Sample & Buy Product Folder Technical Documents Support & Community Tools & Software ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 ADS42JB46 Dual-Channel, 14-Bit, 160-MSPS Analog-to-Digital Converter 1 Features 2 Applications • • • • • • • • • • • • • • • • • • • • • • Dual-Channel ADCs 14-Bit Resolution Maximum Clock Rate: 160 MSPS JESD204B Serial Interface – Subclass 0, 1, 2 Compliant – Up to 3.125 Gbps – Two- and Four-Lane Support Analog Input Buffer with High-Impedance Input Flexible Input Clock Buffer: Divide-by-1, -2, and -4 Differential Full-Scale Input: 2 VPP and 2.5 VPP (Register Programmable) Package: 9-mm × 9-mm QFN-64 Power Dissipation: 679 mW/Ch Aperture Jitter: 85 fS rms Internal Dither Channel Isolation: 100 dB Performance: – fIN = 170 MHz at 2 VPP, –1 dBFS – SNR: 72.9 dBFS – SFDR: 90 dBc for HD2, HD3 – SFDR: 100 dBc for Non HD2, HD3 – fIN = 170 MHz at 2.5 VPP, –1 dBFS – SNR: 74.2 dBFS – SFDR: 84 dBc for HD2, HD3 and 95 dBc for Non HD2, HD3 Simplified Schematic Device INAP, INAM 14-, 16-Bit ADC CLKINP, CLKINM SYSREFP, SYSREFM OVRA Digital Block JESD204B Digital Gain Test Modes Device Information(1) PART NUMBER ADS42JB46 PACKAGE 9.00 mm × 9.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. FFT for 170-MHz Input Signal Sampled at 160 MSPS 0 FIN = 170 MHz SFDR = 92 dBc SNR = 73 dBFS SINAD = 72.9 dBFS THD = 91 dBc SFDR Non HD2, HD3 = 100 dBc DA1P, DA1M −40 14-, 16-Bit ADC Digital Block JESD204B Digital DB0P, DB0M DB1P, DB1M OVRB Common Mode BODY SIZE (NOM) VQFN (64) SYNC~P, SYNC~M Gain Test Modes VCM The ADS42JB46 is a high-linearity, dual-channel, 14bit, 160-MSPS, analog-to-digital converter (ADC). This device supports the JESD204B serial interface with data rates up to 3.125 Gbps. The buffered analog input provides uniform input impedance across a wide frequency range while minimizing sample-and-hold glitch energy, thus making driving analog inputs up to very high input frequencies easy. A sampling clock divider allows more flexibility for system clock architecture design. The device employs internal dither algorithms to provide excellent spurious-free dynamic range (SFDR) over a large input frequency range. DA0P, DA0M Delay INBP, INBM 3 Description −20 PLL x10, x20 Divide by 1, 2, 4 Communication and Cable Infrastructure Multi-Carrier, Multimode Cellular Receivers Radar and Smart Antenna Arrays Broadband Wireless Test and Measurement Systems Software-Defined and Diversity Radios Microwave and Dual-Channel I/Q Receivers Repeaters Power Amplifier Linearization Amplitude (dBFS) 1 −60 −80 Device Configuration MODE CTRL1 CTRL2 STBY SDOUT PDN PDN_GBL SEN SCLK SDATA RESET −100 −120 0 20 40 Frequency (MHz) 60 80 G002 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 8 1 1 1 2 3 3 5 Absolute Maximum Ratings ...................................... 5 ESD Ratings.............................................................. 5 Recommended Operating Conditions....................... 6 Thermal Information .................................................. 6 Electrical Characteristics: ADS42JB46 ..................... 7 Electrical Characteristics: General ............................ 8 Timing Characteristics............................................... 9 Digital Characteristics ............................................. 10 Reset Timing .......................................................... 10 Serial Interface Timing .......................................... 11 Typical Characteristics: ADS42JB46 .................... 14 Typical Characteristics: Contour ........................... 20 Detailed Description ............................................ 22 8.1 8.2 8.3 8.4 8.5 8.6 9 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ Programming........................................................... Register Maps ......................................................... 22 22 23 24 31 34 Application and Implementation ........................ 47 9.1 Application Information............................................ 47 9.2 Typical Application .................................................. 47 10 Power Supply Recommendations ..................... 53 11 Layout................................................................... 53 11.1 Layout Guidelines ................................................. 53 11.2 Layout Example .................................................... 54 12 Device and Documentation Support ................. 55 12.1 12.2 12.3 12.4 12.5 Device Support...................................................... Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 55 55 55 55 55 13 Mechanical, Packaging, and Orderable Information ........................................................... 55 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (August 2013) to Revision B • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................................................................................................. 1 Changes from Original (July 2013) to Revision A • 2 Page Page Changed document status to Production Data; moved from 1-page Preview ....................................................................... 1 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 5 Device Comparison Table INTERFACE OPTION 14-BIT, 160 MSPS 14-BIT, 250 MSPS 16-BIT, 250 MSPS DDR, QDR LVDS — ADS42LB49 ADS42LB69 JESD204B ADS42JB46 ADS42JB46 ADS42JB69 6 Pin Configuration and Functions DRVDD DGND OVRB OVRA DRVDD DB1M DB1P DB0M DB0P IOVDD DA0P DA0M DA1P DA1M DGND DRVDD 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 RGC Package 64-Pin VQFN Top View DGND 1 48 DRVDD 2 47 DRVDD DGND 3 46 DGND MODE 4 45 SDOUT STBY 5 44 RESET PDN_GBL 6 43 SCLK DRVDD 7 42 SDATA SYNC~M 8 SYNC~P 9 Thermal Pad DGND 41 SEN 40 AVDD CTRL2 10 39 CTRL1 AVDD 11 38 AVDD AGND 12 37 AGND INBP 13 36 INAP 32 AVDD3V AVDD 31 SYSREFM 30 SYSREFP 29 AGND 28 AVDD 27 AGND 26 CLKINP 25 CLKINM 24 23 AVDD 22 21 VCM AGND 20 AGND 33 AVDD 19 AVDD 16 AVDD 18 34 AGND AGND 35 INAM AVDD3V 17 INBM 14 AGND 15 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 3 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com Pin Functions: JESD204B Output Interface PIN DESCRIPTION NAME NO. I/O FUNCTION AGND 12, 15, 19, 20, 23, 26, 28, 34, 37 I Supply Analog ground AVDD 11, 16, 18, 22, 27, 31, 33, 38, 40 I Supply 1.8-V analog power supply AVDD3V 17, 32 I Supply 3.3-V analog supply for analog buffer CLKINM 24 I Clock Differential ADC clock input (negative) CLKINP 25 I Clock Differential ADC clock input (positive) CTRL1 39 I Control Power-down control with an internal 150-kΩ pull-down resistor CTRL2 10 I Control Power-down control with an internal 150-kΩ pull-down resistor DA0M 53 O Interface JESD204B serial data output for channel A, lane 0 (negative) DA0P 54 O Interface JESD204B serial data output for channel A, lane 0 (positive) DA1M 51 O Interface JESD204B serial data output for channel A, lane 1 (negative) DA1P 52 O Interface JESD204B serial data output for channel A, lane 1 (positive) DB0M 57 O Interface JESD204B serial data output for channel B, lane 0 (negative) DB0P 56 O Interface JESD204B serial data output for channel B, lane 0 (positive) DB1M 59 O Interface JESD204B serial data output for channel B, lane 1 (negative) DB1P 58 O Interface JESD204B serial data output for channel B, lane 1 (positive) DGND 1, 3, 46, 48, 50, 63 I Supply Digital ground DRVDD 2, 7, 47, 49, 60, 64 I Supply Digital 1.8-V power supply INAM 35 I Input Differential analog input for channel A (negative) INAP 36 I Input Differential analog input for channel A (positive) INBM 14 I Input Differential analog input for channel B (negative) INBP 13 I Input Differential analog input for channel B (positive) IOVDD 55 I Supply Digital 1.8-V power supply for the JESD204B transmitter MODE 4 I Control Connect to GND OVRA 61 O Interface Overrange indication for channel A in CMOS output format OVRB 62 O Interface Overrange indication for channel B in CMOS output format PDN_GBL 6 I Control Global power-down. Active high with an internal 150-kΩ pull-down resistor. RESET 44 I Control Hardware reset; active high. This pin has an internal 150-kΩ pull-down resistor. SCLK 43 I Control Serial interface clock input. This pin has an internal 150-kΩ pull-down resistor. SDATA 42 I Control Serial interface data input. This pin has an internal 150-kΩ pull-down resistor. SDOUT 45 O Control Serial interface data output SEN 41 I Control Serial interface enable. This pin has an internal 150-kΩ pull-up resistor. STBY 5 I Control Standby. Active high with an internal 150-kΩ pull-down resistor. SYNC~M 8 I Interface Synchronization input for JESD204B port (negative) SYNC~P 9 I Interface Synchronization input for JESD204B port (positive) SYSREFM 30 I Clock External SYSREF input, subclass 1 (negative) SYSREFP 29 I Clock External SYSREF input, subclass 1 (positive) VCM 21 O Output 1.9-V common-mode output voltage for analog inputs Thermal Pad 65 GND Ground Connect to ground plane 4 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range, unless otherwise noted. (1) MIN MAX UNIT AVDD3V –0.3 3.6 V AVDD –0.3 2.1 V DRVDD –0.3 2.1 V IOVDD –0.3 2.1 V Voltage between AGND and DGND –0.3 0.3 V –0.3 3 V CLKINP, CLKINM –0.3 minimum (2.1, AVDD + 0.3) V SYNC~P, SYNC~M –0.3 minimum (2.1, AVDD + 0.3) V SYSREFP, SYSREFM –0.3 minimum (2.1, AVDD + 0.3) V SCLK, SEN, SDATA, RESET, PDN_GBL, CTRL1, CTRL2, STBY, MODE –0.3 3.9 V Operating free-air, TA –40 85 °C 125 °C 150 °C Supply voltage INAP, INBP, INAM, INBM Voltage applied to input pins Temperature Operating junction, TJ Storage, Tstg (1) –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings V(ESD) (1) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) VALUE UNIT ±2000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 5 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 7.3 Recommended Operating Conditions (1) Over operating free-air temperature range, unless otherwise noted. MIN NOM MAX UNIT SUPPLIES AVDD Analog supply voltage AVDD3V Analog buffer supply voltage 1.7 1.8 1.9 V 3.15 3.3 3.45 DRVDD V Digital supply voltage 1.7 1.8 1.9 V IOVDD Output buffer supply voltage 1.7 1.8 1.9 V ANALOG INPUTS VID Differential input voltage range VICR Input common-mode voltage Default after reset Register programmable (2) 2 VPP 2.5 VPP VCM ± 0.025 V Maximum analog input frequency with 2.5-VPP input amplitude 250 MHz Maximum analog input frequency with 2-VPP input amplitude 400 MHz CLOCK INPUT Input clock sample rate Input clock amplitude differential (VCLKP – VCLKM) 10x mode 60 160 MSPS 20x mode 40 156.25 MSPS Sine wave, ac-coupled (3) 1.5 VPP LVPECL, ac-coupled 0.3 1.6 VPP LVDS, ac-coupled 0.7 VPP LVCMOS, single-ended, ac-coupled Input clock duty cycle 1.5 35% 50% V 65% DIGITAL OUTPUTS CLOAD Maximum external load capacitance from each output pin to DRGND RLOAD Single-ended load resistance TA Operating free-air temperature (1) (2) (3) 3.3 pF Ω +50 –40 85 °C To reset the device for the first time after power-up, only use the RESET pin. Refer to the Register Initialization section. For details, refer to the Digital Gain section. Refer to the Performance vs Clock Amplitude curves (Figure 32 and Figure 33). 