NCP706B, NCP706AB 1 A, 1% Precision Very Low Dropout Voltage Regulator with Enable The NCP706B/AB are a Very Low Dropout Regulators family which provides up to 1 A of load current and maintains excellent output voltage accuracy of 1% including line, load and temperature variations. The operating input voltage range from 2.4 V up to 5.5 V makes this device suitable for Li−ion battery powered products as well as post−regulation applications. The product is available in 3.0 V fixed output voltage option. NCP706B/AB are fully protected against overheating and output short circuit and includes latched OCP protection which automatically latches−off the device in the case of a short circuit event and the NCP706AB has internal active discharge circuit. Very small 8−pin XDFN8 1.6 x 1.2, 04P package makes the device especially suitable for space constrained portable applications such as tablets and smartphones. Parts feature active output discharge function. www.onsemi.com MARKING DIAGRAM XXMG G XDFN8 CASE 711AS XX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) PIN CONNECTION Features • Operating Input Voltage Range: 2.4 V to 5.5 V • Fixed Output Voltage Option: 3.0 V • • • • • • • • • • • Other Output Voltage Options Available on Request. Low Quiescent Current of Typ. 200 mA Very Low Dropout: 155 mV at IOUT = 1 A ±1% Accuracy Over Load/Line/Temperature High PSRR: 58 dB at 1 kHz Internal Soft−Start to Limit the Inrush Current Thermal Shutdown and Current Limit Protections Stable with a 2.2 mF Ceramic Output Capacitor Active Output Discharge (NCP706AB) Available in XDFN8 1.6 x 1.2, 04P 8−pin Package Latched Overcurrent Protection These are Pb−Free Devices OUT 1 8 IN OUT 2 7 IN N/C 3 6 EN SNS 4 5 GND (Top View) IN 8 1 OUT IN 7 2 OUT EN 6 3 N/C GND 5 4 SNS (Bottom View) Typical Applications • • • • Tablets, Smartphones, Wireless Handsets, Portable Media Players Portable Medical Equipment Other Battery Powered Applications VIN = 2.4 (3.3) − 5.5 V VOUT = 3.0 V @ 1 A IN OUT NCP706B/AB CIN SNS EN ON ORDERING INFORMATION See detailed ordering, marking and shipping information on page 9 of this data sheet. GND OFF COUT 2.2 mF Ceramic Figure 1. Typical Application Schematic © Semiconductor Components Industries, LLC, 2016 May, 2016 − Rev. 3 1 Publication Order Number: NCP706B/D NCP706B, NCP706AB Figure 2. Simplified Internal Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. XDFN8 Pin Name 1 OUT 2 OUT 3 N/C Not connected. This pin can be tied to ground to improve thermal dissipation. 4 SNS Remote sense connection. This pin should be connected to the output voltage rail. 5 GND Power supply ground. 6 EN Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode. In case of the NCP706B/AB pulling the EN low resets the OCP latch state. 7 IN Input pin. A small capacitor is needed from this pin to ground to assure stability. 