TDK C5750X7T2W684K200KA Multilayer ceramic chip capacitor Datasheet

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Creation Date : March 20, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C5750X7T2W684K200KA
TDK item description C5750X7T2W684KT****
Commercial Grade
Applications
Please refer to Part No. CGA9M4X7T2W684K200KA for Automotive use.
Feature
Mid Mid Voltage (100 to 630V)
Series
C5750 [EIA 2220]
Status
Production
Size
Length(L)
5.70mm ±0.40mm
Width(W)
5.00mm ±0.40mm
Thickness(T)
2.00mm ±0.20mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
Recommended Land Pattern (PA)
4.10mm to 4.80mm
Recommended Land Pattern (PB)
1.20mm to 1.40mm
Recommended Land Pattern (PC)
4.00mm to 5.00mm
Electrical Characteristics
Capacitance
680nF ±10%
Rated Voltage
450VDC
Temperature Characteristic
X7T(+22,-33%)
Dissipation Factor (Max.)
2.5%
Insulation Resistance (Min.)
735MΩ
Other
Soldering Method
Reflow
AEC-Q200
No
Packing
Blister (Plastic)Taping [180mm Reel]
Package Quantity
500pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : March 20, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C5750X7T2W684K200KA
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
C5750X7T2W684K200KA
ESR
C5750X7T2W684K200KA
Capacitance
C5750X7T2W684K200KA
C5750X7T2W684K200KA
Temperature Characteristic
C5750X7T2W684K200KA(No Bias)
DC Bias Characteristic
C5750X7T2W684K200KA(DC Bias =
225V )
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Ripple Temperature Rising
C5750X7T2W684K200KA(100kHz)
C5750X7T2W684K200KA(500kHz)
C5750X7T2W684K200KA(1MHz)
Multilayer Ceramic Chip Capacitors
C5750X7T2W684K200KA
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : March 20, 2017 (GMT)
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