLT MCLK 1.5V REG MIC BIAS PLLCAP PLLVDD STBYB DVDD2 DVDD1 REGON DVSS DVDDIO AVSS AVDD Block Diagram PLL XTLO MICBIAS1 MICBIAS2 VOL ADC BPF BPF VOL MIC2INN +20dB MIC2INP DAC DSP ADC VOL MIC1INN +20dB MIC1INP LINEOUT BPF Beam Forming PCMCLK PCM I/F PCMFS PCMIN PCMOUT RSTB 2 wire HOST I/F SCL SDA SPIDO SPIDI SPICSB SPICLK LR EEPROM I/F (SPI) Figure 3 Block Diagram www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M Absolute Maximum Ratings Parameter Symbol Rating Unit. AVDD -0.3 to 4.5 V PLL power supply PLLVDD -0.3 to 4.5 V I/O power supply DVDDIO -0.3 to 4.5 V Digital power supply DVDD1 DVDD2 -0.3 to 2.16 V Analog input voltage VTA AVSS-0.3 to AVDD+0.3 V Digital input voltage VTD DVSS-0.3 to DVDDIO+0.3 V Input current *1 IIN -10 to +10 mA Power Dissipation *2 Pd 0.90 W Storage temperature range TS -50 to 125 ℃ Analog power supply *1: I/O B, J and H of Equivalence Circuits are not included. *2: For operating over 25℃, de-rate the value at 9mW/℃. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameter Symbol Limits Unit Min Typ Max AVDD 3.0 3.3 3.6 V PLL power supply PLLVDD 3.0 3.3 3.6 V I/O power supply DVDDIO DVDD1 DVDD2 3.3 3.6 V DVDD1 1.4 1.5 1.6 V DVDD2 1.45 1.5 1.6 V Clock input frequency FMCLK 4 - 8 MHz Duty DMCLK 40 50 60 % Ta -40 25 85 ℃ Analog power supply Digital power supply Operating temperature range www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M Electrical Characteristics ◆DC Characteristics Application Circuit (Figure 33), Ta=25℃, AVDD=3.3V, PLLVDD=3.3V, REGON=”H” unless otherwise specified. Parameter Current *3 Digital Hi level input voltage Digital Low level input voltage Digital Hi level input current Digital Low level input current Digital Hi level output voltage Digital Low level output voltage Digital Low level output voltage Regulator output voltage *3 Symbol Limits Unit Conditions Min Typ Max IST - 10 90 μA Standby (Setting register) IDST - 1 5 μA Deep standby (STBYB=”L”) IDD - 15 30 mA FS=16kHz,BF=ON VIH 0.7* DVDDIO - - V - VIL - - 0.3* DVDDIO V - IIH - - 1.0 μA VIH=DVDDIO (Pull-down resistance input pins are excluded) IIL -1.0 - - μA VIL=DVSS VOH 0.8* DVDDIO - - V IOH=-1mA VOL 0 - V IOL=1mA VOL 0 - V IOL=3mA (SDA) VREG - 1.5 0.2* DVDDIO 0.2* DVDDIO - V Digital and analog output pin is no-load. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M ◆CODEC Characteristics Application Circuit (Figure 33), Ta=25℃, AVDD=3.3V, PLLVDD=3.3V, REGON=”H”, BF=OFF FS=16 kHz, MIC1VOL/MIC2VOL/LOUTVOL=0dB unless otherwise specified. Limits Parameter Symbol Unit Min Typ Max Transmit signal-to-distortion ratio + Noise MICIN → PCMOUT Receive signal-to-distortion ratio + Noise PCMIN → LINEOUT Transmit gain tracking (-10dBm0 reference) MICIN → PCMOUT SDT 45 - - dB Input signal:0dBm0, 1020Hz Using filter:20kHz LPF SDR 45 - - dB Input signal:0dBm0, 1020Hz Using filter:20kHz LPF -3.0 - 3.0 -1.0 - 1.0 -2.0 - 2.0 -1.0 - 1.0 GTX Receive gain tracking (-10dBm0 reference) PCMIN → LINEOUT GRX Transmit reference level Receive reference level Transmit gain loss relative to frequency (1020Hz reference) MICIN → PCMOUT Receive gain loss relative to frequency (1020Hz reference) PCMIN → LINEOUT dB dB -2.0 - 2.0 VITX 0.037 0.050 0.068 Vrms VORX 0.400 0.500 0.625 Vrms 24 - - 0 - 2.5 -1.0 - 1.0 0 - - 6.5 - - 24 - - 0 - 2.5 -1.0 - 1.0 0 - - 6.5 - - GRTX GRRX