SemiHow HRP35N06K 60v n-channel trench mosfet Datasheet

BVDSS = 60 V
RDS(on) typ = 2.8mΩ
HRP35N06K
ID = 210 A
60V N-Channel Trench MOSFET
TO-220
FEATURES






Originative New Design
Superior Avalanche Rugged Technology
Excellent Switching Characteristics
Unrivalled Gate Charge : 190 nC (Typ.)
Extended Safe Operating Area
Lower RDS(ON) : 2.8 mΩ (Typ.) @VGS=10V
1
2
3
1.Gate 2. Drain 3. Source
 100% Avalanche Tested
Absolute Maximum Ratings
Symbol
VDSS
TC=25℃ unless otherwise specified
Parameter
Drain-Source Voltage
Value
Units
60
V
Drain Current
– Continuous (TC = 25℃)
210
A
Drain Current
– Continuous (TC = 100℃)
150
A
IDM
Drain Current
– Pulsed
735
A
VGS
Gate-Source Voltage
±25
V
EAS
Single Pulsed Avalanche Energy
(Note 2)
2590
mJ
EAR
Repetitive Avalanche Energy
(Note 1)
25
mJ
PD
Power Dissipation (TC = 25℃)
- Derate above 25℃
250
W
TJ, TSTG
Operating and Storage Temperature Range
TL
Maximum lead temperature for soldering purposes,
1/8” from case for 5 seconds
ID
(Note 1)
1.67
W/℃
-55 to +175
℃
300
℃
Thermal Resistance Characteristics
Symbol
Parameter
RθJC
Junction-to-Case
RθCS
Case-to-Sink
RθJA
Junction-to-Ambient
Typ.
Max.
--
0.6
0.5
--
--
62.5
Units
℃/W
◎ SEMIHOW REV.A0,December 2014
HRP35N06K
December 2014
Symbol
Parameter
unless otherwise specified
Test Conditions
Min
Typ
Max
Units
On Characteristics
VGS
RDS(ON)
gFS
Gate Threshold Voltage
VDS = VGS, ID = 250 ㎂
2.0
--
3.6
V
Static Drain-Source
On-Resistance
VGS = 10 V, ID = 30 A
--
2.8
3.5
mΩ
Forward Transconductance
VDS = 20, ID = 30 A
--
90
--
S
VGS = 0 V, ID = 250 ㎂
60
--
--
V
VDS = 48 V, VGS = 0 V
--
--
1
㎂
VDS = 48 V, TJ = 125℃
--
--
100
㎂
VGS = ±25 V, VDS = 0 V
--
--
±100
㎁
--
7900
--
㎊
--
1300
--
㎊
--
900
--
㎊
--
2
--
Ω
--
90
--
㎱
--
140
--
㎱
--
250
--
㎱
--
110
--
㎱
--
190
--
nC
--
30
--
nC
--
77
--
nC
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate-Body Leakage Current
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate Resistance
VDS = 25 V, VGS = 0 V,
f = 1.0 MHz
VGS = 0 V, VDS = 0 V, f = 1MHz
Switching Characteristics
td(on)
Turn-On Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDS = 30 V, ID = 30 A,
RG = 6 Ω
VDS = 48 V, ID = 30 A,
VGS = 10 V
Source-Drain Diode Maximum Ratings and Characteristics
IS
Continuous Source-Drain Diode Forward Current
--
--
210
ISM
Pulsed Source-Drain Diode Forward Current
--
--
735
VSD
Source-Drain Diode Forward Voltage
IS = 30 A, VGS = 0 V
--
--
1.3
V
trr
Reverse Recovery Time
--
80
--
㎱
Qrr
Reverse Recovery Charge
IS = 30 A, VGS = 0 V
diF/dt = 100 A/μs
--
150
--
nC
A
Notes :
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L=1mH, IAS=36A, VDD=45V, RG=25Ω, Starting TJ =25°C
◎ SEMIHOW REV.A0,December 2014
HRP35N06K
Electrical Characteristics TJ=25 °C
HRP35N06K
Typical Characteristics
VGS
15 V
10 V
8V
7V
6V
5.5 V
5V
Bottom : 4.5 V
102
ID, Drain Current [A]
ID, Drain Current [A]
Top :
100
10
175oC
25oC
1
* Notes :
1. VDS= 20V
2. 300us Pulse Test
* Notes :
1. 300us Pulse Test
2. TC = 25oC
101
100
0.1
101
0
2
Figure 1. On Region Characteristics
3.4
6
8
VGS = 10V
3.2
3.0
2.8
100
10
25oC
175oC
1
* Notes :
1. VGS= 0V
2. 300us Pulse Test
∗ Note : TJ = 25oC
2.6
0
90
180
270
360
0.1
0.0
450
0.4
0.8
1.2
1.6
2.0
VSD, Source-Drain Voltage [V]
ID, Drain Current [A]
Figure 4. Body Diode Forward Voltage