8 IN − Exposed Pad Description Regulated output voltage. A minimum 2.2 mF ceramic capacitor is needed from this pin to ground to assure stability. This pad enhances thermal performance and is electrically connected to GND. It is recommended that the exposed pad is connected to the ground plane on the board or otherwise left open. www.onsemi.com 2 NCP706B, NCP706AB ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit VIN −0.3 V to 6 V V Output Voltage VOUT −0.3 V to VIN + 0.3 V V Enable Input VEN −0.3 V to VIN + 0.3 V V Output Short Circuit Duration tSC Indefinite s TJ(MAX) 150 °C Input Voltage (Note 1) Maximum Junction Temperature TSTG −55 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Storage Temperature Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per EIA/JESD22−A114 ESD Machine Model tested per EIA/JESD22−A115 Latch−up Current Maximum Rating tested per JEDEC standard: JESD78 THERMAL CHARACTERISTICS Rating Thermal Characteristics, XDFN8 1.6x1.2, 04P Thermal Resistance, Junction−to−Air www.onsemi.com 3 Symbol Value Unit RqJA 160 °C/W NCP706B, NCP706AB ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 3.0 V −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 0.3 V or 3.3 V, whichever is greater; IOUT = 10 mA, CIN = COUT = 2.2 mF, VEN = 0.9 V, unless otherwise noted. Typical values are at TJ = +25°C. (Note 3) Test Conditions Parameter Operating Input Voltage Symbol Min VIN 2.4 UVLO 1.2 2.97 Typ Max Unit 5.5 V 1.6 1.9 V 3.0 3.03 Undervoltage lock−out VIN rising, IOUT = 0 Output Voltage Accuracy VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 0 – 1 A VOUT Line Regulation VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 10 mA RegLINE 2 mV Load Regulation IOUT = 0 mA to 1 A, VIN = 3.3 V RegLOAD 2 mV Load Transient IOUT = 10 mA to 1 A in 10 ms, VIN = 3.5 V COUT = 10 mF TranLOAD ±120 mV Dropout voltage (Note 4) IOUT = 1 A, VOUT(nom) = 3.0 V VDO 155 Output Current Limit VOUT = 90% VOUT(nom) ICL Quiescent current IOUT = 0 mA IQ 170 Ground current IOUT = 1 A IGND 200 Shutdown current VEN = 0 V, VIN = 2.0 to 5.5 V EN Pin High Threshold EN Pin Low Threshold VEN Voltage increasing VEN Voltage decreasing EN Pin Input Current VEN = 5.5 V Overcurrent Protection Blanking Time (Note 5) VOUT = VOUT(nom) down to VOUT = 0V (Output Shorted to GND) Turn−on Time COUT = 2.2 mF, from assertion EN pin to 98% Vout(nom) Power Supply Rejection Ratio VIN = 3.5 V + 200 mVpp modulation, VOUT = 3.0 V IOUT = 0.5 A, COUT = 4.7 mF Output Noise Voltage VOUT = 3.0 V, VIN = 4.0 V, IOUT = 0.5 A f = 100 Hz to 100 kHz Thermal Shutdown Temperature 1.1 mV A 0.1 VEN_HI VEN_LO 230 V 230 mA mA 1 0.9 mA V 0.4 IEN 300 tBLANK 10 ms tON 150 ms PSRR 65 58 52 dB VNOISE 300 mVrms Temperature increasing from TJ = +25°C TSD 160 °C Thermal Shutdown Hysteresis Temperature falling from TSD TSDH 20 °C Active Output Discharge (NCP706AB only) VEN ≤ 0.4 V, VIN = 4.5 V RDIS 60 W f = 100 Hz f = 1 kHz f = 10 kHz 700 nA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA = 25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 4. Characterized when VOUT falls 90 mV below the regulated voltage at VIN = 3.3 V, IOUT = 10 mA. 5. For more information see APPLICATIONS INFORMATION section on page 8. www.onsemi.com 4 NCP706B, NCP706AB 3.004 3.5 3.002 3.0 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) TYPICAL CHARACTERISTICS 3.000 2.998 2.996 VIN = 3.3 V IOUT = 10 mA COUT = 2.2 mF VOUT(NOM) = 3.0 V 2.994 2.992 −40 −20 0 20 40 60 2.5 VIN = VEN TA = 25°C COUT = 2.2 mF VOUT(NOM) = 