7.4 Thermal Information ADS42JB46 THERMAL METRIC (1) RGC (QFN) UNIT 64 PINS RθJA Junction-to-ambient thermal resistance 22.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 7.1 °C/W RθJB Junction-to-board thermal resistance 2.5 °C/W ψJT Junction-to-top characterization parameter 0.1 °C/W ψJB Junction-to-board characterization parameter 2.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 0.2 °C/W (1) 6 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 7.5 Electrical Characteristics: ADS42JB46 Typical values are at TA = 25°C, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, 50% clock duty cycle, –1dBFS differential analog input, and sampling clock rate = 160 MSPS, unless otherwise noted. Minimum and maximum values are across the full temperature range of TMIN = –40°C to TMAX = 85°C, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, and IOVDD = 1.8 V. PARAMETER SNR Signal-to-noise ratio SINAD Signal-to-noise and distortion ratio SFDR THD HD2 HD3 Spurious-free dynamic range (including second and third harmonic distortion) Total harmonic distortion 2nd-order harmonic distortion 3rd-order harmonic distortion TEST CONDITIONS 2-VPP FULL-SCALE MIN TYP MAX 2.5-VPP FULL-SCALE MIN TYP MAX UNIT fIN = 10 MHz 73.7 75.2 dBFS fIN = 70 MHz 73.5 74.9 dBFS fIN = 170 MHz 72.9 74.2 dBFS fIN = 230 MHz 69.5 72.3 73.3 dBFS fIN = 10 MHz 73.5 75.1 dBFS 73.3 74.7 dBFS 72.8 73.6 dBFS fIN = 230 MHz 72 72.8 dBFS fIN = 10 MHz 96 92 dBc 94 90 dBc 90 84 dBc fIN = 230 MHz 86 83 dBc fIN = 10 MHz 93 90 dBc fIN = 70 MHz 91 88 dBc 87 82 dBc fIN = 230 MHz 84 81 dBc fIN = 10 MHz 96 95 dBc fIN = 70 MHz 94 90 dBc 92 89 dBc fIN = 230 MHz 88 86 dBc fIN = 10 MHz 97 92 dBc fIN = 70 MHz 96 94 dBc fIN = 70 MHz fIN = 170 MHz 68.5 fIN = 70 MHz fIN = 170 MHz fIN = 170 MHz fIN = 170 MHz 76 79 90 84 dBc fIN = 230 MHz 86 83 dBc fIN = 10 MHz 102 101 dBc 102 100 dBc 100 95 dBc fIN = 230 MHz 98 92 dBc f1 = 46 MHz, f2 = 50 MHz, each tone at –7 dBFS 97 95 dBFS f1 = 185 MHz, f2 = 190 MHz, each tone at –7 dBFS 90 89 dBFS Crosstalk 20-MHz, full-scale signal on channel under observation; 170-MHz, full-scale signal on other channel 100 100 dB Input overload recovery Recovery to within 1% (of fullscale) for 6-dB overload with sinewave input 1 1 PSRR AC power-supply rejection ratio For a 90-mVPP signal on AVDD supply, up to 10 MHz > 40 > 40 ENOB Effective number of bits fIN = 170 MHz 11.8 12 LSBs DNL Differential nonlinearity fIN = 170 MHz ±0.4 ±0.5 LSBs INL Integrated nonlinearity fIN = 170 MHz ±0.75 ±0.9 LSBs Worst spur (other than second and third harmonics) IMD Two-tone intermodulation distortion fIN = 170 MHz 79 79 fIN = 70 MHz fIN = 170 MHz 87 ±3 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 Clock cycle dB 7 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 7.6 Electrical Characteristics: General Typical values are at 25°C, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, 50% clock duty cycle, –1dBFS differential analog input, , and sampling clock rate = 160 MSPS unless otherwise noted. Minimum and maximum values are across the full temperature range: TMIN = –40°C to TMAX = 85°C, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, and IOVDD = 1.8 V. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ANALOG INPUTS Default (after reset) Differential input voltage range VID 2 VPP Register programmed (1) 2.5 VPP Differential input resistance (at 170 MHz) 1.2 kΩ 4 pF Differential input capacitance (at 170 MHz) Analog input bandwidth VCM With 50-Ω source impedance and 50-Ω termination 900 MHz Common-mode output voltage 1.9 V VCM output current capability 10 mA DC ACCURACY Offset error EGREF Gain error as a result of internal reference inaccuracy alone EGCHAN Gain error of channel alone –20 20 mV –2 2 %FS –5 Temperature coefficient of EGCHAN %FS Δ%/°C 0.01 POWER SUPPLY IAVDD Analog supply current 90 130 mA IAVDD3V Analog buffer supply current 234 330 mA IDRVDD Digital supply current 174 207 mA IOVDD Output buffer supply current 61 100 mA 50-Ω external termination from pin to IOVDD, fIN = 2.5 MHz, 10x mode Analog power 162 mW Analog buffer power 772 mW 313 mW 109 mW Digital power Power consumption by output buffer 50-Ω external termination from pin to IOVDD, fIN = 2.5 MHz, 10x mode Total power 1.36 Global power-down (1) 8 1.64 W 160 mW Refer to the Serial Interface section. Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 7.7 Timing Characteristics Typical values are at 25°C, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, 50% clock duty cycle, –1dBFS differential analog input, and sampling clock rate = 160 MSPS, unless otherwise noted. Minimum and maximum values are across the full temperature range of TMIN = –40°C to TMAX = 85°C, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, and IOVDD = 1.8 V. See Figure 3. PARAMETER TEST CONDITIONS MIN TYP MAX 0.7 1.1 UNIT SAMPLE TIMING CHARACTERISTICS Aperture delay Aperture delay matching 0.4 Between two channels on the same device Between two devices at the same temperature and supply voltage Aperture jitter Wake-up time ps ±150 ps 85 Time to valid data after exiting STANDBY mode Time to valid data after exiting global power-down ns ±70 fS rms 50 200 µs 250 1000 µs tSU_SYNC~ Setup time for SYNC~ Referenced to input clock rising edge 400 ps tH_SYNC~ Hold time for SYNC~ Referenced to input clock rising edge 100 ps tSU_SYSREF Setup time for SYSREF Referenced to input clock rising edge 400 ps tH_SYSREF Hold time for SYSREF Referenced to input clock rising edge 100 ps CML OUTPUT TIMING CHARACTERISTICS Unit interval 320 Serial output data rate TJitter tR, tF Total jitter Data rise time, data fall time 1667 ps 3.125 Gbps 0.28 P-PUI 3.125 Gbps (20x mode, fS = 156.25 MSPS) 0.3 P-PUI Rise and fall times are measured from 20% to 80%, differential output waveform, 600 Mbps ≤ bit rate ≤ 3.125 Gbps 105 ps 1.6 Gbps (10x mode, fS = 160 MSPS) Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 9 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 7.8 Digital Characteristics The DC specifications refer to the condition where the digital outputs are not switching, but are permanently at a valid logic level 0 or 1. AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, and IOVDD = 1.8 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DIGITAL INPUTS (RESET, SCLK, SEN, SDATA, PDN_GBL, STBY, CTRL1, CTRL2, MODE) (1) VIH High-level input voltage All digital inputs support 1.8-V and 3.3-V logic levels VIL Low-level input voltage All digital inputs support 1.8-V and 3.3-V logic levels IIH High-level input current IIL Low-level input current 1.2 V 0.4 SEN V 0 µA RESET, SCLK, SDATA, PDN_GBL, STBY, CTRL1, CTRL2, MODE 10 µA SEN 10 µA 0 µA RESET, SCLK, SDATA, PDN_GBL, STBY, CTRL1, CTRL2, MODE DIGITAL INPUTS (SYNC~P, SYNC~M, SYSREFP, SYSREFM) VIH High-level input voltage 1.3 V VIL Low-level input voltage 0.5 V VCM_DIG Input common-mode voltage 0.9 V DRVDD V DIGITAL OUTPUTS (SDOUT, OVRA, OVRB) VOH High-level output voltage VOL Low-level output voltage DRVDD – 0.1 0.1 DIGITAL OUTPUTS (JESD204B Interface: DA[0,1], DB[0,1]) V (2) VOH High-level output voltage IOVDD V VOL Low-level output voltage IOVDD – 0.4 V |VOD| Output differential voltage 0.4 V VOCM Output common-mode voltage IOVDD – 0.2 V Transmitter short-circuit current Transmitter terminals shorted to any voltage between –0.25 V and 1.45 V –100 Single-ended output impedance COUT (1) (2) Output capacitance 50 Ω 2 pF Output capacitance inside the device, from either output to ground (1) PARAMETER TEST CONDITIONS MIN t1 Power-on delay Delay from AVDD and DRVDD power-up to active RESET pulse t2 Reset pulse width Active RESET signal pulse width t3 Register write delay Delay from RESET disable to SEN active 10 mA The RESET, SCLK, SDATA, PDN_GBL, STBY, CTRL1, CTRL2, and MODE pins have a 150-kΩ (typical) internal pulldown resistor to ground. The SEN pin has a 150-kΩ (typical) pullup resistor to AVDD. 50-Ω, single-ended, external termination to IOVDD. 7.9 Reset Timing (1) 100 TYP MAX 1 ms 10 ns 1 100 UNIT µs ns Typical values are at 25°C and minimum and maximum values are across the full temperature range of TMIN = –40°C to TMAX = 85°C, unless otherwise noted. Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 7.10 Serial Interface Timing (1) PARAMETER MIN TYP UNIT 20 MHz SCLK frequency (equal to 1 / tSCLK) tSLOADS SEN to SCLK setup time 25 ns tSLOADH SCLK to SEN hold time 25 ns tDSU SDIO setup time 25 ns tDH SDIO hold time 25 ns (1) > dc MAX fSCLK Typical values are at 25°C, minimum and maximum values are across the full temperature range of TMIN = –40°C to TMAX = 85°C, AVDD3V = 3.3 V, and AVDD = DRVDD = IOVDD = 1.8 V, unless otherwise noted. Register Address <5:0> SDATA R/W 0 A5 A4 A3 A2 Register Data <7:0> A1 A0 D7 D6 D5 D4 D3 D2 =0 D1 D0 tDH tSCLK tDSU SCLK tSLOADS tSLOADH SEN RESET Figure 1. Serial Register Write Timing Diagram Power Supply AVDD, DRVDD t1 RESET t2 t3 SEN NOTE: After power-up, the internal registers must be initialized to their default values through a hardware reset by applying a high pulse on the RESET pin. Figure 2. Reset Timing Diagram Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 11 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com N+3 N+2 Sample N N+4 N + Latency + 1 N + Latency N+1 N + Latency + 2 tA CLKP Input Clock CLKM ADC Latency (1) tD (2) Dx0P, Dx0M N - Latency-1 N + Latency N - Latency+1 N - Latency+2 N - Latency+3 N-1 N N+1 N+1 N - Latency-1 N + Latency N - Latency+1 N - Latency+2 N - Latency+3 N-1 N N+1 N+1 (2) Dx1P, Dx1M (1) Overall latency = ADC latency + tD. (2) x = A for channel A and B for channel B. Figure 3. ADC Latency CLKINP Input Clock CLKINM tSU_SYNC~ tH_SYNC~ SYNC~ tD SYNC~ Asserted Latency Dx0P, Dx0M Dx1P, Dx1M (1) CGS Phase (1) Data Data Data Data Data Data Data Data Data K28.5 Data Data Data Data Data Data Data Data Data K28.5 (1) x = A for channel A and B for channel B. Figure 4. SYNC~ Latency in CGS Phase (Two-Lane Mode) 12 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 CLKINP Input Clock CLKINM tSU_SYNC~ tH_SYNC~ SYNC~ tD SYNC~ Deasserted Latency ILA Sequence Dx0P, Dx0M Dx1P, Dx1M (1) (1) K28.5 K28.5 K28.5 K28.5 K28.5 K28.5 K28.5 K28.5 K28.0 K28.0 K28.5 K28.5 K28.5 K28.5 K28.5 K28.5 K28.5 K28.5 K28.0 K28.0 (1) x = A for channel A and B for channel B. Figure 5. SYNC~ Latency in ILAS Phase (Two-Lane Mode) Sample N tSU_SYSREF tH_SYSREF CLKIN SYSREF Figure 6. SYSREF Timing (Subclass 1) Sample N tSU_SYNC~ tH_SYNC~ CLKIN SYNC~ Figure 7. SYNC~ Timing (Subclass 2) Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 13 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 7.11 Typical Characteristics: ADS42JB46 Typical values are at TA = +25°C, ADC sampling rate = 160 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 64k-point FFT, unless otherwise noted. 