AD ADSP-21479BSWZ-2A Sharc processor Datasheet

SHARC Processor
ADSP-21477/ADSP-21478/ADSP-21479
SUMMARY
The ADSP-2147x processors are available with unique
audio-centric peripherals, such as the digital applications
interface, serial ports, precision clock generators, S/PDIF
transceiver, asynchronous sample rate converters, input
data port, and more.
Factory programmed ROM versions containing latest audio
decoders from Dolby and DTS, available to IP licenses
For complete ordering information, see Ordering Guide on
Page 76.
High performance 32-bit/40-bit floating-point processor
optimized for high performance audio processing
Single-instruction, multiple-data (SIMD) computational
architecture
On-chip memory—up to 5M bits of on-chip RAM, 4M bits of
on-chip ROM
Up to 300 MHz operating frequency
Qualified for automotive applications. See Automotive Products on Page 75
Code compatible with all other members of the SHARC family
Internal Memory
SIMD Core
Block 0
RAM/ROM
Instruction
Cache
5 Stage
Sequencer
DAG1/2
Core
Timer
PEx
FLAGx/IRQx/
TMREXP
DMD
64-BIT
PEy
JTAG
PMD
64-BIT
THERMAL
DIODE
S
B0D
64-BIT
Block 1
RAM/ROM
B1D
64-BIT
Block 2
RAM
B2D
64-BIT
Block 3
RAM
B3D
64-BIT
DMD
64-BIT
Core Bus
Cross Bar
Internal Memory I/F
PMD 64-BIT
EPD BUS 64-BIT
IOD0 32-BIT
IOD1
32-BIT
PERIPHERAL BUS 32-BIT
IOD0 BUS
FFT
FIR
IIR
PERIPHERAL BUS
DTCP/
MTM
EP
SPEP BUS
CORE
FLAGS/
PWM3-1
PCG
C-D
TIMER
1-0
TWI SPI/B UART
SHIFT S/PDIF
REG Tx/Rx
PCG
A-D
ASRC PDAP/ SPORT
IDP
7-0
3-0
7-0
DAI Routing/Pins
DPI Routing/Pins
DAI Peripherals
DPI Peripherals
RTC
WDT MLB
CORE PWM
FLAGS 3-0
AMI
SDRAM
CTL
External Port Pin MUX
Peripherals
External
Port
Figure 1. Functional Block Diagram
SHARC and the SHARC logo are registered trademarks of Analog Devices, Inc.
Rev. C
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Tel: 781.329.4700
©2013 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
ADSP-21477/ADSP-21478/ADSP-21479
TABLE OF CONTENTS
Summary ............................................................... 1
ESD Sensitivity ................................................... 24
General Description ................................................. 3
Absolute Maximum Ratings ................................... 24
Family Core Architecture ........................................ 4
Timing Specifications ........................................... 25
Family Peripheral Architecture ................................ 8
Output Drive Currents ......................................... 65
I/O Processor Features ......................................... 12
Test Conditions .................................................. 65
System Design .................................................... 13
Capacitive Loading .............................................. 65
Development Tools ............................................. 13
Thermal Characteristics ........................................ 66
Additional Information ........................................ 15
88-LFCSP_VQ Lead Assignment ................................ 68
Related Signal Chains .......................................... 15
100-LQFP_EP Lead Assignment ................................ 70
Pin Function Descriptions ....................................... 16
196-BGA Ball Assignment ........................................ 72
Specifications ........................................................ 21
Outline Dimensions ................................................ 73
Operating Conditions .......................................... 21
Surface-Mount Design .......................................... 75
Electrical Characteristics ....................................... 22
Automotive Products ........................................... 75
Maximum Power Dissipation ................................ 24
Ordering Guide ..................................................... 76
Package Information ........................................... 24
REVISION HISTORY
7/13—Rev. B to Rev. C
PRODUCT APPLICATION RESTRICTION
Updated Development Tools .................................... 13
Not for use in in-vivo applications for body fluid constituent
monitoring, including monitoring one or more of the components that form, or may be a part of, or contaminate human
blood or other body fluids, such as, but not limited to, carboxyhemoglobin, methemoglobin total hemoglobin, oxygen
saturation, oxygen content, fractional arterial oxygen saturation, bilirubin, glucose, drugs, lipids, water, protein, and pH.
Revised MS1-0 pin description and VDD_RTC pin description in
Pin Function Descriptions ....................................... 16
Corrected parameter from IDD-INTYP to IDD_INT in
Electrical Characteristics .......................................... 22
Modified Total Power Dissipation .............................. 23
Added footnote 3 to Table 32 in AMI Read .................. 37
Changed Max values in Table 43 in Pulse-Width Modulation
Generators (PWM) ................................................ 51
Corrected the following lead names in Table 61 in
88-LFCSP_VQ Lead Assignment ............................... 68
• CLK_CFG_1 to CLK_CFG1
• BOOTCFG_0 to BOOT_CFG0
• BOOTCFG_1 to BOOT_CFG1
• CLK_CFG_0 to CLK_CFG0
• XTAL2 to XTAL
Updated package outline drawings for 88-Lead LFCSP and
100-Lead LQFP_EP packages in Outline Dimensions ..... 73
Added automotive model and corrected models in Table 64
(Automotive Product Models) in Automotive Products ... 75
To view product/process change notifications (PCNs) related to
this data sheet revision, please visit the processor’s product page
on the www.analog.com website and use the View PCN link.
Rev. C |
Page 2 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
GENERAL DESCRIPTION
No
Yes
No
Yes
Shift Register
IDP/PDAP
Yes
UART
1
DAI (SRU)/DPI (SRU2)
Speed
(at 300 MHz)
30.59 μs
Speed
(at 200 MHz)
45.885 μs
1.66 ns
6.65 ns
2.49 ns
9.975 ns
14.99 ns
26.66 ns
11.61 ns
18.08 ns
22.485 ns
39.99 ns
17.41 ns
27.12 ns
20/14 Pins
S/PDIF Transceiver
1
SPI
2
TWI
1
SRC SNR Performance
Thermal Diode
Package1
ADSP-21479
ADSP-21478
ADSP-21477
200 MHz
Yes
Yes
100-Lead
LQFP
88-Lead
LFCSP_VQ
196-Ball CSP_BGA
100-Lead LQFP
88-lead LFCSP_VQ
1
Table 2. ADSP-2147x Family Features
Feature
–128 dB
4
VISA Support
Assumes two files in multichannel SIMD mode.
Frequency
Yes
2
Table 1. Processor Benchmarks
1
No
2, 3
Real-Time Clock
Table 1 shows performance benchmarks for the ADSP-2147x
processors. Table 2 shows the features of the individual product
offerings.
Benchmark Algorithm
1024 Point Complex FFT
(Radix 4, with Reversal)
FIR Filter (per Tap)1
IIR Filter (per Biquad)1
Matrix Multiply (Pipelined)
[3 × 3] × [3 × 1]
[4 × 4] × [4 × 1]
Divide (y/×)
Inverse Square Root
Watch Dog Timer2
Up to 300 MHz
The diagram on Page 1 shows the two clock domains (core and
I/O processor) that make up the ADSP-2147x processors. The
core clock domain contains the following features.
• Two processing elements (PEx, PEy), each of which comprises an ALU, multiplier, shifter, and data register file
2M bits
ROM
N/A
4M bits
• Two data address generators (DAG1, DAG2)
4 units (3 in 100-lead
package)
• A program sequencer with instruction cache
3
No
Yes, 16-Bit
External Port Interface
(SDRAM, AMI)1
Serial Ports
Direct DMA from SPORTs
to External Memory
5M bits
• PM and DM buses capable of supporting 2 × 64-bit data
transfers between memory and the core at every core processor cycle
• One periodic interval timer with pinout
8
• On-chip SRAM (up to 5M bit)
No
FIR, IIR, FFT Accelerator
MediaLB Interface
3M bits
The 100-lead and 88-lead packages of the processors do not contain an external
port. The SDRAM controller pins must be disabled when using this package.
For more information, see Pin Function Descriptions on Page 17.
2
Available on the 196-ball CSP_BGA package only.
3
Real Time Clock (RTC) is supported only for products with a temperature range
of 0°C to +70°C and not supported for all other temperature grades.
4
Available on the 88-lead and 100-lead packages only.
RAM
Pulse-Width Modulation
ADSP-21479
Feature
ADSP-21478
Table 2. ADSP-2147x Family Features (Continued)
ADSP-21477
The ADSP-2147x SHARC® processors are members of the
SIMD SHARC family of DSPs that feature Analog Devices’
Super Harvard Architecture. The processors are source code
compatible with the ADSP-2126x, ADSP-2136x, ADSP-2137x,
ADSP-2146x, and ADSP-2116x DSPs as well as with first
generation ADSP-2106x SHARC processors in SISD (singleinstruction, single-data) mode. These processors are 32-bit/
40-bit floating-point processors optimized for high performance audio applications with a large on-chip SRAM, multiple
internal buses to eliminate I/O bottlenecks, and an innovative
digital applications interface (DAI).
Yes
• A JTAG test access port for emulation and boundary scan.
The JTAG provides software debug through user breakpoints, which allows flexible exception handling.
Yes
No
Automotive models
only
Rev. C |
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July 2013
ADSP-21477/ADSP-21478/ADSP-21479
The block diagram of the ADSP-2147x on Page 1 also shows the
peripheral clock domain (also known as the I/O processor),
which contains the following features:
elements. When using the DAGs to transfer data in SIMD
mode, two data values are transferred with each memory or register file access.
• IOD0 (peripheral DMA) and IOD1 (external port DMA)
buses for 32-bit data transfers
SIMD mode is supported from external SDRAM but is not supported in the AMI.
• Peripheral and external port buses for core connection
Independent, Parallel Computation Units
• External port with an asynchronous memory interface
(AMI) and SDRAM controller
Within each processing element is a set of computational units.
The computational units consist of an arithmetic/logic unit
(ALU), multiplier, and shifter. These units perform all operations in a single cycle. The three units within each processing
element are arranged in parallel, maximizing computational
throughput. Single multifunction instructions execute parallel
ALU and multiplier operations. In SIMD mode, the parallel
ALU and multiplier operations occur in both processing elements. These computation units support IEEE 32-bit singleprecision floating-point, 40-bit extended precision floatingpoint, and 32-bit fixed-point data formats.
• 4 units for pulse width modulation (PWM) control
• 1 memory-to-memory (MTM) unit for internal-to-internal
memory transfers
• Digital applications interface that includes four precision
clock generators (PCG), an input data port (IDP/PDAP)
for serial and parallel interconnect, an S/PDIF
receiver/transmitter, four asynchronous sample rate converters, eight serial ports, a shift register, and a flexible
signal routing unit (DAI SRU).
• Digital peripheral interface that includes two timers, a 2wire interface, one UART, two serial peripheral interfaces
(SPI), two precision clock generators (PCG), three pulse
width modulation (PWM) units, and a flexible signal routing unit (DPI SRU).
As shown in the SHARC core block diagram on Page 5, the processors use two computational units to deliver a significant
performance increase over the previous SHARC processors on a
range of DSP algorithms. With its SIMD computational hardware, the processors can perform 1.8 GFLOPS running at
300 MHz.
FAMILY CORE ARCHITECTURE
The processors are code compatible at the assembly level with
the ADSP-2146x, ADSP-2137x, ADSP-2136x, ADSP-2126x,
ADSP-21160, and ADSP-21161, and with the first generation
ADSP-2106x SHARC processors. The ADSP-2147x share architectural features with the ADSP-2126x, ADSP-2136x, ADSP2137x, ADSP-2146x, and ADSP-2116x SIMD SHARC processors, as shown in Figure 2 and detailed in the following sections.
SIMD Computational Engine
Timer
The processor contains a core timer that can generate periodic
software interrupts. The core timer can be configured to use
FLAG3 as a timer expired signal.
Data Register File
Each processing element contains a general-purpose data register file. The register files transfer data between the computation
units and the data buses, and store intermediate results. These
10-port, 32-register (16 primary, 16 secondary) register files,
combined with the processor’s enhanced Harvard architecture,
allow unconstrained data flow between computation units and
internal memory. The registers in PEX are referred to as
R0–R15 and in PEY as S0–S15.
Context Switch
Many of the processor’s registers have secondary registers that
can be activated during interrupt servicing for a fast context
switch. The data registers in the register file, the DAG registers,
and the multiplier result registers all have secondary registers.
The primary registers are active at reset, while the secondary
registers are activated by control bits in a mode control register.
The processors contain two computational processing elements
that operate as a single-instruction, multiple-data (SIMD)
engine. The processing elements are referred to as PEX and PEY
and each contains an ALU, multiplier, shifter, and register file.
PEX is always active, and PEY may be enabled by setting the
PEYEN mode bit in the MODE1 register. SIMD mode allows
the processor to execute the same instruction in both processing
elements, but each processing element operates on different
data. This architecture is efficient at executing math intensive
DSP algorithms.
Universal Registers
SIMD mode also affects the way data is transferred between
memory and the processing elements because twice the data
bandwidth is required to sustain computational operation in the
processing elements. Therefore, entering SIMD mode also doubles the bandwidth between memory and the processing
Single-Cycle Fetch of Instruction and Four Operands
Rev. C |
Universal registers can be used for general-purpose tasks. The
USTAT (4) registers allow easy bit manipulations (Set, Clear,
Toggle, Test, XOR) for all peripheral control and status
registers.
The data bus exchange register (PX) permits data to be passed
between the 64-bit PM data bus and the 64-bit DM data bus, or
between the 40-bit register file and the PM/DM data bus. These
registers contain hardware to handle the data width difference.
The processors feature an enhanced Harvard architecture in
which the data memory (DM) bus transfers data and the program memory (PM) bus transfers both instructions and data
(see Figure 2). With its separate program and data memory
Page 4 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
buses and on-chip instruction cache, the processor can simultaneously fetch four operands (two over each data bus) and one
instruction (from the cache), all in a single cycle.
S
JTAG
FLAG
TIMER INTERRUPT CACHE
SIMD Core
PM ADDRESS 24
DMD/PMD 64
5 STAGE
PROGRAM SEQUENCER
PM DATA 48
DAG1
16×32
DAG2
16×32
PM ADDRESS 32
SYSTEM
I/F
DM ADDRESS 32
USTAT
4×32-BIT
PM DATA 64
PX
64-BIT
DM DATA 64
MULTIPLIER
MRF
80-BIT
MRB
80-BIT
SHIFTER
ALU
RF
Rx/Fx
PEx
16×40-BIT
DATA
SWAP
RF
Sx/SFx
PEy
16×40-BIT
ASTATx
ASTATy
STYKx
STYKy
ALU
SHIFTER
MULTIPLIER
MSB
80-BIT
MSF
80-BIT
Figure 2. SHARC Core Block Diagram
Instruction Cache
The processor includes an on-chip instruction cache that
enables three-bus operation for fetching an instruction and four
data values. The cache is selective—only the instructions whose
fetches conflict with PM bus data accesses are cached. This
cache allows full speed execution of core looped operations such
as digital filter multiply-accumulates, and FFT butterfly
processing.
Data Address Generators with Zero-Overhead Hardware
Circular Buffer Support
The processor’s two data address generators (DAGs) are used
for indirect addressing and implementing circular data buffers
in hardware. Circular buffers allow efficient programming of
delay lines and other data structures required in digital signal
processing, and are commonly used in digital filters and Fourier
transforms. The two DAGs of the processors contain sufficient
registers to allow the creation of up to 32 circular buffers (16
Rev. C |
primary register sets, 16 secondary). The DAGs automatically
handle address pointer wraparound, reduce overhead, increase
performance, and simplify implementation. Circular buffers can
start and end at any memory location.
Flexible Instruction Set
The 48-bit instruction word accommodates a variety of parallel
operations, for concise programming. For example, the
processors can conditionally execute a multiply, an add, and a
subtract in both processing elements while branching and fetching up to four 32-bit values from memory—all in a single
instruction.
Variable Instruction Set Architecture (VISA)
In addition to supporting the standard 48-bit instructions from
previous SHARC processors, the processors support new
instructions of 16 and 32 bits. This feature, called Variable
Instruction Set Architecture (VISA), drops redundant/unused
Page 5 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
bits within the 48-bit instruction to create more efficient and
compact code. The program sequencer supports fetching these
16-bit and 32-bit instructions from both internal and external
SDRAM memory. This support is not extended to the asynchronous memory interface (AMI). Source modules need to be built
using the VISA option, in order to allow code generation tools
to create these more efficient opcodes.
On-Chip Memory
The processors contain varying amounts of internal RAM and
internal ROM which is shown in Table 3 through Table 5. Each
block can be configured for different combinations of code and
data storage. Each memory block supports single-cycle, independent accesses by the core processor and I/O processor.
The processor’s SRAM can be configured as a maximum of
160k words of 32-bit data, 320k words of 16-bit data, 106.7k
words of 48-bit instructions (or 40-bit data), or combinations of
different word sizes up to 5M bits. All of the memory can be
accessed as 16-bit, 32-bit, 48-bit, or 64-bit words. A 16-bit
floating-point storage format is supported that effectively doubles the amount of data that may be stored on-chip. Conversion
between the 32-bit floating-point and 16-bit floating-point
formats is performed in a single instruction. While each memory block can store combinations of code and data, accesses are
most efficient when one block stores data using the DM bus for
transfers, and the other block stores instructions and data using
the PM bus for transfers.
Using the DM bus and PM buses, with one bus dedicated to a
memory block, assures single-cycle execution with two data
transfers. In this case, the instruction must be available in the
cache.
The memory maps in Table 3 through Table 5 display the internal memory address space of the processors. The 48-bit space
section describes what this address range looks like to an
instruction that retrieves 48-bit memory. The 32-bit section
describes what this address range looks like to an instruction
that retrieves 32-bit memory.
Table 3. ADSP-21477 Internal Memory Space (2M bits)
IOP Registers 0x0000 0000–0x0003 FFFF
Extended Precision Normal or
Long Word (64 Bits)
Instruction Word (48 Bits)
Block 0 ROM (Reserved)
Block 0 ROM (Reserved)
0x0004 0000–0x0004 7FFF
0x0008 0000–0x0008 AAA9
Reserved
Reserved
0x0004 8000–0x0004 8FFF
0x0008 AAAA–0x0008 BFFF
Block 0 SRAM
Block 0 SRAM
0x0004 9000–0x0004 BFFF
0x0008 C000–0x0008 FFFF
Reserved
Reserved
0x0004 C000–0x0004 FFFF
0x0009 000–0x0009 5554
Block 1 ROM (Reserved)
Block 1 ROM (Reserved)
0x0005 0000–0x0005 7FFF
0x000A 0000–0x000A AAA9
Reserved
Reserved
0x0005 8000–0x0005 8FFF
0x000A AAAA–0x000A BFFF
Block 1 SRAM
Block 1 SRAM
0x0005 9000–0x0005 BFFF
0x000A C000–0x000A FFFF
Reserved
Reserved
0x0005 C000–0x0005 FFFF
0x000B 0000–0x000B 5554
Block 2 SRAM
Block 2 SRAM
0x0006 0000–0x0006 0FFF
0x000C 0000–0x000C 1554
Reserved
Reserved
0x0006 1000– 0x0006 FFFF
0x000C 1555–0x000D 5554
Block 3 SRAM
Block 3 SRAM
0x0007 0000–0x0007 0FFF
0x000E 0000–0x000E 1554
Reserved
Reserved
0x0007 1000–0x0007 FFFF
0x000E 1555–0x000F 5554
Rev. C |
Normal Word (32 Bits)
Block 0 ROM (Reserved)
0x0008 0000–0x0008 FFFF
Reserved
0x0009 0000–0x0009 1FFF
Block 0 SRAM
0x0009 2000–0x0009 7FFF
Reserved
0x0009 8000–0x0009 FFFF
Block 1 ROM (Reserved)
0x000A 0000–0x000AFFFF
Reserved
0x000B 0000–0x000B 1FFF
Block 1 SRAM
0x000B 2000–0x000B 7FFF
Reserved
0x000B 8000–0x000B FFFF
Block 2 SRAM
0x000C 0000–0x000C 1FFF
Reserved
0x000C 2000–0x000D FFFF
Block 3 SRAM
0x000E 0000–0x000E 1FFF
Reserved
0x000E 2000–0x000F FFFF
Page 6 of 76 |
July 2013
Short Word (16 Bits)
Block 0 ROM (Reserved)
0x0010 0000–0x0011 FFFF
Reserved
0x0012 0000–0x0012 FFFF
Block 0 SRAM
0x0012 4000–0x0012 FFFF
Reserved
0x0013 0000–0x0013 FFFF
Block 1 ROM (Reserved)
0x0014 0000–0x0015 FFFF
Reserved
0x0016 0000–0x0016 3FFF
Block 1 SRAM
0x0016 4000–0x0016 FFFF
Reserved
0x0017 0000–0x0017 FFFF
Block 2 SRAM
0x0018 0000–0x0018 3FFF
Reserved
0x0018 4000–0x001B FFFF
Block 3 SRAM
0x001C 0000–0x001C 3FFF
Reserved
0x001C 4000–0x001F FFFF
ADSP-21477/ADSP-21478/ADSP-21479
Table 4. ADSP-21478 Internal Memory Space (3M bits)1
Long Word (64 Bits)
Block 0 ROM (Reserved)
0x0004 0000–0x0004 7FFF
Reserved
0x0004 8000–0x0004 8FFF
Block 0 SRAM
0x0004 9000–0x0004 CFFF
Reserved
0x0004 D000–0x0004 FFFF
Block 1 ROM (Reserved)
0x0005 0000–0x0005 7FFF
Reserved
0x0005 8000–0x0005 8FFF
Block 1 SRAM
0x0005 9000–0x0005 CFFF
Reserved
0x0005 D000–0x0005 FFFF
Block 2 SRAM
0x0006 0000–0x0006 1FFF
Reserved
0x0006 2000– 0x0006 FFFF
Block 3 SRAM
0x0007 0000–0x0007 1FFF
Reserved
0x0007 2000–0x0007 FFFF
1
IOP Registers 0x0000 0000–0x0003 FFFF
Extended Precision Normal or
Instruction Word (48 Bits)
Normal Word (32 Bits)
Block 0 ROM (Reserved)
Block 0 ROM (Reserved)
0x0008 0000–0x0008 AAA9
0x0008 0000–0x0008 FFFF
Reserved
Reserved
0x0008 AAAA–0x0008 BFFF
0x0009 0000–0x0009 1FFF
Block 0 SRAM
Block 0 SRAM
0x0008 C000–0x0009 1554
0x0009 2000–0x0009 9FFF
Reserved
Reserved
0x0009 1555–0x0009 FFFF
0x0009 A000–0x0009 FFFF
Block 1 ROM (Reserved)
Block 1 ROM (Reserved)
0x000A 0000–0x000A AAA9
0x000A 0000–0x000A FFFF
Reserved
Reserved
0x000A AAAA–0x000A BFFF
0x000B 0000–0x000B 1FFF
Block 1 SRAM
Block 1 SRAM
0x000A C000–0x000B 1554
0x000B 2000–0x000B 9FFF
Reserved
Reserved
0x000B 1555–0x000B FFFF
0x000B A000–0x000B FFFF
Block 2 SRAM
Block 2 SRAM
0x000C 0000–0x000C 2AA9
0x000C 0000–0x000C 3FFF
Reserved
Reserved
0x000C 2AAA–0x000D FFFF
0x000C 4000–0x000D FFFF
Block 3 SRAM
Block 3 SRAM
0x000E 0000–0x000E 2AA9
0x000E 0000–0x000E 3FFF
Reserved
Reserved
0x000E 2AAA–0x000F FFFF
0x000E 4000–0x000F FFFF
Short Word (16 Bits)
Block 0 ROM (Reserved)
0x0010 0000–0x0011 FFFF
Reserved
0x0012 0000–0x0012 3FFF
Block 0 SRAM
0x0012 4000–0x0013 3FFF
Reserved
0x0013 4000–0x0013 FFFF
Block 1 ROM (Reserved)
0x0014 0000–0x0015 FFFF
Reserved
0x0016 0000–0x0016 3FFF
Block 1 SRAM
0x0016 4000–0x0017 3FFF
Reserved
0x0017 4000–0x0017 FFFF
Block 2 SRAM
0x0018 0000–0x0018 7FFF
Reserved
0x0018 8000–0x001B FFFF
Block 3 SRAM
0x001C 0000–0x001C 7FFF
Reserved
0x001C 8000–0x001F FFFF
Some processors include a customer-definable ROM block. ROM addresses on these models are not reserved as shown in this table. Please contact your Analog Devices sales
representative for additional details.