3.0 V 2.0 1.5 1.0 IOUT = 10 mA IOUT = 50 mA IOUT = 250 mA IOUT = 500 mA 0.5 80 100 0.0 120 0.0 1.0 2.0 TEMPERATURE (°C) Figure 3. Output Voltage vs. Temperature 220 200 GROUND CURRENT (mA) QUIESCENT CURRENT (mA) 5.0 260 IOUT = 0 COUT = 2.2 mF VOUT(NOM) = 3.0 V TA = 125°C 180 TA = 25°C 160 TA = −40°C 140 3.0 3.5 4.0 4.5 INPUT VOLTAGE (V) 5.0 VIN = 3.3 V VIN = 4.0 V VIN = 5.0 V 240 200 180 COUT = 2.2 mF TA = 25°C VOUT(NOM) = 3.0 V 160 140 5.5 VIN = 3.5 V VIN = 4.5 V VIN = 5.5 V 220 0.0 Figure 5. Quiescent Current vs. Input Voltage 0.1 0.2 0.3 0.4 0.5 0.6 0.7 OUTPUT CURRENT (A) 0.8 0.9 1.0 Figure 6. Ground Current vs. Output Current 1.8 200 VOUT = 0 VEN = VIN COUT = 2.2 mF TA = 25°C VOUT(NOM) = 3.0 V 1.7 1.6 VEN = VIN COUT = 2.2 mF VOUT(NOM) = 3.0 V 180 DROPOUT VOLTAGE (mV) SHORT CURRENT LIMIT (A) 4.0 Figure 4. Output Voltage vs. Input Voltage 240 120 3.0 INPUT VOLTAGE (V) 1.5 1.4 1.3 160 125°C 140 25°C 120 −40°C 100 80 60 40 20 1.2 3.0 3.5 4.0 4.5 5.0 0 5.5 0 INPUT VOLTAGE (V) 0.2 0.4 0.6 0.8 OUTPUT CURRENT (A) Figure 7. Short Current Limitation vs. Input Voltage Figure 8. Dropout Voltage vs. Output Current www.onsemi.com 5 1 NCP706B, NCP706AB TYPICAL CHARACTERISTICS 80 VIN = 5.5 V VEN = 0 CIN = COUT = 4.7 mF TA = 25°C 2.0 VIN = 3.5 V + 200 mVPP Modulation IOUT = 500 mA TA = 25°C 60 PSRR (dB) REVERSE LEAKAGE CURRENT IN SHUTDOWN (mA) 2.5 1.5 1.0 40 20 0.5 VOUT(NOM) = 3.0 V 0 0.01 0.0 0.0 1.0 2.0 3.0 4.0 5.0 COUT = 2.2 mF COUT = 4.7 mF COUT = 10 mF 0.1 FORCED OUTPUT VOLTAGE (V) 3.5 OUTPUT NOISE DENSITY (mV/√Hz) VIN = 3.5 V + 200 mVPP Modulation COUT = 2.2 mF TA = 25°C PSRR (dB) 60 40 20 0 0.01 IOUT = 10 mA IOUT = 100 mA IOUT = 500 mA 0.1 1 10 FREQUENCY (kHz) 10 100 1000 Figure 10. PSRR vs. Frequency & Output Capacitor Figure 9. Reverse Leakage Current in Shutdown 80 1 FREQUENCY (kHz) IOUT = 500 mA VIN = 4.0 V TA = 25°C VOUT(NOM) = 3.0 V COUT = 2.2 mF 3.0 2.5 2.0 1.5 1.0 0.5 0.0 100 0.01 1000 0.1 1 10 100 1000 FREQUENCY (kHz) Figure 11. PSRR vs. Frequency & Output Current Figure 12. Output Noise Density vs. Frequency www.onsemi.com 6 NCP706B, NCP706AB TYPICAL CHARACTERISTICS Figure 13. Turn−on by Coupled Input and Enable Pins Figure 14. Turn−on by Enable Signal Figure 15. Line Transient Response Figure 16. Load Transient Response Figure 17. Turn−off by Enable Signal www.onsemi.com 7 NCP706B, NCP706AB APPLICATIONS INFORMATION Input Decoupling (Cin) ambient temperature affect the rate of temperature rise for the part. This is stating that when the NCP706B/AB has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation. The power dissipation across the device can be roughly represented by the equation: A 2.2 mF capacitor either ceramic or tantalum is recommended and should be connected as close as possible to the pins of NCP706B device. Higher values and lower ESR will improve the overall line transient response. Output Decoupling (Cout) The minimum decoupling value for NCP706BMX300TAG and NCP706ABMX300TAG devices is 2.2 mF. The regulator accepts ceramic chip capacitors MLCC. If a tantalum capacitor is used, and its ESR is large, the loop oscillation may result. Larger values improve noise rejection and PSRR. P D + ǒV IN * V OUTǓ * I OUT [W] The maximum power dissipation depends on the thermal resistance of the case and circuit board, the temperature differential between the junction and ambient, PCB orientation and the rate of air flow. The maximum allowable power dissipation can be calculated using the following equation: Enable Operation The enable pin EN will turn on or off the regulator. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used then the pin should be connected to VIN. P MAX + ǒT J * T AǓńq JA [W] Please be sure the Vin and GND lines are sufficiently wide. If their impedance is high, noise pickup or unstable operation may result. Set external components, especially the output capacitor, as close as possible to the circuit. The sense pin SNS trace is recommended to be kept as far from noisy power traces as possible and as close to load as possible. Overcurrent Latch Operation The NCP706B/AB is equipped with latched overcurrent protection feature which will automatically disable the LDO in case of permanent output short circuit. Initally during the OCP condition the current flowing from the input to the output of the LDO is typically 1.65 A. This current cause the die to heat−up and eventually when the temperature rises up to the thermal shutdown threshold the LDO becomes disabled. To resume the operation of the device it is necessary to toggle the EN to ‘OFF’ state and than back to ‘ON’ state again. Thermal As power across the NCP706B/AB increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the 1.2 V 0V 1.2 V 0V 3.0 V Output Voltage 0V 3.0 V 0V 0V 1.65 A 1.65 A 600 mA Output Current (eq. 2) Where (TJ − TA) is the temperature differential between the junction and the surrounding environment and qJA is the thermal resistance from the junction to the ambient. Connecting the exposed pad and non connected pin 3 to a large ground pad or plane helps to conduct away heat and improves thermal relief. Hints Enable Voltage (eq. 1) 600 mA 0 mA 0 mA t t<t blank t>tblank Figure 18. Overcurrent Latch Operation www.onsemi.com 8 NCP706B, NCP706AB ORDERING INFORMATION Nominal Ooutput Voltage Marking Active Discharge NCP706BMX300TAG 3.0 V L3 No NCP706ABMX300TAG 3.0 V CA Yes Device Package Shipping† XDFN8 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 9 NCP706B, NCP706AB PACKAGE DIMENSIONS XDFN8 1.6x1.2, 0.4P CASE 711AS ISSUE D D 8X L1 DETAIL A ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ OPTIONAL CONSTRUCTION DIM A A1 b D D2 E E2 e L L1 E PIN ONE IDENTIFIER ÉÉ ÇÇ ÇÇ EXPOSED Cu TOP VIEW 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L A B MOLD CMPD DETAIL B OPTIONAL CONSTRUCTION A DETAIL B MILLIMETERS MIN NOM MAX 0.300 0.375 0.450 0.000 0.025 0.050 0.130 0.180 0.230 1.500 1.600 1.700 1.200 1.300 1.400 1.100 1.200 1.300 0.200 0.300 0.400 0.40 BSC 0.150 0.200 0.250 0.000 0.050 0.100 A1 8X 0.08 C NOTE 3 C SIDE VIEW 1 E2 L1 1.40 8X L 8 8X 0.35 4 0.44 8X 1.44 PACKAGE OUTLINE D2 DETAIL A 8X RECOMMENDED MOUNTING FOOTPRINT* SEATING PLANE 5 8X e e/2 1 0.26 b 0.40 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 0.05 C BOTTOM VIEW ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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