0 0 FIN = 300 MHz SFDR = 77 dBc SNR = 72.4 dBFS SINAD = 71.2 dBFS THD = 76 dBc SFDR Non HD2, HD3 = 96 dBc −20 −40 −60 −60 −80 −80 −100 −100 −120 0 20 40 60 −120 80 Frequency (MHz) 40 60 80 Frequency (MHz) G004 0 0 FIN = 170 MHz SFDR = 87 dBc SNR = 74.3 dBFS SINAD = 74 dBFS THD = 85 dBc SFDR Non HD2, HD3 = 93 dBc Amplitude (dBFS) −40 −60 −80 −80 −100 −100 0 20 40 60 Frequency (MHz) −120 80 0 20 40 60 Frequency (MHz) G005 Figure 10. FFT for 170-MHz Input Signal (2.5-VPP Full-Scale) 80 G006 Figure 11. FFT for 300-MHz Input Signal (2.5-VPP Full-Scale) 0 0 Each Tone at −7 dBFS Amplitude fIN1 = 46 MHz fIN2 = 50 MHz 2−Tone IMD = 101 dBFS SFDR = 104 dBFS −20 Each Tone at −36 dBFS Amplitude fIN1 = 46 MHz fIN2 = 50 MHz 2−Tone IMD = 101 dBFS SFDR = 104 dBFS −20 −40 Amplitude (dBFS) −40 −60 −60 −80 −80 −100 −100 −120 FIN = 300 MHz SFDR = 74 dBc SNR = 73.4 dBFS SINAD = 70.8 dBFS THD = 73 dBc SFDR Non HD2, HD3 = 94 dBc −20 −60 −120 Amplitude (dBFS) 20 Figure 9. FFT for 10-MHz Input Signal (2.5-VPP Full-Scale) −40 0 20 40 Frequency (MHz) 60 80 −120 0 20 40 Frequency (MHz) G007 Figure 12. FFT for Two-Tone Input Signal (–7 dBFS at 46 MHz and 50 MHz) 14 0 G003 Figure 8. FFT for 300-MHz Input Signal −20 Amplitude (dBFS) −20 Amplitude (dBFS) Amplitude (dBFS) −40 FIN = 10 MHz SFDR = 90 dBc SNR = 75.6 dBFS SINAD = 75.4 dBFS THD = 89 dBc SFDR Non HD2, HD3 = 101 dBc 60 80 G008 Figure 13. FFT for Two-Tone Input Signal (–36 dBFS at 46 MHz and 50 MHz) Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 Typical Characteristics: ADS42JB46 (continued) Typical values are at TA = +25°C, ADC sampling rate = 160 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 64k-point FFT, unless otherwise noted. 0 0 Each Tone at −7 dBFS Amplitude fIN1 = 185 MHz fIN2 = 190 MHz 2−Tone IMD = 98 dBFS SFDR = 105 dBFS −20 −20 −40 Amplitude (dBFS) Amplitude (dBFS) −40 −60 −60 −80 −80 −100 −100 −120 Each Tone at −36 dBFS Amplitude fIN1 = 185 MHz fIN2 = 190 MHz 2−Tone IMD = 102 dBFS SFDR = 103 dBFS 0 20 40 60 −120 80 Frequency (MHz) 0 20 40 60 80 Frequency (MHz) G009 G007 Figure 14. FFT for Two-Tone Input Signal (–7 dBFS at 185 MHz and 190 MHz) Figure 15. FFT for Two-Tone Input Signal (–36 dBFS at 185 MHz and 190 MHz) −98 −94 fIN1 = 46 MHz fIN2 = 50 MHz fIN1 = 185 MHz fIN2 = 190 MHz −96 −100 Two − Tone IMD (dBFS) Two − Tone IMD (dBFS) −98 −102 −104 −106 −100 −102 −104 −108 −106 −110 −108 −112 −36 −33 −30 −27 −24 −21 −18 −15 −12 −110 −36 −9 −7 Each Tone Amplitude (dBFS) −33 −30 −27 −24 −21 −18 −15 −12 −9 −7 Each Tone Amplitude (dBFS) G011 G012 Figure 16. Intermodulation Distortion vs Input Amplitude (46 MHz and 50 MHz) Figure 17. Intermodulation Distortion vs Input Amplitude (185 MHz and 190 MHz) 100 76 2Vpp Fullscale 2.5Vpp Fullscale 95 2Vpp Fullscale 2.5Vpp Fullscale 75 90 74 85 SNR (dBFS) SFDR (dBc) 73 80 75 72 71 70 70 65 69 60 55 0 50 100 150 200 250 300 Input Frequency (MHz) 350 400 G013 Figure 18. Spurious-Free Dynamic Range vs Input Frequency 68 0 50 100 150 200 250 Input Frequency (MHz) 300 350 400 G014 Figure 19. Signal-to-Noise Ratio vs Input Frequency Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 15 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com Typical Characteristics: ADS42JB46 (continued) Typical values are at TA = +25°C, ADC sampling rate = 160 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 64k-point FFT, unless otherwise noted. 120 80 10 MHz 70 MHz 100 MHz 130 MHz 115 110 170 MHz 200 MHz 230 MHz 270 MHz 350 MHz 400 MHz 491 MHz 170 MHz 200 MHz 230 MHz 270 MHz 350 MHz 400 MHz 491 MHz 76 105 100 74 SNR (dBFS) 95 SFDR (dBc) 10 MHz 70 MHz 100 MHz 130 MHz 78 90 85 80 72 70 68 75 70 66 65 64 60 62 −2 −1.5 −1 −0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Digital Gain (dB) Figure 20. Spurious-Free Dynamic Range vs Digital Gain 77 120 76.5 76 110 76 110 75.5 100 75.5 100 SNR(dBFS) SFDR(dBc) SFDR(dBFS) 75 90 74.5 80 74 70 73.5 60 73 SNR(dBFS) SFDR(dBc) SFDR(dBFS) 120 75 90 74.5 80 74 70 73.5 60 50 73 50 72.5 40 72.5 40 72 30 72 30 71.5 −70 −60 −50 −40 −30 −20 −10 0 SNR (dBFS) SNR (dBFS) 130 Input Frequency = 170 MHz SFDR (dBc,dBFS) Input Frequency = 70 MHz 20 71.5 −70 −60 −50 −40 −30 −20 −10 0 20 Amplitude (dBFS) Amplitude (dBFS) G017 G018 Figure 22. Performance vs Input Amplitude (70 MHz) Figure 23. Performance vs Input Amplitude (170 MHz) 76 100 Input Frequency = 70 MHz 75 100 SFDR SNR Input Frequency = 170 MHz SFDR SNR 75.5 97 74.5 96 75 94 74 94 74.5 91 73.5 92 74 88 73 90 73.5 85 72.5 88 73 82 72 86 1.850 1.875 1.900 1.925 72.5 1.950 Input Common−Mode Voltage (V) SFDR (dBc) 98 SNR (dBFS) SFDR (dBc) G016 Figure 21. Signal-to-Noise Ratio vs Digital Gain 130 77 76.5 79 1.85 1.875 1.9 1.925 71.5 1.95 Input Common−Mode Voltage (V) G019 Figure 24. Performance vs Input Common-Mode Voltage (70 MHz) 16 −2 −1.5 −1 −0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 G015 SFDR (dBc,dBFS) Digital Gain (dB) SNR (dBFS) 55 G020 Figure 25. Performance vs Input Common-Mode Voltage (170 MHz) Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 Typical Characteristics: ADS42JB46 (continued) Typical values are at TA = +25°C, ADC sampling rate = 160 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 64k-point FFT, unless otherwise noted. 94 74.5 AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V 93 AVDD = 1.85 V AVDD = 1.9 V AVDD = 1.7 V AVDD = 1.75V AVDD = 1.8 V AVDD = 1.85 V AVDD = 1.9 V 74 SNR (dBFS) SFDR (dBc) 92 91 90 73.5 73 89 72.5 88 Input Frequency = 170 MHz 87 −40 −15 10 35 Temperature (°C) Input Frequency = 170 MHz 60 72 −40 85 −15 10 35 Temperature (°C) 60 85 G021 G022 Figure 26. Spurious-Free Dynamic Range vs AVDD Supply and Temperature (170 MHz) Figure 27. Signal-to-Noise Ratio vs AVDD Supply and Temperature (170 MHz) 75 95 AVDD3V = 3.15 V AVDD3V = 3.2 V AVDD3V = 3.25 V AVDD3V = 3.3 V 94 AVDD3V = 3.35 V AVDD3V = 3.4 V AVDD3V = 3.45 V AVDD3V = 3.15 V AVDD3V = 3.2 V AVDD3V = 3.25 V AVDD3V = 3.3 V 74.5 AVDD3V = 3.35 V AVDD3V = 3.4 V AVDD3V = 3.45 V 93 74 SNR (dBFS) SNR (dBFS) 92 91 90 73.5 89 73 88 72.5 87 Input Frequency = 170 MHz 86 −40 −15 10 35 Temperature (°C) Input Frequency = 170 MHz 60 72 −40 85 −15 10 35 Temperature (°C) 60 85 G023 Figure 28. Spurious-Free Dynamic Range vs AVDD3V Supply and Temperature (170 Mhz) G024 Figure 29. Signal-to-Noise Ratio vs AVDD3V Supply and Temperature (170 MHz) 74.5 94 DRVDD = 1.7 V DRVDD = 1.75 V DRVDD = 1.8 V 93 DRVDD = 1.85 V DRVDD = 1.9 V DRVDD = 1.7 V DRVDD = 1.75 V DRVDD = 1.8 V DRVDD = 1.85 V DRVDD = 1.9 V 74 92 SNR (dBFS) SFDR (dBc) 91 90 73.5 73 89 88 72.5 87 Input Frequency = 170 MHz 86 −40 −15 10 35 Temperature (°C) Input Frequency = 170 MHz 60 72 −40 85 G025 Figure 30. Spurious-Free Dynamic Range vs DRVDD Supply and Temperature (170 MHz) −15 10 35 Temperature (°C) 60 85 G026 Figure 31. Signal-to-Noise Ratio vs DRVDD Supply and Temperature (170 MHz) Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 17 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com Typical Characteristics: ADS42JB46 (continued) Typical values are at TA = +25°C, ADC sampling rate = 160 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 64k-point FFT, unless otherwise noted. Input Frequency = 170 MHz 94 75 92 74 90 73 88 72 86 71 84 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 70 2.1 1.9 74 94 72 92 70 90 68 88 66 86 0.1 Differential Clock Amplitudes (Vpp) 0.3 G027 Input Frequency = 70 MHz 0.7 0.9 1.1 1.3 1.5 1.7 1.9 64 2.1 G028 Figure 33. Performance vs Clock Amplitude (170 MHz) 78 100 0.5 Differential Clock Amplitudes (Vpp) Figure 32. Performance vs Clock Amplitude (70 MHz) 77 94 SNR SFDR Input Frequency = 170 MHz SNR SFDR 98 77 92 76 96 76 90 75 94 75 88 74 92 74 86 73 90 73 84 72 88 72 82 71 71 80 86 30 40 50 60 Input Clock Duty Cycle (%) 70 SFDR (dBc) SNR (dBFS) SFDR (dBc) 96 30 40 50 60 Input Clock Duty Cycle (%) 70 SNR (dBFS) 76 SFDR (dBc) 96 SFDR SNR SNR (dBFS) SFDR SNR SNR (dBFS) SFDR (dBc) Input Frequency = 70 MHz 76 98 77 98 70 G029 Figure 34. Performance vs Clock Duty Cycle (70 MHz) G030 Figure 35. Performance vs Clock Duty Cycle (170 MHz) 0 0 −20 −10 −20 CMRR (dB) −40 Amplitude (dBFS) Input Frequency = 10 MHz 50−mVPP Signal Superimposed on VCM FIN = 10 MHz SFDR = 83 dBc fCM = 4 MHz, 50m VPP fIN Amplitude = −1 dBFS fCM Amplitude = −102 dBFS fIN + fCM Amplitude = −84.4 dBFS fIN − fCM Amplitude = −84 dBFS −60 −30 −40 −80 −50 −100 −120 −60 0 10 20 30 40 50 Frequency (MHz) 60 70 80 0 50 100 150 200 250 Common−Mode Test Signal Frequency (MHz) G031 Figure 36. Common-Mode Rejection Ratio FFT 18 −70 300 G032 Figure 37. Common-Mode Rejection Ratio vs Test Signal Frequency Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 Typical Characteristics: ADS42JB46 (continued) Typical values are at TA = +25°C, ADC sampling rate = 160 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 64k-point FFT, unless otherwise noted. 