Variation with Source Current
and Temperature
Figure 3. On Resistance Variation vs
Drain Current and Gate Voltage
Ciss
10000
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
8000
6000
Coss
4000
* Note ;
1. VGS = 0 V
2. f = 1 MHz
Crss
2000
0
10-1
VGS, Gate-Source Voltage [V]
12
12000
Capacitances [pF]
10
Figure 2. Transfer Characteristics
IDR, Reverse Drain Current [A]
RDS(ON) [mΩ],
Drain-Source On-Resistance
4
VGS, Gate-Source Voltage [V]
VDS, Drain-Source Voltage [V]
10
8
6
4
2
VDS = 48V
ID = 30A
0
100
101
0
30
60
90
120
150
180
210
VDS, Drain-Source Voltage [V]
QG, Total Gate Charge [nC]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
◎ SEMIHOW REV.A0,December 2014
(continued)
2.0
RDS(ON), (Normalized)
Drain-Source On-Resistance
1.2
BVDSS, (Normalized)
Drain-Source Breakdown Voltage
HRP35N06K
Typical Characteristics
1.1
1.0
0.9
∗ Note :
1. VGS = 0 V
2. ID = 250µA
0.8
-100
-50
0
50
100
150
1.5
1.0
0.5
∗ Note :
1. VGS = 10 V
2. ID = 30 A
0.0
-100
200
-50
100 µs
ID, Drain Current [A]
DC
101
100
* Notes :
1. TC = 25 oC
200
150
120
90
60
30
2. TJ = 175 oC
3. Single Pulse
100
101
0
25
102
50
75
100
125
150
175
TC, Case Temperature [oC]
VDS, Drain-Source Voltage [V]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs Case Temperature
100
ZθJC(t), Thermal Response
ID, Drain Current [A]
102
10-2
10-1
150
180
1 ms
10 ms
10
100
210
Operation in This Area
is Limited by R DS(on)
-1
50
Figure 8. On-Resistance Variation
vs Temperature
Figure 7. Breakdown Voltage Variation
vs Temperature
103
0
TJ, Junction Temperature [oC]
TJ, Junction Temperature [oC]
D=0.5
10-1
* Notes :
1. ZθJC(t) = 0.6 oC/W Max.
2. Duty Factor, D=t1/t2
3. TJM - TC = PDM * ZθJC(t)
0.2
0.1
0.05
PDM
0.02
0.01
t1
single pulse
10-2
10-5
10-4
10-3
10-2
10-1
t2
100
101
t1, Square Wave Pulse Duration [sec]
Figure 11. Transient Thermal Response Curve
◎ SEMIHOW REV.A0,December 2014
HRP35N06K
Fig 12. Gate Charge Test Circuit & Waveform
50KΩ
12V
VGS
Same Type
as DUT
Qg
200nF
10V
300nF
VDS
VGS
Qgs
Qgd
DUT
3mA
Charge
Fig 13. Resistive Switching Test Circuit & Waveforms
RL
VDS
VDS
90%
VDD
RG
( 0.5 rated VDS )
Vin
DUT
10V
10%
tr
td(on)
td(off)
t on
tf
t off
Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms
BVDSS
1
EAS = ---- LL IAS2 -------------------2
BVDSS -- VDD
L
VDS
VDD
ID
BVDSS
IAS
RG
10V
ID (t)
DUT
VDS (t)
VDD
tp
Time
◎ SEMIHOW REV.A0,December 2014
HRP35N06K
Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms
DUT
+
VDS
_
IS
L
Driver
RG
VGS
VGS
( Driver )
Same Type
as DUT
VDD
• dv/dt controlled by RG
• IS controlled by pulse period
Gate Pulse Width
D = -------------------------Gate Pulse Period
10V
IFM , Body Diode Forward Current
IS
( DUT )
di/dt
IRM
Body Diode Reverse Current
VDS
( DUT )
Body Diode Recovery dv/dt
Vf
VDD
Body Diode
Forward Voltage Drop
◎ SEMIHOW REV.A0,December 2014
HRP35N06K
Package Dimension
TO-220 (A)
9.90±0.20
0
.2
±0
0
.6
4.50±0.20
6.50±0.20
9.19±0.20
2.80±0.20
1.27±0.20
1.52±0.20
1.30±0.20
2.40±0.20
3.02±0.20
13.08±0.20
15.70±0.20
φ3
0.80±0.20
2.54typ
2.54typ
0.50±0.20
◎ SEMIHOW REV.A0,December 2014
HRP35N06K
Package Dimension
TO-220 (B)
±0.20
84
4.57±0.20
6.30±0.20
1.27±0.20
9.14±0.20
2.74±0.20
15.44±0.20
.
φ3
0
.2
±0
1.27±0.20
2.67±0.20
13.28±0.20
2.67±0.20
0.81±0.20
2.54typ
2.54typ
0.40±0.20
◎ SEMIHOW REV.A0,December 2014
Similar pages