dB dB Transmit noise level VNTX - - -73 dBFS Receive noise level VNRX - - -85 dBV www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Conditions 7/26 Input signal:+3.0 to +0.5dBm0, 1020Hz Using filter:1020Hz BPF Input signal:+0.5 to -40dBm0, 1020Hz Using filter:1020Hz BPF Input signal:-40 to -55dBm0, 1020Hz Using filter:1020Hz BPF Input signal:+3.0 to -40dBm0, 1020Hz Using filter:1020Hz BPF Input signal:-40 to -55dBm0, 1020Hz Using filter:1020Hz BPF Input signal:0dBm0, 1020Hz Using filter:1020Hz BPF 20dB amplification in inside Input signal:0dBm0, 1020Hz Using filter:1020Hz BPF Input signal:0dBm0, 0.06kHz Using filter:BPF Input signal:0dBm0, 0.2kHz Using filter:BPF Input signal:0dBm0, 0.3 to 6.8kHz Using filter:BPF Input signal:0dBm0, 7.2kHz Using filter:BPF Input signal:0dBm0, 7.56kHz Using filter:BPF Input signal:0dBm0, 0.06kHz Using filter:BPF Input signal:0dBm0, 0.2kHz Using filter:BPF Input signal:0dBm0, 0.3 to 6.8kHz Using filter:BPF Input signal:0dBm0, 7.2kHz Using filter:BPF Input signal:0dBm0, 7.56kHz Using filter:BPF COMOUT input in MICIN Using filter:A-Weight PCMIN=“L” fixation Using filter:A-Weight TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M ◆Transmit / Receive analog block Application Circuit (Figure 33), Ta=25℃, AVDD=3.3V, PLLVDD=3.3V, REGON=”H”, f=1kHz unless otherwise specified. Parameter Symbol Limits Min Typ Max Unit Conditions Minimum load resistance RALRT 600 - - Ω Measurement Pin:LINEOUT Maximum load capacitance CALRX - - 50 pF Measurement Pin:LINEOUT Maximum output level VAORX 1.9 - - Vpp Measurement Pin:LINEOUT GTVOL -20 - 30 dB GTSTEP - 2 - dB GRVOL -25 - 16 dB GRSTEP - 1 - dB Volume gain setting range MIC1/MIC2 Volume step width MIC1/MIC2 Volume gain setting range LINEOUT Volume step width LINEOUT Measurement Path: MICIN → PCMOUT Measurement Path: MICIN → PCMOUT Measurement Path: MICIN → LINEOUT Measurement Path: MICIN → LINEOUT ◆Reference Application Circuit (Figure 33), Ta=25℃, AVDD=3.3V, PLLVDD=3.3V, REGON=”H” unless otherwise specified. Parameter Symbol Limits Min Typ Max Unit Output voltage VAG 0.45* AVDD 0.5* AVDD 0.55* AVDD V Rise time *4 TAG - - 15 ms *4 Conditions Measurement Pin: COMIN, COMOUT RSTB=“L”→”H” 90%attainment time COMIN=1μF, COMOUT=1μF Rise time is affected to power supply, COMIN capacitance, and process. Please, have sufficient margin when value determination. ◆Microphone BIAS (MICBIAS) Application Circuit (Figure 33), Ta=25℃, AVDD=3.3V, PLLVDD=3.3V, REGON=”H”, f=1kHz unless otherwise specified. Limits Parameter Symbol Unit Conditions Min Typ Max MICBIAS output voltage VMICB 2.2 2.5 2.8 V MICBIAS output noise VNOMICB - -95 -80 dBV PSRR PSRMICB 40 - - dB www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/26 Measurement Pin: MICBIAS1, MICBIAS2 lload=1mA Measurement Pin: MICBIAS1, MICBIAS2 RL=2kΩ Using filter:A-Weight Measurement Pin: MICBIAS1, MICBIAS2 Using filter:1kHz BPF GMIC=0dB, Vrippl=100mVpp TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M 2.60 2.60 2.55 2.55 Output Voltage [V] Output Voltage[V] Typical Performance Curve(s) 2.50 2.50 2.45 2.45 2.40 2.40 2.7 3.0 3.3 3.6 Power Supply[V] 2.7 3.9 0 0 -10 -10 -20 -20 -30 -30 -40 -50 -60 -60 -70 -70 -80 -80 100 1000 Frequency[Hz] 10000 10 Figure 6. PSRR vs Frequency (MICBIAS1PSRR) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3.9 -40 -50 10 3.3 3.6 Power Supply[V] Figure 5. Output Voltage vs Power Supply (MICBIAS2 output voltage) PSRR[dB] PSRR[dB] Figure 4. Output Voltage vs Power Supply (MICBIAS1 output voltage) 3.0 100 1000 Frequency[Hz] 10000 Figure 7. PSRR vs Frequency (MICBIAS2PSRR) 9/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M 0 0 -10 -20 Output Level[dBFS] THD+N[dB] -20 -30 -40 -50 -40 -60 -80 -60 -100 -70 -120 -140 -80 -60 -50 -40 -30 -20 Output Level[dBFS] -10 0 0 -40 -10 -60 -20 -30 -40 -120 -60 -160 10 10000 Figure 10. Output Level vs Frequency (MIC1 gain loss relative to frequency) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -20 -100 -140 100 1000 Frequency[Hz] -40 -80 -50 10 -100 -80 -60 Input Level [dBV] Figure 9. Output Level vs Input Level (MIC1 signal level) Output Level[dBFS] Output Level[dBFS] Figure 8. THD+N vs Output Level (MIC1 signal-to-distortion ratio + Noise) -120 100 1000 Frequency[Hz] 10000 Figure 11. Output Level vs Frequency (MIC1 noise level) 10/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M 0 0 -10 -20 Output Level[dBFS] THD+N[dB] -20 -30 -40 -50 -40 -60 -80 -60 -100 -70 -120 -140 -80 -60 -50 -40 -30 -20 Output Level[dBFS] -10 0 0 -40 -10 -60 -20 -30 -40 -120 -60 -160 10000 10 Figure 14. Output Level vs Frequency (MIC2 gain loss relative to frequency) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -20 -100 -140 100 1000 Frequency[Hz] -40 -80 -50 10 -100 -80 -60 Input Level[dBV] Figure 13. Output Level vs Input Level (MIC2 signal level) Output Level[dBFS] Output Level[dBFS] Figure 12. THD+N vs Output Level (MIC2 signal-to-distortion ratio + Noise) -120 100 1000 Frequency[Hz] 10000 Figure 15. Output Level vs Frequency (MIC2 noise level) 11/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M 0 0 -10 -20 Output Level[dBV] THD+N[dB] -20 -30 -40 -50 -40 -60 -80 -60 -100 -70 -120 -120 -80 -80 -70 -60 -50 -40 -30 -20 Output Level[dBV] -10 0 0 -40 -10 -60 -20 -80 -30 -40 -80 -60 -40 Input Level[dBFS] -20 0 Figure 17. Output Level vs Input Level (LINEOUT signal level) Output Level[dBV] Output Level[dBV] Figure 16. THD+N vs Output Level (LINEOUT signal-to-distortion ratio + Noise) -100 -50 -100 -120 -140 -60 -160 10 100 1000 Frequency[Hz] 10000 10 Figure 18. Output Level vs Frequency (LINEOUT gain loss relative to frequency) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 100 1000 Frequency[Hz] 10000 Figure 19. Output Level vs Frequency (LINEOUT noise level) 12/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M 30 35 25 30 20 25 20 15 15 GAIN[dB] GAIN[dB] 10 5 0 -5 10 5 0 -5 -10 -10 -15 -15 -20 -20 -25 -25 0 5 10 15 Code[dec] 20 0 25 Figure 20. GAIN vs Code (MIC1 Volume) 5 10 15 Code[dec] 20 25 Figure 21. GAIN vs Code (MIC2 Volume) 20 15 10 GAIN[dB] 5 0 -5 -10 -15 -20 -25 -30 0 5 10 15 20 25 Code[dec] 30 35 40 Figure 22. GAIN vs Code (LINEOUT Volume) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M 6.0 200 180 5.5 160 140 Frequency[MHz] Time[msec] 5.0 4.5 4.0 120 100 80 60 40 3.5 20 3.0 0 2.7 3.0 3.3 3.6 Power Supply[V] 3.9 0.0 1.0 1.5 2.0 2.5 PLLCAP Voltage[V] 3.0 3.5 Figure 24. Frequency vs PLL CAP Voltage (V-F characteristic) 20 1.60 15 1.55 Output Voltage[V] Current[mA] Figure 23. Time vs Power Supply (PLL pull-in time) 0.5 10 5 1.50 1.45 0 1.40 2.7 3.0 3.3 3.6 Power Supply[V] 3.9 2.7 3.3 3.6 Power Supply[V] 