0 0 −20 −10 −20 PSRR (dB) −40 Amplitude (dBFS) 50−mVPP Signal Superimposed on AVDD 100−mVPP Signal Superimposed on AVDD3V FIN = 70 MHz SFDR = 84 dBc fPSRR = 5 MHz, 50m VPP fIN Amplitude = −1 dBFS fPSRR Amplitude = −96 dBFS fIN + fPSRR Amplitude = −85.6 dBFS fIN − fPSRR Amplitude = −95.4 dBFS −60 −30 −40 −80 −50 −100 −60 Input Frequency = 170MHz −120 0 10 20 30 40 50 60 70 Frequency (MHz) −70 80 50 100 150 200 250 300 Test Signal Frequency on Supply (MHz) G033 Figure 38. Power-Supply Rejection Ratio FFT for AVDD Supply G034 Figure 39. Power-Supply Rejection Ratio vs Test Signal Frequency 0.18 1.8 AVDD Power DVDD Power IOVDD Power AVDD3V Power Total Power 1.6 1.4 20X Mode 10X Mode 0.15 IOVDD Power (W) 1.2 Total Power (W) 0 1 0.8 0.6 0.12 0.09 0.06 0.4 0.03 0.2 0 0 20 40 60 80 100 120 Sampling Speed (MSPS) 140 0 160 Figure 40. Total Power vs Sampling Frequency 0 20 40 60 80 100 Sampling Speed (MSPS) G035 120 140 160 G036 Figure 41. Analog Power vs Sampling Frequency Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 19 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 7.12 Typical Characteristics: Contour Typical values are at TA = +25°C, full temperature range is TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 160 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 64k-point FFT, unless otherwise noted. 7.12.1 Spurious-Free Dynamic Range (SFDR) 160 fS - Sampling Frequency - MSPS 150 90 85 80 70 75 90 95 140 90 65 130 120 95 90 90 85 80 85 80 70 75 110 100 90 95 80 90 150 100 50 200 250 75 70 300 400 350 fIN - Input Frequency - MHz 70 65 75 80 85 90 95 SFDR - dBc Figure 42. 0-dB Gain (SFDR) 160 95 95 fS - Sampling Frequency - MSPS 150 95 90 70 75 80 85 95 140 130 95 120 95 110 90 85 75 80 70 95 100 90 80 95 95 95 100 200 90 85 75 80 300 70 400 500 600 85 90 95 fIN - Input Frequency - MHz 70 75 80 SFDR - dBc Figure 43. 6-dB Gain (SFDR) 20 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 7.12.2 Signal-to-Noise Ratio (SNR) 160 73.5 fS - Sampling Frequency - MSPS 150 72.5 73 71.5 72 71 140 130 120 73.5 72.5 73 71.5 72 71 110 100 90 70.5 73.5 74 80 150 100 50 72.5 73 71.5 72 200 250 71 300 350 400 73 73.5 74 fIN - Input Frequency - MHz 70.5 71.5 71 72.5 72 SNR - dBFS Figure 44. 0-dB Gain 160 fS - Sampling Frequency - MSPS 150 140 67.5 67.8 67.2 66.9 66.6 66.3 68.1 130 120 67.8 68.1 67.5 67.2 66.9 66.6 66.3 66 110 100 90 68.4 80 68.1 100 67.8 200 67.2 67.5 300 66.6 66.9 400 66.6 66 500 65.7 600 fIN - Input Frequency - MHz 65.5 66 66.5 67 67.5 68 SNR - dBFS Figure 45. 6-dB Gain Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 21 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 8 Detailed Description 8.1 Overview The ADS42JB46 is a highly linear, buffered analog input, dual-channel, analog-to-digital converter (ADC) with maximum sampling rate of 160 MSPS and JESD204B digital interface. The conversion process is initiated by a rising edge of the external input clock which samples the analog input signal. The sampled signal is sequentially converted by a series of small resolution stages, with the outputs combined in a digital correction logic block. At every clock edge, the sample propagates through the pipeline, resulting in a data latency of 23 clock cycles. The output is available in CML logic levels conforming to the JESD204B standard. 8.2 Functional Block Diagram Device 14-, 16-Bit ADC INAP, INAM OVRA Digital Block Gain Test Modes Divide by 1, 2, 4 CLKINP, CLKINM SYSREFP, SYSREFM DA0P, DA0M JESD204B Digital DA1P, DA1M PLL x10, x20 SYNC-P, SYNC-M Delay 14-, 16-Bit ADC INBP, INBM Digital Block DB0P, DB0M JESD204B Digital DB1P, DB1M Gain Test Modes OVRB Common Mode 22 Submit Documentation Feedback STBY CTRL2 MODE CTRL1 SDATA SDOUT PDN PDN_GBL SEN SCLK Device Configuration RESET VCM Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 8.3 Feature Description 8.3.1 Digital Gain The device includes gain settings that can be used to obtain improved SFDR performance (compared to no gain). Gain is programmable from –2 dB to 6 dB (in 0.5-dB steps). For each gain setting, the analog input fullscale range scales proportionally. Table 1 shows how full-scale input voltage changes when digital gains are programmed in 1-dB steps. Refer to Table 13 to set digital gain with a serial interface register. SFDR improvement is achieved at the expense of SNR; for a 1-dB increase in digital gain, SNR degrades approximately between 0.5 dB and 1 dB. Therefore, gain can be used as a trade-off between SFDR and SNR. Note that the default gain after reset is 0 dB with a 2.0-VPP full-scale voltage. Table 1. Full-Scale Range Across Gains (1) DIGITAL GAIN FULL-SCALE INPUT VOLTAGE –2 dB 2.5 VPP (1) –1 dB 2.2 VPP 0 dB (default) 2.0 VPP 1 dB 1.8 VPP 2 dB 1.6 VPP 3 dB 1.4 VPP 4 dB 1.25 VPP 5 dB 1.1 VPP 6 dB 1.0 VPP Shaded cells indicate performance settings used in the Electrical Characteristics and Typical Characteristics. 8.3.2 Overrange Indication The device provides two different overrange indications. Normal OVR (default) is triggered if the final 16-bit data output exceeds the maximum code value. Fast OVR is triggered if the input voltage exceeds the programmable overrange threshold and is presented after only nine clock cycles, thus enabling a quicker reaction to an overrange event. By default, the normal overrange indication is output on the OVRA and OVRB pins. Using the FAST OVR EN register bit, the fast OVR indication can be presented on the overrange pins instead. The input voltage level at which the overload is detected is the threshold and is programmable using the FAST OVR THRESHOLD bits. FAST OVR is triggered nine output clock cycles after the overload condition occurs. The threshold voltage amplitude at which fast OVR is triggered is described in Equation 1: 1 × [the decimal value of the FAST OVR THRESH bits] / 127 (1) When digital is programmed (for gain values > 0 dB ), the threshold voltage amplitude is as given in Equation 2: 10–Gain / 20 × [the decimal value of the FAST OVR THRESH bits] / 127 (2) 8.3.3 Input Clock Divider The device is equipped with an internal divider on the clock input. By default, the clock divider is set to divide-by1 operation. The divide-by-2 option supports a maximum 500-MHz input clock and the divide-by-4 option supports a maximum 1-GHz input clock frequency. A 320-MHz input clock with the divide-by-2 option and a 640MHz input clock with the divide-by-4 option can be accepted because the maximum conversion rate of the device is 160 MSPS. Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 23 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 8.3.4 Pin Controls The device power-down functions can be controlled either through the parallel control pins (STBY, PDN_GBL, CTRL1, and CTRL2) or through an SPI register setting. Table 2, Table 3, and Table 4 describe the parallel control pin functionality. STBY places the device in a standby power-down mode. PDN_GBL places the device in global power-down mode. Table 2. CTRL1, CTRL2 Pin Functions CTRL1 CTRL2 Low Low Normal operation DESCRIPTION High Low Channel A powered down Low High Channel B powered down High High Global power-down Table 3. PDN_GBL Pin Function PDN_GBL DESCRIPTION Low Normal operation High Global power-down. Wake-up from this mode is slow. Table 4. STBY Pin Function STBY DESCRIPTION Low Normal operation High The ADCs are powered down while the input clock buffer and output CML buffers are alive. Wake-up from this mode is fast. 8.4 Device Functional Modes 8.4.1 JESD204B Interface The JESD interface of the device, as shown in Figure 46 , supports device subclasses 0, 1, and 2 with a maximum output data rate (per lane) of 3.125 Gbps. An external SYSREF (subclass 1) or SYNC~ (subclass 2) signal is used to align all internal clock phases and the local multiframe clock to a specific sampling clock edge. This alignment allows synchronization of multiple devices in a system and minimizes timing and alignment uncertainty. SYSREF SYNC~ INA JESD 204B JESD204B D0, D1 INB JESD 204B JESD204B D0, D1 Sample Clock Figure 46. JESD204B Interface Depending on the ADC sampling rate, the JESD204B output interface can be operated with either one or two lanes per ADC. The JESD204B interface can be configured with serial registers. 24 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 Device Functional Modes (continued) The JESD204B transmitter block (as shown in Figure 47) consists of the transport layer, data scrambler, and link layer. The transport layer maps the ADC output data into the selected JESD204B frame data format and determines whether the ADC output data or test patterns are transmitted. The link layer performs the 8b and 10b data encoding as well as the synchronization and initial lane alignment using the SYNC~ input signal. Optionally, data from the transport layer can be scrambled. JESD204B Block Transport Layer Link Layer Frame Data Mapping 8b,10b encoding Scrambler 1+x14+x15 D0 Comma characters Initial lane alignment Test Patterns D1 SYNC~ Figure 47. JESD204B Block 8.4.1.1 JESD204B Initial Lane Alignment (ILA) When receiving, the device asserts the SYNC~ signal (that is, a logic low signal is applied on SYNC~P and SYNC~M). The device then begins transmitting comma (K28.5) characters to establish the code group synchronization (CGS). When synchronization completes, the receiving device de-asserts the SYNC~ signal and the device begins the initial lane alignment (ILA) sequence with the next local multiframe clock boundary. The device transmits four multiframes, each containing K frames (where K is SPI programmable). Each multiframe contains the frame start and end symbols; the second multiframe also contains the JESD204 link configuration data. 8.4.1.2 JESD204B Test Patterns There are three different test patterns available in the transport layer of the JESD204B interface. The device supports a clock output pattern, an encoded pattern, and a PRBS (215 – 1) pattern. These patterns can be enabled by a serial register write in register 26h, bits D[7:6]. 