Rev. C |
Page 7 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
Table 5. ADSP-21479 Internal Memory Space (5M bits)1
IOP Registers 0x0000 0000–0x0003 FFFF
1
Long Word (64 Bits)
Extended Precision Normal or
Instruction Word (48 Bits)
Normal Word (32 Bits)
Short Word (16 Bits)
Block 0 ROM (Reserved)
0x0004 0000–0x0004 7FFF
Block 0 ROM (Reserved)
0x0008 0000–0x0008 AAA9
Block 0 ROM (Reserved)
0x0008 0000–0x0008 FFFF
Block 0 ROM (Reserved)
0x0010 0000–0x0011 FFFF
Reserved
0x0004 8000–0x0004 8FFF
Reserved
0x0008 AAAA–0x0008 BFFF
Reserved
0x0009 0000–0x0009 1FFF
Reserved
0x0012 0000–0x0012 3FFF
Block 0 SRAM
0x0004 9000–0x0004 EFFF
Block 0 SRAM
0x0008 C000–0x0009 3FFF
Block 0 SRAM
0x0009 2000–0x0009 DFFF
Block 0 SRAM
0x0012 4000–0x0013 BFFF
Reserved
0x0004 F000–0x0004 FFFF
Reserved
0x0009 4000–0x0009 FFFF
Reserved
0x0009 E000–0x0009 FFFF
Reserved
0x0013 C000–0x0013 FFFF
Block 1 ROM (Reserved)
0x0005 0000–0x0005 7FFF
Block 1 ROM (Reserved)
0x000A 0000–0x000A AAA9
Block 1 ROM (Reserved)
0x000A 0000–0x000AFFFF
Block 1 ROM (Reserved)
0x0014 0000–0x0015 FFFF
Reserved
0x0005 8000–0x0005 8FFF
Reserved
0x000A AAAA–0x000A BFFF
Reserved
0x000B 0000–0x000B 1FFF
Reserved
0x0016 0000–0x0016 3FFF
Block 1 SRAM
0x0005 9000–0x0005 EFFF
Block 1 SRAM
0x000A C000–0x000B 3FFF
Block 1 SRAM
0x000B 2000–0x000B DFFF
Block 1 SRAM
0x0016 4000–0x0017 BFFF
Reserved
0x0005 F000–0x0005 FFFF
Reserved
0x000B 4000–0x000B FFFF
Reserved
0x000B E000–0x000B FFFF
Reserved
0x0017 C000–0x0017 FFFF
Block 2 SRAM
0x0006 0000–0x0006 3FFF
Block 2 SRAM
0x000C 0000–0x000C 5554
Block 2 SRAM
0x000C 0000–0x000C 7FFF
Block 2 SRAM
0x0018 0000–0x0018 FFFF
Reserved
0x0006 4000– 0x0006 FFFF
Reserved
0x000C 5555–0x0000D FFFF
Reserved
0x000C 8000–0x000D FFFF
Reserved
0x0019 0000–0x001B FFFF
Block 3 SRAM
0x0007 0000–0x0007 3FFF
Block 3 SRAM
0x000E 0000–0x000E 5554
Block 3 SRAM
0x000E 0000–0x000E 7FFF
Block 3 SRAM
0x001C 0000–0x001C FFFF
Reserved
0x0007 4000–0x0007 FFFF
Reserved
0x000E 5555–0x0000F FFFF
Reserved
0x000E 8000–0x000F FFFF
Reserved
0x001D 0000–0x001F FFFF
Some processors include a customer-definable ROM block. ROM addresses on these models are not reserved as shown in this table. Please contact your Analog Devices sales
representative for additional details.
On-Chip Memory Bandwidth
Digital Transmission Content Protection
The internal memory architecture allows programs to have four
accesses at the same time to any of the four blocks (assuming
there are no block conflicts). The total bandwidth is realized
using the DMD and PMD buses (2 × 64-bit at CCLK speed) and
the IOD0/1 buses (2 × 32-bit at PCLK speed).
The DTCP specification defines a cryptographic protocol for
protecting audio entertainment content from illegal copying,
intercepting, and tampering as it traverses high performance
digital buses, such as the IEEE 1394 standard. Only legitimate
entertainment content delivered to a source device via another
approved copy protection system (such as the DVD content
scrambling system) is protected by this copy protection system.
For more information on this feature, contact your local ADI
sales office.
ROM Based Security
The processors have a ROM security feature that provides hardware support for securing user software code by preventing
unauthorized reading from the internal code. When using this
feature, the processors do not boot-load any external code, executing exclusively from internal ROM. Additionally, the
processor is not freely accessible via the JTAG port. Instead, a
unique 64-bit key, which must be scanned in through the JTAG
or Test Access Port, is assigned to each customer. The device
ignores an incorrect key. Emulation features are available after
the correct key is scanned.
Rev. C |
FAMILY PERIPHERAL ARCHITECTURE
The ADSP-2147x family contains a rich set of peripherals that
support a wide variety of applications including high quality
audio, medical imaging, communications, military, test equipment, 3D graphics, speech recognition, motor control, imaging,
and other applications.
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ADSP-21477/ADSP-21478/ADSP-21479
External Memory
The external memory interface supports access to the external
memory through core and DMA accesses. The external memory
address space is divided into four banks. Any bank can be programmed as either asynchronous or synchronous memory. The
external ports are comprised of the following modules.
• An AMI which communicates with SRAM, FLASH, and
other devices that meet the standard asynchronous SRAM
access protocol. The AMI supports 6M words of external
memory in Bank 0 and 8M words of external memory in
Bank 1, Bank 2, and Bank 3.
• An SDRAM controller that supports a glueless interface
with any of the standard SDRAMs. The SDC supports 62M
words of external memory in Bank 0, and 64M words of
external memory in Bank 1, Bank 2, and Bank 3.
• Arbitration logic to coordinate core and DMA transfers
between internal and external memory over the
external port.
External Port
The external port provides a high performance, glueless interface to a wide variety of industry-standard memory devices. The
external port, available on the 196-ball CSP_BGA, may be used
to interface to synchronous and/or asynchronous memory
devices through the use of its separate internal memory controllers. The first is an SDRAM controller for connection of
industry-standard synchronous DRAM devices while the second is an asynchronous memory controller intended to
interface to a variety of memory devices. Four memory select
pins enable up to four separate devices to coexist, supporting
any desired combination of synchronous and asynchronous
device types. Non-SDRAM external memory address space is
shown in Table 6.
Size in
Words
6M
8M
8M
8M
Address Range
0x0020 0000–0x007F FFFF
0x0400 0000–0x047F FFFF
0x0800 0000–0x087F FFFF
0x0C00 0000–0x0C7F FFFF
Access Type
Size in
Words
Address Range
ISA (NW)
4M
0x0020 0000–0x005F FFFF
VISA (SW)
10M
0x0060 0000–0x00FF FFFF
SDRAM Controller
The SDRAM controller, available on the ADSP-2147x in the
196-ball CSP_BGA package, provides an interface of up to four
separate banks of industry-standard SDRAM devices or
DIMMs, at speeds up to fSDCLK. Fully compliant with the
SDRAM standard, each bank has its own memory select line
(MS0–MS3), and can be configured to contain between
4 Mbytes and 256 Mbytes of memory. SDRAM external memory address space is shown in Table 8.
Table 8. External Memory for SDRAM Addresses
Bank
Size in
Words
Address Range
Bank 0
62M
0x0020 0000–0x03FF FFFF
Bank 1
64M
0x0400 0000–0x07FF FFFF
Bank 2
64M
0x0800 0000–0x0BFF FFFF
Bank 3
64M
0x0C00 0000–0x0FFF FFFF
The SDRAM controller address, data, clock, and control pins
can drive loads up to distributed 30 pF. For larger memory systems, the SDRAM controller external buffer timing should be
selected and external buffering should be provided so that the
load on the SDRAM controller pins does not exceed 30 pF.
SIMD Access to External Memory
The SDRAM controller supports SIMD access on the 64-bit
external port data bus (EPD) which allows access to the complementary registers on the PEy unit in the normal word space
(NW). This improves performance since there is no need to
explicitly load the complementary registers (as in SISD mode).
VISA and ISA Access to External Memory
The SDRAM controller supports VISA code operation which
reduces the memory load since the VISA instructions are compressed. Moreover, bus fetching is reduced because, in the best
case, one 48-bit fetch contains three valid instructions. Code
execution from the traditional ISA operation is also supported.
Rev. C |
Table 7. External Bank 0 Instruction Fetch
A set of programmable timing parameters is available to configure the SDRAM banks to support slower memory devices. The
SDRAM and the AMI interface do not support 32-bit wide
devices.
Table 6. External Memory for Non-SDRAM Addresses
Bank
Bank 0
Bank 1
Bank 2
Bank 3
Note that code execution is only supported from Bank 0 regardless of VISA/ISA. Table 7 shows the address ranges for
instruction fetch in each mode.
Note that the external memory bank addresses shown are for
normal-word (32-bit) accesses. If 48-bit instructions as well as
32-bit data are both placed in the same external memory bank,
care must be taken while mapping them to avoid overlap.
Asynchronous Memory Controller
The asynchronous memory controller, available on the
ADSP-2147x in the 196-ball CSP_BGA package, provides a configurable interface for up to four separate banks of memory or
I/O devices. Each bank can be independently programmed with
different timing parameters, enabling connection to a wide variety of memory devices including SRAM, flash, and EPROM, as
well as I/O devices that interface with standard memory control
lines. Bank 0 occupies a 6M word window and Banks 1, 2, and 3
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ADSP-21477/ADSP-21478/ADSP-21479
occupy a 8M word window in the processor’s address space but,
if not fully populated, these windows are not made contiguous
by the memory controller logic.
Serial ports operate in five modes:
• Standard serial mode
• Multichannel (TDM) mode
External Port Throughput
• I2S mode
The throughput for the external port, based on 133 MHz clock
and 16-bit data bus, is 88 Mbytes/sec for the AMI and
266 Mbytes/sec for SDRAM.
• Packed I2S mode
• Left-justified mode
MediaLB
S/PDIF-Compatible Digital Audio Receiver/Transmitter
The automotive models of the processors have an MLB interface
which allows the processor to function as a media local bus
device. It includes support for both 3-pin and 5-pin MLB protocols. It supports speeds up to 1024 FS (49.25M bits/sec,
FS = 48.1 kHz) and up to 31 logical channels, with up to
124 bytes of data per media local bus frame. For a list of automotive products, see Automotive Products on Page 75.
The S/PDIF receiver/transmitter has no separate DMA channels. It receives audio data in serial format and converts it into a
bi phase encoded signal. The serial data input to the
receiver/transmitter can be formatted as left justified, I2S or
right-justified with word widths of 16, 18, 20, or 24 bits.
Digital Applications Interface (DAI)
The digital applications interface (DAI) provides the ability to
connect various peripherals to any of the DAI pins
(DAI_P20–1).
Programs make these connections using the signal routing unit
(SRU), shown in Figure 1.
The SRU is a matrix routing unit (or group of multiplexers) that
enables the peripherals provided by the DAI to be interconnected under software control. This allows easy use of the DAI
associated peripherals for a much wider variety of applications
by using a larger set of algorithms than is possible with non configurable signal paths.
The associated peripherals include eight serial ports, four precision clock generators (PCG), a S/PDIF transceiver, four ASRCs,
and an input data port (IDP). The IDP provides an additional
input path to the SHARC core, configurable as either eight
channels of serial data, or a single 20-bit wide synchronous parallel data acquisition port. Each data channel has its own DMA
channel that is independent from the processor’s serial ports.
Serial Ports (SPORTs)
The processors feature eight synchronous serial ports that provide an inexpensive interface to a wide variety of digital and
mixed-signal peripheral devices such as Analog Devices’
AD183x family of audio codecs, ADCs, and DACs. The serial
ports are made up of two data lines, a clock, and frame sync. The
data lines can be programmed to either transmit or receive and
each data line has a dedicated DMA channel.
Serial ports can support up to 16 transmit or 16 receive DMA
channels of audio data when all eight SPORTs are enabled, or
four full duplex TDM streams of 128 channels per frame.
Asynchronous Sample Rate Converter (SRC)
The sample rate converter contains four blocks and is the same
core as that used in the AD1896 192 kHz stereo asynchronous
sample rate converter. The SRC block provides up to 128 dB
SNR and is used to perform synchronous or asynchronous sample rate conversion across independent stereo channels, without
using internal processor resources. The four SRC blocks can
also be configured to operate together to convert multichannel
audio data without phase mismatches. Finally, the SRC can be
used to clean up audio data from jittery clock sources such as
the S/PDIF receiver.
Input Data Port
The IDP provides up to eight serial input channels—each with
its own clock, frame sync, and data inputs. The eight channels
are automatically multiplexed into a single 32-bit by eight-deep
FIFO. Data is always formatted as a 64-bit frame and divided
into two 32-bit words. The serial protocol is designed to receive
audio channels in I2S, left-justified sample pair, or right-justified
mode.
The IDP also provides a parallel data acquisition port (PDAP)
which can be used for receiving parallel data. The PDAP port
has a clock input and a hold input. The data for the PDAP can
be received from DAI pins or from the external port pins. The
PDAP supports a maximum of 20-bit data and four different
packing modes to receive the incoming data.
Precision Clock Generators
Serial port data can be automatically transferred to and from
on-chip memory/external memory via dedicated DMA channels. Each of the serial ports can work in conjunction with
another serial port to provide TDM support. One SPORT provides two transmit signals while the other SPORT provides the
two receive signals. The frame sync and clock are shared.
Rev. C |
The serial data, clock, and frame sync inputs to the S/PDIF
receiver/transmitter are routed through the signal routing unit
(SRU). They can come from a variety of sources, such as the
SPORTs, external pins, the precision clock generators (PCGs),
and are controlled by the SRU control registers.
The precision clock generators (PCG) consist of four units, each
of which generates a pair of signals (clock and frame sync)
derived from a clock input signal. The units, A B, C, and D are
identical in functionality and operate independently of each
other. The two signals generated by each unit are normally used
as a serial bit clock/frame sync pair.
The outputs of PCG A and B can be routed through the DAI
pins and the outputs of PCG C and D can be driven on to the
DAI as well as the DPI pins.
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ADSP-21477/ADSP-21478/ADSP-21479
Digital Peripheral Interface (DPI)
Pulse-Width Modulation
The digital peripheral interface provides connections to two
serial peripheral interface ports (SPI), one universal asynchronous receiver-transmitter (UART), 12 flags, a 2-wire interface
(TWI), three PWM modules (PWM3–1), and two generalpurpose timers.
The PWM module is a flexible, programmable, PWM waveform
generator that can be programmed to generate the required
switching patterns for various applications related to motor and
engine control or audio power control. The PWM generator can
generate either center-aligned or edge-aligned PWM waveforms. In addition, it can generate complementary signals on
two outputs in paired mode or independent signals in nonpaired mode (applicable to a single group of four PWM
waveforms).
Serial Peripheral (Compatible) Interface (SPI)
The SPI is an industry-standard synchronous serial link,
enabling the SPI-compatible port to communicate with other
SPI compatible devices. The SPI consists of two data pins, one
device select pin, and one clock pin. It is a full-duplex synchronous serial interface, supporting both master and slave modes.
The SPI port can operate in a multi-master environment by
interfacing with up to four other SPI-compatible devices, either
acting as a master or slave device. The SPI-compatible peripheral implementation also features programmable baud rate and
clock phase and polarities. The SPI-compatible port uses open
drain drivers to support a multi-master configuration and to
avoid data contention.
UART Port
The processors provide a full-duplex Universal Asynchronous
Receiver/Transmitter (UART) port, which is fully compatible
with PC-standard UARTs. The UART port provides a simplified UART interface to other peripherals or hosts, supporting
full-duplex, DMA-supported, asynchronous transfers of serial
data. The UART also has multiprocessor communication capability using 9-bit address detection. This allows it to be used in
multidrop networks through the RS-485 data interface
standard. The UART port also includes support for 5 to 8 data
bits, 1 or 2 stop bits, and none, even, or odd parity. The UART
port supports two modes of operation:
The entire PWM module has four groups of four PWM outputs
generating 16 PWM outputs in total. Each PWM group produces two pairs of PWM signals on the four PWM outputs.
The PWM generator is capable of operating in two distinct
modes while generating center-aligned PWM waveforms: single
update mode or double update mode. In single update mode the
duty cycle values are programmable only once per PWM period.
This results in PWM patterns that are symmetrical about the
midpoint of the PWM period. In double update mode, a second
updating of the PWM registers is implemented at the midpoint
of the PWM period. In this mode, it is possible to produce
asymmetrical PWM patterns that produce lower harmonic distortion in three-phase PWM inverters.
PWM signals can be mapped to the external port address lines
or to the DPI pins.
Timers
The processors have a total of three timers: a core timer that can
generate periodic software interrupts and two general-purpose
timers that can generate periodic interrupts and be independently set to operate in one of three modes:
• Pulse waveform generation mode
• PIO (programmed I/O) – The processor sends or receives
data by writing or reading I/O-mapped UART registers.
The data is double-buffered on both transmit and receive.
• DMA (direct memory access) – The DMA controller transfers both transmit and receive data. This reduces the
number and frequency of interrupts required to transfer
data to and from memory. The UART has two dedicated
DMA channels, one for transmit and one for receive. These
DMA channels have lower default priority than most DMA
channels because of their relatively low service rates.
The UART port's baud rate, serial data format, error code generation and status, and interrupts are programmable:
• Support for bit rates ranging from (fPCLK/1,048,576) to
(fPCLK/16) bits per second.
• Pulse width count/capture mode
• External event watch dog mode
The core timer can be configured to use FLAG3 as a timer
expired signal, and the general-purpose timers have one bidirectional pin and four registers that implement its mode of
operation: a 6-bit configuration register, a 32-bit count register,
a 32-bit period register, and a 32-bit pulse width register. A single control and status register enables or disables the generalpurpose timer.
2-Wire Interface Port (TWI)
The TWI is a bidirectional 2-wire serial bus used to move 8-bit
data while maintaining compliance with the I2C bus protocol.
The TWI master incorporates the following features:
• Support for data formats from 7 to 12 bits per frame.
• 7-bit addressing
• Both transmit and receive operations can be configured to
generate maskable interrupts to the processor.
• Simultaneous master and slave operation on multiple
device systems with support for multi-master data
arbitration
In conjunction with the general-purpose timer functions, autobaud detection is supported.
• Digital filtering and timed event processing
• 100 kbps and 400 kbps data rates
• Low interrupt rate
Rev. C |
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ADSP-21477/ADSP-21478/ADSP-21479
Shift Register
Table 9. DMA Channels (Continued)
The shift register can be used as a serial to parallel data converter. The shift register module consists of an 18-stage serial
shift register, 18-bit latch, and three-state output buffers. The
shift register and latch have separate clocks. Data is shifted into
the serial shift register on the positive-going transitions of the
shift register serial clock (SR_SCLK) input. The data in each
flip-flop is transferred to the respective latch on a positive-going
transition of the shift register latch clock (SR_LAT) input.
The shift register’s signals can be configured as follows.
• The SR_LAT can come from any of SPORT0–7 frame sync
outputs, PCGA/B frame sync, any of the DAI pins (1–8),
and one dedicated pin (SR_LAT).
• The SR_SDI input can from any of SPORT0–7 serial data
outputs, any of the DAI pins (1–8), and one dedicated pin
(SR_SDI).
Scatter/Gather DMA
The processor provides scatter/gather DMA functionality. This
allows processor DMA reads/writes to/from noncontiguous
memory blocks.
FIR Accelerator
The FIR (finite impulse response) accelerator consists of a 1024
word coefficient memory, a 1024 word deep delay line for the
data, and four MAC units. A controller manages the accelerator.
The FIR accelerator runs at the peripheral clock frequency.
I/O PROCESSOR FEATURES
The I/O processor provides up to 65 channels of DMA as well as
an extensive set of peripherals.
DMA Controller
The DMA controller operates independently and invisibly to
the processor core, allowing DMA operations to occur while the
core is simultaneously executing its program instructions. DMA
transfers can occur between the processor’s internal memory
and its serial ports, the SPI-compatible (serial peripheral interface) ports, the IDP (input data port), the parallel data
acquisition port (PDAP) or the UART.