3.9 Figure 26. Output Voltage vs Power Supply (Regulator output voltage) Figure 25. Current vs Power Supply (Operating Current) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3.0 14/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 2.0 14 1.9 12 1.8 10 Time[msec] Output Voltage [V] BU8332CKV-M 1.7 1.6 8 6 1.5 4 1.4 2 1.3 0 2.7 3.0 3.3 3.6 Power Supply[V] 3.9 2.7 3.3 3.6 Power Supply[V] 3.9 Figure 28. Time vs Power Supply (COMOUT rise time) Figure 27. Output Voltage vs Power Supply (COMOUT output voltage) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3.0 15/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M Digital interface characteristic 1. PCM interface Parameter Clock frequency (PCMCLK) fPCLK Clock duty Frame synchronization signal frequency(PMCFS) Digital input rise time tIR Digital input fall time tIF Transmit / Receive synchronization signal timing Limits Symbol Conditions Min PCMFS=16kHz 256 fDU - 40 fFS - Typ Min Unit 2048 kHz - 60 % 15.992 16 16.008 kHz - - 40 ns - - 40 ns tRS DVDDIO*0.3→DVDDIO*0.7 PCKCLK, PCMFS, PCMIN DVDDIO*0.7→DVDDIO*0.3 PCMCLK, PCMFS, PCMIN PCMIN setup time (vs. PCMCLK↓) 20 - - ns tRH PCMIN hold time (vs. PCMCLK↓) 0 - - ns tSR PCMCLK↓ vs. PCMFS↑ 20 - - ns tSS PCMFS setup time (vs. PCMCLK↓) 20 - - ns tSH PCMFS hold time (vs. PCMCLK↓) PCMOUT determined time (vs. PCMFS↑) PCMOUT determined time (vs. PCMCLK↑) 20 - - ns - - 30 ns - - 30 ns tSO tDO 1/fPCLK PCMCLK tSR tSS tSH tIF tIR PCMFS 1/fFS tRS tRH MSB PCMIN LSB tDO tSO PCMOUT MSB LSB Figure 29 Timing of PCM long frame interface * The accuracy of the clock Make sure to use below 100ppm accuracy for PCM interface clock PCMCLK and master clock MCLK. 100ppm oscillate is in use, output signal may not work properly. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/26 In case more than TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M 2. 2-wire host interface (Slave) Parameter Symbol SCL clock frequency ”H” level of SCL ”L” level of SCL Setup time of repeat start condition Hold time of repeat start condition Data setup time Data hold time Setup time of Stop condition Bus release time of between stop condition and start condition fSCL tHI tLO tSUSTA tHDSTA tSUDAT tHDDAT tSUSTP tBUF Standard-mode Max Min 0 100 4.0 4.7 4.7 4.0 0.25 0 3.5 4.0 4.7 - Fast-mode Max Min 0 400 0.6 1.2 0.6 0.6 0.1 0 0.9 0.6 1.2 - Unit kHz μs μs μs μs μs μs μs μs 1/fSCL SCL tHI SDA tLO tSUSTA tHDSTA tSUDAT tHDDAT tSUSTP tBUF Figure 30 Timing of 2-wire host interface www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M 3. EEPROM (SPI master) interface Parameter Symbol SPICLK clock frequency ”H” time of SPICLK clock ”L” time of SPICLK clock “H” time of SPICSB chip select Setup time of SPICSB chip select Enable hold time of SPICSB chip select Data output delay time of SPIDO Output hold time of SPIDO Setup time of SPIDI Hold time of SPIDI fCK tCK_HI tCK_LO tCS_HI tCS_SU tCS_HD tDO_SU tDO_HD tDI_SU tDI_SO Limits Min Typ Max 100 100 100 100 100 0 20 40 - 3.25 80 - Unit MHz ns ns ns ns ns ns ns ns ns 1/fCK SPKCLK tCS_SU tCK_HI tCK_LO tCS_HD tCS_HI SPICSB tDO_SU tDO_HD SPIDO tDI_SU tDI_HD SPIDI Figure 31 Timing of EEPROM (SPI) interface www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M Timing Chart Turn on AVDD and DVDDIO simultaneously and then turn on DVDD1 or DVDD2. Please note that DVDD1 can be supplied by internal voltage regulator. Please set REGON pin =”H” to use internal regulator. It is necessary to input clock on MCLK, before reset (RSTB) is released. Initial values of register are automatically downloaded from EEPROM and register is updated, after reset (RSTB) release. This processing is skipped when EEPROM is not connected. Then, using via 2-wire host interface, please carry out required register setup. 