8.4.1.3 JESD204B Frame Assembly The JESD204B standard defines the following parameters: • L is the number of lanes per lane. • M is the number of converters per device. • F is the number of octets per frame clock period. • S is the number of samples per frame. Table 5 lists the available JESD204B formats and valid device ranges. Ranges are limited by the maximum ADC sample frequency and the SERDES line rate. Table 5. JESD240B Ranges L M F S MAX ADC SAMPLING RATE (MSPS) 4 2 1 1 160 MAX fSERDES (Gbps) 1.6 2 2 2 1 156.25 3.125 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 25 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com The detailed frame assembly in 10x and 20x modes for dual-channel operation is shown in Table 6. Note that unused lanes in 10x mode become 3-stated. Table 6. Frame Assembly for Dual-Channel Mode (1) LANE (1) LMF = 421 LMF = 222 DA0 A0[15:8] A1[15:8] A2[15:8] A0[15:8] A0[7:0] A1[15:8] A1[7:0] A2[15:8] DA1 A0[7:0] A1[7:0] A2[7:0] — — — — — A2[7:0] — DB0 B0[15:8] B1[15:8] B2[15:8] B0[15:8] B0[7:0] B1[15:8] B1[7:0] B2[15:8] B2[7:0] DB1 B0[7:0] B1[7:0] B2[7:0] — — — — — — Two LSBs of the 16-bit data are padded with '00' in the device. Table 7. High-Frequency Modes Summary REGISTER ADDRESS VALUE Dh 90h High-frequency modes should be enabled for input frequencies greater than 250 MHz. Eh 90h High-frequency modes should be enabled for input frequencies greater than 250 MHz. DESCRIPTION 8.4.1.4 JESD Link Configuration During the lane alignment sequence, the device transmits JESD204B configuration parameters in the second multiframe of the ILA sequence. Configuration bits are mapped in octets, as per the JESD204B standard described in Figure 48 and Table 8. Figure 48. Initial Lane Alignment Sequence 26 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 Table 8. Mapping of Configuration Bits to Octets OCTET NO MSB D6 D5 0 D4 D3 1 ADJCNT[3:0] 2 X 3 SCR[0] ADJDIR[0] D1 LSB BID[3:0] PHADJ[0] LID[4:0] L[4:0] 4 F[7:0] 5 K[4:0] 6 M[7:0] 7 CS[1:0] X 8 SUBCLASSV[2:0] 9 JESDV[2:0] 10 D2 DID [7:0] HD[0] X 11 N[4:0] N'[4:0] S[4:0] X CF[4:0] RES1[7:0] 12 RES2[7:0] 13 FCHK[7:0] Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 27 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 8.4.1.4.1 Configuration for 2-Lane (20x) SERDES Mode Table 9 lists the values of the JESD204B configuration bits applicable for the 2-lane SERDES mode. The default value of these bits after reset is also specified in Table 9. Table 9. Configuration for 2-Lane SERDES Mode PARAMETER DESCRIPTION PARAMETER RANGE FIELD ENCODING DEFAULT VALUE AFTER RESET ADJCNT Number of adjustment resolution steps to adjust the DAC LMFC. Applies to subclass 2 operation only. 0:15 ADJCNT[3:0] Binary value 0 ADJDIR Direction to adjust the DAC LMFC. 0 = Advance 1 = Delay applies to subclass 2 operation only 0:1 ADJDIR[0] Binary value 0 BID Bank ID: extension to DID 0:15 BID[3:0] Binary value 0 CF Number of control words per frame clock period per link 0:32 CF[4:0] Binary value 0 CS Number of control bits per sample 0:3 CS[1:0] Binary value 0 DID Device (= link) identification number 0:255 DID[7:0] Binary value 0 1:256 F[7:0] Binary value minus 1 1 High-density format 0:1 HD[0] Binary value 0 JESD204 version 000 = JESD204A 001 = JESD204B 0:7 JESDV[2:0] Binary value 1 K Number of frames per multiframe 1:32 K[4:0] Binary value minus 1 8 L Number of lanes per converter device (link) 1:32 L[4:0] Binary value minus 1 0 Lane identification number (within link) 0:31 LID[4:0] Binary value LID[0] = 0, LID[1] = 1 M Number of converters per device 1:256 M[7:0] Binary value minus 1 1 N Converter resolution 1:32 N[4:0] Binary value minus 1 15 N’ Total number of bits per sample 1:32 N'[4:0] Binary value minus 1 15 Phase adjustment request to DAC subclass 2 only 0:1 PHADJ[0] Binary value 0 0 F HD JESDV LID PHADJ Number of octets per frame Number of samples per converter per frame cycle 1:32 S[4:0] Binary value minus 1 Scrambling enabled 0:1 SCR[0] Binary value 0 SUBCLASSV Device subclass version 000 = Subclass 0 001 = Subclass 1 010 = Subclass 2 0:7 SUBCLASSV[2: 0] Binary value 2 RES1 Device subclass version 000 = Subclass 0 001 = Subclass 1 010 = Subclass 2 0:255 RES1[7:0] Binary value 0 RES2 Reserved field 2 0:255 RES2[7:0] Binary value 0 Checksum Σ (all above fields) mod 256 0:255 FCHK[7:0] Binary value 44, 45 S SCR CHKSUM 28 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 8.4.1.4.2 Configuration for 4-Lane (10x) SERDES Mode Table 10 lists the values of the JESD204 configuration bits applicable for the 4-lane SERDES mode. The default value of these bits after reset is also specified in Table 10. Table 10. Configuration for 4-Lane SERDES Mode PARAMETER DESCRIPTION PARAMETER RANGE FIELD ENCODING DEFAULT VALUE AFTER RESET ADJCNT Number of adjustment resolution steps to adjust the DAC LMFC. Applies to subclass 2 operation only. 0:15 ADJCNT[3:0] Binary value 0 ADJDIR Direction to adjust the DAC LMFC. 0 = Advance 1 = Delay applies to subclass 2 operation only 0:1 ADJDIR[0] Binary value 0 BID Bank ID: extension to DID 0:15 BID[3:0] Binary value 0 CF Number of control words per frame clock period per link 0:32 CF[4:0] Binary value 0 CS Number of control bits per sample 0:3 CS[1:0] Binary value 0 DID Device (= link) identification number 0:255 DID[7:0] Binary value 0 1:256 F[7:0] Binary value minus 1 0 High-density format 0:1 HD[0] Binary value 1 JESD204 version 000 = JESD204A 001 = JESD204B 0:7 JESDV[2:0] Binary value 1 K Number of frames per multiframe 1:32 K[4:0] Binary value minus 1 16 L Number of lanes per converter device (link) 1:32 L[4:0] Binary value minus 1 3 Lane identification number (within link) 0:31 LID[4:0] Binary value LID[0] = 0, LID[1] = 1, LID[2] = 2, LID[3] = 3 M Number of converters per device 1:256 M[7:0] Binary value minus 1 1 N Converter resolution 1:32 N[4:0] Binary value minus 1 15 N’ Total number of bits per sample 1:32 N'[4:0] Binary value minus 1 15 PHADJ Phase adjustment request to DAC subclass 2 only 0:1 PHADJ[0] Binary value 0 S Number of samples per converter per frame cycle 1:32 S[4:0] Binary value minus 1 0 Scrambling enabled 0:1 SCR[0] Binary value 0 SUBCLASSV Device subclass version 000 = Subclass 0 001 = Subclass 1 010 = Subclass 2 0:7 SUBCLASSV[2: 0] Binary value 2 RES1 Device subclass version 000 = Subclass 0 001 = Subclass 1 010 = Subclass 2 0:255 RES1[7:0] Binary value 0 RES2 Reserved field 2 0:255 RES2[7:0] Binary value 0 Checksum Σ (all above fields) mod 256 0:255 FCHK[7:0] Binary value 54, 55, 56, 57 F HD JESDV LID SCR CHKSUM Number of octets per frame Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 29 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com Table 11. Latency in Different Modes (1) (2) MODE 10x 20x LATENCY (N Cycles) TYPICAL DATA DELAY (tD, ns) ADC latency PARAMETER 23 0.65 × tS + 3 Normal OVR latency 14 6.7 Fast OVR latency 9 6.7 From SYNC~ falling edge to CGS phase (3) 16 0.65 × tS + 3 From SYNC~ rising edge to ILA sequence (4) 25 0.65 × tS + 3 ADC latency 22 0.85 × tS + 3 Normal OVR latency 14 6.7 Fast OVR latency 9 6.7 15 0.85 × tS + 3 16 0.85 × tS + 3 From SYNC~ falling edge to CGS phase (3) From SYNC~ rising edge to ILA sequence (4) (1) (2) (3) (4) Overall latency = latency + tD. tS is the time period of the ADC conversion clock. Latency is specified for subclass 2. In subclass 0, the SYNC~ falling edge to CGS phase latency is 16 clock cycles in 10x mode and 15 clock cycles in 20x mode. Latency is specified for subclass 2. In subclass 0, the SYNC~ rising edge to ILA sequence latency is 11 clock cycles in 10x mode and 11 clock cycles in 20x mode. 8.4.1.5 CML Outputs The device JESD204B transmitter uses differential CML output drivers. The CML output current is programmable from 5 mA to 20 mA using register settings. The output driver includes an internal 50-Ω termination to the IOVDD supply. External 50-Ω termination resistors connected to the receiver common-mode voltage should be placed close to the receiver pins. AC-coupling can be used to avoid the common-mode mismatch between the transmitter and receiver, as shown in Figure 49. Vterm Rt= ZO Transmission Line Zo Rt= ZO 0.1uF DA/B[0,1]P Receiver DA/B[0,1]M 0.1uF Figure 49. CML Output Connections Figure 50 shows the data eye measurements of the device JESD204B transmitter against the JESD204B transmitter mask at 3.125 Gbps (20x mode). 30 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 300 Voltage (mV) 150 0 -150 -300 -200 -150 -100 -50 0 50 100 150 200 Time (ps) Figure 50. Eye Diagram: 3.125 Gbps 8.5 Programming The ADS42JB46 can be configured using a serial programming interface, as described in the Serial Interface section. In addition, the device has four dedicated parallel pins (PDN_GBL, STBY, CTRL1, and CTRL2) for controlling the power-down modes. 8.5.1 Serial Interface The ADC has a set of internal registers that can be accessed by the serial interface formed by the SEN (serial interface enable), SCLK (serial interface clock), SDATA (serial interface data), and SDOUT (serial interface data output) pins. Serially shifting bits into the device is enabled when SEN is low. SDATA serial data are latched at every SCLK rising edge when SEN is active (low). Serial data are loaded into the register at every 16th SCLK rising edge when SEN is low. When the word length exceeds a multiple of 16 bits, the excess bits are ignored. Data can be loaded in multiples of 16-bit words within a single active SEN pulse. The interface functions with SCLK frequencies from 20 MHz down to very low speeds (of a few hertz) and also with a non-50% SCLK duty cycle. 8.5.1.1 Register Initialization After power-up, the internal registers must be initialized to their default values through a hardware reset by applying a high pulse on the RESET pin (of widths greater than 10 ns), as shown in Figure 2. During operation, the serial interface registers can be cleared (if required) either by: 1. A hardware reset or 2. By applying a software reset. When using the serial interface, set the RESET bit (register 08h, bit D0) high. This setting initializes the internal registers to the default values and then self-resets the RESET bit low. In this case, the RESET pin remains low. Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 31 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com Programming (continued) 8.5.1.2 Serial Register Write The internal device register can be programmed following these steps: 1. Drive the SEN pin low. 2. Set the R/W bit to ‘0’ (bit A7 of the 8-bit address). 3. Set bit A6 in the address field to ‘0’. 4. Initiate a serial interface cycle specifying the address of the register (A5 to A0) whose content must be written (as shown in Figure 1 and ). 5. Write the 8-bit data that are latched on the SCLK rising edge. 32 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 Programming (continued) 8.5.1.3 Serial Register Readout The device includes a mode where the contents of the internal registers can be read back. This readback mode may be useful as a diagnostic check to verify the serial interface communication between the external controller and the ADC. 1. Set the MSB of the 8-bit address A7 to '1'. 