Up to 65 channels of DMA are available on the processors as
shown in Table 9.
Programs can be downloaded using DMA transfers. Other
DMA features include interrupt generation upon completion of
DMA transfers, and DMA chaining for automatic linked DMA
transfers.
Rev. C |
The processor provides delay line DMA functionality. This
allows processor reads and writes to external delay line buffers
(and therefore to external memory) with limited core
interaction.
The FFT accelerator implements radix-2 complex/real input,
complex output FFTs with no core intervention. The FFT accelerator runs at the peripheral clock frequency.
If SR_SCLK comes from PCGA/B, then SPORT0–7 generates
the SR_LAT and SR_SDI signals. If SR_SCLK and SR_LAT
come from PCGA/B, then SPORT0–7 generates the
SR_SDI signal.
DMA Channels
16
8
2
2
Automotive models only.
FFT Accelerator
Note that the SR_SCLK, SR_LAT, and SR_SDI inputs must
come from same source except in the case of where SR_SCLK
comes from PCGA/B or SR_SCLK and SR_LAT come from
PCGA/B.
Peripheral
SPORTs
PDAP
SPI
UART
1
DMA Channels
2
2
2
31
Delay Line DMA
• The SR_SCLK can come from any of the SPORT0–7 SCLK
outputs, PCGA/B clock, any of the DAI pins (1–8), and one
dedicated pin (SR_SCLK).
Table 9. DMA Channels
Peripheral
External Port
Accelerators
Memory-to-Memory
MediaLB1
IIR Accelerator
The IIR (infinite impulse response) accelerator consists of a
1440 word coefficient memory for storage of biquad coefficients, a data memory for storing the intermediate data and one
MAC unit. A controller manages the accelerator. The IIR accelerator runs at the peripheral clock frequency.
Watchdog Timer (WDT)
The processors include a 32-bit watchdog timer that can be used
to implement a software watchdog function. A software watchdog can improve system reliability by forcing the processor to a
known state through generation of a system reset if the timer
expires before being reloaded by software. Software initializes
the count value of the timer, and then enables the timer.
The WDT is used to supervise the stability of the system software. When used in this way, software reloads the WDT in a
regular manner so that the downward counting timer never
expires. An expiring timer then indicates that system software
might be out of control.
The WDT resets both the core and the internal peripherals.
Software must be able to determine if the watch dog was the
source of the hardware reset by interrogating a status bit in the
watch dog timer control register.
Page 12 of 76 |
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ADSP-21477/ADSP-21478/ADSP-21479
The watch dog timer also has an internal RC oscillator that can
be used as the clock source. The internal RC oscillator can be
used as an optional alternative to using an external clock applied
to the WDT_CLIN pin.
Table 10. Boot Mode Selection
BOOT_CFG2–01
000
001
010
011
Real-Time Clock
The real-time clock (RTC) provides a robust set of digital watch
features, including current time, stopwatch, and alarm. The
RTC is clocked by a 32.768 kHz crystal external to the SHARC
processor. Connect RTC pins RTXI and RTXO with external
components as shown in Figure 3.
The RTC peripheral has dedicated power supply pins so that it
can remain powered up and clocked even when the rest of the
processor is in a low power state. The RTC provides several programmable interrupt options, including interrupt per second,
minute, hour, or day clock ticks, interrupt on programmable
stopwatch countdown, or interrupt at a programmed alarm
time. An RTCLKOUT signal that operates at 1 Hz is also provided for calibration.
100
1xx
1
Booting Mode
SPI Slave Boot
SPI Master Boot (from Flash and Other Slaves)
AMI User Boot (for 8-bit Flash Boot)
No Boot (Processor Executes from Internal
ROM After Reset)
Reserved
Reserved
The BOOT_CFG2 pin is not available on the 100-lead or 88-lead packages.
A running reset feature is used to reset the processor core and
peripherals without resetting the PLL and SDRAM controller,
or performing a boot. The functionality of the RESETOUT
/RUNRSTIN pin has now been extended to also act as the input
for initiating a running reset. For more information, see the
ADSP-214xx SHARC Processor Hardware Reference.
Power Supplies
RTXI
The processors have separate power supply connections for the
internal (VDD_INT) and external (VDD_EXT) power supplies. The
internal and analog supplies must meet the VDD_INT specifications. The external supply must meet the VDD_EXT specification.
All external supply pins must be connected to the same power
supply.
RTXO
R1
X1
C1
C2
To reduce noise coupling, the PCB should use a parallel pair of
power and ground planes for VDD_INT and GND.
NOTE: C1 AND C2 ARE SPECIFIC TO CRYSTAL SPECIFIED FOR X1.
CONTACT CRYSTAL MANUFACTURER FOR DETAILS. C1 AND C2
SPECIFICATIONS ASSUME BOARD TRACE CAPACITANCE OF 3 pF.
Target Board JTAG Emulator Connector
Figure 3. External Components for RTC
The 32.768 kHz input clock frequency is divided down to a 1 Hz
signal by a prescaler. The counter function of the timer consists
of four counters: a 60-second counter, a 60-minute counter, a
24-hour counter, and a 32,768-day counter. When the alarm
interrupt is enabled, the alarm function generates an interrupt
when the output of the timer matches the programmed value in
the alarm control register. There are two alarms: The first alarm
is for a time of day. The second alarm is for a day and time of
that day.
The stopwatch function counts down from a programmed
value, with one-second resolution. When the stopwatch interrupt is enabled and the counter underflows, an interrupt is
generated.
SYSTEM DESIGN
Analog Devices DSP Tools product line of JTAG emulators uses
the IEEE 1149.1 JTAG test access port of the processors to monitor and control the target board processor during emulation.
Analog Devices DSP Tools product line of JTAG emulators provides emulation at full processor speed, allowing inspection and
modification of memory, registers, and processor stacks. The
processor's JTAG interface ensures that the emulator will not
affect target system loading or timing.
For complete information on Analog Devices’ SHARC DSP
Tools product line of JTAG emulator operation, see the appropriate emulator hardware user’s guide.
DEVELOPMENT TOOLS
Analog Devices supports its processors with a complete line of
software and hardware development tools, including integrated
development environments (which include CrossCore® Embedded Studio and/or VisualDSP++®), evaluation products,
emulators, and a wide variety of software add-ins.
The following sections provide an introduction to system design
options and power supply issues.
Integrated Development Environments (IDEs)
Program Booting
For C/C++ software writing and editing, code generation, and
debug support, Analog Devices offers two IDEs.
The internal memory boots at system power-up from an 8-bit
EPROM via the external port, an SPI master, or an SPI slave.
Booting is determined by the boot configuration
(BOOT_CFG2–0) pins in Table 10.
The newest IDE, CrossCore Embedded Studio, is based on the
EclipseTM framework. Supporting most Analog Devices processor families, it is the IDE of choice for future processors,
including multicore devices. CrossCore Embedded Studio
Rev. C |
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ADSP-21477/ADSP-21478/ADSP-21479
seamlessly integrates available software add-ins to support real
time operating systems, file systems, TCP/IP stacks, USB stacks,
algorithmic software modules, and evaluation hardware board
support packages. For more information visit
www.analog.com/cces.
located on the web page for the associated EZ-KIT or EZExtender product. The link is found in the Product Download
area of the product web page.
The other Analog Devices IDE, VisualDSP++, supports processor families introduced prior to the release of CrossCore
Embedded Studio. This IDE includes the Analog Devices VDK
real time operating system and an open source TCP/IP stack.
For more information visit www.analog.com/visualdsp. Note
that VisualDSP++ will not support future Analog Devices
processors.
Analog Devices separately offers middleware add-ins such as
real time operating systems, file systems, USB stacks, and
TCP/IP stacks. For more information see the following web
pages:
Middleware Packages
• www.analog.com/ucos3
• www.analog.com/ucfs
• www.analog.com/ucusbd
EZ-KIT Lite Evaluation Board
• www.analog.com/lwip
For processor evaluation, Analog Devices provides wide range
of EZ-KIT Lite® evaluation boards. Including the processor and
key peripherals, the evaluation board also supports on-chip
emulation capabilities and other evaluation and development
features. Also available are various EZ-Extenders®, which are
daughter cards delivering additional specialized functionality,
including audio and video processing. For more information
visit www.analog.com and search on “ezkit” or “ezextender”.
Algorithmic Modules
To speed development, Analog Devices offers add-ins that perform popular audio and video processing algorithms. These are
available for use with both CrossCore Embedded Studio and
VisualDSP++. For more information visit www.analog.com
and search on “Blackfin software modules” or “SHARC software
modules”.
EZ-KIT Lite Evaluation Kits
Designing an Emulator-Compatible DSP Board (Target)
For a cost-effective way to learn more about developing with
Analog Devices processors, Analog Devices offer a range of EZKIT Lite evaluation kits. Each evaluation kit includes an EZ-KIT
Lite evaluation board, directions for downloading an evaluation
version of the available IDE(s), a USB cable, and a power supply.
The USB controller on the EZ-KIT Lite board connects to the
USB port of the user’s PC, enabling the chosen IDE evaluation
suite to emulate the on-board processor in-circuit. This permits
the customer to download, execute, and debug programs for the
EZ-KIT Lite system. It also supports in-circuit programming of
the on-board Flash device to store user-specific boot code,
enabling standalone operation. With the full version of CrossCore Embedded Studio or VisualDSP++ installed (sold
separately), engineers can develop software for supported EZKITs or any custom system utilizing supported Analog Devices
processors.
For embedded system test and debug, Analog Devices provides
a family of emulators. On each JTAG DSP, Analog Devices supplies an IEEE 1149.1 JTAG Test Access Port (TAP). In-circuit
emulation is facilitated by use of this JTAG interface. The emulator accesses the processor’s internal features via the
processor’s TAP, allowing the developer to load code, set breakpoints, and view variables, memory, and registers. The
processor must be halted to send data and commands, but once
an operation is completed by the emulator, the DSP system is set
to run at full speed with no impact on system timing. The emulators require the target board to include a header that supports
connection of the DSP’s JTAG port to the emulator.
Software Add-Ins for CrossCore Embedded Studio
Analog Devices offers software add-ins which seamlessly integrate with CrossCore Embedded Studio to extend its capabilities
and reduce development time. Add-ins include board support
packages for evaluation hardware, various middleware packages, and algorithmic modules. Documentation, help,
configuration dialogs, and coding examples present in these
add-ins are viewable through the CrossCore Embedded Studio
IDE once the add-in is installed.
For details on target board design issues including mechanical
layout, single processor connections, signal buffering, signal termination, and emulator pod logic, see the EE-68: Analog Devices
JTAG Emulation Technical Reference on the Analog Devices
website (www.analog.com)—use site search on “EE-68.” This
document is updated regularly to keep pace with improvements
to emulator support.
Board Support Packages for Evaluation Hardware
Software support for the EZ-KIT Lite evaluation boards and EZExtender daughter cards is provided by software add-ins called
Board Support Packages (BSPs). The BSPs contain the required
drivers, pertinent release notes, and select example code for the
given evaluation hardware. A download link for a specific BSP is
Rev. C |
Page 14 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
ADDITIONAL INFORMATION
This data sheet provides a general overview of the ADSP-2147x
architecture and functionality. For detailed information on the
family core architecture and instruction set, refer to the SHARC
Processor Programming Reference.
RELATED SIGNAL CHAINS
A signal chain is a series of signal conditioning electronic components that receive input (data acquired from sampling either
real-time phenomena or from stored data) in tandem, with the
output of one portion of the chain supplying input to the next.
Signal chains are often used in signal processing applications to
gather and process data or to apply system controls based on
analysis of real-time phenomena. For more information about
this term and related topics, see the “signal chain” entry in the
Glossary of EE Terms on the Analog Devices website.
Analog Devices eases signal processing system development by
providing signal processing components that are designed to
work together well. A tool for viewing relationships between
specific applications and related components is available on the
www.analog.com website.
The Circuits from the LabTM site (www.analog.com/signal
chains) provides:
• Graphical circuit block diagram presentation of signal
chains for a variety of circuit types and applications
• Drill down links for components in each chain to selection
guides and application information
• Reference designs applying best practice design techniques
Rev. C |
Page 15 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
PIN FUNCTION DESCRIPTIONS
Table 11. Pin Descriptions
State During/
After Reset
Name
Type
Description
ADDR23–0
I/O/T (ipu)
High-Z/driven
low (boot)
External Address. The processor outputs addresses for external memory and
peripherals on these pins. The ADDR pins can be multiplexed to support the
external memory interface address, FLAGS15–8 (I/O) and PWM (O). After reset, all
ADDR pins are in EMIF mode, and FLAG(0–3) pins are in FLAGS mode (default).
When configured in the IDP_PDAP_CTL register, IDP channel 0 scans the ADDR23–4
pins for parallel input data.
DATA15–0
I/O/T (ipu)
High-Z
External Data. The data pins can be multiplexed to support the external memory
interface data (I/O) and FLAGS7–0 (I/O).
AMI_ACK
I (ipu)
MS0–1
O/T (ipu)
High-Z
Memory Select Lines 0–1. These lines are asserted (low) as chip selects for the
corresponding banks of external memory. The MS1-0 lines are decoded memory
address lines that change at the same time as the other address lines. When no
external memory access is occurring the MS1-0 lines are inactive; they are active
however when a conditional memory access instruction is executed, when the
condition evaluates as true.
The MS1 pin can be used in EPORT/FLASH boot mode. For more information on
processor booting, see the ADSP-214xx SHARC Processor Hardware Reference.
AMI_RD
O/T (ipu)
High-Z
AMI Port Read Enable. AMI_RD is asserted whenever the processor reads a word
from external memory.
AMI_WR
O/T (ipu)
High-Z
AMI Port Write Enable. AMI_WR is asserted when the processor writes a word to
external memory.
FLAG0/IRQ0
I/O (ipu)
FLAG[0] INPUT
FLAG0/Interrupt Request0.
FLAG1/IRQ1
I/O (ipu)
FLAG[1] INPUT
FLAG1/Interrupt Request1.
FLAG2/IRQ2/MS2
I/O (ipu)
FLAG[2] INPUT
FLAG2/Interrupt Request2/Memory Select2. This pin is multiplexed with MS2
in the 196-ball BGA package only.
FLAG3/TMREXP/MS3
I/O (ipu)
FLAG[3] INPUT
FLAG3/Timer Expired/Memory Select3. This pin is multiplexed with MS3 in the
196-ball BGA package only.
Memory Acknowledge. External devices can deassert AMI_ACK (low) to add wait
states to an external memory access. AMI_ACK is used by I/O devices, memory
controllers, or other peripherals to hold off completion of an external memory
access.
The following symbols appear in the Type column of Table 11: A = asynchronous, I = input, O = output, S = synchronous, A/D = active drive,
O/D = open drain, and T = three-state, ipd = internal pull-down resistor, ipu = internal pull-up resistor.
The internal pull-up (ipu) and internal pull-down (ipd) resistors are designed to hold the internal path from the pins at the expected logic
levels. To pull-up or pull-down the external pads to the expected logic levels, use external resistors. Internal pull-up/pull-down resistors
cannot be enabled/disabled and the value of these resistors cannot be programmed. The range of an ipu resistor can be 26 kΩ to 63 kΩ. The
range of an ipd resistor can be 31 kΩ to 85 kΩ. The three-state voltage of ipu pads will not reach to full the VDD_EXT level; at typical conditions
the voltage is in the range of 2.3 V to 2.7 V.
In this table, all pins are LVTTL compliant with the exception of the thermal diode, shift register, and real-time clock (RTC) pins.
Not all pins are available in the 88-lead LFCSP_VQ and 100-lead LQFP package. For more information, see Table 2 on Page 3 and Table 62 on
Page 70.
Rev. C |
Page 16 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
Table 11. Pin Descriptions (Continued)
State During/
After Reset
Description
O/T (ipu)
High-Z/
driven high
SDRAM Row Address Strobe. Connect to SDRAM’s RAS pin. In conjunction with
other SDRAM command pins, defines the operation for the SDRAM to perform.
SDCAS
O/T (ipu)
High-Z/
driven high
SDRAM Column Address Select. Connect to SDRAM’s CAS pin. In conjunction
with other SDRAM command pins, defines the operation for the SDRAM to
perform.
SDWE
O/T (ipu)
High-Z/
driven high
SDRAM Write Enable. Connect to SDRAM’s WE or W buffer pin.
SDCKE
O/T (ipu)
High-Z/
driven high
SDRAM Clock Enable. Connect to SDRAM’s CKE pin. Enables and disables the CLK
signal. For details, see the data sheet supplied with the SDRAM device.
SDA10
O/T (ipu)
High-Z/
driven high
SDRAM A10 Pin. Enables applications to refresh an SDRAM in parallel with nonSDRAM accesses. This pin replaces the DSP’s ADDR10 pin only during SDRAM
accesses.
SDDQM
O/T (ipu)
High-Z/
driven high
DQM Data Mask. SDRAM input mask signal for write accesses and output enable
signal for read accesses. Input data is masked when DQM is sampled high during
a write cycle. The SDRAM output buffers are placed in a High-Z state when DQM
is sampled high during a read cycle. SDDQM is driven high from reset de-assertion
until SDRAM initialization completes. Afterwards, it is driven low irrespective of
whether any SDRAM accesses occur or not.
SDCLK
O/T (ipd)
High-Z/
driving
SDRAM Clock Output. Clock driver for this pin differs from all other clock drivers.
See Figure 47 on Page 65. For models in the 100-lead package, the SDRAM
interface should be disabled to avoid unnecessary power switching by setting the
DSDCTL bit in SDCTL register. For more information, see the ADSP-214xx SHARC
Processor Hardware Reference.
DAI _P20–1
I/O/T (ipu)
High-Z
Digital Applications Interface. These pins provide the physical interface to the
DAI SRU. The DAI SRU configuration registers define the combination of on-chip
audio-centric peripheral inputs or outputs connected to the pin and to the pin’s
output enable. The configuration registers of these peripherals then determines
the exact behavior of the pin. Any input or output signal present in the DAI SRU
may be routed to any of these pins.
DPI _P14–1
I/O/T (ipu)
High-Z
Digital Peripheral Interface. These pins provide the physical interface to the DPI
SRU. The DPI SRU configuration registers define the combination of on-chip
peripheral inputs or outputs connected to the pin and to the pin's output enable.
The configuration registers of these peripherals then determine the exact
behavior of the pin. Any input or output signal present in the DPI SRU may be
routed to any of these pins.
Name
Type
SDRAS
WDT_CLKIN
I
Watch Dog Timer Clock Input. This pin should be pulled low when not used.
WDT_CLKO
O
Watch Dog Resonator Pad Output.
WDTRSTO
O (ipu)
Watch Dog Timer Reset Out.
The following symbols appear in the Type column of Table 11: A = asynchronous, I = input, O = output, S = synchronous, A/D = active drive,
O/D = open drain, and T = three-state, ipd = internal pull-down resistor, ipu = internal pull-up resistor.
The internal pull-up (ipu) and internal pull-down (ipd) resistors are designed to hold the internal path from the pins at the expected logic
levels. To pull-up or pull-down the external pads to the expected logic levels, use external resistors. Internal pull-up/pull-down resistors
cannot be enabled/disabled and the value of these resistors cannot be programmed. The range of an ipu resistor can be 26 kΩ to 63 kΩ. The
range of an ipd resistor can be 31 kΩ to 85 kΩ. The three-state voltage of ipu pads will not reach to full the VDD_EXT level; at typical conditions
the voltage is in the range of 2.3 V to 2.7 V.
In this table, all pins are LVTTL compliant with the exception of the thermal diode, shift register, and real-time clock (RTC) pins.
Not all pins are available in the 88-lead LFCSP_VQ and 100-lead LQFP package. For more information, see Table 2 on Page 3 and Table 62 on
Page 70.
Rev. C |
Page 17 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
Table 11. Pin Descriptions (Continued)
Name
Type
THD_P
I
State During/
After Reset
Description
Thermal Diode Anode. When not used, this pin can be left floating.
THD_M
O
Thermal Diode Cathode. When not used, this pin can be left floating.
MLBCLK
I
Media Local Bus Clock. This clock is generated by the MLB controller that is
synchronized to the MOST network and provides the timing for the entire MLB
interface at 49.152 MHz at FS = 48 kHz. When the MLB controller is not used, this
pin should be grounded.
MLBDAT
I/O/T in 3 pin
mode.
I in 5 pin mode.
High-Z
Media Local Bus Data. The MLBDAT line is driven by the transmitting MLB device
and is received by all other MLB devices including the MLB controller. The
MLBDAT line carries the actual data. In 5-pin MLB mode, this pin is an input only.
When the MLB controller is not used, this pin should be grounded.
MLBSIG
I/O/T in 3 pin
mode.
I in 5 pin mode
High-Z
Media Local Bus Signal. This is a multiplexed signal which carries the
Channel/Address generated by the MLB Controller, as well as the Command and
RxStatus bytes from MLB devices. In 5-pin mode, this pin is input only. When the
MLB controller is not used, this pin should be grounded.
MLBDO
O/T
High-Z
Media Local Bus Data Output (in 5 Pin Mode). This pin is used only in 5-pin MLB
mode and serves as the output data pin. When the MLB controller is not used, this
pin should be grounded.
MLBSO
O/T
High-Z
Media Local Bus Signal Output (in 5 Pin Mode). This pin is used only in 5-pin
MLB mode and serves as the output signal pin. When the MLB controller is not
used, this pin should be grounded.
SR_SCLK
I (ipu)
Shift Register Serial Clock. (Active high, rising edge sensitive)
SR_CLR
I (ipu)
Shift Register Reset. (Active low)
SR_SDI
I (ipu)
Shift Register Serial Data Input.
SR_SDO
O (ipu)
SR_LAT
I (ipu)
SR_LDO17–0
O/T (ipu)
RTXI
I
RTC Crystal Input. If RTC is not used, then this pin needs to be NC (no connect)
and the RTC_PDN and RTC_BUSDIS bits of RTC_INIT register must be set to 1.
RTXO
O
RTC Crystal Output. If RTC is not used, then this pin needs to be NC (No Connect).
RTCLKOUT
O (ipd)
RTC Clock Output. For calibration purposes. The clock runs at 1 Hz. If RTC is not
used, then this pin needs to be NC (No Connect).
