Material Content Data Sheet Sales Product Name SAB-C161PI-LM CA MA# MA000733216 Package PG-MQFP-100-2 Issued 29. August 2013 Weight* 1786.95 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon magnesium silicon nickel copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7439-95-4 7440-21-3 7440-02-0 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 16.055 0.90 0.538 0.03 301 1304 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.90 8985 8985 2.331 0.13 10.756 0.60 344.917 19.30 20.06 193020 200644 3.785 0.21 0.21 2118 2118 6.917 0.39 6019 3871 200.582 11.22 1175.827 65.82 77.43 658006 774125 19.520 1.09 1.09 10924 10924 1.857 0.10 0.10 1039 1039 0.967 0.05 2.901 0.16 112248 541 0.21 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 1624 2165 1000000