2. Write the register address on bits A5 through A0 whose contents must be read. See Figure 51. 3. The device outputs the contents (D[7:0]) of the selected register on the SDOUT pin (pin 45). 4. The external controller can latch the contents at the SCLK rising edge. When serial registers are enabled for writing (when bit A7 of the 8-bit address bus is '0'), the SDOUT pin is in a high-impedance mode. If serial readout is not used, the SDOUT pin must float. Figure 51 shows a timing diagram of this readout mode. SDOUT comes out at the SCLK falling edge with an approximate delay (tSD_DELAY) of 20 ns, as shown in Figure 52. Register Address <5:0> SDATA R/W 0 A5 A4 A3 A2 A1 Register Data: don’t care A0 D7 D6 D5 D4 D3 D2 D1 D0 D1 D0 =1 Register Read Data <7:0> SDOUT D7 D6 D5 D4 D3 D2 SCLK SEN Figure 51. Serial Register Readout Timing Diagram SCLK tSD_DELAY SDOUT Figure 52. SDOUT Timing Diagram Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 33 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 8.6 Register Maps 8.6.1 Summary of Serial Interface Registers Table 12 lists the device registers. Table 12. Register Map REGISTER ADDRESS REGISTER DATA A[7:0] (Hex) D7 D6 D5 D4 D3 D2 06 0 0 0 0 0 0 07 0 0 0 0 0 STDBY DATA FORMAT Always write 1 08 PDN CHA PDN CHB D0 CLK DIV SYSREF DELAY 0 0 RESET 0 0B CHA GAIN CHA GAIN EN 0 0C CHBGAIN CHB GAIN EN 0 0 0 0 FAST OVR EN 0 0 0 0D HIGH FREQ 1 0E HIGH FREQ 2 0F 0 0 HIGH FREQ 1 0 0 0 HIGH FREQ 2 0 CHA TEST PATTERNS CHB TEST PATTERNS 10 CUSTOM PATTERN[15:8] 11 CUSTOM PATTERN[15:8] 12 CUSTOM PATTERN[15:8] 13 1F 26 CUSTOM PATTERN[15:8] Always write 0 FAST OVR THRESHOLD SERDES TEST PATTERN IDLE SYNC TESTMODE EN FLIP ADC DATA LAN ALIGN FRAME ALIGN TX LINK CONFIG DATA0 CTRLF 27 0 0 0 0 0 0 CTRLK 2B SCRAMBLE EN 0 0 0 0 0 0 0 0 OCTETS PER FRAME 0 0 2C 0 2D 0 0 0 0 0 30 SUBCLASS 36 LMFC RESET MASK 37 38 34 D1 SYNC REQ LINK LAYER TESTMODE FORCE LMFC COUNT 0 0 0 0 0 0 FRAMES PER MULTIFRAME 0 LINK LAYER RPAT 0 OUTPUT CURRENT SEL 0 LMFC COUNT INIT Submit Documentation Feedback PULSE DET MODES RELEASE ILANE SEQ Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 8.6.2 Description of Serial Interface Registers 8.6.2.1 Register Address 06 Figure 53. Register Address 06 REGISTER ADDRESS A[7:0] (Hex) 06 REGISTER DATA D7 0 D6 0 D5 0 D4 0 D3 0 D2 0 D1 D0 D2 0 D1 D0 SYSREF DELAY CLK DIV Default: 00h D[1:0] CLK DIV 00 Divide-by-1 (clock divider bypassed) Internal clock divider for input sample clock 01 Divide-by-2 10 Divide-by-1 11 Divide-by-4 8.6.2.2 Register Address 07 Figure 54. Register Address 07 REGISTER ADDRESS A[7:0] (Hex) 07 REGISTER DATA D7 0 D6 0 D5 0 D4 0 D3 0 Default: 00h D[2:0] SYSREF DELAY Controls the delay of the SYSREF input with respect to the input clock. Typical values for the expected delay of different settings are: 000 0-ps delay 001 60-ps delay 010 120-ps delay 011 180-ps delay 100 240-ps delay 101 300-ps delay 110 360-ps delay 111 420-ps delay Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 35 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 8.6.2.3 Register Address 08 Figure 55. Register Address 08 REGISTER ADDRESS A[7:0] (Hex) D7 D6 D5 08 PDN CHA PDN CHB STDBY REGISTER DATA D4 DATA FORMAT D3 Always write 1 D2 D1 D0 0 0 RESET Default: 00h D7 PDN CHA Power-down channel A 0 Normal operation 1 Channel A power down D6 PDN CHB 0 Normal operation 1 Channel B power down D5 STBY 0 Normal operation 1 Both ADCs are powered down (input clock buffer and CML output buffers are alive) D4 DATA FORMAT 0 Twos complement 1 Offset binary D3 Always write 1 Power-down channel B Dual ADC is placed into standby mode Digital output data format Default value of this bit is '0'. This bit must always be set to '1'. D0 RESET Software reset applied This bit resets all internal registers to the default values and self-clears to ‘0’. 36 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 8.6.2.4 Register Address 0B Figure 56. Register Address 0B REGISTER ADDRESS A[7:0] (Hex) 0B REGISTER DATA D7 D6 D5 CHA GAIN D4 D3 D2 CHA GAIN EN D1 0 D0 0 Default: 00h D[7:3] CHA GAIN Digital gain for channel A (must set the CHA GAIN EN bit first, bit D2) Table 13. Digital Gain for Channel A DIGITAL GAIN FULL-SCALE INPUT VOLTAGE REGISTER VALUE DIGITAL GAIN FULL-SCALE INPUT VOLTAGE 00000 0 dB 2.0 VPP 01010 1.5 dB 1.7 VPP 00001 Do not use — 01011 2 dB 1.6 VPP 00010 Do not use — 01100 2.5 dB 1.5 VPP 00011 –2.0 dB 2.5 VPP 01101 3 dB 1.4 VPP 00100 –1.5 dB 2.4 VPP 01110 3.5 dB 1.3 VPP 00101 –1.0 dB 2.2 VPP 01111 4 dB 1.25 VPP 00110 –0.5 dB 2.1 VPP 10000 4.5 dB 1.2 VPP 00111 0 dB 2.0 VPP 10001 5 dB 1.1 VPP 01000 0.5 dB 1.9 VPP 10010 5.5 dB 1.05 VPP 01001 1 dB 1.8 VPP 10011 6 dB 1.0 VPP REGISTER VALUE D2 0 1 CHA GAIN EN Digital gain enable bit for channel A Digital gain disabled Digital gain enabled Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 37 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 8.6.2.5 Register Address 0C Figure 57. Register Address 0C REGISTER ADDRESS A[7:0] (Hex) REGISTER DATA D7 D6 0C D5 D4 D3 D2 CHB GAIN EN CHB GAIN Default: 00h D[7:3] CHB GAIN D1 D0 0 0 Digital gain for channel B (must set the CHA GAIN EN bit first, bit D2) Table 14. Digital Gain for Channel B DIGITAL GAIN FULL-SCALE INPUT VOLTAGE REGISTER VALUE DIGITAL GAIN FULL-SCALE INPUT VOLTAGE 00000 0 dB 2.0 VPP 01010 1.5 dB 1.7 VPP 00001 Do not use — 01011 2 dB 1.6 VPP 00010 Do not use — 01100 2.5 dB 1.5 VPP 00011 –2.0 dB 2.5 VPP 01101 3 dB 1.4 VPP 00100 –1.5 dB 2.4 VPP 01110 3.5 dB 1.3 VPP 00101 –1.0 dB 2.2 VPP 01111 4 dB 1.25 VPP 00110 –0.5 dB 2.1 VPP 10000 4.5 dB 1.2 VPP 00111 0 dB 2.0 VPP 10001 5 dB 1.1 VPP 01000 0.5 dB 1.9 VPP 10010 5.5 dB 1.05 VPP 01001 1 dB 1.8 VPP 10011 6 dB 1.0 VPP REGISTER VALUE D2 0 1 CHB GAIN EN Digital gain disabled Digital gain enabled Digital gain enable bit for channel B 8.6.2.6 Register Address 0D Figure 58. Register Address 0D REGISTER ADDRESS A[7:0] (Hex) 0D REGISTER DATA D7 HIGH FREQ 1 D6 D5 0 0 D4 HIGH FREQ 1 D3 D2 D1 D0 0 0 0 FAST OVR EN D7, D4 00 11 HIGH FREQ 1 High-frequency mode 1 Default Use for input frequencies > 250 MHz along with HIGH FREQ 2 D0 0 1 FAST OVR EN Selects if normal or fast OVR signal is presented on OVRA, OVRB pins Normal OVR on OVRA, OVRB pins Fast OVR on OVRA, OVRB pins 38 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 8.6.2.7 Register Address 0E Figure 59. Register Address 0E REGISTER ADDRESS A[7:0] (Hex) 0E D7, D4 00 11 REGISTER DATA D7 HIGH FREQ 2 D6 D5 0 0 D4 HIGH FREQ 2 D3 D2 D1 D0 0 0 0 0 HIGH FREQ 2 High-frequency mode 2 Default Use for input frequencies > 250 MHz along with HIGH FREQ 1 8.6.2.8 Register Address 0F Figure 60. Register Address 0F REGISTER ADDRESS A[7:0] (Hex) 0F REGISTER DATA D7 D6 D5 CHA TEST PATTERNS D4 D3 D2 D1 CHB TEST PATTERNS D0 Default: 00h D[7:4] CHA TEST PATTERNS Channel A test pattern programmability The 16-bit test pattern data are selected as the input to the JESD block (the last two LSBs of the 16-bit data are replaced by '00'). 0000 Normal operation 0001 All '0's 0010 All '1's 0011 Toggle pattern: Data alternate between 10101010101010 and 01010101010101. 0100 Digital ramp: Data increment by 1 LSB every fourth clock cycle from code 0 to 16383. 0101 Do not use 0110 Single pattern: Data are the same as that programmed by the CUSTOM PATTERN 1[15:2] register bits. 0111 Double pattern: Data alternate between CUSTOM PATTERN 1[15:2] and CUSTOM PATTERN 2[15:2]. 1000 Deskew pattern: Data are AAA8h. 1001 Do not use 1010 PRBS pattern: Data are a sequence of pseudo random numbers. 1011 8-point sine wave: Data are a repetitive sequence of the following eight numbers, forming a sine-wave in twos complement format: 0, 2399, 8192, 13984, 16383, 13984, 8192, 2399. D3-D0 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 CHB TEST PATTERNS Channel B test pattern programmability The 16-bit test pattern data are selected as the input to the JESD block (the last two LSBs of the 16-bit data are replaced by '00'). Normal operation All '0's All '1's Toggle pattern: Data alternate between 10101010101010 and 01010101010101. Digital ramp: Data increment by 1 LSB every fourth clock cycle from code 0 to 16383. Do not use Single pattern: Data are the same as that programmed by the CUSTOM PATTERN 1[15:2] register bits. Double pattern: Data alternate between CUSTOM PATTERN 1[15:2] and CUSTOM PATTERN 2[15:2]. Deskew pattern: Data are AAA8h. Do not use PRBS pattern: Data are a sequence of pseudo random numbers. 8-point sine wave: Data are a repetitive sequence of the following eight numbers, forming a sine-wave in twos complement format: 0, 2399, 8192, 13984, 16383, 13984, 8192, 2399. Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 39 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 8.6.2.9 Register Address 10 Figure 61. Register Address 10 REGISTER ADDRESS A[7:0] (Hex) 10 REGISTER DATA D7 D6 Default: 00h D[7:0] CUSTOM PATTERN 1[15:8] D5 D4 D3 CUSTOM PATTERN 1[15:8] D2 D1 D0 D2 D1 D0 D2 D1 D0 D2 D1 D0 These bits set the custom pattern 1[15:8] for both channels. 8.6.2.10 Register Address 11 Figure 62. Register Address 11 REGISTER ADDRESS A[7:0] (Hex) REGISTER DATA D7 D6 D5 11 D4 D3 CUSTOM PATTERN 1[7:0] Default: 00h D[7:0] CUSTOM PATTERN 1[7:0] These bits set the custom pattern 1[7:0] for both channels. 8.6.2.11 Register Address 12 Figure 63. Register Address 12 REGISTER ADDRESS A[7:0] (Hex) 12 REGISTER DATA D7 D6 Default: 00h D[7:0] CUSTOM PATTERN 2[15:8] D5 D4 D3 CUSTOM PATTERN 2[15:8] These bits set the custom pattern 2[15:8] for both channels. 8.6.2.12 Register Address 13 Figure 64. Register Address 13 REGISTER ADDRESS A[7:0] (Hex) 13 REGISTER DATA D7 D6 Default: 00h D[7:0] CUSTOM PATTERN 2[7:0] 40 D5 D4 D3 CUSTOM PATTERN 2[7:0] These bits set the custom pattern 2[7:0] for both channels. Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 8.6.2.13 Register Address 1F Figure 65. Register Address 1F REGISTER ADDRESS A[7:0] (Hex) 1F REGISTER DATA D7 Always write 0 D6 D5 D4 D3 D2 FAST OVR THRESHOLD D1 D0 Default: FFh D7 Always write 0 Default value of this bit is '1'. Always write this bit to '0' when the fast OVR thresholds are programmed. D[6:0] FAST OVR THRESHOLD The device has a fast OVR mode that indicates an overload condition at the ADC input. The input voltage level at which the overload is detected is referred to as the threshold and is programmable using the FAST OVR THRESHOLD bits. FAST OVR is triggered nine output clock cycles after the overload condition occurs. The threshold at which fast OVR is triggered is (full-scale × [the decimal value of the FAST OVR THRESHOLD bits] / 127). See the Overrange Indication section for details. Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 41 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 8.6.2.14 Register Address 26 Figure 66. Register Address 26 REGISTER ADDRESS A[7:0] (Hex) 26 REGISTER DATA D7 D6 SERDES TEST PATTERN D5 IDLE SYNC D4 TESTMODE EN D3 FLIP ADC DATA D2 LANE ALIGN D1 FRANE ALIGN D0 TX LINK CONFIG DATA Default: 00h D[7:6] SERDES TEST PATTERN Sets test patterns in the transport layer of the JESD204B interface. 00 Normal operation 01 Outputs clock pattern: Output is in a 10101010 pattern 10 Encoded pattern: Output is 1111111100000000 11 PRBS sequence: Output is 215 – 1 D5 0 IDLE SYNC Sets the output pattern when SYNC~ is asserted. Sync code is k28.5 (0xBCBC) 1 Sync code is 0xBC50 D4 TESTMODE EN 0 1 Test mode disabled Test mode enabled D3 0 1 FLIP ADC DATA Normal operation Output data order is reversed: D2 LANE ALIGN 0 1 Lane alignment characters are not inserted. Inserts lane alignment characters D1 FRAME ALIGN 0 Frame alignment characters are not inserted. Inserts frame alignment characters 1 D0 0 1 42 TX LINK CONFIG DATA ILA enabled ILA disabled Generates a long transport layer test pattern mode according to clause 5.1.63 of the JESD204B specification. MSB – LSB Inserts a lane alignment character (K28.3) for the receiver to align to the lane boundary, as per section 5.3.3.5 of the JESD204B specification. Inserts a frame alignment character (K28.7) for the receiver to align to the frame boundary, as per section 5.3.3.4 of the JESD204B specification. Disables sending the initial link alignment (ILA) sequence when SYNC~ is de-asserted, '0'. Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 8.6.2.15 Register Address 27 Figure 67. Register Address 27 REGISTER ADDRESS A[7:0] (Hex) 27 REGISTER DATA D7 0 D6 0 D5 0 D4 0 D3 0 D2 0 D1 CTRL K D0 CTRL F D2 0 D1 0 D0 0 Default: 00h D1 CTRL K Enables bit for number of frames per multiframe. 0 Default 1 Frames per multiframe can be set in register 2Dh D0 0 1 CTRL F Enables bit for number of octets per frame. Default Octets per frame can be specified in register 2Ch 8.6.2.16 Register Address 2B Figure 68. Register Address 2B REGISTER ADDRESS A[7:0] (Hex) 2B REGISTER DATA D7 SCRAMBLE EN D6 0 D5 0 D4 0 D3 0 Default: 00h D7 SCRAMBLE EN Scramble enable bit in the JESD204B interface 0 Scrambling disabled 1 Scrambling enabled 8.6.2.17 Register Address 2C Figure 69. Register Address 2C REGISTER ADDRESS A[7:0] (Hex) D7 D6 D5 D4 D3 D2 D1 2C 0 0 0 0 0 0 0 REGISTER DATA D0 OCTETS PER FRAME Default: 00h D[7:0] OCTETS PER FRAME Sets number of octets per frame (F). 0 10x mode using two lanes per ADC 1 20x mode using one lane per ADC Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 43 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 8.6.2.18 Register Address 2D Figure 70. Register Address 2D REGISTER ADDRESS A[7:0] (Hex) 2D REGISTER DATA D7 0 D6 0 D5 0 D4 D3 D2 D1 FRAMES PER MULTIFRAME D0 Default: 00h D[4:0] FRAMES PER MULTIFRAME Sets number of frames per multiframe. After reset, the default settings for frames per multiframe are: 10x K = 16 20x K=8 For each mode, K should not be set to a lower value. 8.6.2.19 Register Address 30 Figure 71. Register Address 30 REGISTER ADDRESS A[7:0] (Hex) 30 Default: 40h D[7:5] SUBCLASS 000 001 010 44 Subclass 0 Subclass 1 Subclass 2 REGISTER DATA D7 D6 SUBCLASS D5 D4 0 D3 0 D2 0 D1 0 D0 0 Sets JESD204B subclass. Note that the default value of these bits after reset is '010', which makes subclass 2 the default class. Backward compatibility with JESD204A Deterministic latency using the SYSREF signal Deterministic latency using SYNC~ detection (default subclass after reset) Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 8.6.2.20 Register Address 36 Figure 72. Register Address 36 REGISTER ADDRESS A[7:0] (Hex) 36 REGISTER DATA D7 SYNC REQ D6 LMFC RESET MASK Default: 00h D7 SYNC REQ 0 Normal operation 1 Generates sync request D6 0 1 D3-D0 0000 0001 0010 0011 0100 0101 0110 0111 D5 0 D4 0 D3 D2 D1 OUTPUT CURRENT SEL D0 Generates a synchronization request. LMFC RESET MASK LMFC reset is not masked Ignores LMFC reset Mask the LMFC reset coming to digital. OUTPUT CURRENT SEL 16 mA 15 mA 14 mA 13 mA 20 mA 19 mA 18 mA 17 mA Changes the JESD output buffer current. 1000 1001 1010 1011 1100 1101 1110 1111 8 mA 7 mA 6 mA 5 mA 12 mA 11 mA 10 mA 9 mA Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 45 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 8.6.2.21 Register Address 37 Figure 73. Register Address 37 REGISTER ADDRESS A[7:0] (Hex) 37 REGISTER DATA D7 D6 D5 LINK LAYER TESTMODE D4 LINK LAYER RPAT D3 0 D2 D1 D0 PULSE DET MODES Default: 00h D[7:5] LINK LAYER TESTMODE Generates a pattern according to clause 5.3.3.8.2 of the JESD204B document. 000 Normal ADC data 001 D21.5 (high-frequency jitter pattern) 010 K28.5 (mixed-frequency jitter pattern) 011 Repeats initial lane alignment (generates a K28.5 character and continuously repeats the lane alignment sequences) 100 12-octet RPAT jitter pattern D4 LINK LAYER RPAT 0 1 Normal operation Changes disparity D[2:0] PULSE DET MODES Changes the running disparity in the modified RPAT pattern test mode (only when the link layer test mode = 100). Selects different detection modes for SYSREF (subclass 1) and SYNC (subclass 2). D2 D1 D0 FUNCTIONALITY 0 Don’t care 0 Allows all pulses to reset input clock dividers 1 Don’t care 0 Do not allow reset of analog clock dividers Don’t care 0 -> 1 transition 1 Allows one pulse immediately after the 0 -> 1 transition to reset the divider 8.6.2.22 Register Address 38 Figure 74. Register Address 38 REGISTER ADDRESS A[7:0] (Hex) 38 REGISTER DATA D7 FORCE LMFC COUNT D6 D5 D4 D3 LMFC COUNT INIT D2 D1 D0 RELEASE ILANE SEQ Default: 00h D7 FORCE LMFC COUNT Forces an LMFC count. 0 Normal operation 1 Enables using a different starting value for the LMFC counter D[6:2] D[1:0] 00 01 10 11 46 LMFC COUNT INIT SYSREF receives the digital block and resets the LMFC count to '0'. K28.5 stops transmitting when the LMFC count reaches 31. The initial value that the LMFC count resets to can be set using LMFC COUNT INIT. In this manner, the Rx can be synchronized early because the Rx gets the LANE ALIGNMENT SEQUENCE early. The FORCE LMFC COUNT register bit must be enabled. RELEASE ILANE SEQ Delays the generation of the lane alignment sequence by 0, 1, 2, or 3 multiframes after the code group synchronization. 0 1 2 3 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information A device clock and sysref signal must be provided to the ADC and it is recommended that these are source synchronous (generated from a common source with match trace lengths) if synchronizing multiple ADCs. An example of a device that can be used to generate source synchronous device clock and sysref is the LMK04828. The device clock frequency must be the same frequency as the desired sampling rate. The sysref period is required to be an integer multiple of the period of the multi-frame clock. Consequently, the frequency of sysref must be restricted to (Device Clock Frequency) / (2×n×K),n = 1,2,3… K is set by the value in spi register 0x2D and it ranges from 1 to 32. A large enough K is recommended (greater than 16) to absorb the lane skews and avoid data transmission errors across the JESD204B interface. The sync~ signal is used by the FPGA or ASIC to acknowledge the correct reception of comma characters from the ADC during the JESD204B link initialization process. During normal operation this signal should be logic 1 if there are no errors in the data transmission from the ADC to the FPGA or ASIC. 9.2 Typical Application In a typical application, such as a dual channel digitizer, the ADS42JB46 is connected to an FPGA or ASIC as shown in Figure 75. Device clock Device clock sysref sysref Lanes J E S D 2 0 4 B CHA CHB BASEBAND PROCESSOR (FPGA/ASIC) Sync~ ADS42JBxx Figure 75. ADS42JBxx in a Dual-Channel Digitizer 9.2.1 Design Requirements For this design example, use the parameters listed in Table 15 as the input parameters. Table 15. Design Parameters PARAMETER EXAMPLE VALUE Fsampling 160 MSPS IF 10 MHz,170 MHz SNR >72 dBc SFDR >80 dBc HD2 >90 dBc Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 47 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 9.2.2 Detailed Design Procedure 9.2.2.1 Analog Input The analog input pins have analog buffers (running from the AVDD3V supply) that internally drive the differential sampling circuit. As a result of the analog buffer, the input pins present high input impedance to the external driving source (10-kΩ dc resistance and 4-pF input capacitance). The buffer helps isolate the external driving source from the switching currents of the sampling circuit. This buffering makes driving the buffered inputs easier than when compared to an ADC without the buffer. The input common-mode is set internally using a 5-kΩ resistor from each input pin to VCM so the input signal can be ac-coupled to the pins. Each input pin (INP, INM) must swing symmetrically between (VCM + 0.5 V) and (VCM – 0.5 V), resulting in a 2-V PP differential input swing. When programmed for a 2.5-V PP full-scale, each input pin must swing symmetrically between (VCM + 0.625 V) and (VCM – 0.625 V). The input sampling circuit has a high 3-dB bandwidth that extends up to 900 MHz (measured with a 50-Ω source driving a 50-Ω termination between INP and INM). The dynamic offset of the first-stage sub-ADC limits the maximum analog input frequency to approximately 250 MHz (with a 2.5-VPP full-scale amplitude) and to approximately 400 MHz (with a 2-VPP full-scale amplitude). This 3-dB bandwidth is different than the analog bandwidth of 900 MHz, which is only an indicator of signal amplitude versus frequency. 