Driven Low
Shift Register Serial Data Output.
Shift Register Latch Clock Input. (Active high, rising edge sensitive)
High-Z
Shift Register Parallel Data Output.
The following symbols appear in the Type column of Table 11: A = asynchronous, I = input, O = output, S = synchronous, A/D = active drive,
O/D = open drain, and T = three-state, ipd = internal pull-down resistor, ipu = internal pull-up resistor.
The internal pull-up (ipu) and internal pull-down (ipd) resistors are designed to hold the internal path from the pins at the expected logic
levels. To pull-up or pull-down the external pads to the expected logic levels, use external resistors. Internal pull-up/pull-down resistors
cannot be enabled/disabled and the value of these resistors cannot be programmed. The range of an ipu resistor can be 26 kΩ to 63 kΩ. The
range of an ipd resistor can be 31 kΩ to 85 kΩ. The three-state voltage of ipu pads will not reach to full the VDD_EXT level; at typical conditions
the voltage is in the range of 2.3 V to 2.7 V.
In this table, all pins are LVTTL compliant with the exception of the thermal diode, shift register, and real-time clock (RTC) pins.
Not all pins are available in the 88-lead LFCSP_VQ and 100-lead LQFP package. For more information, see Table 2 on Page 3 and Table 62 on
Page 70.
Rev. C |
Page 18 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
Table 11. Pin Descriptions (Continued)
Name
Type
TDI
I (ipu)
State During/
After Reset
Description
Test Data Input (JTAG). Provides serial data for the boundary scan logic.
High-Z
Test Data Output (JTAG). Serial scan output of the boundary scan path.
TDO
O/T
TMS
I (ipu)
Test Mode Select (JTAG). Used to control the test state machine.
TCK
I
Test Clock (JTAG). Provides a clock for JTAG boundary scan. TCK must be asserted
(pulsed low) after power-up or held low for proper operation of the device.
TRST
I (ipu)
Test Reset (JTAG). Resets the test state machine. TRST must be asserted (pulsed
low) after power-up or held low for proper operation of the processor.
EMU
O (O/D, ipu)
CLK_CFG1–0
I
Core to CLKIN Ratio Control. These pins set the startup clock frequency.
Note that the operating frequency can be changed by programming the PLL
multiplier and divider in the PMCTL register at any time after the core comes out
of reset. The allowed values are:
00 = 8:1
01 = 32:1
10 = 16:1
11 = reserved
CLKIN
I
Local Clock In. Used in conjunction with XTAL. CLKIN is the clock input. It
configures the processors to use either its internal clock generator or an external
clock source. Connecting the necessary components to CLKIN and XTAL enables
the internal clock generator. Connecting the external clock to CLKIN while leaving
XTAL unconnected configures the processors to use the external clock source
such as an external clock oscillator. CLKIN may not be halted, changed, or
operated below the specified frequency.
XTAL
O
Crystal Oscillator Terminal. Used in conjunction with CLKIN to drive an external
crystal.
RESET
I
Processor Reset. Resets the processor to a known state. Upon deassertion, there
is a 4096 CLKIN cycle latency for the PLL to lock. After this time, the core begins
program execution from the hardware reset vector address. The RESET input must
be asserted (low) at power-up.
High-Z
Emulation Status. Must be connected to the Analog Devices DSP Tools product
line of JTAG emulators target board connector only.
RESETOUT/RUNRSTIN I/O (ipu)
Reset Out/Running Reset In. The default setting on this pin is reset out. This pin
also has a second function as RUNRSTIN which is enabled by setting bit 0 of the
RUNRSTCTL register. For more information, see the ADSP-214xx SHARC Processor
Hardware Reference.
BOOT_CFG2–0
Boot Configuration Select. These pins select the boot mode for the processor.
The BOOT_CFG pins must be valid before RESET (hardware and software) is deasserted.
The BOOT_CFG2 pin is only available on the 196-lead package.
I
The following symbols appear in the Type column of Table 11: A = asynchronous, I = input, O = output, S = synchronous, A/D = active drive,
O/D = open drain, and T = three-state, ipd = internal pull-down resistor, ipu = internal pull-up resistor.
The internal pull-up (ipu) and internal pull-down (ipd) resistors are designed to hold the internal path from the pins at the expected logic
levels. To pull-up or pull-down the external pads to the expected logic levels, use external resistors. Internal pull-up/pull-down resistors
cannot be enabled/disabled and the value of these resistors cannot be programmed. The range of an ipu resistor can be 26 kΩ to 63 kΩ. The
range of an ipd resistor can be 31 kΩ to 85 kΩ. The three-state voltage of ipu pads will not reach to full the VDD_EXT level; at typical conditions
the voltage is in the range of 2.3 V to 2.7 V.
In this table, all pins are LVTTL compliant with the exception of the thermal diode, shift register, and real-time clock (RTC) pins.
Not all pins are available in the 88-lead LFCSP_VQ and 100-lead LQFP package. For more information, see Table 2 on Page 3 and Table 62 on
Page 70.
Rev. C |
Page 19 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
Table 12. Pin List, Power and Ground
1
Name
Type
Description
VDD_INT
P
Internal Power Supply.
VDD_EXT
P
I/O Power Supply.
VDD_RTC
P
Real-Time Clock Power Supply. When RTC is not used, this pin should be connected to VDD_EXT.
GND1
G
Ground.
VDD_THD
P
Thermal Diode Power Supply. When not used, this pin can be left floating.
The exposed pad is required to be electrically and thermally connected to GND. Implement this by soldering the exposed pad to a GND PCB land that is the same size as the
exposed pad. The GND PCB land should be robustly connected to the GND plane in the PCB for best electrical and thermal performance. See also 88-LFCSP_VQ Lead
Assignment on Page 68 and 100-LQFP_EP Lead Assignment on Page 70.
Rev. C |
Page 20 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
SPECIFICATIONS
OPERATING CONDITIONS
200 MHz
Parameter
VDD_INT
VDD_EXT
VDD_THD
VDD_RTC
VIH2
VIL3
VIH_CLKIN3
VIL_CLKIN
TJ
TJ
TJ4
TJ
TJ4
TJ4
TJ5
TJ5
1
266 MHz
300 MHz
Description
Min
Nom Max
Min Nom Max
Min
Nom Max
Unit
Internal (Core) Supply Voltage
External (I/O) Supply Voltage
Thermal Diode Supply Voltage
Real-Time Clock Power Supply Voltage
High Level Input Voltage @ VDD_EXT = Max
Low Level Input Voltage @ VDD_EXT = Min
High Level Input Voltage @ VDD_EXT = Max
Low Level Input Voltage @ VDD_EXT = Max
Junction Temperature 88-Lead LFCSP_VQ @
TAMBIENT 0C to +70C
Junction Temperature 88-Lead LFCSP_VQ @
TAMBIENT –40C to +85C
Junction Temperature 88-Lead LFCSP_VQ @
TAMBIENT –40C to +105C
Junction Temperature 100-Lead LQFP_EP @
TAMBIENT 0°C to +70°C
Junction Temperature 100-Lead LQFP_EP @
TAMBIENT –40°C to +85°C
Junction Temperature 100-Lead LQFP_EP @
TAMBIENT –40°C to +105°C
Junction Temperature 196-Ball CSP_BGA @
TAMBIENT 0°C to +70°C
Junction Temperature 196-Ball CSP_BGA @
TAMBIENT –40°C to +85°C
1.14
3.13
3.13
2.0
2.0
1.2
3.3
3.3
3.0
1.14
3.13
3.13
2.0
2.0
1.25
3.13
3.13
2.0
2.0
1.3
3.3
3.3
3.0
2.2
–0.3
0
0.8
VDD_EXT 2.2
+0.8 –0.3
105
N/A
0.8
VDD_EXT 2.2
+0.8
–0.3
N/A
N/A
0.8
VDD_EXT
+0.8
N/A
V
V
V
V
V
V
V
V
°C
–40
+115
N/A
N/A
N/A
N/A
°C
–40
+125
N/A
N/A
N/A
N/A
°C
0
105
0
105
N/A
N/A
°C
N/A
N/A
–40
+125
N/A
N/A
°C
–40
+125
–40
+125
N/A
N/A
°C
N/A
N/A
0
105
0
100
°C
N/A
N/A
–40
+125
N/A
N/A
°C
1
1.26
3.47
3.47
3.6
1.2
3.3
3.3
3.0
1.26
3.47
3.47
3.6
1.35
3.47
3.47
3.6
Specifications subject to change without notice.
Applies to input and bidirectional pins: ADDR23–0, DATA15–0, FLAG3–0, DAI_Px, DPI_Px, BOOT_CFGx, CLK_CFGx, RUNRSTIN, RESET, TCK, TMS, TDI, TRST, SDA10,
AMI_ACK, MLBCLK, MLBDAT, MLBSIG.
3
Applies to input pin CLKIN, WDT_CLKIN.
4
Applies to automotive models only. See Automotive Products on Page 75.
5
Real Time Clock (RTC) is supported only for products with a temperature range of 0°C to +70°C and not supported for all other temperature grades. For the status of unused RTC
pins please see Table 11 on Page 16.
2
Rev. C |
Page 21 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
ELECTRICAL CHARACTERISTICS
200 MHz
1
Parameter
2
Description
Test Conditions
Min
IDD_INT9
High Level Output Voltage @ VDD_EXT = Min,
IOH = –1.0 mA3
Low Level Output Voltage @ VDD_EXT = Min,
IOL = 1.0 mA3
High Level Input Current
@ VDD_EXT = Max,
VIN = VDD_EXT Max
Low Level Input Current
@ VDD_EXT = Max, VIN = 0 V
Low Level Input Current
@ VDD_EXT = Max, VIN = 0 V
Pull-up
Three-State Leakage
@ VDD_EXT = Max,
Current
VIN = VDD_EXT Max
Three-State Leakage
@ VDD_EXT = Max, VIN = 0 V
Current
Three-State Leakage
@ VDD_EXT = Max, VIN = 0 V
Current Pull-up
Three-State Leakage
@ VDD_EXT = Max,
Current Pull-down
VIN = VDD_EXT Max
VDD_RTC Current
@ VDD_RTC = 3.0,
TJ = 25°C
Supply Current (Internal)
fCCLK > 0 MHz
CIN10, 11
Input Capacitance
VOH
VOL2
IIH4, 5
IIL4
IILPU5
IOZH6, 7
IOZL6
IOZLPU7
IOZHPD8
IDD_RTC
Max
2.4
TCASE = 25°C
266 MHz
Min
Max
2.4
300 MHz
Min
Max
2.4
Unit
V
0.4
0.4
0.4
V
10
10
10
μA
–10
200
–10
200
–10
200
μA
μA
10
10
10
μA
–10
–10
–10
μA
200
200
200
μA
200
200
200
μA
0.76
0.76
0.76
μA
Table 14
+
Table 15
× ASF
5
Table 14
+
Table 15
× ASF
5
Table 14
+
Table 15
× ASF
5
mA
1
pF
Specifications subject to change without notice.
Applies to output and bidirectional pins: ADDR23-0, DATA15-0, AMI_RD, AMI_WR, FLAG3–0, DAI_Px, DPI_Px, EMU, TDO, RESETOUT,MLBSIG, MLBDAT, MLBDO,
MLBSO, SDRAS, SDCAS, SDWE, SDCKE, SDA10, SDDQM, MS0-1.
3
See Output Drive Currents on Page 65 for typical drive current capabilities.
4
Applies to input pins: BOOT_CFGx, CLK_CFGx, TCK, RESET, CLKIN.
5
Applies to input pins with internal pull-ups: TRST, TMS, TDI.
6
Applies to three-statable pins: TDO, MLBDAT, MLBSIG, MLBDO, and MLBSO.
7
Applies to three-statable pins with pull-ups: DAI_Px, DPI_Px, EMU.
8
Applies to three-statable pin with pull-down: SDCLK.
9
See Engineer-to-Engineer Note “Estimating Power Dissipation for ADSP-214xx SHARC Processors” for further information.
10
Applies to all signal pins.
11
Guaranteed, but not tested.
2
Rev. C |
Page 22 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
Total Power Dissipation
The information in this section should be augmented with
Estimating Power for ADSP-214xx SHARC Processors (EE-348).
Total power dissipation has two components:
Table 13. Activity Scaling Factors (ASF)1
Activity
Idle
Low
Medium Low
Medium High
Peak-Typical (50:50)2
Peak-Typical (60:40)2
Peak-Typical (70:30)2
High Typical
High
Peak
1. Internal power consumption is additionally comprised of
two components:
• Static current due to leakage. Table 14 shows the static
current consumption (IDD_INT_STATIC) as a function of
junction temperature (TJ) and core voltage (VDD_INT).
• Dynamic current (IDD_INT_DYNAMIC), due to transistor
switching characteristics and activity level of the processor. The activity level is reflected by the Activity
Scaling Factor (ASF), which represents the activity
level of the application code running on the processor
core and having various levels of peripheral and external port activity (Table 13). Dynamic current
consumption is calculated by selecting the ASF that
corresponds most closely with the user application
and then multiplying that with the dynamic current
consumption (Table 15).
Scaling Factor (ASF)
0.31
0.53
0.62
0.78
0.85
0.93
1.00
1.18
1.28
1.34
1
See Estimating Power for ADSP-214xx SHARC Processors (EE-348) for more
information on the explanation of the power vectors specific to the ASF table.
2
Ratio of continuous instruction loop (core) to SDRAM control code reads and
writes.
2. External power consumption is due to the switching activity of the external pins.
Table 14. Static Current—IDD_INT_STATIC (mA)1
TJ (°C)
–45
–35
–25
–15
–5
+5
+15
+25
+35
+45
+55
+65
+75
+85
+95
+100
+105
+115
+125
1
1.05 V
< 0.1
< 0.1
< 0.1
< 0.1
0.2
0.5
0.8
1.3
2.0
3.0
4.3
6.0
8.3
11.2
15.2
17.4
20.0
26.3
34.4
1.10 V
< 0.1
< 0.1
0.2
0.4
0.6
0.9
1.4
1.9
2.8
3.9
5.4
7.3
9.9
13.2
17.6
20.2
23.0
30.0
38.9
1.15 V
0.4
0.4
0.4
0.6
0.9
1.3
1.8
2.5
3.4
4.7
6.3
8.6
11.5
15.3
20.1
22.9
26.1
33.9
43.6
Voltage (VDD_INT)
1.20 V
1.25 V
0.8
1.3
0.7
1.1
0.8
1.2
1.0
1.4
1.3
1.8
1.8
2.3
2.3
3.0
3.1
3.9
4.2
5.1
5.7
6.7
7.6
8.8
10.1
11.7
13.3
15.3
17.5
19.9
22.9
26.1
25.9
29.4
29.5
33.4
38.2
42.9
48.8
54.8
Valid temperature and voltage ranges are model-specific. See Operating Conditions on Page 21.
Rev. C |
Page 23 of 76 |
July 2013
1.30 V
2.1
1.7
1.7
1.9
2.3
3.0
3.7
4.7
6.0
7.8
10.3
13.5
17.4
22.6
29.4
33.0
N/A
N/A
N/A
1.35 V
3.3
2.9
2.9
3.2
3.7
4.4
5.1
6.2
8.0
10.1
12.9
16.4
21.2
27.1
34.6
39.2
N/A
N/A
N/A
ADSP-21477/ADSP-21478/ADSP-21479
Table 15. Dynamic Current in CCLK Domain—IDD_INT_DYNAMIC (mA, with ASF = 1.0)1, 2
fCCLK (MHz)
100
150
200
266
300
1
2
1.05 V
75
111
N/A
N/A
N/A
1.10 V
78
117
N/A
N/A
N/A
Voltage (VDD_INT)
1.20 V
1.25 V
86
90
128
134
170
178
225
234
N/A
264
1.15 V
82
122
162
215
N/A
1.35 V
98
146
194
256
291
The values are not guaranteed as standalone maximum specifications. They must be combined with static current per the equations of Electrical Characteristics on Page 22.
Valid frequency and voltage ranges are model-specific. See Operating Conditions on Page 21.
MAXIMUM POWER DISSIPATION
ESD SENSITIVITY
See Engineer-to-Engineer Note “Estimating Power Dissipation
for ADSP-2147x SHARC Processors” for detailed thermal and
power information regarding maximum power dissipation. For
information on package thermal specifications, see Thermal
Characteristics on Page 66.
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can discharge
without detection. Although this product features
patented or proprietary protection circuitry, damage
may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to
avoid performance degradation or loss of functionality.
PACKAGE INFORMATION
The information presented in Figure 4 provides details about
the package branding. For a complete listing of product availability, see Ordering Guide on Page 76.
ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed in Table 17 may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions greater than those indicated in Operating Conditions on
Page 21 is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
a
ADSP-2147x
tppZ-cc
vvvvvv.x n.n
Table 17. Absolute Maximum Ratings
#yyww country_of_origin
S
Parameter
Internal (Core) Supply Voltage (VDD_INT)
External (I/O) Supply Voltage (VDD_EXT)
Real Time Clock Voltage (VDD_RTC)
Thermal Diode Supply Voltage (VDD_THD)
Input Voltage
Output Voltage Swing
Storage Temperature Range
Junction Temperature While Biased
Figure 4. Typical Package Brand
Table 16. Package Brand Information1
Brand Key
t
pp
Z
cc
vvvvvv.x
n.n
#
yyww
1
1.30 V
95
141
186
246
279
Field Description
Temperature Range
Package Type
RoHS Compliant Option
See Ordering Guide
Assembly Lot Code
Silicon Revision
RoHS Compliant Designation
Date Code
Nonautomotive only. For branding information specific to automotive products,
contact Analog Devices Inc.
Rev. C |
Page 24 of 76 |
July 2013
Rating
–0.3 V to +1.35 V
–0.3 V to +4.6 V
–0.3 V to +4.6 V
–0.3 V to +4.6 V
–0.5 V to +3.8 V
–0.5 V to VDD_EXT +0.5 V
–65°C to +150°C
125°C
ADSP-21477/ADSP-21478/ADSP-21479
TIMING SPECIFICATIONS
fINPUT is the input frequency to the PLL.
Use the exact timing information given. Do not attempt to
derive parameters from the addition or subtraction of others.
While addition or subtraction would yield meaningful results
for an individual device, the values given in this data sheet
reflect statistical variations and worst cases. Consequently, it is
not meaningful to add parameters to derive longer times. See
Figure 49 on Page 65 under Test Conditions for voltage reference levels.
fINPUT = CLKIN when the input divider is disabled, or
CLKIN ÷ 2 when the input divider is enabled.
Switching Characteristics specify how the processor changes its
signals. Circuitry external to the processor must be designed for
compatibility with these signal characteristics. Switching characteristics describe what the processor will do in a given
circumstance. Use switching characteristics to ensure that any
timing requirement of a device connected to the processor (such
as memory) is satisfied.
Timing Requirements apply to signals that are controlled by circuitry external to the processor, such as the data input for a read
operation. Timing requirements guarantee that the processor
operates correctly with other devices.
Core Clock Requirements
The processor’s internal clock (a multiple of CLKIN) provides
the clock signal for timing internal memory, processor core, and
serial ports. During reset, program the ratio between the processor’s internal clock frequency and external (CLKIN) clock
frequency with the CLK_CFG1–0 pins.
Note the definitions of the clock periods that are a function of
CLKIN and the appropriate ratio control shown in Table 20. All
of the timing specifications for the peripherals are defined in
relation to tPCLK. See the peripheral specific section for each
peripheral’s timing information.
Table 18. Clock Periods
Timing
Requirements
tCK
tCCLK
tPCLK
tSDCLK
Figure 5 shows core to CLKIN relationships with an external
oscillator or crystal. The shaded divider/multiplier blocks
denote where clock ratios can be set through hardware or software using the power management control register (PMCTL).
For more information, see the ADSP-214xx SHARC Processor
Hardware Reference.
The processor’s internal clock switches at higher frequencies
than the system input clock (CLKIN). To generate the internal
clock, the processor uses an internal phase-locked loop (PLL,
see Figure 5). This PLL-based clocking minimizes the skew
between the system clock (CLKIN) signal and the processor’s
internal clock.
Voltage Controlled Oscillator (VCO)
In application designs, the PLL multiplier value should be
selected in such a way that the VCO frequency never exceeds
fVCO specified in Table 20.
• The product of CLKIN and PLLM must never exceed 1/2 of
fVCO (max) in Table 20 if the input divider is not enabled
(INDIV = 0).
• The product of CLKIN and PLLM must never exceed fVCO
(max) in Table 20 if the input divider is enabled
(INDIV = 1).
The VCO frequency is calculated as follows:
fVCO = 2 × PLLM × fINPUT
fCCLK = (2 × PLLM × fINPUT) ÷ PLLD
where:
fVCO = VCO output
PLLM = Multiplier value programmed in the PMCTL register.
During reset, the PLLM value is derived from the ratio selected
using the CLK_CFG pins in hardware.
PLLD = 2, 4, 8, or 16 based on the divider value programmed on
the PMCTL register. During reset this value is 2.
Rev. C |
Description
CLKIN Clock Period
Processor Core Clock Period
Peripheral Clock Period = 2 × tCCLK
SDRAM Clock Period = (tCCLK) × SDCKR
Page 25 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
PMCTL
(SDCKR)
PMCTL
(PLLBP)
CLKIN
DIVIDER
fINPUT
LOOP
FILTER
VCO
fVCO
PLL
DIVIDER
fCCLK
CCLK
SDRAM
DIVIDER
BYPASS
MUX
CLKIN
BYPASS
MUX
PLL
XTAL
BUF
CLK_CFGx/
PMCTL (2 × PLLM)
PMCTL
(INDIV)
PMCTL
(PLLD)
DIVIDE
BY 2
PMCTL
(PLLBP)
PCLK
fVCO ÷ (2 × PLLM)
PCLK
CCLK
RESET
DELAY OF
4096 CLKIN
CYCLES
PIN
MUX
CLKOUT (TEST ONLY)*
RESETOUT
Figure 5. Core Clock and System Clock Relationship to CLKIN
Page 26 of 76 |
RESETOUT
CORESRST
*CLKOUT (TEST ONLY) FREQUENCY IS THE SAME AS fINPUT.
THIS SIGNAL IS NOT SPECIFIED OR SUPPORTED FOR ANY DESIGN.
Rev. C |
BUF
July 2013
SDCLK
ADSP-21477/ADSP-21478/ADSP-21479
• If the VDD_INT power supply comes up after VDD_EXT, any
pin, such as RESETOUT and RESET, may actually drive
momentarily until the VDD_INT rail has powered up. Systems
sharing these signals on the board must determine if there
are any issues that need to be addressed based on this
behavior.
Power-Up Sequencing
The timing requirements for processor startup are given in
Table 19. While no specific power-up sequencing is required
between VDD_EXT and VDD_INT, there are some considerations
that the system designs should take into account.
• No power supply should be powered up for an extended
period of time (>200 ms) before another supply starts to
ramp up.
Note that during power-up, when the VDD_INT power supply
comes up after VDD_EXT, a leakage current of the order of threestate leakage current pull-up, pull-down, may be observed on
any pin, even if that is an input only (for example, the RESET
pin), until the VDD_INT rail has powered up.
Table 19. Power-Up Sequencing Timing Requirements (Processor Startup)
Parameter
Timing Requirements
tRSTVDD
RESET Low Before VDD_EXT or VDD_INT On
tIVDDEVDD
VDD_INT On Before VDD_EXT
tCLKVDD1
CLKIN Valid After VDD_INT and VDD_EXT Valid
tCLKRST
CLKIN Valid Before RESET Deasserted
PLL Control Setup Before RESET Deasserted
tPLLRST
Switching Characteristic
tCORERST
Core Reset Deasserted After RESET Deasserted
Min
0
–200
0
102
203
Max
+200
200
Unit
ms
ms
ms
μs
μs
4096 × tCK + 2 × tCCLK 4, 5
1
Valid VDD_INT and VDD_EXT assumes that the supplies are fully ramped to their nominal values (it does not matter which supply comes up first). Voltage ramp rates can vary
from microseconds to hundreds of milliseconds depending on the design of the power supply subsystem.
2
Assumes a stable CLKIN signal, after meeting worst-case startup timing of crystal oscillators. Refer to your crystal oscillator manufacturer's data sheet for startup time. Assume
a 25 ms maximum oscillator startup time if using the XTAL pin and internal oscillator circuit in conjunction with an external crystal.
3
Based on CLKIN cycles.
4
Applies after the power-up sequence is complete. Subsequent resets require a minimum of four CLKIN cycles for RESET to be held low in order to properly initialize and
propagate default states at all I/O pins.
5
The 4096 cycle count depends on tSRST specification in Table 21. If setup time is not met, one additional CLKIN cycle may be added to the core reset time, resulting in 4097
cycles maximum.
tRSTVDD
RESET
VDDINT
tIVDDEVDD
VDDEXT
tCLKVDD
CLKIN
tCLKRST
CLK_CFG1–0
tPLLRST
tCORERST
RESETOUT
Figure 6. Power-Up Sequencing
Rev. C |
Page 27 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
Clock Input
Table 20. Clock Input
Min
Parameter
Timing Requirements
tCK
CLKIN Period
tCKL
CLKIN Width Low
tCKH
CLKIN Width High
tCKRF
CLKIN Rise/Fall (0.4 V to 2.0 V)
tCCLK2
CCLK Period
VCO Frequency
fVCO3
tCKJ4, 5
CLKIN Jitter Tolerance
200 MHz
Max
40
20
20
5
200
–250
100
45
45
3
10
600
+250
Min
266 MHz
Max
301
15
15
3.75
200
–250
100
45
45
3
10
600
+250
1
Applies only for CLKCFG1–0 = 00 and default values for PLL control bits in PMCTL.
Any changes to PLL control bits in the PMCTL register must meet core clock timing specification tcclk.
3
See Figure 5 on Page 26 for VCO diagram.
4
Actual input jitter should be combined with ac specifications for accurate timing analysis.
5
Jitter specification is maximum peak-to-peak time interval error (TIE) jitter.
2
tCKJ
tCK
CLKIN
tCKH
tCKL
Figure 7. Clock Input
Rev. C |
Page 28 of 76 |
July 2013
Min
26.661
13.33
13.33
3.33
200
–250
300 MHz
Max
Unit
100
45
45
3
10
600
+250
ns
ns
ns
ns
ns
MHz
ps
ADSP-21477/ADSP-21478/ADSP-21479
mental mode. Note that the clock rate is achieved using a
16.67 MHz crystal and a PLL multiplier ratio 16:1
(CCLK:CLKIN achieves a clock speed of 266 MHz). To achieve
the full core clock rate, programs need to configure the multiplier bits in the PMCTL register.
Clock Signals
The processors can use an external clock or a crystal. See the
CLKIN pin description in Table 11. Programs can configure the
processor to use its internal clock generator by connecting the
necessary components to CLKIN and XTAL. Figure 8 shows the
component connections used for a crystal operating in funda-
ADSP-2147x
R1
1MΩ *
CLKIN
XTAL
R2
47Ω *
C1
22pF
C2
22pF
Y1
CHOOSE C1 AND C2 BASED ON THE CRYSTAL Y1.
CHOOSE R2 TO LIMIT CRYSTAL DRIVE POWER.
REFER TO CRYSTAL MANUFACTURER'S SPECIFICATIONS
16.67
*TYPICAL VALUES
Figure 8. 266 MHz Operation (Fundamental Mode Crystal)
Reset
Table 21. Reset
Parameter
Timing Requirements
tWRST1
RESET Pulse Width Low
tSRST
RESET Setup Before CLKIN Low
1
Min
Max
4 × tCK
8
Unit
ns
ns
Applies after the power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 100 s while RESET is low, assuming stable
VDD and CLKIN (not including start-up time of external clock oscillator).
CLKIN
tWRST
tSRST
RESET
Figure 9. Reset
Rev. C |
Page 29 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
Running Reset
The following timing specification applies to RESETOUT/
RUNRSTIN pin when it is configured as RUNRSTIN.
Table 22. Running Reset
Parameter
Timing Requirements
tWRUNRST
Running RESET Pulse Width Low
tSRUNRST
Running RESET Setup Before CLKIN High
Min
Max
Unit
4 × tCK
8
ns
ns
CLKIN
tWRUNRST
tSRUNRST
RUNRSTIN
Figure 10. Running Reset
Interrupts
The following timing specification applies to the FLAG0,
FLAG1, and FLAG2 pins when they are configured as IRQ0,
IRQ1, and IRQ2 interrupts, as well as the DAI_P20–1 and
DPI_P14–1 pins when they are configured as interrupts.
Table 23. Interrupts
Parameter
Timing Requirement
tIPW
IRQx Pulse Width
Min
2 × tPCLK + 2
INTERRUPT
INPUTS
tIPW
Figure 11. Interrupts
Rev. C |
Page 30 of 76 |
July 2013
Max
Unit
ns
ADSP-21477/ADSP-21478/ADSP-21479
Core Timer
The following timing specification applies to FLAG3 when it is
configured as the core timer (TMREXP).
Table 24. Core Timer
Parameter
Switching Characteristic
tWCTIM
TMREXP Pulse Width
Min
88-Lead LFCSP Package
Max
4 × tPCLK – 1.55
Min
All Other Packages
Max
4 × tPCLK – 1.2
Unit
ns
tWCTIM
FLAG3
(TMREXP)
Figure 12. Core Timer
Timer PWM_OUT Cycle Timing
The following timing specification applies to timer0 and timer1
in PWM_OUT (pulse-width modulation) mode. Timer signals
are routed to the DPI_P14–1 pins through the DPI SRU. Therefore, the timing specifications provided below are valid at the
DPI_P14–1 pins.
Table 25. Timer PWM_OUT Timing
Parameter
Switching Characteristic
tPWMO
Timer Pulse Width Output
Min
88-Lead LFCSP Package
Max
2 × tPCLK – 1.65
2 × (231 – 1) × tPCLK
tPWMO
PWM
OUTPUTS
Figure 13. Timer PWM_OUT Timing
Rev. C |
Page 31 of 76 |
July 2013
Min
All Other Packages
Max
2 × tPCLK – 1.2
2 × (231 – 1) × tPCLK
Unit
ns
ADSP-21477/ADSP-21478/ADSP-21479
Timer WDTH_CAP Timing
The following timing specification applies to timer0 and timer1,
and in WDTH_CAP (pulse width count and capture) mode.
Timer signals are routed to the DPI_P14–1 pins through the
SRU. Therefore, the timing specification provided below is valid
at the DPI_P14–1 pins.
Table 26. Timer Width Capture Timing
Parameter
Timing Requirement
tPWI
Timer Pulse Width
Min
Max
Unit
2 × tPCLK
2 × (231 – 1) × tPCLK
ns
Min
Max
Unit
100
1000
ns
3
7.6
ns
tPWI
TIMER
CAPTURE
INPUTS
Figure 14. Timer Width Capture Timing
Watchdog Timer Timing
Table 27. Watchdog Timer Timing
Parameter
Timing Requirement
tWDTCLKPER
Switching Characteristics
tRST
WDT Clock Rising Edge to Watchdog Timer
RESET Falling Edge
tRSTPW
Reset Pulse Width
1
64 × tWDTCLKPER1
When the internal oscillator is used, the 1/tWDTCLKPER varies from 1.5 MHz to 2.5 MHz and the WDT_CLKIN pin should be pulled low.
tWDTCLKPER
WDT_CLKIN
tRST
tRSTPW
WDTRSTO
Figure 15. Watchdog Timer Timing
Rev. C |
Page 32 of 76 |
July 2013
ns
ADSP-21477/ADSP-21478/ADSP-21479
Pin to Pin Direct Routing (DAI and DPI)
For direct pin connections only (for example, DAI_PB01_I to
DAI_PB02_O).
Table 28. DAI/DPI Pin to Pin Routing
Parameter
Timing Requirement
tDPIO
Delay DAI/DPI Pin Input Valid to DAI/DPI Output Valid
Min
Max
Unit
1.5
10
ns
DAI_Pn
DPI_Pn
tDPIO
DAI_Pm
DPI_Pm
Figure 16. DAI Pin to Pin Direct Routing
Rev. C |
Page 33 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
Precision Clock Generator (Direct Pin Routing)
This timing is only valid when the SRU is configured such that
the precision clock generator (PCG) takes its inputs directly
from the DAI pins (via pin buffers) and sends its outputs
directly to the DAI pins. For the other cases, where the PCG’s
inputs and outputs are not directly routed to/from DAI pins (via
pin buffers) there is no timing data available. All timing parameters and switching characteristics apply to external DAI pins
(DAI_P01 – DAI_P20).
Table 29. Precision Clock Generator (Direct Pin Routing)
88-Lead LFCSP Package
All Other Packages
Unit
Parameter
Min
Max
Min
Max
Timing Requirements
tPCGIP
Input Clock Period
tPCLK × 4
tPCLK × 4
ns
PCG Trigger Setup Before
4.5
4.5
ns
tSTRIG
Falling Edge of PCG Input Clock
tHTRIG
PCG Trigger Hold After Falling 3
3
ns
Edge of PCG Input Clock
Switching Characteristics
tDPCGIO
12.5
PCG Output Clock and Frame
2 × tPCLK
2.5
ns
Sync Active Edge Delay After 2.5
PCG Input Clock
tDTRIGCLK PCG Output Clock Delay After 2.5 + (2.5 × tPCGIP)
2 × tPCLK + (2.5 × tPCGIP) 2.5 + (2.5 × tPCGIP)
12.5 + (2.5 × tPCGIP) ns
PCG Trigger
tDTRIGFS PCG Frame Sync Delay After 2.5 + ((2.5 + D – PH) × 2 × tPCLK + ((2.5 + D – 2.5 + ((2.5 + D – PH) × 12.5 + ((2.5 + D – PH) ns
tPCGIP)
× tPCGIP)
PCG Trigger
tPCGIP)
PH) × tPCGIP)
tPCGOW1 Output Clock Period
2 × tPCGIP – 1
2 × tPCGIP – 1
ns
D = FSxDIV, PH = FSxPHASE. For more information, see the ADSP-214xx SHARC Processor Hardware Reference, “Precision Clock Generators”
chapter.
1
Normal mode of operation.
tSTRIG
tHTRIG
DAI_Pn
DPI_Pn
PCG_TRIGx_I
DAI_Pm
DPI_Pm
PCG_EXTx_I
(CLKIN)
tPCGIP
tDPCGIO
DAI_Py
DPI_Py
PCK_CLKx_O
tDTRIGCLK
tDPCGIO
DAI_Pz
DPI_Pz
PCG_FSx_O
tDTRIGFS
Figure 17. Precision Clock Generator (Direct Pin Routing)
Rev. C |
Page 34 of 76 |
July 2013
tPCGOW
ADSP-21477/ADSP-21478/ADSP-21479
Flags
The timing specifications provided below apply to ADDR23–0
and DATA7–0 when configured as FLAGS. See Table 11 on
Page 16 for more information on flag use.
Table 30. Flags
Parameter
Timing Requirement
FLAGs IN Pulse Width1
tFIPW
Switching Characteristic
tFOPW
FLAGs OUT Pulse Width1
1
Min
This is applicable when the Flags are connected to DPI_P14–1, ADDR23–0, DATA7–0 and FLAG3–0 pins.
FLAG
INPUTS
tFIPW
FLAG
OUTPUTS
tFOPW
Figure 18. Flags
Rev. C |
Page 35 of 76 |
July 2013
Max
Unit
2 × tPCLK + 3
ns
2 × tPCLK – 3.5
ns
ADSP-21477/ADSP-21478/ADSP-21479
SDRAM Interface Timing
Table 31. SDRAM Interface Timing
Parameter
Timing Requirements
tSSDAT
DATA Setup Before SDCLK
tHSDAT
DATA Hold After SDCLK
Switching Characteristics
tSDCLK1
SDCLK Period
tSDCLKH
SDCLK Width High
SDCLK Width Low
tSDCLKL
tDCAD2
Command, ADDR, Data Delay After SDCLK
2
tHCAD
Command, ADDR, Data Hold After SDCLK
tDSDAT
Data Disable After SDCLK
tENSDAT
Data Enable After SDCLK
133 MHz
Max
Min
Min
150 MHz
Max
Unit
0.7
1.66
0.7
1.5
ns
ns
7.5
2.5
2.5
6.66
2.2
2.2
ns
ns
ns
ns
ns
ns
ns
5
4.75
1
1
6.2
5.3
0.3
0.3
1
Systems should use the SDRAM model with a speed grade higher than the desired SDRAM controller speed. For example, to run the SDRAM controller at 133 MHz the
SDRAM model with a speed grade of 143 MHz or above should be used. See Engineer-to-Engineer Note “Interfacing SDRAM memory to SHARC processors (EE-286)” for
more information on hardware design guidelines for the SDRAM interface.
2
Command pins include: SDCAS, SDRAS, SDWE, MSx, SDA10, SDQM, SDCKE.
tSDCLKH
tSDCLK
SDCLK
tSSDAT
tHSDAT
tSDCLKL
DATA (IN)
tDCAD
tENSDAT
tHCAD
DATA (OUT)
tDCAD
tHCAD
COMMAND/ADDR
(OUT)
Figure 19. SDRAM Interface Timing
Rev. C |
Page 36 of 76 |
July 2013
tDSDAT
ADSP-21477/ADSP-21478/ADSP-21479
AMI Read
Use these specifications for asynchronous interfacing to memories. Note that timing for AMI_ACK, ADDR, DATA, AMI_RD,
AMI_WR, and strobe timing parameters only apply to asynchronous access mode.
Table 32. AMI Read
Parameter
Min
Timing Requirements
tDAD1, 2, 3
Address Selects Delay to Data Valid
tDRLD1, 3
AMI_RD Low to Data Valid
tSDS4, 5
Data Setup to AMI_RD High
2.6
tHDRH
Data Hold from AMI_RD High
0.4
tDAAK2, 6
AMI_ACK Delay from Address Selects
tDSAK4
AMI_ACK Delay from AMI_RD Low
Switching Characteristics
tDRHA
Address Selects Hold After AMI_RD High
RHC + 0.38
2
tDARL
Address Selects to AMI_RD Low
tSDCLK – 5
tRW
AMI_RD Pulse Width
W – 1.4
tRWR
AMI_RD High to AMI_RD Low
HI + tSDCLK – 1.2
W = (number of wait states specified in AMICTLx register) × tSDCLK.
RHC = (number of Read Hold Cycles specified in AMICTLx register) × tSDCLK
Where PREDIS = 0
HI = RHC: Read to Read from same bank
HI = RHC + IC: Read to Read from different bank
HI = RHC + Max (IC, (4 × tSDCLK)) : Read to Write from same or different bank
Where PREDIS = 1
HI = RHC + Max (IC, (4 × tSDCLK)) : Read to Write from same or different bank
HI = RHC + (3 × tSDCLK): Read to Read from same bank
HI = RHC + Max (IC, (3 × tSDCLK)) : Read to Read from different bank
IC = (number of idle cycles specified in AMICTLx register) × tSDCLK
H = (number of hold cycles specified in AMICTLx register) × tSDCLK.
1
Max
Unit
W + tSDCLK – 6.32
W–3
ns
ns
ns
ns
ns
ns
tSDCLK – 10 + W
W – 7.0
ns
ns
ns
ns
Data delay/setup: System must meet tDAD, tDRLD, or tSDS.
The falling edge of AMI_MSx, is referenced.
3
The maximum limit of timing requirement values for tDAD and tDRLD parameters are applicable for the case where AMI_ACK is always high and when the ACK feature is not used.
4
Note that timing for AMI_ACK, ADDR, DATA, AMI_RD, AMI_WR, and strobe timing parameters only apply to asynchronous access mode.
5
Data hold: User must meet tHDRH in asynchronous access mode. See Test Conditions on Page 65 for the calculation of hold times given capacitive and dc loads.
6
AMI_ACK delay/setup: User must meet tdaak, or tdsak, for deassertion of AMI_ACK (low).
2
Rev. C |
Page 37 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
ADDR
MSx
tDARL
tRW
tDRHA
RD
tDRLD
tSDS
tDAD
tHDRH
DATA
tRWR
tDSAK
tDAAK
ACK
WR
Figure 20. AMI Read
Rev. C |
Page 38 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
AMI Write
Use these specifications for asynchronous interfacing to memories. Note that timing for AMI_ACK, ADDR, DATA, AMI_RD,
AMI_WR, and strobe timing parameters only apply to asynchronous access mode.
Table 33. AMI Write
Parameter
Timing Requirements
tDAAK
AMI_ACK Delay from Address Selects1, 2
tDSAK
AMI_ACK Delay from AMI_WR Low1, 3
Switching Characteristics
tDAWH
Address Selects to AMI_WR Deasserted2
tDAWL
Address Selects to AMI_WR Low2
tWW
AMI_WR Pulse Width
tDDWH
Data Setup Before AMI_WR High
tDWHA
Address Hold After AMI_WR Deasserted
Data Hold After AMI_WR Deasserted
tDWHD
tDATRWH
Data Disable After AMI_WR Deasserted4
tWWR
AMI_WR High to AMI_WR Low5
tDDWR
Data Disable Before AMI_RD Low
tWDE
AMI_WR Low to Data Enabled
W = (number of wait states specified in AMICTLx register) × tSDCLK
H = (number of hold cycles specified in AMICTLx register) × tSDCLK
Min
tSDCLK – 4.4 + W
tSDCLK – 4.5
W – 1.3
tSDCLK – 4.3 + W
H
H
tSDCLK – 1.37 + H
tSDCLK – 1.5+ H
2 × tSDCLK – 7.1
tSDCLK – 4.5
1
Max
Unit
tSDCLK – 10.1 + W
W – 7.1
ns
ns
tSDCLK + 6.75+ H
AMI_ACK delay/setup: System must meet tDAAK, or tDSAK, for deassertion of AMI_ACK (low).
The falling edge of AMI_MSx is referenced.
3
Note that timing for AMI_ACK, ADDR, DATA, AMI_RD, AMI_WR, and strobe timing parameters only applies to asynchronous access mode.
4
See Test Conditions on Page 65 for calculation of hold times given capacitive and dc loads.
5
For Write to Write: tSDCLK + H, for both same bank and different bank. For Write to Read: 3 × tSDCLK + H, for the same bank and different banks.
2
Rev. C |
Page 39 of 76 |
July 2013
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ADSP-21477/ADSP-21478/ADSP-21479
ADDR
MSx
tDWHA
tDAWH
tDAWL
tWW
WR
tWWR
tWDE
tDATRWH
tDDWH
tDDWR
DATA
tDSAK
tDWHD
tDAAK
ACK
RD
Figure 21. AMI Write
Rev. C |
Page 40 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
Serial Ports
In slave transmitter mode and master receiver mode, the maximum serial port frequency is fPCLK/8. In master transmitter
mode and slave receiver mode, the maximum serial port clock
frequency is fPCLK/4.
Serial port signals (SCLK, FS, Data Channel A, Data Channel B)
are routed to the DAI_P20–1 pins using the SRU. Therefore, the
timing specifications provided below are valid at the
DAI_P20–1 pins.
To determine whether communication is possible between two
devices at clock speed, n, the following specifications must be
confirmed: 1) frame sync delay and frame sync setup and hold,
2) data delay and data setup and hold, and 3) SCLK width.
Table 34. Serial Ports—External Clock
Parameter
Timing Requirements
tSFSE1
Frame Sync Setup Before SCLK
(Externally Generated Frame Sync in Either Transmit or
Receive Mode)
1
tHFSE
Frame Sync Hold After SCLK
(Externally Generated Frame Sync in Either Transmit or
Receive Mode)
tSDRE1 Receive Data Setup Before Receive SCLK
tHDRE1 Receive Data Hold After SCLK
tSCLKW SCLK Width
tSCLK
SCLK Period
Switching Characteristics
tDFSE2 Frame Sync Delay After SCLK
(Internally Generated Frame Sync in Either Transmit or
Receive Mode)
2
tHOFSE Frame Sync Hold After SCLK
(Internally Generated Frame Sync in Either Transmit or
Receive Mode)
2
tDDTE
Transmit Data Delay After Transmit SCLK
tHDTE2 Transmit Data Hold After Transmit SCLK
1
2
88-Lead LFCSP Package
Min
Max
Min
4
2.5
ns
4
2.5
ns
4
4
(tPCLK × 4) ÷ 2 – 1.5
tPCLK × 4
2.5
2.5
(tPCLK × 4) ÷ 2 – 1.5
tPCLK × 4
ns
ns
ns
ns
15
2
15
2
15
2
Page 41 of 76 |
July 2013
Unit
ns
ns
15
2
Referenced to sample edge.
Referenced to drive edge.
Rev. C |
All Other Packages
Max
ns
ns
ADSP-21477/ADSP-21478/ADSP-21479
Table 35. Serial Ports—Internal Clock
Parameter
Timing Requirements
tSFSI1
Frame Sync Setup Before SCLK
(Externally Generated Frame Sync in Either Transmit
or Receive Mode)
tHFSI1
Frame Sync Hold After SCLK
(Externally Generated Frame Sync in Either Transmit
or Receive Mode)
1
tSDRI
Receive Data Setup Before SCLK
tHDRI1 Receive Data Hold After SCLK
Switching Characteristics
tDFSI2
Frame Sync Delay After SCLK (Internally Generated
Frame Sync in Transmit Mode)
2
tHOFSI Frame Sync Hold After SCLK (Internally Generated
Frame Sync in Transmit Mode)
tDFSIR2 Frame Sync Delay After SCLK (Internally Generated
Frame Sync in Receive Mode)
tHOFSIR2 Frame Sync Hold After SCLK (Internally Generated
Frame Sync in Receive Mode)
tDDTI2 Transmit Data Delay After SCLK
tHDTI2 Transmit Data Hold After SCLK
tSCKLIW Transmit or Receive SCLK Width
Min
88-Lead LFCSP Package
Max
All Other Packages
Max
Unit
13
10.5
ns
2.5
2.5
ns
13
2.5
10.5
2.5
ns
ns
5
–1.0
5
–1.0
10.7
–1.0
10.7
4
–1.0
2 × tPCLK – 1.5
2 × tPCLK + 1.5
Referenced to the sample edge.
2
Referenced to drive edge.
Page 42 of 76 |
July 2013
ns
ns
4
–1.0
2 × tPCLK – 1.5
ns
ns
–1.0
1
Rev. C |
Min
2 × tPCLK + 1.5
ns
ns
ns
ADSP-21477/ADSP-21478/ADSP-21479
DATA RECEIVE—INTERNAL CLOCK
DRIVE EDGE
DATA RECEIVE—EXTERNAL CLOCK
SAMPLE EDGE
DRIVE EDGE
tSCLKIW
SAMPLE EDGE
tSCLKW
DAI_P20–1
(SCLK)
DAI_P20–1
(SCLK)
tDFSIR
tDFSE
tSFSI
tHOFSIR
tHFSI
DAI_P20–1
(FS)
tSFSE
tHFSE
tSDRE
tHDRE
tHOFSE
DAI_P20–1
(FS)
tSDRI
tHDRI
DAI_P20–1
(DATA
CHANNEL A/B)
DAI_P20–1
(DATA
CHANNEL A/B)
DATA TRANSMIT—INTERNAL CLOCK
DRIVE EDGE
DATA TRANSMIT—EXTERNAL CLOCK
SAMPLE EDGE
DRIVE EDGE
tSCLKIW
SAMPLE EDGE
tSCLKW
DAI_P20–1
(SCLK)
DAI_P20–1
(SCLK)
tDFSI
tDFSE
tHOFSI
tSFSI
tHFSI
DAI_P20–1
(FS)
tSFSE
tHOFSE
DAI_P20–1
(FS)
tDDTI
tDDTE
tHDTI
tHDTE
DAI_P20–1
(DATA
CHANNEL A/B)
DAI_P20–1
(DATA
CHANNEL A/B)
Figure 22. Serial Ports
Rev. C |
Page 43 of 76 |
July 2013
tHFSE
ADSP-21477/ADSP-21478/ADSP-21479
Table 36. Serial Ports—External Late Frame Sync
88-Lead LFCSP Package
All Other Packages
Min
Max
Min
Max
Parameter
Switching Characteristics
tDDTLFSE1
Data Delay from Late External Transmit Frame Sync or
External Receive Frame Sync with MCE = 1, MFD = 0
tDDTENFS1
Data Enable for MCE = 1, MFD = 0
1
2 × tPCLK
0.5
13.5
0.5
The tDDTLFSE and tDDTENFS parameters apply to left-justified as well as DSP serial mode, and MCE = 1, MFD = 0.
EXTERNAL RECEIVE FS WITH MCE = 1, MFD = 0
DRIVE
SAMPLE
DRIVE
DAI_P20–1
(SCLK)
tHFSE/I
tSFSE/I
DAI_P20–1
(FS)
tDDTE/I
tDDTENFS
tHDTE/I
DAI_P20–1
(DATA CHANNEL
A/B)
2ND BIT
1ST BIT
tDDTLFSE
LATE EXTERNAL TRANSMIT FS
DRIVE
SAMPLE
DRIVE
DAI_P20–1
(SCLK)
tHFSE/I
tSFSE/I
DAI_P20–1
(FS)
tDDTE/I
tDDTENFS
tHDTE/I
DAI_P20–1
(DATA CHANNEL
A/B)
2ND BIT
1ST BIT
tDDTLFSE
Figure 23. External Late Frame Sync1
1
This figure reflects changes made to support left-justified mode.
Rev. C |
Page 44 of 76 |
July 2013
Unit
ns
ns
ADSP-21477/ADSP-21478/ADSP-21479
Table 37. Serial Ports—Enable and Three-State
Parameter
Switching Characteristics
tDDTEN1
Data Enable from External Transmit SCLK
tDDTTE1
Data Disable from External Transmit SCLK
1
tDDTIN
Data Enable from Internal Transmit SCLK
1
88-Lead LFCSP Package
Min
Max
Min
2
2
All Other Packages
Max
23
–1
20
–1
Referenced to drive edge.
DRIVE EDGE
DRIVE EDGE
DAI_P20–1
(SCLK, EXT)
tDDTEN
tDDTTE
DAI_P20–1
(DATA
CHANNEL A/B)
DRIVE EDGE
DAI_P20–1
(SCLK, INT)
tDDTIN
DAI_P20–1
(DATA
CHANNEL A/B)
Figure 24. Enable and Three-State
Rev. C |
Page 45 of 76 |
July 2013
Unit
ns
ns
ns
ADSP-21477/ADSP-21478/ADSP-21479
The SPORTx_TDV_O output signal (routing unit) becomes
active in SPORT multichannel/packed mode. During transmit
slots (enabled with active channel selection registers), the
SPORTx_TDV_O is asserted for communication with external
devices.
Table 38. Serial Ports—TDV (Transmit Data Valid)
Parameter
Switching Characteristics1
tDRDVEN
TDV Assertion Delay from Drive Edge of External Clock
tDFDVEN
TDV Deassertion Delay from Drive Edge of External Clock
tDRDVIN
TDV Assertion Delay from Drive Edge of Internal Clock
tDFDVIN
TDV Deassertion Delay from Drive Edge of Internal Clock
1
88-Lead LFCSP Package
All Other Packages
Min
Max
Min
Max
3
3
2 × tPCLK
–0.1
3.5
3.5
Referenced to drive edge.
DRIVE EDGE
DRIVE EDGE
DAI_P20–1
(SCLK, EXT)
TDVx
DAI_P20-1
tDFDVEN
tDRDVEN
DRIVE EDGE
DRIVE EDGE
DAI_P20–1
(SCLK, INT)
TDVx
DAI_P20-1
tDFDVIN
tDRDVIN
Figure 25. Serial Ports—TDV Internal and External Clock
Rev. C |
Page 46 of 76 |
July 2013
13.25
–0.1
Unit
ns
ns
ns
ns
ADSP-21477/ADSP-21478/ADSP-21479
Input Data Port (IDP)
The timing requirements for the IDP are given in Table 39. IDP
signals are routed to the DAI_P20–1 pins using the SRU. Therefore, the timing specifications provided below are valid at the
DAI_P20–1 pins.
Table 39. Input Data Port (IDP)
Parameter
Timing Requirements
tSISFS1
Frame Sync Setup Before Serial Clock Rising Edge
Frame Sync Hold After Serial Clock Rising Edge
tSIHFS1
tSISD1
Data Setup Before Serial Clock Rising Edge
1
tSIHD
Data Hold After Serial Clock Rising Edge
tIDPCLKW
Clock Width
tIDPCLK
Clock Period
1
88-Lead LFCSP Package
Min
Max
Min
All Other Packages
Max
4.5
3
4
3
(tPCLK × 4) ÷ 2 – 1
tPCLK × 4
3.8
2.5
2.5
2.5
(tPCLK × 4) ÷ 2 – 1
tPCLK × 4
Unit
ns
ns
ns
ns
ns
ns
The serial clock, data, and frame sync signals can come from any of the DAI pins. The serial clock and frame sync signals can also come via PCG or SPORTs. The PCG’s input
can be either CLKIN or any of the DAI pins.
tIPDCLK
SAMPLE EDGE
DAI_P20–1
(SCLK)
tIPDCLKW
tSISFS
tSIHFS
DAI_P20–1
(FS)
tSISD
tSIHD
DAI_P20–1
(SDATA)
Figure 26. IDP Master Timing
Rev. C |
Page 47 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
PDAP chapter of the ADSP-214xx SHARC Processor Hardware
Reference. Note that the 20 bits of external PDAP data can be
provided through the ADDR23–0 pins or over the DAI pins.
Parallel Data Acquisition Port (PDAP)
The timing requirements for the PDAP are provided in
Table 40. PDAP is the parallel mode operation of Channel 0 of
the IDP. For details on the operation of the PDAP, see the
Table 40. Parallel Data Acquisition Port (PDAP)
Parameter
Timing Requirements
tSPHOLD1
PDAP_HOLD Setup Before PDAP_CLK Sample Edge
tHPHOLD1
PDAP_HOLD Hold After PDAP_CLK Sample Edge
1
tPDSD
PDAP_DAT Setup Before SCLK PDAP_CLK Sample Edge
tPDHD1
PDAP_DAT Hold After SCLK PDAP_CLK Sample Edge
tPDCLKW
Clock Width
Clock Period
tPDCLK
Switching Characteristics
tPDHLDD
Delay of PDAP Strobe After Last PDAP_CLK
Capture Edge for a Word
tPDSTRB
PDAP Strobe Pulse Width
1
88-Lead LFCSP Package
All Other Packages
Min
Max
Min
Max
Unit
4
4
5
4
(tPCLK × 4) ÷ 2 – 3
tPCLK × 4
2.5
2.5
3.85
2.5
(tPCLK × 4) ÷ 2 – 3
tPCLK × 4
ns
ns
ns
ns
ns
ns
2 × tPCLK + 3
2 × tPCLK + 3
ns
2 × tPCLK – 1.5
2 × tPCLK – 1.5
ns
Source pins of DATA and control are ADDR23–0 or DAI pins. Source pins for SCLK and FS are: 1) DAI pins, 2) CLKIN through PCG, or 3) DAI pins through PCG.
SAMPLE EDGE
tPDCLK
tPDCLKW
DAI_P20–1
(PDAP_CLK)
tSPHOLD
tHPHOLD
DAI_P20–1
(PDAP_HOLD)
tPDSD
tPDHD
DAI_P20–1/
ADDR23–4
(PDAP_DATA)
tPDHLDD
DAI_P20–1
(PDAP_STROBE)
Figure 27. PDAP Timing
Rev. C |
Page 48 of 76 |
July 2013
tPDSTRB
ADSP-21477/ADSP-21478/ADSP-21479
Sample Rate Converter—Serial Input Port
The ASRC input signals are routed from the DAI_P20–1 pins
using the SRU. Therefore, the timing specifications provided in
Table 41 are valid at the DAI_P20–1 pins.
Table 41. ASRC, Serial Input Port
Parameter
Timing Requirements
Frame Sync Setup Before Serial Clock Rising Edge
tSRCSFS1
tSRCHFS1
Frame Sync Hold After Serial Clock Rising Edge
tSRCSD1
Data Setup Before Serial Clock Rising Edge
1
tSRCHD
Data Hold After Serial Clock Rising Edge
tSRCCLKW
Clock Width
tSRCCLK
Clock Period
1
Min
4
5.5
4
5.5
(tPCLK × 4) ÷ 2 – 1
tPCLK × 4
Max
Unit
ns
ns
ns
ns
ns
ns
The serial clock, data, and frame sync signals can come from any of the DAI pins. The serial clock and frame sync signals can also come via PCG or SPORTs. PCG’s input
can be either CLKIN or any of the DAI pins.
SAMPLE EDGE
DAI_P20–1
(SCLK)
tSRCCLK
tSRCCLKW
tSRCSFS
tSRCHFS
DAI_P20–1
(FS)
tSRCSD
tSRCHD
DAI_P20–1
(SDATA)
Figure 28. ASRC Serial Input Port Timing
Rev. C |
Page 49 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
delay specification with regard to serial clock. Note that serial
clock rising edge is the sampling edge and the falling edge is the
drive edge.
Sample Rate Converter—Serial Output Port
For the serial output port, the frame sync is an input, and it
should meet setup and hold times with regard to the serial clock
on the output port. The serial data output has a hold time and
Table 42. ASRC, Serial Output Port
Parameter
Timing Requirements
tSRCSFS1
Frame Sync Setup Before Serial Clock Rising Edge
tSRCHFS1
Frame Sync Hold After Serial Clock Rising Edge
tSRCCLKW
Clock Width
tSRCCLK
Clock Period
Switching Characteristics
Transmit Data Delay After Serial Clock Falling Edge
tSRCTDD1
tSRCTDH1
Transmit Data Hold After Serial Clock Falling Edge
1
88-Lead LFCSP Package
Min
Max
Min
4
5.5
(tPCLK × 4) ÷ 2 – 1
tPCLK × 4
4
5.5
(tPCLK × 4) ÷ 2 – 1
tPCLK × 4
2 × tPCLK
1
All Other Packages
Max
ns
ns
ns
ns
13
1
Unit
ns
ns
The serial clock, data, and frame sync signals can come from any of the DAI pins. The serial clock and frame sync signals can also come via PCG or SPORTs. PCG’s input can
be either CLKIN or any of the DAI pins.
SAMPLE EDGE
tSRCCLK
tSRCCLKW
DAI_P20–1
(SCLK)
tSRCSFS
tSRCHFS
DAI_P20–1
(FS)
tSRCTDD
tSRCTDH
DAI_P20–1
(SDATA)
Figure 29. ASRC Serial Output Port Timing
Rev. C |
Page 50 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
Pulse-Width Modulation Generators (PWM)
The following timing specifications apply when the
ADDR23–8/DPI_14–1 pins are configured as PWM.
Table 43. Pulse-Width Modulation (PWM) Timing
Parameter
Switching Characteristics
tPWMW
PWM Output Pulse Width
tPWMP
PWM Output Period
88-Lead LFCSP Package
Max
Min
tPCLK – 2
2 × tPCLK – 2
(216 – 2) × tPCLK
(216 – 1) × tPCLK
tPWMW
PWM
OUTPUTS
tPWMP
Figure 30. PWM Timing
Rev. C |
Page 51 of 76 |
July 2013
Min
All Other Packages
Max
tPCLK – 2
2 × tPCLK – 1.5
(216 – 2) × tPCLK
(216 – 1) × tPCLK
Unit
ns
ns
ADSP-21477/ADSP-21478/ADSP-21479
S/PDIF Transmitter
Serial data input to the S/PDIF transmitter can be formatted as
left-justified, I2S, or right-justified with word widths of 16, 18,
20, or 24 bits. The following sections provide timing for the
transmitter.
in 24-bit output mode or the maximum in 16-bit output mode
from a frame sync transition, so that when there are 64 serial
clock periods per frame sync period, the LSB of the data is rightjustified to the next frame sync transition.
S/PDIF Transmitter-Serial Input Waveforms
Figure 32 shows the default I2S-justified mode. The frame sync
is low for the left channel and high for the right channel. Data is
valid on the rising edge of serial clock. The MSB is left-justified
to the frame sync transition but with a delay.
Figure 31 shows the right-justified mode. Frame sync is high for
the left channel and low for the right channel. Data is valid on
the rising edge of serial clock. The MSB is delayed the minimum
Table 44. S/PDIF Transmitter Right-Justified Mode
Parameter
Timing Requirement
tRJD
FS to MSB Delay in Right-Justified Mode
16-Bit Word Mode
18-Bit Word Mode
20-Bit Word Mode
24-Bit Word Mode
Nominal
Unit
16
14
12
8
SCLK
SCLK
SCLK
SCLK
LEFT/RIGHT CHANNEL
DAI_P20–1
FS
DAI_P20–1
SCLK
tRJD
DAI_P20–1
SDATA
LSB
MSB
MSB–1
MSB–2
LSB+2
LSB+1
LSB
Figure 31. Right-Justified Mode
Table 45. S/PDIF Transmitter I2S Mode
Parameter
Timing Requirement
tI2SD
FS to MSB Delay in I2S Mode
LEFT/RIGHT CHANNEL
DAI_P20–1
FS
DAI_P20–1
SCLK
tI2SD
DAI_P20–1
SDATA
MSB
MSB–1
MSB–2
LSB+2
LSB+1
Figure 32. I2S-Justified Mode
Figure 33 shows the left-justified mode. The frame sync is high
for the left channel and low for the right channel. Data is valid
on the rising edge of serial clock. The MSB is left-justified to the
frame sync transition with no delay.
Rev. C |
Page 52 of 76 |
July 2013
LSB
Nominal
Unit
1
SCLK
ADSP-21477/ADSP-21478/ADSP-21479
Table 46. S/PDIF Transmitter Left-Justified Mode
Parameter
Timing Requirement
tLJD
FS to MSB Delay in Left-Justified Mode
DAI_P20–1
FS
LEFT/RIGHT CHANNEL
DAI_P20–1
SCLK
tLJD
DAI_P20–1
SDATA
MSB
MSB–1
MSB–2
LSB+2
LSB+1
Figure 33. Left-Justified Mode
Rev. C |
Page 53 of 76 |
July 2013
LSB
Nominal
Unit
0
SCLK
ADSP-21477/ADSP-21478/ADSP-21479
S/PDIF Transmitter Input Data Timing
The timing requirements for the S/PDIF transmitter are given
in Table 47. Input signals are routed to the DAI_P20–1 pins
using the SRU. Therefore, the timing specifications provided
below are valid at the DAI_P20–1 pins.
Table 47. S/PDIF Transmitter Input Data Timing
Parameter
Timing Requirements
tSISFS1
Frame Sync Setup Before Serial Clock Rising Edge
tSIHFS1
Frame Sync Hold After Serial Clock Rising Edge
tSISD1
Data Setup Before Serial Clock Rising Edge
Data Hold After Serial Clock Rising Edge
tSIHD1
tSITXCLKW
Transmit Clock Width
tSITXCLK
Transmit Clock Period
tSISCLKW
Clock Width
tSISCLK
Clock Period
1
88-Lead LFCSP Package
All Other Packages
Min
Max
Min
Max
Unit
4.5
3
4.5
3
9
20
36
80
ns
ns
ns
ns
ns
ns
ns
ns
3
3
3
3
9
20
36
80
The serial clock, data, and frame sync signals can come from any of the DAI pins. The serial clock and frame sync signals can also come via PCG or SPORTs. PCG’s input
can be either CLKIN or any of the DAI pins.
SAMPLE EDGE
tSITXCLKW
tSITXCLK
DAI_P20–1
(TxCLK)
tSISCLK
tSISCLKW
DAI_P20–1
(SCLK)
tSISFS
tSIHFS
DAI_P20–1
(FS)
tSISD
tSIHD
DAI_P20–1
(SDATA)
Figure 34. S/PDIF Transmitter Input Timing
Oversampling Clock (TxCLK) Switching Characteristics
The S/PDIF transmitter requires an oversampling clock input.
This high frequency clock (TxCLK) input is divided down to
generate the internal biphase clock.
Table 48. Oversampling Clock (TxCLK) Switching Characteristics
Parameter
Frequency for TxCLK = 384 × Frame Sync
Frequency for TxCLK = 256 × Frame Sync
Frame Rate (FS)
Max
Oversampling Ratio × Frame Sync ≤ 1/tSITXCLK
49.2
192.0
Rev. C |
Page 54 of 76 |
July 2013
Unit
MHz
MHz
kHz
ADSP-21477/ADSP-21478/ADSP-21479
S/PDIF Receiver
The following section describes timing as it relates to the
S/PDIF receiver.
Internal Digital PLL Mode
In the internal digital phase-locked loop mode the internal PLL
(digital PLL) generates the 512 × FS clock.
Table 49. S/PDIF Receiver Internal Digital PLL Mode Timing
Parameter
Switching Characteristics
tDFSI
tHOFSI
tDDTI
tHDTI
tSCLKIW1
1
Min
FS Delay After Serial Clock
FS Hold After Serial Clock
Transmit Data Delay After Serial Clock
Transmit Data Hold After Serial Clock
Transmit Serial Clock Width
Unit
5
ns
ns
ns
ns
ns
–2
5
–2
38.5
The serial clock frequency is 64 × frame sync (FS) where FS = the frequency of LRCLK.
SAMPLE EDGE
DRIVE EDGE
tSCLKIW
DAI_P20–1
(SCLK)
tDFSI
tHOFSI
DAI_P20–1
(FS)
tDDTI
tHDTI
DAI_P20–1
(DATA CHANNEL
A/B)
Figure 35. S/PDIF Receiver Internal Digital PLL Mode Timing
Rev. C |
Max
Page 55 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
SPI Interface—Master
Both the primary and secondary SPIs are available through DPI
only. The timing provided in Table 50 and Table 51 applies
to both.
Table 50. SPI Interface Protocol—Master Switching and Timing Specifications
Parameter
Timing Requirements
tSSPIDM
Data Input Valid to SPICLK Edge (Data Input Setup Time)
tHSPIDM
SPICLK Last Sampling Edge to Data Input Not Valid
Switching Characteristics
tSPICLKM
Serial Clock Cycle
tSPICHM
Serial Clock High Period
Serial Clock Low Period
tSPICLM
tDDSPIDM
SPICLK Edge to Data Out Valid (Data Out Delay time)
tHDSPIDM
SPICLK Edge to Data Out Not Valid (Data Out Hold time)
tSDSCIM
DPI Pin (SPI Device Select) Low to First SPICLK Edge
tHDSM
Last SPICLK Edge to DPI Pin (SPI Device Select) High
tSPITDM
Sequential Transfer Delay
88-Lead LFCSP Package
All Other Packages
Min
Max
Min
Max
Unit
10
2
8.6
2
ns
ns
8 × tPCLK – 2
4 × tPCLK – 2
4 × tPCLK – 2
8 × tPCLK – 2
4 × tPCLK – 2
4 × tPCLK – 2
ns
ns
ns
2.5
2.5
4 × tPCLK – 2
4 × tPCLK – 2
4 × tPCLK – 2
4 × tPCLK – 2
4 × tPCLK – 2
4 × tPCLK – 2
4 × tPCLK – 2
4 × tPCLK – 1.4
DPI
(OUTPUT)
tSDSCIM
tSPICHM
tSPICLM
tSPICLKM
tHDSM
SPICLK
(CP = 0,
CP = 1)
(OUTPUT)
tHDSPIDM
tDDSPIDM
MOSI
(OUTPUT)
tSSPIDM
tSSPIDM
tHSPIDM
CPHASE = 1
tHSPIDM
MISO
(INPUT)
tHDSPIDM
tDDSPIDM
MOSI
(OUTPUT)
CPHASE = 0
tSSPIDM
tHSPIDM
MISO
(INPUT)
Figure 36. SPI Master Timing
Rev. C |
Page 56 of 76 |
July 2013
tSPITDM
ns
ns
ns
ns
ADSP-21477/ADSP-21478/ADSP-21479
SPI Interface—Slave
Table 51. SPI Interface Protocol—Slave Switching and Timing Specifications
Parameter
Timing Requirements
tSPICLKS
Serial Clock Cycle
tSPICHS
Serial Clock High Period
tSPICLS
Serial Clock Low Period
tSDSCO
SPIDS Assertion to First SPICLK Edge, CPHASE = 0 or CPHASE = 1
tHDS
Last SPICLK Edge to SPIDS Not Asserted, CPHASE = 0
Data Input Valid to SPICLK Edge (Data Input Setup Time)
tSSPIDS
tHSPIDS
SPICLK Last Sampling Edge to Data Input Not Valid
tSDPPW
SPIDS Deassertion Pulse Width (CPHASE = 0)
Switching Characteristics
tDSOE
SPIDS Assertion to Data Out Active
1
tDSOE
SPIDS Assertion to Data Out Active (SPI2)
SPIDS Deassertion to Data High Impedance
tDSDHI
tDSDHI1
SPIDS Deassertion to Data High Impedance (SPI2)
tDDSPIDS
SPICLK Edge to Data Out Valid (Data Out Delay Time)
tHDSPIDS
SPICLK Edge to Data Out Not Valid (Data Out Hold Time)
tDSOV
SPIDS Assertion to Data Out Valid (CPHASE = 0)
1
88-Lead LFCSP Package
All Other Packages
Min
Max
Min
Max
Unit
4 × tPCLK – 2
2 × tPCLK – 2
2 × tPCLK – 2
2 × tPCLK
2 × tPCLK
2
2
2 × tPCLK
ns
ns
ns
ns
ns
ns
ns
ns
0
0
0
0
4 × tPCLK – 2
2 × tPCLK – 2
2 × tPCLK – 2
2 × tPCLK
2 × tPCLK
2
2
2 × tPCLK
13
13
2 × tPCLK
2 × tPCLK
13
2 × tPCLK
0
0
0
0
10.25
10.25
13.25
13.25
11.5
2 × tPCLK
5 × tPCLK
5 × tPCLK
ns
ns
ns
ns
ns
ns
ns
The timing for these parameters applies when the SPI is routed through the signal routing unit. For more information, see the processor hardware reference, “Serial Peripheral
Interface Port (SPI)” chapter.
SPIDS
(INPUT)
tSPICHS
SPICLK
(CP = 0,
CP = 1)
(INPUT)
tSPICLS
tSPICLKS
tHDS
tSDPPW
tSDSCO
tDSOE
tDSDHI
tDDSPIDS
tDDSPIDS
tHDSPIDS
MISO
(OUTPUT)
tSSPIDS tHSPIDS
CPHASE = 1
MOSI
(INPUT)
tHDSPIDS
MISO
(OUTPUT)
tDSOV
tHSPIDS
CPHASE = 0
tSSPIDS
MOSI
(INPUT)
Figure 37. SPI Slave Timing
Rev. C |
Page 57 of 76 |
July 2013
tDSDHI
ADSP-21477/ADSP-21478/ADSP-21479
Media Local Bus
All the numbers given are applicable for all speed modes
(1024 FS, 512 FS, and 256 FS for 3-pin; 512 FS and 256 FS for
5-pin) unless otherwise specified. Please refer to MediaLB specification document rev 3.0 for more details.
Table 52. MLB Interface, 3-Pin Specifications
Parameter
3-Pin Characteristics
tMLBCLK
MLB Clock Period
1024 FS
512 FS
256 FS
tMCKL
MLBCLK Low Time
1024 FS
512 FS
256 FS
tMCKH
MLBCLK High Time
1024 FS
512 FS
256 FS
tMCKR
MLBCLK Rise Time (VIL to VIH)
1024 FS
512 FS/256 FS
MLBCLK Fall Time (VIH to VIL)
tMCKF
1024 FS
512 FS/256 FS
1
MLBCLK Pulse Width Variation
tMPWV
1024 FS
512 FS/256
DAT/SIG Input Setup Time
tDSMCF
tDHMCF
DAT/SIG Input Hold Time
tMCFDZ
DAT/SIG Output Time to Three-State
DAT/SIG Output Data Delay From MLBCLK Rising Edge
tMCDRV
tMDZH2
Bus Hold Time
1024 FS
512 FS/256
DAT/SIG Pin Load
CMLB
1024 FS
512 FS/256
1
2
Min
Typ
Max
20.3
40
81
Unit
ns
ns
ns
6.1
14
30
ns
ns
ns
9.3
14
30
ns
ns
ns
1
1.2
0
1
3
ns
ns
1
3
ns
ns
0.7
2.0
ns p-p
ns p-p
15
8
ns
ns
ns
ns
2
4
ns
ns
40
60
pf
pf
Pulse width variation is measured at 1.25 V by triggering on one edge of MLBCLK and measuring the spread on the other edge, measured in ns peak-to-peak (p-p).
The board must be designed to ensure that the high impedance bus does not leave the logic state of the final driven bit for this time period. Therefore, coupling must be
minimized while meeting the maximum capacitive load listed.
Rev. C |
Page 58 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
MLBSIG/
MLBDAT
(Rx, Input)
VALID
tDHMCF
tDSMCF
tMCKH
MLBCLK
tMCKR
tMCKL
tMCKF
tMLBCLK
tMCFDZ
tMCDRV
tMDZH
MLBSIG/
MLBDAT
(Tx, Output)
VALID
Figure 38. MLB Timing (3-Pin Interface)
Table 53. MLB Interface, 5-Pin Specifications
Parameter
5-Pin Characteristics
tMLBCLK
MLB Clock Period
512 FS
256 FS
tMCKL
MLBCLK Low Time
512 FS
256 FS
tMCKH
MLBCLK High Time
512 FS
256 FS
tMCKR
MLBCLK Rise Time (VIL to VIH)
tMCKF
MLBCLK Fall Time (VIH to VIL)
1
MLBCLK Pulse Width Variation
tMPWV
tDSMCF2
DAT/SIG Input Setup Time
tDHMCF
DAT/SIG Input Hold Time
tMCDRV
DS/DO Output Data Delay From MLBCLK Rising Edge
tMCRDL3
DO/SO Low From MLBCLK High
512 FS
256 FS
DS/DO Pin Load
Cmlb
Min
Typ
Max
40
81
Unit
ns
ns
15
30
ns
ns
15
30
ns
ns
6
6
2
8
ns
ns
ns p-p
ns
ns
ns
10
20
ns
ns
40
pf
3
5
1
Pulse width variation is measured at 1.25 V by triggering on one edge of MLBCLK and measuring the spread on the other edge, measured in ns peak-to-peak (p-p).
2
Gate delays due to OR’ing logic on the pins must be accounted for.
3
When a node is not driving valid data onto the bus, the MLBSO and MLBDO output lines shall remain low. If the output lines can float at anytime, including while in reset,
external pull-down resistors are required to keep the outputs from corrupting the MediaLB signal lines when not being driven.
Rev. C |
Page 59 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
MLBSIG/
MLBDAT
(Rx, Input)
VALID
tDHMCF
tDSMCF
tMCKH
MLBCLK
tMCKR
tMCKL
tMCKF
tMLBCLK
tMCRDL
tMCDRV
VALID
MLBSO/
MLBDO
(Tx, Output)
Figure 39. MLB Timing (5-Pin Interface)
MLBCLK
tMPWV
tMPWV
Figure 40. MLB 3-Pin and 5-Pin MLBCLK Pulse Width Variation Timing
Rev. C |
Page 60 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
Shift Register
Table 54. Shift Register
Parameter
Timing Requirements
tSSDI
SR_SDI Setup Before SR_SCLK Rising Edge
tHSDI
SR_SDI Hold After SR_SCLK Rising Edge
tSSDIDAI1
DAI_P08–01 (SR_SDI) Setup Before DAI_P08–01 (SR_SCLK) Rising Edge
tHSDIDAI1
DAI_P08–01 (SR_SDI) Hold After DAI_P08–01 (SR_SCLK) Rising Edge
2
tSSCK2LCK
SR_SCLK to SR_LAT Setup
tSSCK2LCKDAI1, 2
DAI_P08–01 (SR_SCLK) to DAI_P08–01 (SR_LAT) Setup
Removal Time SR_CLR to SR_SCLK
tCLRREM2SCK
tCLRREM2LCK
Removal Time SR_CLR to SR_LAT
tCLRW
SR_CLR Pulse Width
tSCKW
SR_SCLK Clock Pulse Width
tLCKW
SR_LAT Clock Pulse Width
fMAX
Maximum Clock Frequency SR_SCLK or SR_LAT
Switching Characteristics
tDSDO13
SR_SDO Hold After SR_SCLK Rising Edge
3
tDSDO2
SR_SDO Max. Delay After SR_SCLK Rising Edge
tDSDODAI11, 3
SR_SDO Hold After DAI_P08–01 (SR_SCLK) Rising Edge
tDSDODAI21, 3
SR_SDO Max. Delay After DAI_P08–01 (SR_SCLK) Rising Edge
3, 4
tDSDOSP1
SR_SDO Hold After DAI_P20–01 (SR_SCLK) Rising Edge
SR_SDO Max. Delay After DAI_P20–01 (SR_SCLK) Rising Edge
tDSDOSP23, 4
tDSDOPCG13, 5, 6
SR_SDO Hold After DAI_P20–01 (SR_SCLK) Rising Edge
3, 5, 6
tDSDOPCG2
SR_SDO Max. Delay After DAI_P20–01 (SR_SCLK) Rising Edge
tDSDOCLR13
SR_CLR to SR_SDO Min. Delay
tDSDOCLR23
SR_CLR to SR_SDO Max. Delay
3
tDLDO1
SR_LDO Hold After SR_LAT Rising Edge
tDLDO23
SR_LDO Max. Delay After SR_LAT Rising Edge
SR_LDO Hold After DAI_P08–01 (SR_LAT) Rising Edge
tDLDODAI13
tDLDODAI23
SR_LDO Max. Delay After DAI_P08–01 (SR_LAT) Rising Edge
3, 4
tDLDOSP1
SR_LDO Hold After DAI_P20–01 (SR_LAT) Rising Edge
tDLDOSP23, 4
SR_LDO Max. Delay After DAI_P20–01 (SR_LAT) Rising Edge
tDLDOPCG13, 5, 6
SR_LDO Hold After DAI_P20–01 (SR_LAT) Rising Edge
3, 5, 6
tDLDOPCG2
SR_LDO Max. Delay After DAI_P20–01 (SR_LAT) Rising Edge
SR_CLR to SR_LDO Min. Delay
tDLDOCLR13
tDLDOCLR23
SR_CLR to SR_LDO Max. Delay
1
Min
Max
7
2
7
2
2
2
3 × tPCLK – 5
2 × tPCLK – 5
4 × tPCLK – 5
2 × tPCLK – 2
2 × tPCLK – 5
fPCLK  4
3
13
3
13
–2
5
–2
5
4
13
3
13
3
13
–2
5
–2
5
4
14
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Any of the DAI_P08–01 pins can be routed to the shift register clock, latch clock and serial data input via the SRU.
Both clocks can be connected to the same clock source. If both clocks are connected to same clock source, then data in the 18-stage shift register is always one cycle ahead of
latch register data.
3
For setup/hold timing requirements of off-chip shift register interfacing devices.
4
SPORTx serial clock out, frame sync out, and serial data outputs are routed to shift register block internally and are also routed onto DAI_P20–01.
5
PCG serial clock output is routed to SPORT and shift register block internally and are also routed onto DAI_P20–01. The SPORTs generate SR_LAT and SDI internally.
6
PCG Serial clock and frame sync outputs are routed to SPORT and shift register block internally and are also routed onto DAI_P20–01. The SPORTs generate SDI internally.
2
Rev. C |
Page 61 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
tSSDI,tSSDIDAI
DAI_P08-01
OR
SR_SCLK
tHSDI,tHSDIDAI
DAI_P08-01
OR
SR_SDI
SR_SDO
Figure 41. SR_SDI Setup, Hold
SR_SCLK OR
DAI_P08-01 OR
DAI_P20-01(SPx_CLK_O) OR
DAI_P20-01(PCG_CLKx_O)
tDSDO2
tDSDO1
SR_SDO
THE TIMING PARAMETERS SHOWN FOR tDSDO1 AND tDSDO2 ARE VALID FOR tDSDODAI1,
tDSDOSP1, tDSDOPCG1, tDSDODAI2, tDSDOSP2, AND tDSDOPCG2
Figure 42. SR_ SDO Delay
SR_LAT OR
DAI_P08-01 OR
DAI_P20-01
(SPx_FS_O)
OR
DAI_P20-01
(PCG_FSx_O)
tDLDO1
tDLDO2
SR_LDO
THE TIMING PARAMETERS SHOWN FOR tDLDO1 AND tDLDO2 ARE ALSO VALID FOR tDLDODAI1,
tDLDODAI2, tDLDOSP1, tDLDOSP2, tDLDOPCG1, AND tDLDOPCG2.
Figure 43. SR_LDO Delay
Rev. C |
Page 62 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
SR_SCLK
OR
DAI_P08-01
tSSCK2LCK
tSSCK2LCKDAI
SR_LAT
OR
DAI_P08-01
SR_SDI
OR
DAI_P08-01
SR_LDO
Figure 44. SR_SCLK to SR_LAT Setup, Clocks Pulse Width and Maximum Frequency
tCLRW
SR_CLR
tCLRREM2SCK
SR_SDCLK
OR
DAI_P08-01
tCLRREM2LCK
SR_LAT
OR
DAI_P08-01
tDSDOCLR2
tDSDOCLR1
SR_SDO
tDLDOCLR2
tDLDOCLR1
SR_LDO
Figure 45. Shift Register Reset Timing
Rev. C |
Page 63 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
Universal Asynchronous Receiver-Transmitter
(UART) Ports—Receive and Transmit Timing
For information on the UART port receive and transmit operations, see the ADSP-214xx SHARC Hardware Reference Manual.
2-Wire Interface (TWI)—Receive and Transmit Timing
For information on the TWI receive and transmit operations,
see the ADSP-214xx SHARC Hardware Reference Manual.
JTAG Test Access Port and Emulation
Table 55. JTAG Test Access Port and Emulation
Parameter
Timing Requirements
tTCK
TCK Period
tSTAP
TDI, TMS Setup Before TCK High
tHTAP
TDI, TMS Hold After TCK High
tSSYS1
System Inputs Setup Before TCK High
tHSYS1
System Inputs Hold After TCK High
TRST Pulse Width
tTRSTW
Switching Characteristics
tDTDO
TDO Delay from TCK Low
2
tDSYS
System Outputs Delay After TCK Low
88-Lead LFCSP Package
Min
Max
All Other Packages
Min
Max
Unit
20
5
6
7
18
4 × tCK
20
5
6
7
18
4 × tCK
ns
ns
ns
ns
ns
ns
11.5
tCK ÷ 2 + 7
1
10.5
tCK ÷ 2 + 7
ns
ns
System Inputs = DATA15–0, CLK_CFG1–0, RESET, BOOT_CFG1–0, DAI_Px, DPI_Px, FLAG3–0, MLBCLK, MLBDAT, MLBSIG, SR_SCLK, SR_CLR, SR_SDI, and
SR_LAT.
2
System Outputs = DAI_Px, DPI_Px, ADDR23–0, AMI_RD, AMI_WR, FLAG3–0, SDRAS, SDCAS, SDWE, SDCKE, SDA10, SDDQM, SDCLK, MLBDAT, MLBSIG, MLBDO,
MLBSO, SR_SDO, SR_LDO, and EMU.
tTCK
TCK
tSTAP
tHTAP
TMS
TDI
tDTDO
TDO
tSSYS
tHSYS
SYSTEM
INPUTS
tDSYS
SYSTEM
OUTPUTS
Figure 46. IEEE 1149.1 JTAG Test Access Port
Rev. C |
Page 64 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
OUTPUT DRIVE CURRENTS
TESTER PIN ELECTRONICS
Table 56 shows the driver types and the pins associated with
each driver. Figure 47 shows typical I-V characteristics for each
driver. The curves represent the current drive capability of the
output drivers as a function of output voltage.
50:
VLOAD
T1
70:
Table 56. Driver Types
B
Associated Pins
FLAG[0–3], AMI_ADDR[23–0], DATA[15–0],
AMI_RD, AMI_WR, AMI_ACK, MS[1-0], SDRAS,
SDCAS, SDWE, SDDQM, SDCKE, SDA10, EMU,
TDO, RESETOUT, DPI[1–14], DAI[1–20],
WDTRSTO, MLBDAT, MLBSIG, MLBSO, MLBDO,
MLBCLK, SR_CLR, SR_LAT, SR_LDO[17–0],
SR_SCLK, SR_SDI
SDCLK, RTCLKOUT
0.5pF
2pF
400:
NOTES:
THE WORST CASE TRANSMISSION LINE DELAY IS SHOWN AND CAN BE USED
FOR THE OUTPUT TIMING ANALYSIS TO REFLECT THE TRANSMISSION LINE
EFFECT AND MUST BE CONSIDERED. THE TRANSMISSION LINE (TD) IS FOR
LOAD ONLY AND DOES NOT AFFECT THE DATA SHEET TIMING SPECIFICATIONS.
ANALOG DEVICES RECOMMENDS USING THE IBIS MODEL TIMING FOR A GIVEN
SYSTEM REQUIREMENT. IF NECESSARY, A SYSTEM MAY INCORPORATE
EXTERNAL DRIVERS TO COMPENSATE FOR ANY TIMING DIFFERENCES.
Figure 48. Equivalent Device Loading for AC Measurements
(Includes All Fixtures)
200
SOURCE/SINK (VDDEXT) CURRENT (mA)
ZO = 50:(impedance)
TD = 4.04 r 1.18 ns
50:
4pF
Driver Type
A
DUT
OUTPUT
45:
150
VOH 3.13 V, 125 °C
TYPE B
100
INPUT
1.5V
OR
OUTPUT
TYPE A
50
0
1.5V
Figure 49. Voltage Reference Levels for AC Measurements
TYPE A
-50
CAPACITIVE LOADING
-100
TYPE B
Output delays and holds are based on standard capacitive loads:
30 pF on all pins (see Figure 48). Figure 52 shows graphically
how output delays and holds vary with load capacitance. The
graphs of Figure 50, Figure 51, and Figure 52 may not be linear
outside the ranges shown for Typical Output Delay vs. Load
Capacitance and Typical Output Rise Time (20% to 80%,
V = Min) vs. Load Capacitance.
-150
VOL 3.13 V, 125 °C
-200
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
SWEEP (VDDEXT) VOLTAGE (V)
Figure 47. Typical Drive at Junction Temperature
TEST CONDITIONS
7
Timing is measured on signals when they cross the 1.5 V level as
described in Figure 49. All delays (in nanoseconds) are measured between the point that the first signal reaches 1.5 V and
the point that the second signal reaches 1.5 V.
6
RISE AND FALL TIMES (ns)
The ac signal specifications (timing parameters) appear in
Table 21 on Page 29 through Table 55 on Page 64. These include
output disable time, output enable time, and capacitive loading.
The timing specifications for the SHARC apply for the voltage
reference levels in Figure 48.
TYPE A DRIVE FALL
y = 0.0421x + 0.2418
TYPE A DRIVE RISE
y = 0.0331x + 0.2662
5
TYPE B DRIVE FALL
y = 0.0206x + 0.2271
4
3
TYPE B DRIVE RISE
y = 0.0184x + 0.3065
2
1
0
0
25
50
75
100
125
150
175
LOAD CAPACITANCE (pF)
Figure 50. Typical Output Rise/Fall Time (20% to 80%,
VDD_EXT = Max)
Rev. C |
Page 65 of 76 |
July 2013
200
ADSP-21477/ADSP-21478/ADSP-21479
where:
14
TJ = junction temperature (°C)
TYPE A DRIVE FALL
y = 0.0748x + 0.4601
RISE AND FALL TIMES (ns)
12
TCASE = case temperature (°C) measured at the top center of the
package
TYPE A DRIVE RISE
y = 0.0567x + 0.482
10
TYPE B DRIVE FALL
y = 0.0367x + 0.4502
8
PD = power dissipation
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first order approximation of TJ by the equation:
6
TYPE B DRIVE RISE
y = 0.0314x + 0.5729
4
JT = junction-to-top (of package) characterization parameter is
the typical value from Table 58
T J = T A +   JA  P D 
2
where:
0
0
25
50
75
100
125
150
175
200
TA = ambient temperature °C
LOAD CAPACITANCE (pF)
Values of θJC are provided for package comparison and PCB
design considerations when an external heatsink is required.
Figure 51. Typical Output Rise/Fall Time (20% to 80%,
VDD_EXT = Min)
Note that the thermal characteristics values provided in
Table 58 are modeled values.
4.5
RISE AND FALL DELAY (ns)
Table 57. Thermal Characteristics for 88-Lead LFCSP_VQ
TYPE A DRIVE FALL
y = 0.0199x + 1.1083
4
Parameter
JA
JMA
JMA
JC
JT
JMT
JMT
TYPE A DRIVE RISE
y = 0.015x + 1.4889
3.5
TYPE B DRIVE RISE
y = 0.0088x + 1.6008
3
2.5
TYPE B DRIVE FALL
y = 0.0102x + 1.2726
2
1.5
1
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
22.6
18.2
17.3
7.9
0.22
0.36
0.44
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Table 58. Thermal Characteristics for 100-Lead LQFP_EP
0.5
0
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
0
25
50
75
100
125
150
175
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
200
LOAD CAPACITANCE (pF)
Figure 52. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
THERMAL CHARACTERISTICS
The processor is rated for performance over the temperature
range specified in Operating Conditions on Page 21.
Table 58 airflow measurements comply with JEDEC standards
JESD51-2 and JESD51-6 and the junction-to-board measurement complies with JESD51-8. Test board design complies with
JEDEC standards JESD51-7 (PBGA). The junction-to-case measurement complies with MIL- STD-883. All measurements use a
2S2P JEDEC test board.
To determine the junction temperature of the device while on
the application PCB, use:
T J = T CASE +   JT  P D 
Rev. C |
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
18.1
15.5
14.6
2.4
0.22
0.36
0.50
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Table 59. Thermal Characteristics for 196-Ball CSP_BGA
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
Page 66 of 76 |
July 2013
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
29.0
26.1
25.1
8.8
0.23
0.42
0.52
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
ADSP-21477/ADSP-21478/ADSP-21479
Thermal Diode
where:
The processors incorporate thermal diode/s to monitor the die
temperature. The thermal diode is a grounded collector, PNP
bipolar junction transistor (BJT). The THD_P pin is connected
to the emitter, and the THD_M pin is connected to the base of
the transistor. These pins can be used by an external temperature sensor (such as ADM1021A or LM86 or others) to read the
die temperature of the chip.
n = multiplication factor close to 1, depending on process
variations
The technique used by the external temperature sensor is to
measure the change in VBE when the thermal diode is operated
at two different currents. This is shown in the following
equation:
The two currents are usually in the range of 10 μA to 300 μA for
the common temperature sensor chips available.
k = Boltzmann constant
T = temperature (°C)
q = charge of the electron
N = ratio of the two currents
Table 60 contains the thermal diode specifications using the
transistor model.
kT
V BE = n  ------  In(N)
q
Table 60. Thermal Diode Parameters—Transistor Model1
Symbol
IFW2
IE
nQ3, 4
RT3, 5
Parameter
Forward Bias Current
Emitter Current
Transistor Ideality
Series Resistance
Min
10
10
1.012
0.12
Typ
1.015
0.2
1
Max
300
300
1.017
0.28
Unit
μA
μA
Ω
Analog Devices does not recommend operation of the thermal diode under reverse bias.
Analog Devices does not recommend operation of the thermal diode under reverse bias.
3
Specified by design characterization.
4
The ideality factor, nQ, represents the deviation from ideal diode behavior as exemplified by the diode equation: IC = IS × (e qVBE/nqkT – 1) where IS = saturation current,
q = electronic charge, VBE = voltage across the diode, k = Boltzmann constant, and T = absolute temperature (Kelvin).
5
The series resistance (RT) can be used for more accurate readings as needed.
2
Rev. C |
Page 67 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
88-LFCSP_VQ LEAD ASSIGNMENT
Table 61 lists the 88-Lead LFCSP_VQ package lead names.
Table 61. 88-Lead LFCSP_VQ Lead Assignments (Numerical by Lead Number)
Lead Name
CLK_CFG1
BOOT_CFG0
VDD_EXT
VDD_INT
BOOT_CFG1
GND
CLK_CFG0
VDD_INT
CLKIN
XTAL
VDD_EXT
VDD_INT
VDD_INT
RESETOUT/RUNRSTIN
VDD_INT
DPI_P01
DPI_P02
DPI_P03
VDD_INT
DPI_P05
DPI_P04
DPI_P06
Lead No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Lead Name
VDD_EXT
DPI_P08
DPI_P07
DPI_P09
DPI_P10
DPI_P11
DPI_P12
DPI_P13
DAI_P03
DPI_P14
VDD_INT
DAI_P13
DAI_P07
DAI_P19
DAI_P01
DAI_P02
VDD_INT
VDD_EXT
VDD_INT
DAI_P06
DAI_P05
DAI_P09
Lead No.
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
Lead Name
Lead No.
VDD_INT
67
FLAG0
68
VDD_INT
69
FLAG1
70
FLAG2
71
FLAG3
72
GND
73
GND
74
VDD_EXT
75
GND
76
VDD_INT
77
TRST
78
EMU
79
TDO
80
VDD_EXT
81
VDD_INT
82
TDI
83
TCK
84
VDD_INT
85
RESET
86
TMS
87
VDD_INT
88
GND
89*
* Lead no. 89 is the GND supply (see Figure 53 and Figure 54) for the processor; this pad must be robustly connected to GND in order for the
processor to function.
Rev. C |
Lead Name
DAI_P10
VDD_INT
VDD_EXT
DAI_P20
VDD_INT
DAI_P08
DAI_P04
DAI_P14
DAI_P18
DAI_P17
DAI_P16
DAI_P15
DAI_P12
DAI_P11
VDD_INT
GND
THD_M
THD_P
VDD_THD
VDD_INT
VDD_INT
VDD_INT
Page 68 of 76 |
July 2013
Lead No.
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
ADSP-21477/ADSP-21478/ADSP-21479
Figure 53 shows the top view of the 88-lead LFCSP_VQ pin
configuration. Figure 54 shows the bottom view.
PIN 88
PIN 67
PIN 1
PIN 66
PIN 1 INDICATOR
ADSP-2147x
88-LEAD LFCSP_VQ
TOP VIEW
PIN 22
PIN 45
PIN 23
PIN 44
Figure 53. 88-Lead LFCSP_VQ Lead Configuration (Top View)
PIN 67
PIN 88
PIN 66
PIN 1
ADSP-2147x
88-LEAD LFCSP_VQ
BOTTOM VIEW
GND PAD
(PIN 89)
PIN 1 INDICATOR
PIN 45
PIN 22
PIN 44
PIN 23
Figure 54. 88-Lead LFCSP_VQ Lead Configuration (Bottom View)
Rev. C |
Page 69 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
100-LQFP_EP LEAD ASSIGNMENT
Table 62 lists the 100-Lead LQFP_EP lead names.
Table 62. 100-Lead LQFP_EP Lead Assignments (Numerical by Lead Number)
Lead Name
VDD_INT
CLK_CFG1
BOOT_CFG0
VDD_EXT
VDD_INT
BOOT_CFG1
GND
NC
NC
CLK_CFG0
VDD_INT
CLKIN
XTAL
VDD_EXT
VDD_INT
VDD_INT
RESETOUT/RUNRSTIN
VDD_INT
DPI_P01
DPI_P02
DPI_P03
VDD_INT
DPI_P05
DPI_P04
DPI_P06
Lead No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
Lead Name
VDD_EXT
DPI_P08
DPI_P07
VDD_INT
DPI_P09
DPI_P10
DPI_P11
DPI_P12
DPI_P13
DAI_P03
DPI_P14
VDD_INT
VDD_INT
VDD_INT
DAI_P13
DAI_P07
DAI_P19
DAI_P01
DAI_P02
VDD_INT
VDD_EXT
VDD_INT
DAI_P06
DAI_P05
DAI_P09
Lead No.
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
Lead Name
Lead No.
VDD_INT
76
FLAG0
77
VDD_INT
78
VDD_INT
79
FLAG1
80
FLAG2
81
FLAG3
82
MLBCLK
83
MLBDAT
84
MLBDO
85
VDD_EXT
86
MLBSIG
87
VDD_INT
88
MLBSO
89
TRST
90
EMU
91
TDO
92
VDD_EXT
93
VDD_INT
94
TDI
95
TCK
96
VDD_INT
97
RESET
98
TMS
99
VDD_INT
100
GND
101*
* Lead no. 101 is the GND supply (see Figure 55 and Figure 56) for the processor; this pad must be robustly connected to GND.
MLB pins (pins 83, 84, 85, 87, and 89) are available for automotive models only. For non-automotive models, these pins should be connected
to ground (GND).
Rev. C |
Lead Name
DAI_P10
VDD_INT
VDD_EXT
DAI_P20
VDD_INT
DAI_P08
DAI_P04
DAI_P14
DAI_P18
DAI_P17
DAI_P16
DAI_P15
DAI_P12
VDD_INT
DAI_P11
VDD_INT
VDD_INT
GND
THD_M
THD_P
VDD_THD
VDD_INT
VDD_INT
VDD_INT
VDD_INT
Page 70 of 76 |
July 2013
Lead No.
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
ADSP-21477/ADSP-21478/ADSP-21479
Figure 55 shows the top view configuration of the 100-lead
LQFP_EP package. Figure 56 shows the bottom view configuration of the 100-lead LQFP_EP package.
LEAD 100
LEAD 76
LEAD 1
LEAD 75
LEAD 1 INDICATOR
ADSP-2147x
100-LEAD LQFP_EP
TOP VIEW
LEAD 25
LEAD 51
LEAD 26
LEAD 50
Figure 55. 100-Lead LQFP_EP Lead Configuration (Top View)
LEAD 76
LEAD 100
LEAD 75
LEAD 1
ADSP-2147x
100-LEAD LQFP_EP
BOTTOM VIEW
GND PAD
(LEAD 101)
LEAD 1 INDICATOR
LEAD 51
LEAD 25
LEAD 50
LEAD 26
Figure 56. 100-Lead LQFP_EP Lead Configuration (Bottom View)
Rev. C |
Page 71 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
196-BGA BALL ASSIGNMENT
Table 63. 196-Ball CSP_BGA Ball Assignment (Numerical by Ball No.)
Ball No.
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
Signal
GND
SDCKE
SDDQM
SDRAS
SDWE
DATA12
DATA13
DATA10
DATA9
DATA7
DATA3
DATA1
DATA2
GND
ADDR0
CLK_CFG1
BOOT_CFG0
TMS
RESET
DATA14
DATA11
DATA4
DATA8
DATA6
DATA5
TRST
FLAG1
DATA0
ADDR2
ADDR3
RTCLKOUT
MS0
SDCAS
DATA15
TCK
TDI
SDCLK
EMU
TDO
FLAG3
ADDR16
WDT_CLKIN
Ball No. Signal
D1
ADDR6
D2
ADDR4
D3
ADDR1
D4
CLK_CFG0
D5
VDD_EXT
D6
VDD_EXT
D7
VDD_EXT
D8
VDD_EXT
D9
VDD_EXT
D10
VDD_EXT
D11
VDD_EXT
D12
ADDR14
D13
ADDR20
D14
WDT_CLKO
E1
ADDR8
E2
ADDR7
E3
ADDR5
E4
VDD_EXT
E5
VDD_INT
E6
VDD_INT
E7
VDD_INT
E8
VDD_INT
E9
VDD_INT
E10
VDD_INT
E11
VDD_EXT
E12
AMI_RD
E13
ADDR22
E14
FLAG2
F1
CLKIN
F2
ADDR9
F3
BOOT_CFG1
F4
NC
F5
NC
F6
GND
F7
GND
F8
GND
F9
GND
F10
VDD_INT
F11
VDD_EXT
F12
ADDR15
F13
FLAG0
F14
AMI_WR
Ball No. Signal
G1
XTAL
G2
SDA10
G3
ADDR11
G4
GND
G5
VDD_INT
G6
GND
G7
GND
G8
GND
G9
GND
G10
VDD_INT
G11
VDD_EXT
G12
ADDR21
G13
ADDR19
G14
RTXO
H1
ADDR13
H2
ADDR12
H3
ADDR10
H4
ADDR17
H5
VDD_INT
H6
GND
H7
GND
H8
GND
H9
GND
H10
VDD_INT
H11
VDD_EXT
H12
BOOT_CFG2
H13
ADDR23
H14
RTXI
J1
DPI_P01
J2
DPI_P03
J3
ADDR18
J4
RESETOUT/RUNRSTIN
J5
VDD_INT
J6
GND
J7
GND
J8
GND
J9
GND
J10
VSS_RTC
J11
VDD_RTC
J12
DAI_P11
J13
AMI_ACK
J14
MS1
Rev. C |
Page 72 of 76 |
July 2013
Ball No.
K1
K2
K3
K4
K5
K6
K7
K8
K9
K10
K11
K12
K13
K14
L1
L2
L3
L4
L5
L6
L7
L8
L9
L10
L11
L12
L13
L14
M1
M2
M3
M4
M5
M6
M7
M8
M9
M10
M11
M12
M13
M14
Signal
DPI_P02
DPI_P04
DPI_P05
DPI_P09
VDD_INT
GND
GND
GND
GND
VDD_INT
GND
DAI_P16
DAI_P18
DAI_P15
DAI_P03
DPI_P10
DPI_P08
DPI_P06
VDD_INT
VDD_INT
VDD_INT
VDD_INT
VDD_INT
VDD_INT
DAI_P10
DAI_P20
DAI_P17
DAI_P04
DPI_P13
DPI_P12
SR_LDO0
DPI_P07
DPI_P11
SR_LDO5
SR_LDO7
DAI_P07
SR_LDO16
SR_SDO
DAI_P06
DAI_P05
DAI_P08
DAI_P12
Ball No.
N1
N2
N3
N4
N5
N6
N7
N8
N9
N10
N11
N12
N13
N14
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
Signal
DPI_P14
SR_LDO1
SR_LDO4
SR_LDO8
SR_LDO10
DAI_P01
SR_LDO9
DAI_P02
SR_LDO13
SR_SCLK
DAI_P09
SR_SDI
SR_LDO17
DAI_P14
GND
SR_LDO3
SR_LDO2
SR_LDO6
WDTRSTO
DAI_P19
DAI_P13
SR_LDO11
SR_LDO15
SR_CLR
SR_LAT
SR_LDO14
SR_LDO12
GND
ADSP-21477/ADSP-21478/ADSP-21479
OUTLINE DIMENSIONS
The processors are available in 88-lead LFCSP_VQ, 100-lead
LQFP_EP and 196-ball CSP_BGA RoHS compliant packages.
For package assignment by model, see Ordering Guide on
Page 76.
12.10
12.00 SQ
11.90
0.30
0.23
0.18
0.60 MAX
0.60
MAX
88
67
66
1
PIN 1
INDICATOR
PIN 1
INDICATOR
0.50
BSC
11.85
11.75 SQ
11.65
0.50
0.40
0.30
SEATING
PLANE
12° MAX
22
45
44
23
BOTTOM VIEW
TOP VIEW
*0.90
0.85
0.75
0.70
0.65
0.60
10.50
REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.045
0.025
0.005
COPLANARITY
0.08
0.138~0.194 REF
*COMPLIANT TO JEDEC STANDARDS MO-220-VRRD
EXCEPT FOR MINIMUM THICKNESS AND LEAD COUNT.
Figure 57. 88-Lead Lead Frame Chip Scale Package [LFCSP_VQ1]
(CP-88-5)
Dimensions Shown in Millimeters
1
6.70
REF SQ
EXPOSED PAD
For information relating to the exposed pad on the CP-88-5 package, see the table endnote on Page 68.
Rev. C |
Page 73 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
0.75
0.60
0.45
16.20
16.00 SQ
15.80
1.60
MAX
14.20
14.00 SQ
13.80
100
12.00 REF
76
1
1.00 REF
76
75
100
1
75
PIN 1
SEATING
PLANE
EXPOSED
PAD
TOP VIEW
1.45
1.40
1.35
0.20
0.09
0.15
0.05
7°
0°
26
51
(PINS UP)
51
50
25
26
50
0.27
0.22
0.17
VIEW A
0.08
COPLANARITY
BOTTOM VIEW
(PINS DOWN)
25
0.50
BSC
LEAD PITCH
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
VIEW A
COMPLIANT TO JEDEC STANDARDS MS-026-BED-HD
ROTATED 90° CCW
Figure 58. 100-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP1]
(SW-100-2)
Dimensions shown in millimeters
1
For information relating to the exposed pad on the SW-100-2 package, see the table endnote on Page 70.
A1 BALL
CORNER
12.10
12.00 SQ
11.90
A1 BALL
CORNER
14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
10.40
BSC SQ
0.80
BSC
0.80
REF
TOP VIEW
1.50
1.41
1.32
BOTTOM VIEW
DETAIL A
0.70
REF
DETAIL A
0.50
COPLANARITY
0.45
0.12
0.40
BALL DIAMETER
COMPLIANT TO JEDEC STANDARDS MO-275-GGAB-1.
Figure 59. 196-Ball Chip Scale Package, Ball Grid Array [CSP_BGA]
(BC-196-8)
Dimensions shown in millimeters
Rev. C |
Page 74 of 76 |
1.13
1.06
0.99
0.35 NOM
0.30 MIN
0.36
REF
SEATING
PLANE
6.00 BSC
SQ
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
SURFACE-MOUNT DESIGN
AUTOMOTIVE PRODUCTS
For industry-standard design recommendations, refer to
IPC-7351, Generic Requirements for Surface-Mount Design
and Land Pattern Standard.
The ADSP-21477, ADSP-21478, and ADSP-21479 are available
with controlled manufacturing to support the quality and reliability requirements of automotive applications. Note that these
automotive models may have specifications that differ from the
commercial models, and designers should review the product
Specifications section of this data sheet carefully.
Only the automotive grade products shown in Table 64 are
available for use in automotive applications. Contact your local
ADI account representative for specific product ordering information and to obtain the specific Automotive Reliability reports
for these models.
Table 64. Automotive Product Models
Model1
Temperature
Range2
On-Chip
SRAM
Processor
Instruction
Rate (Max)
Package Description
Package
Option
AD21477WYCPZ1Axx
–40°C to +105°C
2M bits
200 MHz
88-Lead LFCSP_VQ
CP-88-5
AD21477WYSWZ1Axx
–40°C to +105°C
2M bits
200 MHz
100-Lead LQFP_EP
SW-100-2
AD21478WYBCZ2Axx
–40°C to +105°C
3M bits
200 MHz
88-Lead LFCSP_VQ
CP-88-5
AD21478WYCPZ1Axx
–40°C to +105°C
3M bits
200 MHz
88-Lead LFCSP_VQ
CP-88-5
AD21478WYSWZ2Axx
–40°C to +105°C
3M bits
266 MHz
100-Lead LQFP_EP
SW-100-2
AD21478WYSWZ2Bxx
–40°C to +105°C
3M bits
266 MHz
100-Lead LQFP_EP
SW-100-2
AD21479WYCPZ1Axx
–40°C to +105°C
5M bits
200 MHz
88-Lead LFCSP_VQ
CP-88-5
AD21479WYCPZ1Bxx
–40°C to +105°C
5M bits
200MHz
88-Lead LFCSP_VQ
CP-88-5
AD21479WYSWZ2Axx
–40°C to +105°C
5M bits
266 MHz
100-Lead LQFP_EP
SW-100-2
AD21479WYSWZ2Bxx
–40°C to +105°C
5M bits
266 MHz
100-Lead LQFP_EP
SW-100-2
1
Notes
3, 4
3, 4
3, 4
Z = RoHS compliant part.
Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions on Page 21 for junction temperature (TJ)
specification, which is the only temperature specification.
3
Contains multichannel audio decoders from Dolby and DTS.
4
Contains Digital Transmission Content Protection (DTCP) from DTLA. User must have current license from DTLA to order this product.
2
Rev. C |
Page 75 of 76 |
July 2013
ADSP-21477/ADSP-21478/ADSP-21479
ORDERING GUIDE
Model1
ADSP-21477KCPZ-1A
ADSP-21477KSWZ-1A
ADSP-21477BCPZ-1A
ADSP-21478KCPZ-1A
ADSP-21478BCPZ-1A
ADSP-21478BBCZ-2A
ADSP-21478BSWZ-2A
ADSP-21478KBCZ-1A
ADSP-21478KBCZ-2A
ADSP-21478KBCZ-3A
ADSP-21478KSWZ-1A
ADSP-21478KSWZ-2A
ADSP-21479KCPZ-1A
ADSP-21479BCPZ-1A
ADSP-21479BBCZ-2A
ADSP-21479BSWZ-2A
ADSP-21479KBCZ-1A
ADSP-21479KBCZ-2A
ADSP-21479KBCZ-3A
ADSP-21479KSWZ-1A
ADSP-21479KSWZ-2A
Temperature Range2
0°C to +70°C
0°C to +70°C
–40C to +85C
0°C to +70°C
–40C to +85C
–40°C to +85°C
–40°C to +85°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
–40C to +85C
–40°C to +85°C
–40°C to +85°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
On-Chip SRAM
2M Bits
2M Bits
2M Bits
3M Bits
3M Bits
3M Bits
3M Bits
3M Bits
3M Bits
3M Bits
3M Bits
3M Bits
5M Bits
5M Bits
5M Bits
5M Bits
5M Bits
5M Bits
5M Bits
5M Bits
5M Bits
Processor Instruction
Rate (Max)
200 MHz
200 MHz
200 MHz
200 MHz
200 MHz
266 MHz
266 MHz
200 MHz
266 MHz
300 MHz
200 MHz
266 MHz
200 MHz
200 MHz
266 MHz
266 MHz
200 MHz
266 MHz
300 MHz
200 MHz
266 MHz
1
Package Description
88-Lead LFCSP_VQ
100-Lead LQFP_EP
88-Lead LFCSP_VQ
88-Lead LFCSP_VQ
88-Lead LFCSP_VQ
196-Ball CSP_BGA
100-Lead LQFP_EP
196-Ball CSP_BGA
196-Ball CSP_BGA
196-Ball CSP_BGA
100-Lead LQFP_EP
100-Lead LQFP_EP
88-Lead LFCSP_VQ
88-Lead LFCSP_VQ
196-Ball CSP_BGA
100-Lead LQFP_EP
196-Ball CSP_BGA
196-Ball CSP_BGA
196-Ball CSP_BGA
100-Lead LQFP_EP
100-Lead LQFP_EP
Package
Option
CP-88-5
SW-100-2
CP-88-5
CP-88-5
CP-88-5
BC-196-8
SW-100-2
BC-196-8
BC-196-8
BC-196-8
SW-100-2
SW-100-2
CP-88-5
CP-88-5
BC-196-8
SW-100-2
BC-196-8
BC-196-8
BC-196-8
SW-100-2
SW-100-2
Z =RoHS compliant part.
Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions on Page 21 for junction temperature (TJ)
specification, which is the only temperature specification.
2
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09017-0-7/13(C)
Rev. C |
Page 76 of 76 |
July 2013
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