Sample & Buy Product Folder Support & Community Tools & Software Technical Documents LMS3655-Q1, LMS3635-Q1 SNAS701 – SEPTEMBER 2016 LMS3635/55-Q1, 3.5-A /5.5-A, 36-V Synchronous, 400-kHz, Step-Down Converter 1 Features 2 Applications • • • • • • • • • • • • • • • • • • • • AEC-Q100 Qualified for Automotive Applications – Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature – Device HBM Classification Level 2 – Device CDM Classification Level C6 96% Peak Efficiency While Converting 12 V to 5 V Low EMI and Switch Noise – Minimized Switch Node Ringing – Pseudo-Random Spread Spectrum 400-kHz (±10%) Fixed Switching Frequency –40°C to +150°C Junction Temperature Range External Frequency Synchronization RESET Output With Internal Filter and 3-ms Release Timer Automatic Light Load Mode for Improved Efficiency Pin-Selectable Forced PWM Mode Built-In Compensation, Soft Start, Current Limit, Thermal Shutdown, and UVLO 0.35-V Dropout With 3.5-A Load at 25°C (Typical) 15-µA Iq – Quiescent Current at No Load (Typical) 3.5-A or 5.5-A Continuous Load Current Output Voltage Options: 5 V, 3.3 V, and ADJ (1 V to 15 V) ±2% Output Voltage Tolerance 4-mm × 5-mm, 0.5-mm Pitch SON Package Automotive Systems Industrial Performance In-Dash Instrumentation Battery-Powered Applications 3 Description The LMS3635-Q1 and LMS3655-Q1 synchronous buck regulators are optimized for high performance applications, providing an output voltage of 3.3 V, 5 V, or an adjustable output of 1 V to 15 V. Seamless transition between PWM and PFM modes, along with a low quiescent current, ensures high efficiency and superior transient responses at all loads. Advanced high-speed circuitry allows the LMS3635Q1 and LMS3655-Q1 to regulate an input of 24 V to an output of 3.3 V at a fixed frequency of 400 kHz. An innovative frequency foldback architecture allows this device to regulate a 3.3-V output from an input voltage of only 3.5 V. The input voltage can range up to 36 V, with transient tolerance up to 42 V, easing input surge protection design. The LMS3655-Q1 enables a continuous load current of 5.5 A across the wide input voltage range. An open-drain reset output, with built-in filtering and delay, provides a true indication of system status. This feature negates the requirement for an additional supervisory component, saving cost and board space. Device Information(1) DEVICE NAME LMS3635-Q1 LMS3655-Q1 PACKAGE SON (22) BODY SIZE 4.00 mm × 5.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application Circuit LMS3635 and LMS3655 Efficiency: VOUT = 5 V VIN 3.5V to 36V 100% 98% 10µF 96% PVIN 1 94% 10µF 10µF PGND1 VCC AGND Efficiency (%) PGND2 RESET AVIN 2.2µF LMS3635/55 SYNC CBIAS 0.1µF NC VIN=12 PVIN 2 92% 90% VIN=24 88% 86% FB 84% FPWM EN CBOOT 470nF 82% SW VOUT L1=10µH 3 X 47µF 80% 0.001 0.01 0.1 1 10 Output Current (A) 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to change without notice. ADVANCE INFORMATION 1 LMS3655-Q1, LMS3635-Q1 SNAS701 – SEPTEMBER 2016 www.ti.com Table of Contents 1 2 3 4 5 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device and Documentation Support.................... 