Material Content Data Sheet Sales Product Name BSC082N10LS G MA# MA001337748 Package PG-TDSON-8-1 Issued 19. February 2015 Weight* 122.78 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal noble metal non noble metal inorganic material non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper carbon black epoxy resin silicondioxide tin silver silver tin lead silver iron phosphorus copper iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7440-22-4 7439-89-6 7723-14-0 7440-50-8 7439-89-6 7723-14-0 7440-50-8 5.418 4.41 0.038 0.03 encapsulation leadfinish plating solder CLIP plating heatspreader heat sink CLIP *deviation 0.011 0.01 37.762 30.76 0.078 0.06 Sum [%] Average Mass [ppm] Sum [ppm] 4.41 44126 44126 308 92 30.80 307565 5.529 4.50 33.329 27.15 31.71 271458 317124 1.452 1.18 1.18 11824 11824 0.166 0.13 0.13 1348 1348 0.101 0.08 0.081 0.07 3.868 3.15 3.30 31505 32990 1.289 1.05 1.05 10502 10502 0.011 0.01 0.003 0.00 11.320 9.22 0.022 0.02 0.007 0.01 22.292 18.16 45032 825 660 92 28 9.23 92201 2. 3. 55 18.19 181563 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 92321 182 Important Remarks: 1. 307965 634 181800 1000000