2 2-wire host interface is compatible with I C bus specification, but is not 5V tolerant. AVDD/DVDDIO 90% REGON 40ms 90% DVDD1 MCLK > 5ms RSTB 30ms EEPROM Download Enable (internal signal) 2-wire Access (internal signal) Not Available Available PLL ON (internal signal) 15ms PLL Condition (internal signal) Not Stable Stable DSP Reset Release (internal signal) Figure 32 Timing Chart www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M Application Example 4.7μ 0.1μ 4.7μ 0.1μ 4.7μ 0.1μ 1μ 4.7μ 0.1μ 56n 0.1μ PLLCAP 1M MICBIAS1 220 470 XTLO MICBIAS2 LINEOUT 47μ 2k CERALOCK(4MHz) CSTCR4M00G55B-R0 MCLK 220 47μ PLLVDD STBYB DVDD2 DVDD1 REGON DVSS COMOUT BGFLT COMIN DVDDIO AVSS AVDD Open 1μ 2k MIC1INP 1μ PCMCLK BU8332CKV-M MIC1INN 1μ 1μ PCMFS MIC2INP PCMIN MIC2INN PCMOUT 1μ RSTB TMODE0 TMODE1 SPIDO SPICLK SPICSB SPIDI LR TMON1 Open 2.2k SCL SDA Open NC Open Open TMODE3 TMON0 2.2k TMODE2 Figure 33 Application Circuit Application circuit above shows line output. Please follow Timing Chart described earlier. DVDDIO should be selected depending on I/O interface voltage level requirement, without exceeding the maximum specification. PCM output may be used if required. An EEPROM may be connected to SPI BUS pins to load register values automatically upon reset. Circuit constant should be selected one that tolerance is within 10%. Resistor for microphone bias should be decided by actual microphone specification. Also circuit elements around oscillator circuit should be estimated based on matching evaluation for each actual board. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M I/O Equivalence Circuits PLLVDD DVDDIO DVDDIO STBYB PAD MCLK CIN PLLVDD CIN XTLO PAD GND GND GND GND A B C AVDD DVDDIO PAD PAD I OSC_XIN inv DVDDIO CIN PAD I GND GND GND D GND E F DVDDIO DVDDIO Open Drain CIN PAD PAD CIN PAD CIN I GND GND GND GND G PAD Open Drain H I CIN GND J Figure 34 I/O equivalent circuits www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M Ordering Information B U 8 3 3 2 C Parts Number K V Package KV: VQFP48 - ME 2 Product Rank M:for Automotive Packaging Specification E2: Embossed tape and reel Marking Diagram VQFP48 (TOP VIEW) Part Number Marking BU8332C LOT Number 1PIN MARK www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M Physical Dimension, Tape and Reel Information Package Name www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VQFP48 25/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 BU8332CKV-M Revision history Date Revision Changes 2014.10.10 001 New Release 2014.10.31 002 Delete ALC, Noise Suppression, LINE IN www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 26/26 TSZ02201-0V1V0C104570-1-2 2014.10.31 Rev.002 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – SS © 2013 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice – SS © 2013 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001