5.3 5.4 5.5 5.6 5.7 1 1 1 2 3 6 5.1 Documentation Support ............................................ 3 5.2 Related Links ............................................................ 3 Receiving Notification of Documentation Updates.... Community Resources.............................................. Trademarks ............................................................... Electrostatic Discharge Caution ................................ Glossary .................................................................... 3 3 3 3 3 Mechanical, Packaging, and Orderable Information ............................................................. 4 4 Revision History DATE REVISION NOTES September 2016 * Initial release. ADVANCE INFORMATION 2 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: LMS3655-Q1 LMS3635-Q1 LMS3655-Q1, LMS3635-Q1 www.ti.com SNAS701 – SEPTEMBER 2016 5 Device and Documentation Support 5.1 Documentation Support 5.1.1 Related Documentation For additional information, see the following: • Optimizing Transient Response of Internally Compensated DC-DC Converters With Feedforward Capacitor (SLVA289) • Output Ripple Voltage for Buck Switching Regulator (SLVA630) • AN-1149 Layout Guidelines for Switching Power Supplies (SNVA021) • AN-1229 Simple Switcher® PCB Layout Guidelines (SNVA054) • Constructing Your Power Supply- Layout Considerations (SLUP230) • AN-2020 Thermal Design By Insight, Not Hindsight (SNVA419) • Semiconductor and IC Package Thermal Metrics (SPRA953) The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LMS3655-Q1 Click here Click here Click here Click here Click here LMS5335-Q1 Click here Click here Click here Click here Click here 5.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 5.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 5.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 5.6 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 5.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: LMS3655-Q1 LMS3635-Q1 3 ADVANCE INFORMATION 5.2 Related Links LMS3655-Q1, LMS3635-Q1 SNAS701 – SEPTEMBER 2016 www.ti.com 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. ADVANCE INFORMATION 4 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: LMS3655-Q1 LMS3635-Q1 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) (4/5) LMS36353QRNLRQ1 PREVIEW VQFN-HR RNL 22 3000 TBD Call TI Call TI -40 to 150 LMS36353QRNLTQ1 PREVIEW VQFN-HR RNL 22 250 TBD Call TI Call TI -40 to 150 LMS36355QRNLRQ1 PREVIEW VQFN-HR RNL 22 3000 TBD Call TI Call TI -40 to 150 LMS36355QRNLTQ1 PREVIEW VQFN-HR RNL 22 250 TBD Call TI Call TI -40 to 150 LMS3635AQRNLRQ1 PREVIEW VQFN-HR RNL 22 3000 TBD Call TI Call TI -40 to 150 LMS3635AQRNLTQ1 PREVIEW VQFN-HR RNL 22 250 TBD Call TI Call TI -40 to 150 LMS3635LQRNLRQ1 PREVIEW VQFN-HR RNL 22 3000 TBD Call TI Call TI -40 to 150 LMS3635LQRNLTQ1 PREVIEW VQFN-HR RNL 22 250 TBD Call TI Call TI -40 to 150 LMS3635MQRNLRQ1 PREVIEW VQFN-HR RNL 22 3000 TBD Call TI Call TI -40 to 150 LMS3635MQRNLTQ1 PREVIEW VQFN-HR RNL 22 250 TBD Call TI Call TI -40 to 150 LMS3635NQRNLRQ1 PREVIEW VQFN-HR RNL 22 3000 TBD Call TI Call TI -40 to 150 LMS3635NQRNLTQ1 PREVIEW VQFN-HR RNL 22 250 TBD Call TI Call TI -40 to 150 LMS36553QRNLRQ1 PREVIEW VQFN-HR RNL 22 3000 TBD Call TI Call TI -40 to 150 LMS36553QRNLTQ1 PREVIEW VQFN-HR RNL 22 250 TBD Call TI Call TI -40 to 150 LMS36555QRNLRQ1 PREVIEW VQFN-HR RNL 22 3000 TBD Call TI Call TI -40 to 150 LMS36555QRNLTQ1 PREVIEW VQFN-HR RNL 22 250 TBD Call TI Call TI -40 to 150 LMS3655AQRNLRQ1 PREVIEW VQFN-HR RNL 22 3000 TBD Call TI Call TI -40 to 150 LMS3655AQRNLTQ1 PREVIEW VQFN-HR RNL 22 250 TBD Call TI Call TI -40 to 150 LMS3655LQRNLRQ1 PREVIEW VQFN-HR RNL 22 3000 TBD Call TI Call TI -40 to 150 LMS3655LQRNLTQ1 PREVIEW VQFN-HR RNL 22 250 TBD Call TI Call TI -40 to 150 LMS3655MQRNLRQ1 PREVIEW VQFN-HR RNL 22 3000 TBD Call TI Call TI -40 to 150 LMS3655MQRNLTQ1 PREVIEW VQFN-HR RNL 22 250 TBD Call TI Call TI -40 to 150 LMS3655NQRNLRQ1 PREVIEW VQFN-HR RNL 22 3000 TBD Call TI Call TI -40 to 150 LMS3655NQRNLTQ1 PREVIEW VQFN-HR RNL 22 250 TBD Call TI Call TI -40 to 150 XMS3655MQRNLTQ1 PREVIEW VQFN-HR RNL 22 250 TBD Call TI Call TI -40 to 150 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Device Marking Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2016 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE OUTLINE RNL0022A VQFN - 0.9 mm max height SCALE 2.800 PLASTIC QUAD FLATPACK - NO LEAD 4.1 3.9 B A PIN 1 INDEX AREA 5.1 4.9 (0.08) (0.05) SECTION A-A SECTION A-A SCALE 30.000 TYPICAL C 0.9 MAX SEATING PLANE 0.05 0.00 0.08 C 2 1 2X 0.8 0.1 9 8 8X 0.5 2X 2.175 5X 10 7 (0.2) TYP 11 2X 1.45 0.1 2X 0.25 2.95±0.1 4 2X 2 0.45 0.35 PKG 14 15X 2X 0.85 5X A 0.65 0.45 A 0.3 0.2 0.1 0.05 C A C B 17 1 2X 0.575 0.45 0.35 0.5 0.3 22 SYMM 0.45 0.35 18 11X 2 0.5 0.3 4221861/B 04/2016 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com EXAMPLE BOARD LAYOUT RNL0022A VQFN - 0.9 mm max height PLASTIC QUAD FLATPACK - NO LEAD 4X (0.5) SYMM 15X (0.25) 18 22 12X (0.6) 2X (0.4) (2.325) 1 17 2X (2) 5X (0.75) 2X (1.425) 3X (0.4) 2X (0.575) 2X (1) 0.000 PKG 2X (0.25) 4 2X (0.4) 14 (0.295) ( 0.2) VIA TYP NOTE 4 (3.15) (1.125) 2X (1.65) 2X (1.875) (2.175) 4X (0.5) (1.955) 11 7 9 8 10 (2) (3.4) 6X (3.8) LAND PATTERN EXAMPLE SCALE:20X 0.05 MIN ALL AROUND SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED ALL PADS 4221861/B 04/2016 NOTES: (continued) 3. This package is designed to be soldered to thermal pads on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 4. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN RNL0022A VQFN - 0.9 mm max height PLASTIC QUAD FLATPACK - NO LEAD 15X (0.25) 4X (0.5) SYMM 22 18 5X (0.75) 12X (0.6) 2X (0.4) (2.325) 1 2X (2) 17 (R0.05) TYP 2X (1.425) 6X EXPOSED METAL 2X (0.575) 7X EXPOSED METAL (1.4) (0.12) 0.000 PKG (0.25) 4X ( 0.4) 4 14 SOLDER MASK EDGE TYP (0.71) (2) 2X (1.445) (1.54) 4X (0.5) 2X (2.175) 2X (2.305) 11 4X (0.66) 7 8 8X (0.4) (2.37) 9 10 4X (0.63) (2) (3.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL FOR PADS 4,8,9,10 & 14 80% PRINTED SOLDER COVERAGE BY AREA SCALE:25X 4221861/B 04/2016 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. 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