9.2.2.1.1 Drive Circuit Requirements For optimum performance, the analog inputs must be driven differentially. This technique improves the commonmode noise immunity and even-order harmonic rejection. A small resistor (5 Ω to 10 Ω) in series with each input pin is recommended to damp out ringing caused by package parasitics. Figure 76, Figure 77, and Figure 78 show the differential impedance (ZIN = RIN || CIN) at the ADC input pins. The presence of the analog input buffer results in an almost constant input capacitance up to 1 GHz. INxP(1) ZIN(2) RIN CIN INxM (1) X = A or B. (2) ZIN = RIN || (1 / jωCIN). Figure 76. ADC Equivalent Input Impedance 5 Differential Capacitance, Cin (pF) Differential Resistance, Rin (kΩ) 10 1 0.1 0.05 0 200 400 600 Frequency (MHz) 800 1000 3 2 1 0 0 G073 Figure 77. ADC Analog Input Resistance (RIN) Across Frequency 48 4 200 400 600 Frequency (MHz) 800 1000 G074 Figure 78. ADC Analog Input Capacitance (CIN) Across Frequency Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 9.2.2.1.2 Driving Circuit An example driving circuit configuration is shown in Figure 79. To optimize even-harmonic performance at high input frequencies (greater than the first Nyquist), the use of back-to-back transformers is recommended, as shown in Figure 79. Note that the drive circuit is terminated by 50 Ω near the ADC side. The ac-coupling capacitors allow the analog inputs to self-bias around the required common-mode voltage. An additional R-C-R (39 Ω – 6.8 pF – 39 Ω) circuit placed near the device pins helps further improve HD3. 0.1µF 0.1µF 5Q INP RINT 39 25 0.1µF 6.8 pF 25 RINT 39 INM 1:1 5 0.1µF 1:1 Device Figure 79. Drive Circuit for Input Frequencies up to 250 MHz The mismatch in the transformer parasitic capacitance (between the windings) results in degraded even-order harmonic performance. Connecting two identical RF transformers back-to-back helps minimize this mismatch and good performance is obtained for high-frequency input signals. An additional termination resistor pair may be required between the two transformers, as shown in Figure 79. The center point of this termination is connected to ground to improve the balance between the P (positive) and M (negative) sides. The values of the terminations between the transformers and on the secondary side must be chosen to obtain an effective 50 Ω (for a 50-Ω source impedance). For high input frequencies (> 250 MHz), the R-C-R circuit can be removed, as indicated in Figure 80. 0.1µF 0.1µF 5Q INP RINT 0.1µF 25 25 RINT INM 1:1 1:1 0.1µF 5 Device Figure 80. Drive Circuit for Input Frequencies > 250 MHz Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 49 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 9.2.2.2 Clock Input The device clock inputs can be driven differentially (sine, LVPECL, or LVDS) or single-ended (LVCMOS), with little or no difference in performance between them. The common-mode voltage of the clock inputs is set to 1.4 V using internal 5-kΩ resistors. The self-bias clock inputs of the device can be driven by the transformer-coupled, sine-wave clock source or by the ac-coupled, LVPECL and LVDS clock sources, as shown in Figure 81, Figure 82, and Figure 83. Figure 84 details the internal clock buffer. 0.1 mF 0.1 mF Zo CLKP Differential Sine-Wave Clock Input CLKP RT Typical LVDS Clock Input 0.1 mF 100 W CLKM Device 0.1 mF Zo NOTE: RT = termination resistor, if necessary. CLKM Figure 81. Differential Sine-Wave Clock Driving Circuit Zo Device Figure 82. LVDS Clock Driving Circuit 0.1 mF CLKP 150 W Typical LVPECL Clock Input 100 W Zo 0.1 mF CLKM Device 150 W Figure 83. LVPECL Clock Driving Circuit Clock Buffer LPKG 2 nH 20 W CLKP CBOND 1 pF 5 kW RESR 100 W LPKG 2 nH CEQ CEQ 1.4 V 20 W 5 kW CLKM CBOND 1 pF RESR 100 W NOTE: CEQ is 1 pF to 3 pF and is the equivalent input capacitance of the clock buffer. Figure 84. Internal Clock Buffer 50 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 A single-ended CMOS clock can be ac-coupled to the CLKP input, with CLKM connected to ground with a 0.1-μF capacitor, as shown in Figure 85. However, for best performance, the clock inputs must be driven differentially, thereby reducing susceptibility to common-mode noise. For high input frequency sampling, TI recommends using a clock source with very low jitter. Band-pass filtering of the clock source can help reduce the effects of jitter. There is no change in performance with a non-50% duty cycle clock input. 0.1 mF CMOS Clock Input CLKP 0.1 mF CLKM Device Figure 85. Single-Ended Clock Driving Circuit 9.2.2.3 SNR and Clock Jitter The signal-to-noise ratio (SNR) of the ADC is limited by three different factors, as shown in Equation 3. Quantization noise is typically not noticeable in pipeline converters and is 96 dBFS for a 16-bit ADC. Thermal noise limits SNR at low input frequencies and clock jitter sets SNR for higher input frequencies. SNRQuantization _ Noise æ SNR ADC [dBc] = -20 ´ log çç 10 20 è 2 2 2 ö æ SNRThermalNoise ö æ SNRJitter ö ÷÷ + ç 10 ÷ + ç 10 ÷ 20 20 ø è ø ø è SNR limitation is a result of sample clock jitter and can be calculated by Equation 4: SNRJitter [dBc] = -20 ´ log(2p ´ fIN ´ tJitter) (3) (4) The total clock jitter (TJitter) has three components: the internal aperture jitter (85 fS for the device) is set by the noise of the clock input buffer, the external clock jitter, and the jitter from the analog input signal. TJitter can be calculated by Equation 5: TJitter = (TJitter,Ext.Clock_Input)2 + (TAperture_ADC)2 (5) External clock jitter can be minimized by using high-quality clock sources and jitter cleaners as well as band-pass filters at the clock input while a faster clock slew rate improves ADC aperture jitter. The device has a 74.1-dBFS thermal noise and an 85-fS internal aperture jitter. The SNR value depends on the amount of external jitter for different input frequencies, as shown in Figure 86. 76 SNR (dBFS) 74 72 35 fs 70 50 fs 68 100 fs 150 fs 66 200 fs 64 10 100 1000 Fin (MHz) Figure 86. SNR versus Input Frequency and External Clock Jitter Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 51 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com 9.2.3 Application Curves 0 0 FIN = 10 MHz SFDR = 94 dBc SNR = 73.9 dBFS SINAD = 73.8 dBFS THD = 92 dBc SFDR Non HD2, HD3 = 103 dBc −20 −40 −60 −60 −80 −80 −100 −100 −120 0 20 40 60 Frequency (MHz) 80 −120 0 20 40 60 Frequency (MHz) G001 Figure 87. FFT for 10-MHz Input Signal 52 −20 Amplitude (dBFS) Amplitude (dBFS) −40 FIN = 170 MHz SFDR = 92 dBc SNR = 73 dBFS SINAD = 72.9 dBFS THD = 91 dBc SFDR Non HD2, HD3 = 100 dBc 80 G002 Figure 88. FFT for 170-MHz Input Signal Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 10 Power Supply Recommendations Four different power supply rails are required for ADS42JBxx device family: • 3.3-V AVDD3V is used to supply power to the analog buffers. • 1.8-V AVDD is used to supply power to the analog core of the ADC. • 1.8-V DRVDD is used to supply power to the digital core of the ADC. • 1.8-V IOVDD is used to supply power to the output buffers. Because of the switching activities on the digital rail, it is recommended to provide the 1.8-V digital and analog supplies from separate sources. Both IOVDD and DRVDD may be supplied from a common source and a ferrite bead is recommended to separate these two supply rails. An example power supply scheme suitable for the ADS42JB46 is shown in Figure 89. In this example supply scheme, AVDD3V, AVDD, DRVDD and IOVDD are supplied from LDOs. To improve on the efficiency of the power supply scheme and to minimize heat dissipation, it is recommended that a DC-DC converter (or switcher) is used before the LDOs if the input voltage is greater than 4.5 V. LDO Input Voltage (>4.5V) 3.3V(340mA) AVDD3V 1.8V(130mA) 4V LDO DC-DC converter LDO AVDD 1.8V(207mA) DRVDD IOVDD 1.8V(100mA) Figure 89. Example Power Supply Scheme 11 Layout 11.1 Layout Guidelines • • • • • • • The length of the positive and negative traces of a differential pair should be matched to within 2 mils (0.051mm) of each other. Each differential pair length should be matched within 10 mils (0.254 mm) of each other. When the ADC is used on the same PCB with a digital intensive component such as FPGA or ASIC, separate digital and analog ground planes should be used. These separate ground planes should not overlap to minimize undesired coupling. Connect decoupling caps directly to ground and place close to the ADC power pins and the power supply pins to filter high-frequency current transients directly to the ground plane. This is illustrated in Figure 90. Ground and power planes should be wide enough to keep the impedance very low. In a multi-layer PCB, one layer each should be dedicated to ground and power planes. All high speed serdes traces should be routed straight with minimum curves and bends. Where a bend is necessary, avoid making very sharp right angle bends in the trace. FR4 material may be used for the PCB core dielectric up to the maximum 3.125-Gbps bit rate supported by ADS42JBxx device family. Path loss can be compensated for by adjusting the drive strength from the ADS42JBxx using SPI register 0x36. Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 53 ADS42JB46 SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 www.ti.com Layout Guidelines (continued) 10 F AVDD DRVDD 10 F Place de-coupling capacitor close to power supply pin 10 F 10 F Place de-coupling capacitor close to ADC power supply pin ADS42LBxx Figure 90. Recommended Placement of Power Supply De-coupling Capacitors 11.2 Layout Example Figure 91. Layout Recommendation 54 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 ADS42JB46 www.ti.com SBAS621B – JULY 2013 – REVISED SEPTEMBER 2015 12 Device and Documentation Support 12.1 Device Support 12.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: ADS42JB46 55 PACKAGE OPTION ADDENDUM www.ti.com 29-Aug-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) ADS42JB46IRGC25 ACTIVE VQFN RGC 64 25 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 85 AZ42JB46 ADS42JB46IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 85 AZ42JB46 ADS42JB46IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 85 AZ42JB46 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 29-Aug-2015 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 2-Sep-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant ADS42JB46IRGCR VQFN RGC 64 2000 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 ADS42JB46IRGCT VQFN RGC 64 250 180.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 2-Sep-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADS42JB46IRGCR VQFN RGC 64 2000 336.6 336.6 28.6 ADS42JB46IRGCT VQFN RGC 64 250 213.0 191.0 55.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated